USRE36907E - Leadframe with power and ground planes - Google Patents
Leadframe with power and ground planes Download PDFInfo
- Publication number
- USRE36907E USRE36907E US08/947,843 US94784397A USRE36907E US RE36907 E USRE36907 E US RE36907E US 94784397 A US94784397 A US 94784397A US RE36907 E USRE36907 E US RE36907E
- Authority
- US
- United States
- Prior art keywords
- ring
- leads
- electrically conductive
- die attach
- attach pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (51)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/947,843 USRE36907E (en) | 1992-12-07 | 1997-10-09 | Leadframe with power and ground planes |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/986,951 US5457340A (en) | 1992-12-07 | 1992-12-07 | Leadframe with power and ground planes |
US08/947,843 USRE36907E (en) | 1992-12-07 | 1997-10-09 | Leadframe with power and ground planes |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/986,951 Reissue US5457340A (en) | 1992-12-07 | 1992-12-07 | Leadframe with power and ground planes |
Publications (1)
Publication Number | Publication Date |
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USRE36907E true USRE36907E (en) | 2000-10-10 |
Family
ID=25532924
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/986,951 Expired - Lifetime US5457340A (en) | 1992-12-07 | 1992-12-07 | Leadframe with power and ground planes |
US08/947,843 Expired - Lifetime USRE36907E (en) | 1992-12-07 | 1997-10-09 | Leadframe with power and ground planes |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/986,951 Expired - Lifetime US5457340A (en) | 1992-12-07 | 1992-12-07 | Leadframe with power and ground planes |
Country Status (1)
Country | Link |
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US (2) | US5457340A (en) |
Cited By (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020140061A1 (en) * | 2001-03-27 | 2002-10-03 | Lee Hyung Ju | Lead frame for semiconductor package |
US6541849B1 (en) * | 2000-08-25 | 2003-04-01 | Micron Technology, Inc. | Memory device power distribution |
US6750545B1 (en) | 2003-02-28 | 2004-06-15 | Amkor Technology, Inc. | Semiconductor package capable of die stacking |
US20040150086A1 (en) * | 1999-10-15 | 2004-08-05 | Lee Tae Heon | Semiconductor package having reduced thickness |
US6777789B1 (en) | 2001-03-20 | 2004-08-17 | Amkor Technology, Inc. | Mounting for a package containing a chip |
US6794740B1 (en) | 2003-03-13 | 2004-09-21 | Amkor Technology, Inc. | Leadframe package for semiconductor devices |
US6798047B1 (en) | 2002-12-26 | 2004-09-28 | Amkor Technology, Inc. | Pre-molded leadframe |
US6798046B1 (en) * | 2002-01-22 | 2004-09-28 | Amkor Technology, Inc. | Semiconductor package including ring structure connected to leads with vertically downset inner ends |
US6833609B1 (en) | 1999-11-05 | 2004-12-21 | Amkor Technology, Inc. | Integrated circuit device packages and substrates for making the packages |
US6873032B1 (en) | 2001-04-04 | 2005-03-29 | Amkor Technology, Inc. | Thermally enhanced chip scale lead on chip semiconductor package and method of making same |
US6879034B1 (en) * | 2003-05-01 | 2005-04-12 | Amkor Technology, Inc. | Semiconductor package including low temperature co-fired ceramic substrate |
US20050263863A1 (en) * | 2004-06-01 | 2005-12-01 | Toshio Sasaki | Semiconductor device and a method of manufacturing the same |
US7183630B1 (en) | 2002-04-15 | 2007-02-27 | Amkor Technology, Inc. | Lead frame with plated end leads |
US7692286B1 (en) | 2002-11-08 | 2010-04-06 | Amkor Technology, Inc. | Two-sided fan-out wafer escape package |
US7723210B2 (en) | 2002-11-08 | 2010-05-25 | Amkor Technology, Inc. | Direct-write wafer level chip scale package |
US7902660B1 (en) | 2006-05-24 | 2011-03-08 | Amkor Technology, Inc. | Substrate for semiconductor device and manufacturing method thereof |
US7968998B1 (en) | 2006-06-21 | 2011-06-28 | Amkor Technology, Inc. | Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package |
US7977163B1 (en) | 2005-12-08 | 2011-07-12 | Amkor Technology, Inc. | Embedded electronic component package fabrication method |
US8294276B1 (en) | 2010-05-27 | 2012-10-23 | Amkor Technology, Inc. | Semiconductor device and fabricating method thereof |
US8324511B1 (en) | 2010-04-06 | 2012-12-04 | Amkor Technology, Inc. | Through via nub reveal method and structure |
US8390130B1 (en) | 2011-01-06 | 2013-03-05 | Amkor Technology, Inc. | Through via recessed reveal structure and method |
US8410585B2 (en) | 2000-04-27 | 2013-04-02 | Amkor Technology, Inc. | Leadframe and semiconductor package made using the leadframe |
US8440554B1 (en) | 2010-08-02 | 2013-05-14 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
US8487445B1 (en) | 2010-10-05 | 2013-07-16 | Amkor Technology, Inc. | Semiconductor device having through electrodes protruding from dielectric layer |
US8552548B1 (en) | 2011-11-29 | 2013-10-08 | Amkor Technology, Inc. | Conductive pad on protruding through electrode semiconductor device |
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