WO1994020801A1 - Heating/cooling systems - Google Patents

Heating/cooling systems Download PDF

Info

Publication number
WO1994020801A1
WO1994020801A1 PCT/GB1994/000469 GB9400469W WO9420801A1 WO 1994020801 A1 WO1994020801 A1 WO 1994020801A1 GB 9400469 W GB9400469 W GB 9400469W WO 9420801 A1 WO9420801 A1 WO 9420801A1
Authority
WO
WIPO (PCT)
Prior art keywords
heating
fins
heat exchange
transfer means
capillary transfer
Prior art date
Application number
PCT/GB1994/000469
Other languages
French (fr)
Inventor
Tudor Stanley Thomas
Original Assignee
Mars G.B. Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mars G.B. Limited filed Critical Mars G.B. Limited
Publication of WO1994020801A1 publication Critical patent/WO1994020801A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
    • F25D21/14—Collecting or removing condensed and defrost water; Drip trays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2321/00—Details or arrangements for defrosting; Preventing frosting; Removing condensed or defrost water, not provided for in other groups of this subclass
    • F25D2321/14—Collecting condense or defrost water; Removing condense or defrost water
    • F25D2321/147—Collecting condense or defrost water; Removing condense or defrost water characterised by capillary, wick, adsorbent, or evaporation elements

Definitions

  • This invention relates to heating/cooling systems, and, in particular, to thermoelectric systems such as those which use devices operating to the Peltier effect.
  • a low voltage current is passed through such a device to cause one major surface to cool and an opposed major surface correspondingly to heat.
  • a problem which arises in conjunction with these systems is the build-up of moisture due to condensation inside the cooling chamber. This is brought about at the junction of the air in the chamber with the cooled major surface, and in particular with the cooling fins where these are provided. This impairs the efficiency of the cooling fins. Eventually the moisture drips off the fins to form a pool in the base of the chamber. As well as being unsightly, where point- of-sale display cabinets are involved, such build-up can adversely affect the contents of the chamber, in particular perishable foodstuffs, unless it is periodically drained off. The necessity of providing drainage holes for this purpose further impairs performance of the unit since it cannot then be sealed against the atmosphere.
  • a heating/cooling system comprising a heating/cooling device having, in use, a hot surface and a cool surface, and capillary transfer means arranged with respect to the surfaces so as to conduct moisture from the vicinity of the cool surface to the vicinity of the hot surface for evaporation therefrom.
  • the capillary transfer means comprises a wick.
  • This may suitably be of fabric.
  • the fabric is most preferably any of the commercially available types known as close weave fabrics, such as are used in wicking for gardening applications.
  • a preferred example is close weave polypropylene ribbon.
  • the heating/cooling device is typically of the thermoelectric type, and is preferably a semiconductor Peltier device. It could, however, be of another type, for example cooling equipment based on the expansion/compression refrigerant cycle.
  • thermoelectric device The cool surface of such a thermoelectric device is normally provided with a plurality of heat exchange fins, as is known in the art.
  • the fins are provided with a coating of hydrophobic material such as fluorethylene propylene, in order to repel moisture condensing on the fins in use.
  • the capillary transfer means is positioned so as to intercept this flow. Most preferably it extends as a layer along the base of the cabinet in which the system is installed.
  • the capillary transfer means may be arranged to contact the heat exchange fins so as to absorb water directly therefrom.
  • the hot surface of the heating/cooling device is also provided with heat exchange fins, as is known in the art.
  • a small electric fan may be employed in association with these fins. This removes warm air more efficiently by increasing its convective flow over and around the fins.
  • the capillary transfer means may make contact with the heat exchange fins associated with the hot surface, or may alternatively be separated therefrom by an intermediate air space.
  • a semiconductor Peltier device (10) (as is available commercially, e.g. from Melcor Inc., Trenton, New Jersey, USA) having a hot surface (H) and a cold surface (C) is situated within a casing (11) having a basal portion (12) a top wall (13) and a back wall (14).
  • Back wall (14) is provided with apertures (15) for the removal of moist air.
  • Cold surface (C) is provided with heat exchange fins (16) which are angled downwardly, towards the basal portion (12) of casing (11) .
  • Hot surface (H) is also provided with associated heat exchange fins (17) . These project horizontally with respect to hot surface (H) .
  • Wick (18) is made of close-weave polypropylene ribbon (as is available commercially from Hattersley (Narrow Fabrics) Ltd. , Keighley, West Yorkshire) and extends from beneath the region of heat exchange fins (16) along basal portion (12) and up between back wall (14) and heat exchange fins (17) .
  • the system operates as follows.
  • the semiconductor Peltier device (10) is actuated.
  • the hot surface (H) rises to a temperature above ambient, and the cold surface (C) falls to a temperature below ambient.
  • Electric fans (not shown) are disposed to force air across heat exchange fins (16) and heat exchange fins (17) .
  • wick (18) forms a layer positioned between heat exchange fins (17) and back wall (14) .
  • the above-ambient temperature of hot surface (H) and associated heat exchange fins (17) promotes evaporation of moisture held in wick (18) .
  • Moist air is dissipated into the surrounding atmosphere, through apertures (15) provided in back wall (14) .

Abstract

A heating/cooling system, such as a semiconductor Peltier effect device e.g. for use in chilled display cabinets for food and beverages, is provided with capillary transfer means (18). This facilitates the efficient removal of accumulated moisture which arises as a result of condensation on the cool surface (C) of such systems, by conducting it to the hot surface (H) where evaporation occurs. The capillary transfer means (18) may be a fabric wick.

Description

HEATING/COOLING SYSTEMS
This invention relates to heating/cooling systems, and, in particular, to thermoelectric systems such as those which use devices operating to the Peltier effect. A low voltage current is passed through such a device to cause one major surface to cool and an opposed major surface correspondingly to heat.
Such systems have been proposed for example, as the cooling unit in chilled display cabinets for food and beverages at point of sale. In order to ensure an adequate cooling effect in such cases it is typical to provide, on the cooled major surface, i.e. on the inside of the cooling chamber, finned or ribbed members. These present a maximum heat exchange surface to the air of the cooling chamber.
A problem which arises in conjunction with these systems is the build-up of moisture due to condensation inside the cooling chamber. This is brought about at the junction of the air in the chamber with the cooled major surface, and in particular with the cooling fins where these are provided. This impairs the efficiency of the cooling fins. Eventually the moisture drips off the fins to form a pool in the base of the chamber. As well as being unsightly, where point- of-sale display cabinets are involved, such build-up can adversely affect the contents of the chamber, in particular perishable foodstuffs, unless it is periodically drained off. The necessity of providing drainage holes for this purpose further impairs performance of the unit since it cannot then be sealed against the atmosphere.
According to the present invention there is provided a heating/cooling system comprising a heating/cooling device having, in use, a hot surface and a cool surface, and capillary transfer means arranged with respect to the surfaces so as to conduct moisture from the vicinity of the cool surface to the vicinity of the hot surface for evaporation therefrom.
Preferably the capillary transfer means comprises a wick. This may suitably be of fabric. The fabric is most preferably any of the commercially available types known as close weave fabrics, such as are used in wicking for gardening applications. A preferred example is close weave polypropylene ribbon.
The heating/cooling device is typically of the thermoelectric type, and is preferably a semiconductor Peltier device. It could, however, be of another type, for example cooling equipment based on the expansion/compression refrigerant cycle.
The cool surface of such a thermoelectric device is normally provided with a plurality of heat exchange fins, as is known in the art. In the present invention, preferably the fins are provided with a coating of hydrophobic material such as fluorethylene propylene, in order to repel moisture condensing on the fins in use.
In a preferred embodiment, where the fins are oriented angularly such that moisture accumulating on these in use is directed downwards, the capillary transfer means is positioned so as to intercept this flow. Most preferably it extends as a layer along the base of the cabinet in which the system is installed.
In an alternative embodiment the capillary transfer means may be arranged to contact the heat exchange fins so as to absorb water directly therefrom.
Typically, the hot surface of the heating/cooling device is also provided with heat exchange fins, as is known in the art. Suitably, a small electric fan may be employed in association with these fins. This removes warm air more efficiently by increasing its convective flow over and around the fins.
The capillary transfer means may make contact with the heat exchange fins associated with the hot surface, or may alternatively be separated therefrom by an intermediate air space.
In use, moisture retained within the capillary transfer means, which has been conducted from the cool surface, reaches the vicinity of the hot surface, where its evaporation is promoted by the supply of the required latent heat by the hot surface. This has the additional advantage that the performance of the hot surface is improved by such transfer of heat.
Preferred features of the invention will now be described, by way of example, with reference to the accompanying drawing which is a schematic vertical cross section of part of a refrigerator cabinet employing a heating/cooling system of the invention.
Referring to the drawing, a semiconductor Peltier device (10) (as is available commercially, e.g. from Melcor Inc., Trenton, New Jersey, USA) having a hot surface (H) and a cold surface (C) is situated within a casing (11) having a basal portion (12) a top wall (13) and a back wall (14). Back wall (14) is provided with apertures (15) for the removal of moist air. Cold surface (C) is provided with heat exchange fins (16) which are angled downwardly, towards the basal portion (12) of casing (11) . Hot surface (H) is also provided with associated heat exchange fins (17) . These project horizontally with respect to hot surface (H) .
Wick (18) is made of close-weave polypropylene ribbon (as is available commercially from Hattersley (Narrow Fabrics) Ltd. , Keighley, West Yorkshire) and extends from beneath the region of heat exchange fins (16) along basal portion (12) and up between back wall (14) and heat exchange fins (17) . The system operates as follows. The semiconductor Peltier device (10) is actuated. The hot surface (H) rises to a temperature above ambient, and the cold surface (C) falls to a temperature below ambient. Electric fans (not shown) are disposed to force air across heat exchange fins (16) and heat exchange fins (17) .
Moisture builds up as a result of condensation on cold surface (C) and associated heat exchange fins (16). This drains down under gravity, directed by the downward slope of fins (16) and is absorbed by wick (18) . Moisture held in wick (18) is conducted through it by capillary action, and thus passes along the surface of basal portion (12) towards hot surface (H) .
In the region of hot surface (H) , wick (18) forms a layer positioned between heat exchange fins (17) and back wall (14) . The above-ambient temperature of hot surface (H) and associated heat exchange fins (17) promotes evaporation of moisture held in wick (18) . Moist air is dissipated into the surrounding atmosphere, through apertures (15) provided in back wall (14) .

Claims

1. A heating/cooling system comprising a heating/cooling device having, in use, a hot surface and a cool surface, and capillary transfer means arranged with respect to the surfaces so as to conduct moisture from the vicinity of the cool surface to the vicinity of the hot surface for evaporation therefrom.
2. A system according to claim 1 in which the capillary transfer means comprises a wick.
3. A system according to claim 2 in which the wick comprises a fabric.
4. A system according to claim 3 in which the fabric is a close weave fabric.
5. A system according to claim 4 in which the close weave fabric is a polypropylene ribbon.
6. A system according to any one of claims 1 to 5 in which the heating/cooling device is a thermoelectric heating/cooling device.
7. A system according to claim 6 in which, the thermoelectric heating/cooling device is a semiconductor Peltier effect device.
8. A system according to claim 6 or claim 7 which also comprises a plurality of heat exchange fins in association with the cool surface.
9. A system according to claim 8 in which the fins are oriented at an angle with respect to the surface such that, in use, moisture accumulating thereon is directed downwards.
10. A system according to claim 8 or claim 9 in which the heat exchange fins are provided with a coating of hydrophobic material.
11. A system according to claim 10 in which hydrophobic material is fluorethylene propylene.
12. A system according to any one of claims 8 to 11 in which the capillary transfer means is arranged to contact the heat exchange fins.
13. A system according to claim 9 in which the capillary transfer means is oriented so as to intercept moisture directed from the fins.
14. A system according to any one of the preceding claims which also comprises heat exchange fins in association with the hot surface.
15. A system according to claim 14 which also comprises a fan which increases the convective flow of air over and around the fins.
16. A system according to claim 14 or 15 in which the capillary transfer means is arranged to contact the heat exchange fins.
17. A heating/cooling unit comprising a refrigerator cabinet which houses a heating/cooling device according to any one of claims 1 to 16.
PCT/GB1994/000469 1993-03-12 1994-03-10 Heating/cooling systems WO1994020801A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9305149.8 1993-03-12
GB939305149A GB9305149D0 (en) 1993-03-12 1993-03-12 Heating/cooling systems

Publications (1)

Publication Number Publication Date
WO1994020801A1 true WO1994020801A1 (en) 1994-09-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1994/000469 WO1994020801A1 (en) 1993-03-12 1994-03-10 Heating/cooling systems

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GB (1) GB9305149D0 (en)
WO (1) WO1994020801A1 (en)

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0856137A1 (en) * 1995-10-17 1998-08-05 Marlow Industries, Inc. Thermoelectric device with evaporating/condensing heat exchanger
WO2003073028A1 (en) * 2002-02-28 2003-09-04 Paradis Marc A Method and apparatus for cooling and dehumidifying air
EP1429089A2 (en) * 1998-05-12 2004-06-16 Amerigon, Inc. Thermoelectric heat exchanger
WO2004113808A1 (en) * 2003-06-20 2004-12-29 Australasian Sign Company Pty Ltd An improved packaged beverage refrigerator
US7272936B2 (en) 2004-12-28 2007-09-25 Steve Feher Variable temperature cushion and heat pump
CN103390861A (en) * 2013-08-06 2013-11-13 华北电力大学（保定） Dehumidifying device of power grid terminal box
WO2014195720A1 (en) * 2013-06-05 2014-12-11 Mars, Incorporated Cool storage cabinet with improved efficiency
US9027635B2 (en) 2004-08-24 2015-05-12 Waters Technologies Corporation Heat exchange surface including a hydrophobic coating layer
US9121414B2 (en) 2010-11-05 2015-09-01 Gentherm Incorporated Low-profile blowers and methods
US9310112B2 (en) 2007-05-25 2016-04-12 Gentherm Incorporated System and method for distributed thermoelectric heating and cooling
US9335073B2 (en) 2008-02-01 2016-05-10 Gentherm Incorporated Climate controlled seating assembly with sensors
US9365090B2 (en) 2004-05-10 2016-06-14 Gentherm Incorporated Climate control system for vehicles using thermoelectric devices
US9447994B2 (en) 2008-10-23 2016-09-20 Gentherm Incorporated Temperature control systems with thermoelectric devices
CN106066111A (en) * 2015-04-21 2016-11-02 日立空调·家用电器株式会社 Refrigerator
CN106352650A (en) * 2016-08-30 2017-01-25 海信（山东）冰箱有限公司 Refrigerating apparatus with humidifying function and humidifying method thereof
US9555686B2 (en) 2008-10-23 2017-01-31 Gentherm Incorporated Temperature control systems with thermoelectric devices
US9622588B2 (en) 2008-07-18 2017-04-18 Gentherm Incorporated Environmentally-conditioned bed
US9662962B2 (en) 2013-11-05 2017-05-30 Gentherm Incorporated Vehicle headliner assembly for zonal comfort
US9685599B2 (en) 2011-10-07 2017-06-20 Gentherm Incorporated Method and system for controlling an operation of a thermoelectric device
US9857107B2 (en) 2006-10-12 2018-01-02 Gentherm Incorporated Thermoelectric device with internal sensor
US9863672B2 (en) 2005-04-08 2018-01-09 Gentherm Incorporated Thermoelectric-based air conditioning system
US9989267B2 (en) 2012-02-10 2018-06-05 Gentherm Incorporated Moisture abatement in heating operation of climate controlled systems
US10005337B2 (en) 2004-12-20 2018-06-26 Gentherm Incorporated Heating and cooling systems for seating assemblies
US10106011B2 (en) 2009-05-18 2018-10-23 Gentherm Incorporated Temperature control system with thermoelectric device
CN108794845A (en) * 2017-04-27 2018-11-13 国安瑞（北京）科技有限公司 A kind of high heat conduction anti-dewing capillary network material and preparation method thereof
GB2566602A (en) * 2017-07-31 2019-03-20 Univ Nottingham Cooling system
US10405667B2 (en) 2007-09-10 2019-09-10 Gentherm Incorporated Climate controlled beds and methods of operating the same
US10603976B2 (en) 2014-12-19 2020-03-31 Gentherm Incorporated Thermal conditioning systems and methods for vehicle regions
US10625566B2 (en) 2015-10-14 2020-04-21 Gentherm Incorporated Systems and methods for controlling thermal conditioning of vehicle regions
US10991869B2 (en) 2018-07-30 2021-04-27 Gentherm Incorporated Thermoelectric device having a plurality of sealing materials
US11033058B2 (en) 2014-11-14 2021-06-15 Gentherm Incorporated Heating and cooling technologies
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
US11240883B2 (en) 2014-02-14 2022-02-01 Gentherm Incorporated Conductive convective climate controlled seat
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies

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Cited By (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0856137A4 (en) * 1995-10-17 1998-11-25 Marlow Ind Inc Thermoelectric device with evaporating/condensing heat exchanger
US6003319A (en) * 1995-10-17 1999-12-21 Marlow Industries, Inc. Thermoelectric refrigerator with evaporating/condensing heat exchanger
EP0856137A1 (en) * 1995-10-17 1998-08-05 Marlow Industries, Inc. Thermoelectric device with evaporating/condensing heat exchanger
EP1429089A2 (en) * 1998-05-12 2004-06-16 Amerigon, Inc. Thermoelectric heat exchanger
EP1429089A3 (en) * 1998-05-12 2005-07-06 Amerigon, Inc. Thermoelectric heat exchanger
US7178344B2 (en) 1998-05-12 2007-02-20 Amerigon, Inc. Thermoelectric heat exchanger
WO2003073028A1 (en) * 2002-02-28 2003-09-04 Paradis Marc A Method and apparatus for cooling and dehumidifying air
WO2004113808A1 (en) * 2003-06-20 2004-12-29 Australasian Sign Company Pty Ltd An improved packaged beverage refrigerator
US9365090B2 (en) 2004-05-10 2016-06-14 Gentherm Incorporated Climate control system for vehicles using thermoelectric devices
US9027635B2 (en) 2004-08-24 2015-05-12 Waters Technologies Corporation Heat exchange surface including a hydrophobic coating layer
US10005337B2 (en) 2004-12-20 2018-06-26 Gentherm Incorporated Heating and cooling systems for seating assemblies
US7272936B2 (en) 2004-12-28 2007-09-25 Steve Feher Variable temperature cushion and heat pump
US9863672B2 (en) 2005-04-08 2018-01-09 Gentherm Incorporated Thermoelectric-based air conditioning system
US9857107B2 (en) 2006-10-12 2018-01-02 Gentherm Incorporated Thermoelectric device with internal sensor
US9310112B2 (en) 2007-05-25 2016-04-12 Gentherm Incorporated System and method for distributed thermoelectric heating and cooling
US10464391B2 (en) 2007-05-25 2019-11-05 Gentherm Incorporated System and method for distributed thermoelectric heating and cooling
US10405667B2 (en) 2007-09-10 2019-09-10 Gentherm Incorporated Climate controlled beds and methods of operating the same
US9335073B2 (en) 2008-02-01 2016-05-10 Gentherm Incorporated Climate controlled seating assembly with sensors
US9651279B2 (en) 2008-02-01 2017-05-16 Gentherm Incorporated Condensation and humidity sensors for thermoelectric devices
US10228166B2 (en) 2008-02-01 2019-03-12 Gentherm Incorporated Condensation and humidity sensors for thermoelectric devices
US9622588B2 (en) 2008-07-18 2017-04-18 Gentherm Incorporated Environmentally-conditioned bed
US11297953B2 (en) 2008-07-18 2022-04-12 Sleep Number Corporation Environmentally-conditioned bed
US10226134B2 (en) 2008-07-18 2019-03-12 Gentherm Incorporated Environmentally-conditioned bed
US9555686B2 (en) 2008-10-23 2017-01-31 Gentherm Incorporated Temperature control systems with thermoelectric devices
US9447994B2 (en) 2008-10-23 2016-09-20 Gentherm Incorporated Temperature control systems with thermoelectric devices
US10106011B2 (en) 2009-05-18 2018-10-23 Gentherm Incorporated Temperature control system with thermoelectric device
US11203249B2 (en) 2009-05-18 2021-12-21 Gentherm Incorporated Temperature control system with thermoelectric device
US9121414B2 (en) 2010-11-05 2015-09-01 Gentherm Incorporated Low-profile blowers and methods
US10288084B2 (en) 2010-11-05 2019-05-14 Gentherm Incorporated Low-profile blowers and methods
US11408438B2 (en) 2010-11-05 2022-08-09 Gentherm Incorporated Low-profile blowers and methods
US9685599B2 (en) 2011-10-07 2017-06-20 Gentherm Incorporated Method and system for controlling an operation of a thermoelectric device
US10208990B2 (en) 2011-10-07 2019-02-19 Gentherm Incorporated Thermoelectric device controls and methods
US9989267B2 (en) 2012-02-10 2018-06-05 Gentherm Incorporated Moisture abatement in heating operation of climate controlled systems
US10495322B2 (en) 2012-02-10 2019-12-03 Gentherm Incorporated Moisture abatement in heating operation of climate controlled systems
WO2014195720A1 (en) * 2013-06-05 2014-12-11 Mars, Incorporated Cool storage cabinet with improved efficiency
CN103390861A (en) * 2013-08-06 2013-11-13 华北电力大学（保定） Dehumidifying device of power grid terminal box
US10266031B2 (en) 2013-11-05 2019-04-23 Gentherm Incorporated Vehicle headliner assembly for zonal comfort
US9662962B2 (en) 2013-11-05 2017-05-30 Gentherm Incorporated Vehicle headliner assembly for zonal comfort
US11240883B2 (en) 2014-02-14 2022-02-01 Gentherm Incorporated Conductive convective climate controlled seat
US11240882B2 (en) 2014-02-14 2022-02-01 Gentherm Incorporated Conductive convective climate controlled seat
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
US11033058B2 (en) 2014-11-14 2021-06-15 Gentherm Incorporated Heating and cooling technologies
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies
US10603976B2 (en) 2014-12-19 2020-03-31 Gentherm Incorporated Thermal conditioning systems and methods for vehicle regions
US11358433B2 (en) 2014-12-19 2022-06-14 Gentherm Incorporated Thermal conditioning systems and methods for vehicle regions
CN106066111A (en) * 2015-04-21 2016-11-02 日立空调·家用电器株式会社 Refrigerator
US10625566B2 (en) 2015-10-14 2020-04-21 Gentherm Incorporated Systems and methods for controlling thermal conditioning of vehicle regions
CN106352650A (en) * 2016-08-30 2017-01-25 海信（山东）冰箱有限公司 Refrigerating apparatus with humidifying function and humidifying method thereof
CN108794845A (en) * 2017-04-27 2018-11-13 国安瑞（北京）科技有限公司 A kind of high heat conduction anti-dewing capillary network material and preparation method thereof
GB2566602A (en) * 2017-07-31 2019-03-20 Univ Nottingham Cooling system
US11223004B2 (en) 2018-07-30 2022-01-11 Gentherm Incorporated Thermoelectric device having a polymeric coating
US11075331B2 (en) 2018-07-30 2021-07-27 Gentherm Incorporated Thermoelectric device having circuitry with structural rigidity
US10991869B2 (en) 2018-07-30 2021-04-27 Gentherm Incorporated Thermoelectric device having a plurality of sealing materials
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board

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