WO1988000429A1 - Parallel-flow air system for cooling electronic equipment - Google Patents

Parallel-flow air system for cooling electronic equipment Download PDF

Info

Publication number
WO1988000429A1
WO1988000429A1 PCT/US1987/001335 US8701335W WO8800429A1 WO 1988000429 A1 WO1988000429 A1 WO 1988000429A1 US 8701335 W US8701335 W US 8701335W WO 8800429 A1 WO8800429 A1 WO 8800429A1
Authority
WO
WIPO (PCT)
Prior art keywords
card
parallel
air system
ducts
duct
Prior art date
Application number
PCT/US1987/001335
Other languages
French (fr)
Inventor
Grant Merrell Smith
Samuel Richard Romania
Ronald Thomas Gibbs
Original Assignee
Unisys Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unisys Corporation filed Critical Unisys Corporation
Priority to AT87904176T priority Critical patent/ATE99857T1/en
Priority to DE87904176T priority patent/DE3788715T2/en
Priority to JP62503796A priority patent/JPH0760955B2/en
Publication of WO1988000429A1 publication Critical patent/WO1988000429A1/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554Forced ventilation of a gaseous coolant
    • H05K7/20572Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00Heat exchange
    • Y10S165/908Fluid jets

Definitions

  • Thermal design considerations for electronic equipment involve primary concerns for performance, cost, reliability and low maintenance. In practice, performance requirements, on the one hand, are weighed against the remaining concerns, on the other.
  • the cooling problem is further exacerbated, by the increase in power and size of the integrated circuit packages.
  • the high power levels of the last mentioned devices result in higher than-average local temperature rises. Each pocket of high temperature air is directed by the air stream onto the next package. Also, as the devices become physically larger, they tend to block the flow of cooling air from the downstream packages. Because of the last mentioned thermal effects, every package forms a downstream wake of high temperature, low velocity air. With the high density packaging of present day electronic equipment, it is apparent that the downstream packages will fall directly within this wake. Moreover, these thermal effects become more .difficult to control in proportion to the increase in physical size and power dissipation of the integrated circuit packages.
  • the package and card power levels may overwhelm the cooling reasonably expected to be provided by the above-described, serially directed air stream.
  • more exotic cooling systems such as those employing a water approach may be considered, notwithstanding the increase in complexity and cost and decrease in reliability of such systems.
  • an arrangement for directing cooling air simultaneously from individual outlets upon a respective plurality of integrated circuit packages generally utilize heat sink members disposed thereon to enhance the cooling effect.
  • the aforementioned arrangement comprises the integral assembly of a printed circuit board or card and a ducting structure arranged in parallel, spaced-apart relationship.
  • the card includes a plurality of integrated circuit packages, with heat sinks mounted thereon, and disposed in parallel, spaced-apart columns.
  • the ducting structure includes a card plenum leading into a plurality of finger-like ducts arranged to coincide with the columns of integrated circuit packages.
  • Each of the ducts has a plurality of outlets, that is, ' apertures formed therein — the apertures being homologously positioned with respect to the packages.
  • a cabinet is provided having a rack for holding the card-duct assemblies of the present invention.
  • Blower scrolls located at the bottom of the cabinet provide a source of high velocity, large volume cooling air flow, which is delivered to a central cabinet plenum.
  • the individual card plenums of the respective card-duct assemblies interface with the central plenum in an air-sealed manner.
  • air from the blower scrolls travels into the finger-like ducts, exits the apertures thereof, and is directed upon the respective surfaces of the individual heat sink members.
  • the present parallel system offers highly significant advantages, not the least of which is that a high power card can be cooled with air. Also, the present system insures that every integrated circuit package in the card rack will receive cooling air at the blower inlet air temperature, while the temperature difference between packages is minimized. The system also requires a much lower volumetric air flow per watt of power dissipated, and the average device temperature is lower than that which can be achieved with a serial air system.
  • each of the cards is provided with its own cooling system as an integral part of its assembly.
  • Each card-duct assembly is comp.act in form, such that a large number of such assemblies may be mounted in close-packed relation to each other within the cabinet. Installation and removal of a card-duct assembly from a card rack is readily accomplished without disturbing the remaining assemblies.
  • FIG. 1 is a pictorial illustration of the parallel air cooling system of the present invention.
  • FIG. 2 is a partial side view of the card-duct assemblies of the system of FIG. 1.
  • FIG. 3 is a section view taken along lines 3-3 of FIG. 2 illustrating the surface of the ducts having air outlets disposed adjacent the integrated circuit packages.
  • FIG. 4 is an exploded view depicting an integrated circuit package with its attendant heat sink member. Detailed Description of the Preferred Embodiment
  • FIG. 1 depicts an actual working environment for the parallel cooling system of the present invention.
  • a cabinet 10 is shown with its exterior walls partially cut away to illustrate a card rack 12 containing a plurality of card-duct assemblies 14.
  • louvers 20 draw surrounding air into the cabinet through louvers 20.
  • a large volume, fast moving air stream is delivered by the scrolls to a central plenum 22.
  • each of the card-duct assemblies 14 mounted in card rack 12 is comprised of a printed circuit board or card 24 rigidly fastened to a ducting structure 26 having a card plenum 26a and a plurality of finger-like ducts 26b opening thereinto.
  • Each card 24 and its associated ducting structure 26 are held in proximate, parallel, spaced-apart relation by substantially U-shaped members 28, as seen particularly in FIG. 2.
  • one leg of each of the members 28 is elongated to engage the groove in each of the rack support channels 30.
  • Each card-duct assembly 14 further includes a projection 32 for engaging the groove in each of the channels 34 mounted on the exterior surface of the central plenum 22. Electrical connections for each card result from the mating of connectors 36 mounted respectively on the card-duct assemblies 14 and the cabinet backplane 38.
  • each of the cards 24 has mounted thereon a plurality of integrated circuit packages 40 with respective heat sink members 42 affixed thereto.
  • the packages 40 are arranged generally in columns which coincide with the placement of the adjacent finger-like ducts 26b.
  • each of the latter ducts has a plurality of apertures 44 formed therein — the apertures 44 being homologously disposed with respect to the heat sink members 42.
  • the scrolls 16 (FIG. 1) deliver cooling air to the central plenum 22. From the latter, air is pushed into the openings of card plenums 26a via slots 46 in the central plenum 22.
  • each of the finger-like ducts 26b As the air traverses each of the finger-like ducts 26b, individual air streams are directed via apertures 44 (FIG. 3) over the respective heat sink members 42 of the integrated circuit packages 40. The heated air then exits the cabinet 10 via openings 48 in the upper pr ⁇ r-fcion thereof.
  • heat sink members 42 are used to better dissipate the heat generated in the packages 40.
  • the form and configuration of heat sinks vary appreciably. While the present invention is not to be considered limited to the heat sinks 42 depicted in FIG. 4, the structure of the latter lends itself to the present system.
  • each of the heat sink members 42 includes a -pair of metallic corrugated sections 42a separated by .an opening 50 and supported within a frame 52. Cooling air exiting an aperture 44 in a finger-like duct 26b tends to enter the opening 50 in the heat sink 42 and is then carried in opposite directions by sections 42a across the heat sink, where it exits the latter.
  • the cross section of the duct is stepped, rather than constant. That is, the cross section of duct 26b is a maximum at its extremity adjacent the card plenum 26a and decreases in steps to the approximate midpoint of the duct.
  • the duct 26b has a minimum cross section from the latter point to its opposite extremity.
  • the reason for the stepped finger-like duct is that this configuration yields the highest total air flow rate at the lowest plenum pressure and with the least variability from one aperture 44 to another along the duct.
  • a constant cross section duct requires a high plenum pressure and exhibits considerable variability in individual air flow.
  • the stepped cross section duct 26b is preferred in the present system because it is superior to the constant cross section in maintaining a uniform differential pressure across all of the apertures 44.
  • apertures 44 may be chosen in accordance with the power dissipations of the respective integrated circuit packages 40.
  • package 40a is of a higher power type , than the other packages. Accordingly, aperture 44a is larger to provide the volume of air needed to cool the chip housed in package 40a to substantially the same temperature as the chips in the other packages.

Abstract

An air cooling system which has the ability to maintain acceptable temperature levels in present day high density electronic equipment. More specifically, the system provides an arrangement whereby each printed circuit card (24) has its own ducting structure (26) affixed thereto to form an integral unit. Cooling air streams are directed simultaneously from individual apertures (44) in the ducting structure upon a respective plurality of integrated circuit package assemblies (40) mounted on the card.

Description

PARALLEL-FLOW AIR SYSTEM FOR COOLING ELECTRONIC EQUIPMENT Background of the Invention
Thermal design considerations for electronic equipment ,' such as a large scale computer system, involve primary concerns for performance, cost, reliability and low maintenance. In practice, performance requirements, on the one hand, are weighed against the remaining concerns, on the other. A system characterized by simplicity, but having the ability to provide adquate cooling of the electronic equipment, represents the best solution to the thermal problem. Air cooling is generally regarded as the most simple and reliable system. However, as the power density on the computer cards continually increases, it becomes increasingly more difficult to cool with air.
In the typical forced air cooling scheme, air is blown across the computer card in a direction parallel to the planar surface of the card. As the air travels across the card, it picks up heat in serial fashion, from the integrated circuit packages mounted thereon and the air increases in temperature. With the rise in card power levels, large volumes of air are needed to keep the air temperature rise from exceeding acceptable levels.
The cooling problem is further exacerbated, by the increase in power and size of the integrated circuit packages. The high power levels of the last mentioned devices result in higher than-average local temperature rises. Each pocket of high temperature air is directed by the air stream onto the next package. Also, as the devices become physically larger, they tend to block the flow of cooling air from the downstream packages. Because of the last mentioned thermal effects, every package forms a downstream wake of high temperature, low velocity air. With the high density packaging of present day electronic equipment, it is apparent that the downstream packages will fall directly within this wake. Moreover, these thermal effects become more .difficult to control in proportion to the increase in physical size and power dissipation of the integrated circuit packages. Ultimately, in new computer design applications, the package and card power levels may overwhelm the cooling reasonably expected to be provided by the above-described, serially directed air stream. In such a case, more exotic cooling systems, such as those employing a water approach may be considered, notwithstanding the increase in complexity and cost and decrease in reliability of such systems.
What is desired is a cooling system which utilizes air as the cooling medium, but which differs from the conventional approach in its ability to maintain acceptable temperature levels in present day high density electronic equipment. The parallel-flow air system of the present invention fills such a need. Sum ary of the Invention
In accordance with the present invention, there is provided an arrangement for directing cooling air simultaneously from individual outlets upon a respective plurality of integrated circuit packages. The latter packages generally utilize heat sink members disposed thereon to enhance the cooling effect.
The aforementioned arrangement comprises the integral assembly of a printed circuit board or card and a ducting structure arranged in parallel, spaced-apart relationship. More specifically, the card includes a plurality of integrated circuit packages, with heat sinks mounted thereon, and disposed in parallel, spaced-apart columns. The ducting structure includes a card plenum leading into a plurality of finger-like ducts arranged to coincide with the columns of integrated circuit packages. Each of the ducts has a plurality of outlets, that is,' apertures formed therein — the apertures being homologously positioned with respect to the packages. In an actual working environment, a cabinet is provided having a rack for holding the card-duct assemblies of the present invention. Blower scrolls located at the bottom of the cabinet provide a source of high velocity, large volume cooling air flow, which is delivered to a central cabinet plenum. The individual card plenums of the respective card-duct assemblies interface with the central plenum in an air-sealed manner. Thus, air from the blower scrolls travels into the finger-like ducts, exits the apertures thereof, and is directed upon the respective surfaces of the individual heat sink members.
In contrast to the conventional serial air cooling scheme mentioned hereinbefore, the present parallel system offers highly significant advantages, not the least of which is that a high power card can be cooled with air. Also, the present system insures that every integrated circuit package in the card rack will receive cooling air at the blower inlet air temperature, while the temperature difference between packages is minimized. The system also requires a much lower volumetric air flow per watt of power dissipated, and the average device temperature is lower than that which can be achieved with a serial air system.
An important feature of the present invention is that each of the cards is provided with its own cooling system as an integral part of its assembly. Each card-duct assembly is comp.act in form, such that a large number of such assemblies may be mounted in close-packed relation to each other within the cabinet. Installation and removal of a card-duct assembly from a card rack is readily accomplished without disturbing the remaining assemblies. Other features and advantages of the present invention will become apparent from the detailed description thereof which follows. Brief Description of the Drawing
FIG. 1 is a pictorial illustration of the parallel air cooling system of the present invention.
FIG. 2 is a partial side view of the card-duct assemblies of the system of FIG. 1.
FIG. 3 is a section view taken along lines 3-3 of FIG. 2 illustrating the surface of the ducts having air outlets disposed adjacent the integrated circuit packages.
FIG. 4 is an exploded view depicting an integrated circuit package with its attendant heat sink member. Detailed Description of the Preferred Embodiment
FIG. 1 depicts an actual working environment for the parallel cooling system of the present invention. A cabinet 10 is shown with its exterior walls partially cut away to illustrate a card rack 12 containing a plurality of card-duct assemblies 14. A pair of blower scrolls 16, driven by a motor 18, and located at the bottom of cabinet 10, draw surrounding air into the cabinet through louvers 20. Thus, a large volume, fast moving air stream is delivered by the scrolls to a central plenum 22.
With continued general reference to FIG. 1 and more specific reference to FIGS. 2 and 3, each of the card-duct assemblies 14 mounted in card rack 12 is comprised of a printed circuit board or card 24 rigidly fastened to a ducting structure 26 having a card plenum 26a and a plurality of finger-like ducts 26b opening thereinto. Each card 24 and its associated ducting structure 26 are held in proximate, parallel, spaced-apart relation by substantially U-shaped members 28, as seen particularly in FIG. 2. Moreover, one leg of each of the members 28 is elongated to engage the groove in each of the rack support channels 30. Each card-duct assembly 14 further includes a projection 32 for engaging the groove in each of the channels 34 mounted on the exterior surface of the central plenum 22. Electrical connections for each card result from the mating of connectors 36 mounted respectively on the card-duct assemblies 14 and the cabinet backplane 38.
As seen particularly in FIGS. 1 and 2, each of the cards 24 has mounted thereon a plurality of integrated circuit packages 40 with respective heat sink members 42 affixed thereto. The packages 40 are arranged generally in columns which coincide with the placement of the adjacent finger-like ducts 26b. As seen in FIG. 3, each of the latter ducts has a plurality of apertures 44 formed therein — the apertures 44 being homologously disposed with respect to the heat sink members 42. In operation, the scrolls 16 (FIG. 1) deliver cooling air to the central plenum 22. From the latter, air is pushed into the openings of card plenums 26a via slots 46 in the central plenum 22. As the air traverses each of the finger-like ducts 26b, individual air streams are directed via apertures 44 (FIG. 3) over the respective heat sink members 42 of the integrated circuit packages 40. The heated air then exits the cabinet 10 via openings 48 in the upper prαr-fcion thereof. As is customary, heat sink members 42 are used to better dissipate the heat generated in the packages 40. In general, the form and configuration of heat sinks vary appreciably. While the present invention is not to be considered limited to the heat sinks 42 depicted in FIG. 4, the structure of the latter lends itself to the present system. Thus, each of the heat sink members 42 includes a -pair of metallic corrugated sections 42a separated by .an opening 50 and supported within a frame 52. Cooling air exiting an aperture 44 in a finger-like duct 26b tends to enter the opening 50 in the heat sink 42 and is then carried in opposite directions by sections 42a across the heat sink, where it exits the latter.
As to the design of the finger-like ducts 26b, reference to FIG. 1 reveals that the cross section of the duct is stepped, rather than constant. That is, the cross section of duct 26b is a maximum at its extremity adjacent the card plenum 26a and decreases in steps to the approximate midpoint of the duct. The duct 26b has a minimum cross section from the latter point to its opposite extremity. The reason for the stepped finger-like duct is that this configuration yields the highest total air flow rate at the lowest plenum pressure and with the least variability from one aperture 44 to another along the duct. Conversely, a constant cross section duct requires a high plenum pressure and exhibits considerable variability in individual air flow. For example, low flow rates issue from apertures 44 near the card plenum 26a of uniform cross section ducts — such low flow rates providing inadequate cooling for the integrated circuit packages 40 associated therewith. In summary, the stepped cross section duct 26b is preferred in the present system because it is superior to the constant cross section in maintaining a uniform differential pressure across all of the apertures 44.
Another significant feature of the present invention is that the individual volumes of cooling air provided by apertures 44 may be chosen in accordance with the power dissipations of the respective integrated circuit packages 40. Thus, as seen in FIGS. 2 and 3, it is assumed that package 40a is of a higher power type, than the other packages. Accordingly, aperture 44a is larger to provide the volume of air needed to cool the chip housed in package 40a to substantially the same temperature as the chips in the other packages.
In conclusion, there has been described an effective air cooling system for high density electronic packaging applications. It is apparent that depending upon particular circumstances, changes and modifications of the system as described herein may be required. Such changes and modifications, insofar as they are not departures from the true scope of the invention, are intended to be covered by the claims which follow.

Claims

What is claimed is:
1. A parallel-flow air system disposed in a cabinet having a source of cooling air comprising: at least one card-duct assembly including a printed circuit card and an associated ducting structure, means for 5 retaining^said card and said ducting structure in fixed, parallel, spaced-apart relationship, said card having a plurality of integrated circuit package assemblies mounted thereon in a predetermined spaced-apart columnar relationship, said ducting structure lφ- including a plurality of finger-like ducts disposed in spatial correspondence with the columnar arrangement of said package assemblies, each of said ducts having a plurality of apertures homologously positioned with respect to said package assemblies, and
15^ means including said source of cooling air for causing air flow into said ducts and out of said apertures, thereby directing individual streams of cooling air simultaneously upon the respective package assemblies.
2. A parallel-flow air system as defined in Claim 1 wherein each of said integrated circuit package assemblies includes a heat sink member affixed to an integrated circuit package.
3. A parallel-flow air system as defined in Claim 2 wherein said means for causing air flow into said ducts includes a central plenum for receiving cooling air from said source thereof, said central plenum having a slotted opening therein for each card-duct assembly, said ducting structure including a card plenum, said card plenum having respective openings into said ducts and a further opening into said central plenum via said slotted opening in the latter.
4. A parallel-flow air system as defined in Claim 3 further characterized in that each of said finger-like ducts exhibits a stepped cross section, the cross section of the duct being maximum at its extremity contiguous with said card plenum, and minimum at its opposite extremity, whereby the rates of air flow at the respective apertures of the duct are substantially equal.
5. A parallel-flow air system as defined in Claim 4 further including a rack, channel means disposed opposite each other respectively on said rack and the surface of said central plenum, said card-duct assembly including means for engaging said channel means, whereby said card-duct assembly may be slidably installed within said cabinet.
6. A parallel-flow air system as defined in Claim 5 further including a backplane, at least one electrical connector installed on said backplane, said card having at least one electrical connector mounted thereon for engagement with said electrical connector on said backplane when said card-duct assembly is slidably installed within said cabinet.
7. A parallel-flow air system as defined in Claim 6 wherein said heat sink member is comprised of a frame, a pair of metallic corrugated sections mounted in said frame in spaced-apart fashion such that an opening is formed therebetween, each of said streams of cooling air emanating from said apertures being directed substantially toward the last mentioned opening in said heat sink member.
8. A parallel-flow air system as defined in Claim 7 further characterized in that said means for retaining said card and said ducting structure in fixed, parallel, spaced-apart relationship is a U-shaped member, said latter member having an elongated leg for engaging said channel means on said rack, said card-duct assembly having a projection for engaging said channel means on the surface of said central plenum.
9. A parallel-flow air system as defined in Claim 8 wherein the cross section of each of said ducts is a maximum at its extremity contiguous with said card plenum and decreases in steps to the approximate midpoint of the duct and is a minimum from the last mentioned point to its opposite extremity.
10. A parallel-flow air system as defined in Claim 9 wherein the stepped cross section of the finger-like duct is rectangular.
PCT/US1987/001335 1986-07-03 1987-06-08 Parallel-flow air system for cooling electronic equipment WO1988000429A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AT87904176T ATE99857T1 (en) 1986-07-03 1987-06-08 PARALLEL FLOW AIR SYSTEM FOR COOLING OF ELECTRONIC EQUIPMENT.
DE87904176T DE3788715T2 (en) 1986-07-03 1987-06-08 AIR SYSTEM WITH PARALLEL FLOW FOR COOLING ELECTRONIC EQUIPMENT.
JP62503796A JPH0760955B2 (en) 1986-07-03 1987-06-08 Parallel airflow device for cooling electronics

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US881,725 1986-07-03
US06/881,725 US4674004A (en) 1986-07-03 1986-07-03 Parallel-flow air system for cooling electronic equipment

Publications (1)

Publication Number Publication Date
WO1988000429A1 true WO1988000429A1 (en) 1988-01-14

Family

ID=25379073

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1987/001335 WO1988000429A1 (en) 1986-07-03 1987-06-08 Parallel-flow air system for cooling electronic equipment

Country Status (5)

Country Link
US (1) US4674004A (en)
EP (1) EP0274486B1 (en)
JP (1) JPH0760955B2 (en)
DE (1) DE3788715T2 (en)
WO (1) WO1988000429A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2651636A1 (en) * 1989-09-06 1991-03-08 Segem Modular electronic rack with built-in forced cooling
EP0447819A2 (en) * 1990-03-19 1991-09-25 International Business Machines Corporation Multileveled electronic assembly with cooling means

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4777560A (en) * 1987-09-02 1988-10-11 Microelectronics And Computer Technology Corporation Gas heat exchanger
US4851965A (en) * 1987-03-09 1989-07-25 Unisys Corporation Directed air management system for cooling multiple heat sinks
JPS6474798A (en) * 1987-09-16 1989-03-20 Nec Corp Integrated type power amplifier
US4872088A (en) * 1988-08-29 1989-10-03 Motorola, Inc. Radial mounting for stacked wafer modules with cooling
US5063476A (en) * 1989-12-05 1991-11-05 Digital Equipment Corporation Apparatus for controlled air-impingement module cooling
JP2544497B2 (en) * 1990-02-28 1996-10-16 株式会社日立製作所 Computer cooling device
US5196989A (en) * 1990-04-09 1993-03-23 Trw Inc. Rigid circuit board structure using impingement cooling
US5067047A (en) * 1990-05-11 1991-11-19 At&T Bell Laboratories Circuit pack with inboard jet cooling
JP2934493B2 (en) * 1990-10-24 1999-08-16 株式会社日立製作所 Electronic equipment cooling device
JP2653913B2 (en) * 1990-11-28 1997-09-17 三菱電機株式会社 Burn-in device and burn-in board insertion / removal method
JPH04196395A (en) * 1990-11-28 1992-07-16 Hitachi Ltd Electronic computer and cooling device thereof
US5101320A (en) * 1991-01-22 1992-03-31 Hayes Microcomputer Products, Inc. Apparatus for rack mounting multiple circuit boards
US5207613A (en) * 1991-07-08 1993-05-04 Tandem Computers Incorporated Method and apparatus for mounting, cooling, interconnecting, and providing power and data to a plurality of electronic modules
US5237484A (en) * 1991-07-08 1993-08-17 Tandem Computers Incorporated Apparatus for cooling a plurality of electronic modules
US5208729A (en) * 1992-02-14 1993-05-04 International Business Machines Corporation Multi-chip module
US5218513A (en) * 1992-08-04 1993-06-08 Digital Equipment Corporation Plenum for air-impingement cooling of electronic components
US5592363A (en) * 1992-09-30 1997-01-07 Hitachi, Ltd. Electronic apparatus
US5315479A (en) * 1993-01-21 1994-05-24 Cray Research, Inc. Air manifold for cooling electronic components
DE4309308C1 (en) * 1993-03-23 1994-04-14 Siemens Nixdorf Inf Syst Ventilation system for power electronic appts. housing - has 2 overlying ventilation units inserted between upper and lower halves of function module stack.
US5424914A (en) * 1993-11-24 1995-06-13 Unisys Corporation Through backplane impingement cooling apparatus
US5566377A (en) * 1995-07-10 1996-10-15 Lee; Richard Heat dissipating apparatus
US5574626A (en) * 1995-07-12 1996-11-12 Unisys Corporation Add-on heat sink
TW313277U (en) * 1996-07-19 1997-08-11 Mitac Int Corp Transmission interface bridge device
US5823005A (en) * 1997-01-03 1998-10-20 Ncr Corporation Focused air cooling employing a dedicated chiller
US5982619A (en) * 1997-06-12 1999-11-09 Harris Corporation Housing for diverse cooling configuration printed circuit cards
US6058379A (en) 1997-07-11 2000-05-02 Auction Source, L.L.C. Real-time network exchange with seller specified exchange parameters and interactive seller participation
JPH11135973A (en) * 1997-10-31 1999-05-21 Nec Corp Cooling device
US6031720A (en) * 1997-11-14 2000-02-29 The Panda Project Cooling system for semiconductor die carrier
US6130819A (en) * 1998-01-29 2000-10-10 Intel Corporation Fan duct module
JP3366244B2 (en) * 1998-02-04 2003-01-14 富士通株式会社 Electronics
US6253834B1 (en) 1998-10-28 2001-07-03 Hewlett-Packard Company Apparatus to enhance cooling of electronic device
US6359781B1 (en) 2000-04-21 2002-03-19 Dell Products L.P. Apparatus for cooling heat generating devices
US6452789B1 (en) * 2000-04-29 2002-09-17 Hewlett-Packard Company Packaging architecture for 32 processor server
US6538885B1 (en) * 2000-09-15 2003-03-25 Lucent Technologies Inc. Electronic circuit cooling with impingement plate
US7028753B2 (en) * 2000-09-20 2006-04-18 Hewlett-Packard Development Company, L.P. Apparatus to enhance cooling of electronic device
US6397931B1 (en) * 2001-02-27 2002-06-04 The United States Of America As Represented By The Secretary Of The Air Force Finned heat exchanger
US6525936B2 (en) * 2001-04-30 2003-02-25 Hewlett-Packard Company Air jet cooling arrangement for electronic systems
US6646878B2 (en) * 2001-07-16 2003-11-11 I-Bus Corporation Fail safe cooling system
US7401046B2 (en) * 2001-07-25 2008-07-15 Chicago Board Options Exchange System and method for displaying option market information
US20030025966A1 (en) * 2001-08-03 2003-02-06 Ross Halgren OSP hardened WDM network
US20030101128A1 (en) * 2001-11-29 2003-05-29 Abernethy William Randolph State tracking system for a basket trading system
WO2003056734A1 (en) 2001-12-21 2003-07-10 Redfern Broadband Networks, Inc. Improved wdm add/drop multiplexer module
US6795316B2 (en) * 2001-12-21 2004-09-21 Redfern Broadband Networks, Inc. WDM add/drop multiplexer module
US6603662B1 (en) * 2002-01-25 2003-08-05 Sun Microsystems, Inc. Computer cooling system
US6625033B1 (en) * 2002-04-01 2003-09-23 White Rock Networks Systems and methods for a reducing EMI in a communications switch component utilizing overlapping interfaces
US6819560B2 (en) 2002-07-11 2004-11-16 Storage Technology Corporation Forced air system for cooling a high density array of disk drives
US6925531B2 (en) * 2002-07-11 2005-08-02 Storage Technology Corporation Multi-element storage array
US6862173B1 (en) 2002-07-11 2005-03-01 Storage Technology Corporation Modular multiple disk drive apparatus
US8209254B2 (en) * 2002-07-26 2012-06-26 Ebs Group Limited Automated trading system
US6661666B1 (en) 2002-09-24 2003-12-09 Agilent Technologies, Inc. Device for enhancing the local cooling of electronic packages subject to laminar air flow
US7304855B1 (en) 2003-03-03 2007-12-04 Storage Technology Corporation Canister-based storage system
US6837063B1 (en) 2003-07-31 2005-01-04 Dell Products L.P. Power management of a computer with vapor-cooled processor
US7573713B2 (en) 2005-09-13 2009-08-11 Pacific Star Communications High velocity air cooling for electronic equipment
US7535861B2 (en) * 2005-10-07 2009-05-19 Pacific Star Communications Inc. Self-contained portable broadband communication system
US20080005380A1 (en) * 2006-02-21 2008-01-03 Pacific Star Communications, Inc. Integrated configuration and management of hardware devices
US7817589B2 (en) * 2006-02-21 2010-10-19 Pacific Star Communications, Inc. Self-contained portable broadband communications system
US20080013276A1 (en) * 2006-06-29 2008-01-17 Michael Pyle Systems and methods for improved cooling of electrical components
US20080002838A1 (en) * 2006-06-29 2008-01-03 Michael Pyle Systems and methods for noise reduction in audio and video components
DE102006056967B4 (en) * 2006-11-30 2009-05-07 Siemens Ag System unit of a computer
JP4530054B2 (en) * 2008-01-23 2010-08-25 ソニー株式会社 Cooling ducts and electronics
DE102008016444B3 (en) * 2008-03-31 2009-09-10 Siemens Aktiengesellschaft System unit of a computer
US20090260795A1 (en) * 2008-04-16 2009-10-22 Perazzo Thomas M Active door array for cooling system
US20100097760A1 (en) * 2008-10-20 2010-04-22 Kaveh Azar Impingement Cooling
EP2288247B1 (en) * 2009-08-21 2013-05-01 Siemens Aktiengesellschaft Automation system with cooling unit
US9253928B2 (en) * 2011-06-27 2016-02-02 Henkel IP & Holding GmbH Cooling module with parallel blowers
US8913391B2 (en) 2012-01-30 2014-12-16 Alcatel Lucent Board-level heat transfer apparatus for communication platforms
US9480149B2 (en) 2013-12-10 2016-10-25 Brocade Communications Systems, Inc. Printed circuit board with fluid flow channels
TWD203264S (en) * 2019-08-27 2020-03-11 宏碁股份有限公司 Airflow guiding structure
US11725667B2 (en) 2019-12-30 2023-08-15 Cnh Industrial America Llc Air source system of an agricultural system

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2843806A (en) * 1955-04-29 1958-07-15 Hughes Aircraft Co Cross-cooled cabinet for electrical equipment
US3198991A (en) * 1964-02-26 1965-08-03 Gen Electric Air cooled electronic enclosure
US3817160A (en) * 1972-05-04 1974-06-18 Hussmann Refrigerator Co Air door for cooler or the like
US4227317A (en) * 1973-04-21 1980-10-14 Vepa Aktiengesellschaft Apparatus for the heat treatment of textiles
US4277816A (en) * 1979-05-29 1981-07-07 International Business Machines Corporation Electronic circuit module cooling
US4296455A (en) * 1979-11-23 1981-10-20 International Business Machines Corporation Slotted heat sinks for high powered air cooled modules
US4417295A (en) * 1977-06-30 1983-11-22 International Business Machines Corporation Air jet powered cooling system for electronic assemblies
US4489363A (en) * 1983-01-31 1984-12-18 Sperry Corporation Apparatus for cooling integrated circuit chips
US4498118A (en) * 1983-04-05 1985-02-05 Bicc-Vero Electronics Limited Circuit board installation

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5917559A (en) * 1982-07-21 1984-01-28 Minolta Camera Co Ltd Nonmagnetic toner used for pressure fixing

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2843806A (en) * 1955-04-29 1958-07-15 Hughes Aircraft Co Cross-cooled cabinet for electrical equipment
US3198991A (en) * 1964-02-26 1965-08-03 Gen Electric Air cooled electronic enclosure
US3817160A (en) * 1972-05-04 1974-06-18 Hussmann Refrigerator Co Air door for cooler or the like
US4227317A (en) * 1973-04-21 1980-10-14 Vepa Aktiengesellschaft Apparatus for the heat treatment of textiles
US4417295A (en) * 1977-06-30 1983-11-22 International Business Machines Corporation Air jet powered cooling system for electronic assemblies
US4277816A (en) * 1979-05-29 1981-07-07 International Business Machines Corporation Electronic circuit module cooling
US4296455A (en) * 1979-11-23 1981-10-20 International Business Machines Corporation Slotted heat sinks for high powered air cooled modules
US4489363A (en) * 1983-01-31 1984-12-18 Sperry Corporation Apparatus for cooling integrated circuit chips
US4498118A (en) * 1983-04-05 1985-02-05 Bicc-Vero Electronics Limited Circuit board installation

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
N. TIMKO, Jr., "Blower Performance Enhancements in the 4381 Computer", published October 1984, see pages 475-482. *
R.G. BISKEBORN et al., "Integral Cap Heat Sink Assembly for the IBM 4381 Processor", published October 1984, see pages 468-474. *
ST-100, Star Technologies, Inc. published August 1983, see pages 1-8. *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2651636A1 (en) * 1989-09-06 1991-03-08 Segem Modular electronic rack with built-in forced cooling
EP0447819A2 (en) * 1990-03-19 1991-09-25 International Business Machines Corporation Multileveled electronic assembly with cooling means
EP0447819A3 (en) * 1990-03-19 1991-12-11 International Business Machines Corporation Multileveled electronic assembly with cooling means

Also Published As

Publication number Publication date
DE3788715T2 (en) 1994-04-28
DE3788715D1 (en) 1994-02-17
JPH01500235A (en) 1989-01-26
EP0274486A4 (en) 1989-09-11
EP0274486B1 (en) 1994-01-05
US4674004A (en) 1987-06-16
JPH0760955B2 (en) 1995-06-28
EP0274486A1 (en) 1988-07-20

Similar Documents

Publication Publication Date Title
US4674004A (en) Parallel-flow air system for cooling electronic equipment
US7209352B2 (en) Heat dissipation device incorporating fan duct
US6525936B2 (en) Air jet cooling arrangement for electronic systems
US5604665A (en) Multiple parallel impingement flow cooling with tuning
US5297005A (en) Apparatus and method for cooling heat generating electronic components in a cabinet
US5946190A (en) Ducted high aspect ratio heatsink assembly
US6912128B2 (en) Electronics cooling subassembly
US7184267B2 (en) Longitudinally cooled electronic assembly
US5304846A (en) Narrow channel finned heat sinking for cooling high power electronic components
US7916472B1 (en) Cooling system for a data processing unit
US5828549A (en) Combination heat sink and air duct for cooling processors with a series air flow
WO1995025255A1 (en) Apparatus and method for cooling heat generating electronic components in a cabinet
US5294831A (en) Circuit pack layout with improved dissipation of heat produced by high power electronic components
US4682268A (en) Mounting structure for electronic circuit modules
EP0886463B1 (en) Compact apparatus for cooling a plurality of circuit packs arranged within a cage
US6922337B2 (en) Circuit card divider to facilitate thermal management in an electronic system
US7106586B2 (en) Computer heat dissipating system
US6719038B2 (en) Heat removal system
KR0136070B1 (en) Electronic equipment
US5424914A (en) Through backplane impingement cooling apparatus
WO2006098020A1 (en) Cooling apparatus and electronic apparatus
JPH0715160A (en) Cooling mechanism for electronic device
JP3011349B2 (en) Forced air cooling for electronic devices
JPH1041661A (en) Electronic apparatus cooling structure
GB2351344A (en) An enclosure for electrical equipment

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): JP

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE FR GB IT LU NL SE

WWE Wipo information: entry into national phase

Ref document number: 1987904176

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1987904176

Country of ref document: EP

WWG Wipo information: grant in national office

Ref document number: 1987904176

Country of ref document: EP