USRE44562E1 - Solder joint flip chip interconnection having relief structure - Google Patents
Solder joint flip chip interconnection having relief structure Download PDFInfo
- Publication number
- USRE44562E1 USRE44562E1 US13/558,953 US201213558953A USRE44562E US RE44562 E1 USRE44562 E1 US RE44562E1 US 201213558953 A US201213558953 A US 201213558953A US RE44562 E USRE44562 E US RE44562E
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- flip chip
- chip interconnection
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- interconnect
- connection
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Abstract
Description
Claims (27)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/558,953 USRE44562E1 (en) | 2003-11-10 | 2012-07-26 | Solder joint flip chip interconnection having relief structure |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51886403P | 2003-11-10 | 2003-11-10 | |
US53391803P | 2003-12-31 | 2003-12-31 | |
US10/985,654 US7368817B2 (en) | 2003-11-10 | 2004-11-10 | Bump-on-lead flip chip interconnection |
US66520805P | 2005-03-25 | 2005-03-25 | |
US59764805P | 2005-12-14 | 2005-12-14 | |
US11/388,755 US20060216860A1 (en) | 2005-03-25 | 2006-03-24 | Flip chip interconnection having narrow interconnection sites on the substrate |
US11/640,534 US7659633B2 (en) | 2004-11-10 | 2006-12-14 | Solder joint flip chip interconnection having relief structure |
US13/558,953 USRE44562E1 (en) | 2003-11-10 | 2012-07-26 | Solder joint flip chip interconnection having relief structure |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/640,534 Reissue US7659633B2 (en) | 2003-11-10 | 2006-12-14 | Solder joint flip chip interconnection having relief structure |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE44562E1 true USRE44562E1 (en) | 2013-10-29 |
Family
ID=46326821
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/640,534 Ceased US7659633B2 (en) | 2003-11-10 | 2006-12-14 | Solder joint flip chip interconnection having relief structure |
US13/558,953 Active 2025-07-26 USRE44562E1 (en) | 2003-11-10 | 2012-07-26 | Solder joint flip chip interconnection having relief structure |
US13/756,817 Active USRE44761E1 (en) | 2003-11-10 | 2013-02-01 | Solder joint flip chip interconnection having relief structure |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/640,534 Ceased US7659633B2 (en) | 2003-11-10 | 2006-12-14 | Solder joint flip chip interconnection having relief structure |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/756,817 Active USRE44761E1 (en) | 2003-11-10 | 2013-02-01 | Solder joint flip chip interconnection having relief structure |
Country Status (1)
Country | Link |
---|---|
US (3) | US7659633B2 (en) |
Cited By (2)
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US9147796B2 (en) * | 2012-02-17 | 2015-09-29 | Hon Hai Precision Industry Co., Ltd. | Method for manufacturing LED device with structure for precisely locating LEDs thereon |
US9902006B2 (en) | 2014-07-25 | 2018-02-27 | Raytheon Company | Apparatus for cleaning an electronic circuit board |
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JP4790297B2 (en) * | 2005-04-06 | 2011-10-12 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method thereof |
US7602062B1 (en) * | 2005-08-10 | 2009-10-13 | Altera Corporation | Package substrate with dual material build-up layers |
JP2008091639A (en) * | 2006-10-02 | 2008-04-17 | Nec Electronics Corp | Electronic equipment, and manufacturing method thereof |
US20080246147A1 (en) * | 2007-04-09 | 2008-10-09 | Chao-Yuan Su | Novel substrate design for semiconductor device |
TWI455263B (en) * | 2009-02-16 | 2014-10-01 | Ind Tech Res Inst | Chip package structure and chip package method |
US8844125B2 (en) | 2011-01-14 | 2014-09-30 | Harris Corporation | Method of making an electronic device having a liquid crystal polymer solder mask and related devices |
US9087701B2 (en) * | 2011-04-30 | 2015-07-21 | Stats Chippac, Ltd. | Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POP |
JP6011887B2 (en) | 2012-04-19 | 2016-10-25 | パナソニックIpマネジメント株式会社 | Electronic component mounting method and electronic component mounting line |
JP2014049608A (en) * | 2012-08-31 | 2014-03-17 | Ibiden Co Ltd | Printed wiring board and method of manufacturing the same |
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