USD692896S1 - Module - Google Patents
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- USD692896S1 USD692896S1 US29/406,462 US201129406462F USD692896S US D692896 S1 USD692896 S1 US D692896S1 US 201129406462 F US201129406462 F US 201129406462F US D692896 S USD692896 S US D692896S
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Claims (1)
- I claim the ornamental design for a module, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/406,462 USD692896S1 (en) | 2011-11-15 | 2011-11-15 | Module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/406,462 USD692896S1 (en) | 2011-11-15 | 2011-11-15 | Module |
Publications (1)
Publication Number | Publication Date |
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USD692896S1 true USD692896S1 (en) | 2013-11-05 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US29/406,462 Active USD692896S1 (en) | 2011-11-15 | 2011-11-15 | Module |
Country Status (1)
Country | Link |
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US (1) | USD692896S1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
Citations (213)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2706742A (en) * | 1950-10-14 | 1955-04-19 | Sprague Electric Co | Resin sealed elastomeric housing for electrical components |
US3185947A (en) * | 1959-11-16 | 1965-05-25 | Arf Products | Inductive module for electronic devices |
US3357099A (en) * | 1962-10-29 | 1967-12-12 | North American Aviation Inc | Providing plated through-hole connections with the plating resist extending to the hole edges |
US3398232A (en) * | 1965-10-19 | 1968-08-20 | Amp Inc | Circuit board with interconnected signal conductors and interconnected shielding conductors |
US3747210A (en) * | 1971-09-13 | 1973-07-24 | Int Standard Electric Corp | Method of producing terminal pins of a printed circuit board |
US3760091A (en) * | 1971-11-16 | 1973-09-18 | Ibm | Multilayer circuit board |
US3887783A (en) * | 1972-11-09 | 1975-06-03 | Honeywell Bull Sa | Devices for welding of integrated-circuit wafers |
US3964087A (en) * | 1975-05-15 | 1976-06-15 | Interdyne Company | Resistor network for integrated circuit |
US4029531A (en) * | 1976-03-29 | 1977-06-14 | Rca Corporation | Method of forming grooves in the [011] crystalline direction |
US4074340A (en) * | 1976-10-18 | 1978-02-14 | Vitramon, Incorporated | Trimmable monolithic capacitors |
USD254687S (en) * | 1979-01-25 | 1980-04-08 | Mcdonnell Douglas Corporation | Biochemical card for use with an automated microbial identification machine |
US4223321A (en) * | 1979-04-30 | 1980-09-16 | The Mead Corporation | Planar-faced electrode for ink jet printer and method of manufacture |
US4288840A (en) * | 1978-09-26 | 1981-09-08 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board |
US4312026A (en) * | 1979-04-11 | 1982-01-19 | Tdk Electronics Co., Ltd. | Chip ceramic capacitor |
US4313157A (en) * | 1978-09-26 | 1982-01-26 | Draloric Electronic Gmbh | Capacitive network |
USD267094S (en) * | 1979-04-12 | 1982-11-30 | Sharp Corporation | Magnetic card for microwave oven |
US4400762A (en) * | 1980-08-25 | 1983-08-23 | Allen-Bradley Company | Edge termination for an electrical circuit device |
US4419714A (en) * | 1982-04-02 | 1983-12-06 | International Business Machines Corporation | Low inductance ceramic capacitor and method for its making |
US4430690A (en) * | 1982-10-07 | 1984-02-07 | International Business Machines Corporation | Low inductance MLC capacitor with metal impregnation and solder bar contact |
US4437141A (en) * | 1981-09-14 | 1984-03-13 | Texas Instruments Incorporated | High terminal count integrated circuit device package |
US4522449A (en) * | 1979-08-07 | 1985-06-11 | Hayward C Michael | Matrix board |
US4551746A (en) * | 1982-10-05 | 1985-11-05 | Mayo Foundation | Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation |
US4616655A (en) * | 1984-01-20 | 1986-10-14 | Cordis Corporation | Implantable pulse generator having a single printed circuit board and a chip carrier |
US4627533A (en) * | 1984-10-29 | 1986-12-09 | Hughes Aircraft Company | Ceramic package for compensated crystal oscillator |
US4630171A (en) * | 1983-11-22 | 1986-12-16 | Eurofarad-Efd | Support for a high-speed component, in particular a microwave frequency component, the support including incorporated decoupling members |
US4661884A (en) * | 1986-03-10 | 1987-04-28 | American Technical Ceramics Corp. | Miniature, multiple layer, side mounting high frequency blocking capacitor |
US4750246A (en) * | 1984-10-29 | 1988-06-14 | Hughes Aircraft Company | Method of making compensated crystal oscillator |
US4775917A (en) * | 1985-12-03 | 1988-10-04 | Wells Manufacturing Company | Thermal compensated circuit board interconnect apparatus and method of forming the same |
US4790894A (en) * | 1987-02-19 | 1988-12-13 | Hitachi Condenser Co., Ltd. | Process for producing printed wiring board |
USD299139S (en) * | 1985-12-04 | 1988-12-27 | Interlego | Interface panel |
US4821007A (en) * | 1987-02-06 | 1989-04-11 | Tektronix, Inc. | Strip line circuit component and method of manufacture |
US4842184A (en) * | 1988-06-23 | 1989-06-27 | Ltv Aerospace & Defense Company | Method and apparatus for applying solder preforms |
US4853826A (en) * | 1988-08-01 | 1989-08-01 | Rogers Corporation | Low inductance decoupling capacitor |
US4852227A (en) * | 1988-11-25 | 1989-08-01 | Sprague Electric Company | Method for making a multilayer ceramic capacitor with buried electrodes and terminations at a castellated edge |
US4947286A (en) * | 1988-08-11 | 1990-08-07 | Murata Manufacturing Co., Ltd. | Multilayer capacitor device |
US4956694A (en) * | 1988-11-04 | 1990-09-11 | Dense-Pac Microsystems, Inc. | Integrated circuit chip stacking |
US4963843A (en) * | 1988-10-31 | 1990-10-16 | Motorola, Inc. | Stripline filter with combline resonators |
US4978639A (en) * | 1989-01-10 | 1990-12-18 | Avantek, Inc. | Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips |
US5092035A (en) * | 1990-09-10 | 1992-03-03 | Codex Corporation | Method of making printed circuit board assembly |
US5126286A (en) * | 1990-10-05 | 1992-06-30 | Micron Technology, Inc. | Method of manufacturing edge connected semiconductor die |
US5138115A (en) * | 1990-10-12 | 1992-08-11 | Atmel Corporation | Carrierles surface mounted integrated circuit die |
US5140745A (en) * | 1990-07-23 | 1992-08-25 | Mckenzie Jr Joseph A | Method for forming traces on side edges of printed circuit boards and devices formed thereby |
US5206495A (en) * | 1989-10-24 | 1993-04-27 | Angewandte Digital Elektronik Gmbh | Chip card |
US5224021A (en) * | 1989-10-20 | 1993-06-29 | Matsushita Electric Industrial Co., Ltd. | Surface-mount network device |
US5225969A (en) * | 1989-12-15 | 1993-07-06 | Tdk Corporation | Multilayer hybrid circuit |
US5239198A (en) * | 1989-09-06 | 1993-08-24 | Motorola, Inc. | Overmolded semiconductor device having solder ball and edge lead connective structure |
US5247423A (en) * | 1992-05-26 | 1993-09-21 | Motorola, Inc. | Stacking three dimensional leadless multi-chip module and method for making the same |
US5266833A (en) * | 1992-03-30 | 1993-11-30 | Capps David F | Integrated circuit bus structure |
US5293067A (en) * | 1991-05-23 | 1994-03-08 | Motorola, Inc. | Integrated circuit chip carrier |
US5309326A (en) * | 1991-12-06 | 1994-05-03 | Rohm Co., Ltd. | Circuit module having stacked circuit boards |
US5313096A (en) * | 1992-03-16 | 1994-05-17 | Dense-Pac Microsystems, Inc. | IC chip package having chip attached to and wire bonded within an overlying substrate |
USD350125S (en) * | 1992-04-24 | 1994-08-30 | Sento Krei | Data containing rocket card |
US5367430A (en) * | 1992-10-21 | 1994-11-22 | Presidio Components, Inc. | Monolithic multiple capacitor |
US5376778A (en) * | 1992-02-26 | 1994-12-27 | Angewandte Digital Electronik Gmbh | Contact-free chip card for remote transmission |
US5383095A (en) * | 1993-10-29 | 1995-01-17 | The Whitaker Corporation | Circuit board and edge-mountable connector therefor, and method of preparing a circuit board edge |
US5386087A (en) * | 1992-02-17 | 1995-01-31 | E. I. Du Pont De Nemours And Company | Printed circuit board having U-shaped solder mask layer separating respective contacts |
US5428885A (en) * | 1989-01-14 | 1995-07-04 | Tdk Corporation | Method of making a multilayer hybrid circuit |
US5434745A (en) * | 1994-07-26 | 1995-07-18 | White Microelectronics Div. Of Bowmar Instrument Corp. | Stacked silicon die carrier assembly |
US5471368A (en) * | 1993-11-16 | 1995-11-28 | International Business Machines Corporation | Module having vertical peripheral edge connection |
US5488765A (en) * | 1992-07-27 | 1996-02-06 | Murata Manufacturing Co., Ltd. | Method of measuring characteristics of a multilayer electronic component |
US5493769A (en) * | 1993-08-05 | 1996-02-27 | Murata Manufacturing Co., Ltd. | Method of manufacturing electronic component and measuring characteristics of same |
US5502885A (en) * | 1992-02-25 | 1996-04-02 | Rohm Co., Ltd. | Method of manfacturing a chip-type composite electronic part |
US5514907A (en) * | 1995-03-21 | 1996-05-07 | Simple Technology Incorporated | Apparatus for stacking semiconductor chips |
US5600101A (en) * | 1994-07-21 | 1997-02-04 | Murata Manufacturing Co., Ltd. | Multilayer electronic component and method of manufacturing the same |
US5599413A (en) * | 1992-11-25 | 1997-02-04 | Matsushita Electric Industrial Co., Ltd. | Method of producing a ceramic electronic device |
US5621619A (en) * | 1990-10-25 | 1997-04-15 | Cts Corporation | All ceramic surface mount sip and dip networks having spacers and solder barriers |
US5635669A (en) * | 1992-07-27 | 1997-06-03 | Murata Manufacturing Co., Ltd. | Multilayer electronic component |
US5661420A (en) * | 1995-03-08 | 1997-08-26 | Etymotic Research, Inc. | Mounting configuration for monolithic integrated circuit |
US5714239A (en) * | 1993-03-15 | 1998-02-03 | Murata Manufacturing Co., Ltd. | Composite component |
US5729437A (en) * | 1994-06-22 | 1998-03-17 | Seiko Epson Corporation | Electronic part including a thin body of molding resin |
US5731709A (en) * | 1996-01-26 | 1998-03-24 | Motorola, Inc. | Method for testing a ball grid array semiconductor device and a device for such testing |
US5740010A (en) * | 1992-10-21 | 1998-04-14 | Devoe; Daniel F. | Printing and adhering patterned metal on laid-up multi-layer green wafer before firing so as to later form precise integral co-fired conductive traces and pads on top and bottom surfaces of monolithic, buried-substrate, capacitors |
US5752182A (en) * | 1994-05-09 | 1998-05-12 | Matsushita Electric Industrial Co., Ltd. | Hybrid IC |
US5773812A (en) * | 1994-02-08 | 1998-06-30 | Angewandte Digital Elektronik Gmbh | Chip card capable of both contact and contactless operation including a contact block |
US5811799A (en) * | 1997-07-31 | 1998-09-22 | Wu; Liang-Chung | Image sensor package having a wall with a sealed cover |
US5832600A (en) * | 1995-06-06 | 1998-11-10 | Seiko Epson Corporation | Method of mounting electronic parts |
US5841217A (en) * | 1996-03-14 | 1998-11-24 | Citizen Watch Co., Ltd. | Surface mounting crystal unit |
US5847930A (en) * | 1995-10-13 | 1998-12-08 | Hei, Inc. | Edge terminals for electronic circuit modules |
US5854534A (en) * | 1992-08-05 | 1998-12-29 | Fujitsu Limited | Controlled impedence interposer substrate |
US5877561A (en) * | 1995-07-28 | 1999-03-02 | Lg Semicon Co., Ltd. | Plate and column type semiconductor package having heat sink |
US5917709A (en) * | 1997-06-16 | 1999-06-29 | Eastman Kodak Company | Multiple circuit board assembly having an interconnect mechanism that includes a flex connector |
US5949294A (en) * | 1996-09-20 | 1999-09-07 | Matsushita Electric Industrial Co., Ltd. | Reference frequency source oscillator formed from first and second containers |
US5966052A (en) * | 1997-04-09 | 1999-10-12 | Murata Manufacturing Co., Ltd. | Voltage-controlled oscillator with input and output on opposite corners of substrate |
US5979048A (en) * | 1995-06-21 | 1999-11-09 | Polyplastics, Co., Inc. | Method of manufacturing connectors |
USD416236S (en) * | 1998-09-02 | 1999-11-09 | Citizen Electronics Co., Ltd. | Integrated circuit package |
US5991162A (en) * | 1997-06-27 | 1999-11-23 | Nec Corporation | High-frequency integrated circuit device and manufacture method thereof |
US6046409A (en) * | 1997-02-26 | 2000-04-04 | Ngk Spark Plug Co., Ltd. | Multilayer microelectronic circuit |
US6057597A (en) * | 1997-12-15 | 2000-05-02 | Micron Technology, Inc. | Semiconductor package with pre-fabricated cover |
US6058004A (en) * | 1997-09-08 | 2000-05-02 | Delaware Capital Formation, Inc. | Unitized discrete electronic component arrays |
US6084780A (en) * | 1996-02-06 | 2000-07-04 | Kabushiki Kaisha Toshiba | Printed circuit board with high electronic component density |
USD429704S (en) * | 1999-03-10 | 2000-08-22 | Keonil Kang | Printed circuit board for wireless telephones |
US6115262A (en) * | 1998-06-08 | 2000-09-05 | Ford Motor Company | Enhanced mounting pads for printed circuit boards |
US6144090A (en) * | 1997-02-13 | 2000-11-07 | Fujitsu Limited | Ball grid array package having electrodes on peripheral side surfaces of a package board |
US6147876A (en) * | 1993-09-14 | 2000-11-14 | Kabushiki Kaisha Toshiba | Multi-chip module having printed wiring board comprising circuit pattern for IC chip |
US6181560B1 (en) * | 1995-07-28 | 2001-01-30 | Hyundai Electronics Industries Co., Ltd. | Semiconductor package substrate and semiconductor package |
US6218628B1 (en) * | 1994-05-18 | 2001-04-17 | Dyconex Patente Ag | Foil circuit boards and semifinished products and method for the manufacture thereof |
USD444132S1 (en) * | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
US6278178B1 (en) * | 1998-02-10 | 2001-08-21 | Hyundai Electronics Industries Co., Ltd. | Integrated device package and fabrication methods thereof |
US6288345B1 (en) * | 2000-03-22 | 2001-09-11 | Raytheon Company | Compact z-axis DC and control signals routing substrate |
US6287949B1 (en) * | 1994-06-20 | 2001-09-11 | Fujitsu Limited | Multi-chip semiconductor chip module |
US20010055191A1 (en) * | 1997-11-10 | 2001-12-27 | Murata Manufacturing Co., Ltd. | Multilayer capacitor |
USD453734S1 (en) * | 2000-06-30 | 2002-02-19 | Molex Incorporated | Board to board receptacle connector |
US20020029904A1 (en) * | 1998-03-04 | 2002-03-14 | Peter Matuschik | Printed circuit board with smd components |
USD455125S1 (en) * | 2000-06-30 | 2002-04-02 | Molex Incorporated | Board to board plug connector |
US6378757B1 (en) * | 2001-01-31 | 2002-04-30 | Agilent Technologies, Inc. | Method for edge mounting flex media to a rigid PC board |
US6383835B1 (en) * | 1995-09-01 | 2002-05-07 | Canon Kabushiki Kaisha | IC package having a conductive material at least partially filling a recess |
US6388264B1 (en) * | 1997-03-28 | 2002-05-14 | Benedict G Pace | Optocoupler package being hermetically sealed |
US6407906B1 (en) * | 1999-12-06 | 2002-06-18 | Tdk Corporation | Multiterminal-multilayer ceramic capacitor |
US6407904B1 (en) * | 1999-05-10 | 2002-06-18 | Murata Manufacturing Co., Ltd. | Multi-layer capacitor |
US20020116668A1 (en) * | 2001-02-20 | 2002-08-22 | Matrix Semiconductor, Inc. | Memory card with enhanced testability and methods of making and using the same |
US20020123213A1 (en) * | 2000-02-24 | 2002-09-05 | Williams Vernon M. | Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
US6452112B1 (en) * | 1998-10-19 | 2002-09-17 | Alps Electric Co., Ltd. | Electronic circuit unit useful for portable telephone, etc., and a method of manufacturing the same |
US6456168B1 (en) * | 2000-12-29 | 2002-09-24 | Cts Corporation | Temperature compensated crystal oscillator assembled on crystal base |
US6462408B1 (en) * | 2001-03-27 | 2002-10-08 | Staktek Group, L.P. | Contact member stacking system and method |
US20020171997A1 (en) * | 2000-01-28 | 2002-11-21 | Tdk Corporation | Multilayer electronic device and method for producing same |
USD466093S1 (en) * | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
US6496355B1 (en) * | 2001-10-04 | 2002-12-17 | Avx Corporation | Interdigitated capacitor with ball grid array (BGA) terminations |
US6528870B2 (en) * | 2000-01-28 | 2003-03-04 | Kabushiki Kaisha Toshiba | Semiconductor device having a plurality of stacked wiring boards |
US6534726B1 (en) * | 1999-10-25 | 2003-03-18 | Murata Manufacturing Co., Ltd. | Module substrate and method of producing the same |
US20030071341A1 (en) * | 2001-10-16 | 2003-04-17 | Jeung Boon Suan | Apparatus and method for leadless packaging of semiconductor devices |
USD474773S1 (en) * | 2001-07-10 | 2003-05-20 | Sony Corporation | Information recording element |
US6566611B2 (en) * | 2001-09-26 | 2003-05-20 | Intel Corporation | Anti-tombstoning structures and methods of manufacture |
US6576999B2 (en) * | 2000-07-06 | 2003-06-10 | Murata Manufacturing Co., Ltd. | Mounting structure for an electronic component having an external terminal electrode |
US6583981B2 (en) * | 2000-11-29 | 2003-06-24 | Murata Manufacturing Co., Ltd. | Ceramic condenser module |
US20030117784A1 (en) * | 2001-12-05 | 2003-06-26 | Kenji Fukunabe | Circuit board device and mounting method therefor |
USD476962S1 (en) * | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
US6601295B2 (en) * | 1999-03-03 | 2003-08-05 | Mamoru Maekawa | Method of producing chip-type electronic devices |
US6601296B1 (en) * | 1999-07-06 | 2003-08-05 | Visteon Global Technologies, Inc. | Multi-shot injection molding process for making electrical connectors and three-dimensional circuits |
US6606237B1 (en) * | 2002-06-27 | 2003-08-12 | Murata Manufacturing Co., Ltd. | Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same |
US6624505B2 (en) * | 1998-02-06 | 2003-09-23 | Shellcase, Ltd. | Packaged integrated circuits and methods of producing thereof |
US6639311B2 (en) * | 2001-10-05 | 2003-10-28 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component |
US20030232462A1 (en) * | 2002-06-18 | 2003-12-18 | Poo Chia Yong | Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods |
US6670700B1 (en) * | 1999-08-19 | 2003-12-30 | Seiko Epson Corporation | Interconnect substrate and semiconductor device electronic instrument |
US6700794B2 (en) * | 2001-07-26 | 2004-03-02 | Harris Corporation | Decoupling capacitor closely coupled with integrated circuit |
US6713868B2 (en) * | 2001-11-30 | 2004-03-30 | Kabushiki Kaisha Toshiba | Semiconductor device having leadless package structure |
US6714420B2 (en) * | 2000-05-30 | 2004-03-30 | Alps Electric Co., Ltd. | Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment |
US6724083B2 (en) * | 2001-07-16 | 2004-04-20 | Ars Electronics Co., Ltd. | Method of producing semiconductor packages by cutting via holes into half when separating substrate |
US6727116B2 (en) * | 2002-06-18 | 2004-04-27 | Micron Technology, Inc. | Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods |
US6751101B2 (en) * | 2000-11-02 | 2004-06-15 | Murata Manufacturing Co., Ltd. | Electronic component and method of producing the same |
US6760227B2 (en) * | 2000-11-02 | 2004-07-06 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component and manufacturing method thereof |
US6759940B2 (en) * | 2002-01-10 | 2004-07-06 | Lamina Ceramics, Inc. | Temperature compensating device with integral sheet thermistors |
USD493152S1 (en) * | 2002-11-27 | 2004-07-20 | International Business Machines Corporation | Server blade chassis midplane printed circuit board with cover |
US20040157410A1 (en) * | 2003-01-16 | 2004-08-12 | Seiko Epson Corporation | Semiconductor device, semiconductor module, electronic equipment, method for manufacturing semiconductor device, and method for manufacturing semiconductor module |
US6795294B2 (en) * | 2003-01-31 | 2004-09-21 | Murata Manufacturing Co., Ltd. | Laminated capacitor, printed circuit board, decoupling circuit, and high-frequency circuit |
US20040207049A1 (en) * | 2003-02-27 | 2004-10-21 | Infineon Technologies Ag | Electronic component and semiconductor wafer, and method for producing the same |
US20040218344A1 (en) * | 2002-04-15 | 2004-11-04 | Ritter Andrew P. | Plated terminations |
US6822321B2 (en) * | 2002-09-30 | 2004-11-23 | Cree Microwave, Inc. | Packaged RF power transistor having RF bypassing/output matching network |
US6828656B2 (en) * | 2001-02-08 | 2004-12-07 | Micron Technology, Inc. | High performance silicon contact for flip chip and a system using same |
USD499379S1 (en) * | 2003-08-08 | 2004-12-07 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector |
USD501448S1 (en) * | 2003-08-19 | 2005-02-01 | Japan Aviation Electronics Industry, Limited | Electrical connector |
US6855572B2 (en) * | 2002-08-28 | 2005-02-15 | Micron Technology, Inc. | Castellation wafer level packaging of integrated circuit chips |
US6862190B2 (en) * | 2001-01-17 | 2005-03-01 | Honeywell International, Inc. | Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers |
US6906907B2 (en) * | 2003-04-15 | 2005-06-14 | Kemet Electronics Corporation | Monolithic multi-layer capacitor with improved lead-out structure |
USD508235S1 (en) * | 2003-12-05 | 2005-08-09 | Nichia Corporation | Light emitting diode |
US6929974B2 (en) * | 2002-10-18 | 2005-08-16 | Motorola, Inc. | Feedthrough design and method for a hermetically sealed microdevice |
US6933209B2 (en) * | 2003-12-24 | 2005-08-23 | Super Talent Electronics Inc. | Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges |
US6934145B2 (en) * | 2000-07-06 | 2005-08-23 | Phycomp Holding B.V. | Ceramic multilayer capacitor array |
USD508682S1 (en) * | 2004-02-23 | 2005-08-23 | Kabushiki Kaisha Toshiba | Semiconductor device |
US6949819B2 (en) * | 2001-12-27 | 2005-09-27 | Alps Electric Co., Ltd. | Jumper chip component and mounting structure therefor |
US6956252B2 (en) * | 2002-04-24 | 2005-10-18 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
US6960366B2 (en) * | 2002-04-15 | 2005-11-01 | Avx Corporation | Plated terminations |
US6987315B2 (en) * | 2002-11-25 | 2006-01-17 | Samsung Electro-Mechanics Co., Ltd. | Ceramic multilayer substrate |
US6998926B2 (en) * | 2002-12-17 | 2006-02-14 | Seiko Epson Corporation | Piezoelectric oscillator, portable phone employing piezoelectric oscillator, and electronic apparatus employing piezoelectric oscillator |
US7024947B2 (en) * | 2002-03-07 | 2006-04-11 | Alps Electric Co., Ltd. | Detection device including circuit component |
US7041527B2 (en) * | 1997-07-29 | 2006-05-09 | Harvatek Corp. | Charge coupled device package |
US7045386B2 (en) * | 1999-02-03 | 2006-05-16 | Rohm Co., Ltd. | Semiconductor device and semiconductor chip for use therein |
US7050288B2 (en) * | 2004-03-11 | 2006-05-23 | Tdk Corporation | Laminated ceramic capacitor |
USD521952S1 (en) * | 2004-02-23 | 2006-05-30 | Kabushiki Kaisha Toshiba | Semiconductor device |
US7068490B2 (en) * | 2004-04-16 | 2006-06-27 | Kemet Electronics Corporation | Thermal dissipating capacitor and electrical component comprising same |
US7067172B2 (en) * | 2002-04-15 | 2006-06-27 | Avx Corporation | Component formation via plating technology |
US7098081B2 (en) * | 2001-09-27 | 2006-08-29 | Hamamatsu Photonics K.K. | Semiconductor device and method of manufacturing the device |
US7123108B2 (en) * | 2004-08-26 | 2006-10-17 | Nihon Dempa Kogyo Co., Ltd. | Surface mount crystal oscillator |
US7151310B2 (en) * | 2001-09-25 | 2006-12-19 | Tdk Corporation | Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device |
US7152291B2 (en) * | 2002-04-15 | 2006-12-26 | Avx Corporation | Method for forming plated terminations |
US7168161B2 (en) * | 2003-08-25 | 2007-01-30 | Renesas Technology Corp. | Manufacturing method of solid-state image sensing device |
USD536309S1 (en) * | 2004-12-08 | 2007-02-06 | Nichia Corporation | Light emitting diode board |
US7177137B2 (en) * | 2002-04-15 | 2007-02-13 | Avx Corporation | Plated terminations |
US7189083B2 (en) * | 2002-04-01 | 2007-03-13 | Interplex Nas, Inc, | Method of retaining a solder mass on an article |
US7212395B2 (en) * | 2004-12-28 | 2007-05-01 | Intel Corporation | Capacitor design for controlling equivalent series resistance |
USD544447S1 (en) * | 2006-09-26 | 2007-06-12 | Cheng Uei Precision Industry Co., Ltd. | Board to board connector |
US7232318B2 (en) * | 2005-11-22 | 2007-06-19 | Lih Duo International Co., Ltd. | IC embedding seat |
US7247509B2 (en) * | 2003-09-03 | 2007-07-24 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing solid-state imaging devices |
US20070205017A1 (en) * | 2005-01-31 | 2007-09-06 | Sanyo Electric Co., Ltd. | Circuit device and method of manufacturing the same |
US7273765B2 (en) * | 2003-04-28 | 2007-09-25 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device and method for producing the same |
US7335951B2 (en) * | 2003-10-06 | 2008-02-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US7411776B2 (en) * | 2006-07-12 | 2008-08-12 | Tdk Corporation | Multilayer capacitor array |
US20080211113A1 (en) * | 2002-06-14 | 2008-09-04 | Micron Technology, Inc. | Wafer level packaging |
US7429501B1 (en) * | 2003-08-25 | 2008-09-30 | Xilinx, Inc. | Lid and method of employing a lid on an integrated circuit |
US7433172B2 (en) * | 2005-03-10 | 2008-10-07 | Tdk Corporation | Multilayer capacitor |
US7466535B2 (en) * | 2005-11-22 | 2008-12-16 | Murata Manufacturing Co., Ltd. | Multilayer capacitor |
USD582858S1 (en) * | 2007-05-31 | 2008-12-16 | Omron Corporation | Socket |
USD582852S1 (en) * | 2007-05-31 | 2008-12-16 | Omron Corporation | Plug |
US7502216B2 (en) * | 2007-08-06 | 2009-03-10 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip capacitor |
US7506438B1 (en) * | 2000-11-14 | 2009-03-24 | Freescale Semiconductor, Inc. | Low profile integrated module interconnects and method of fabrication |
US7508647B2 (en) * | 2005-11-22 | 2009-03-24 | Murata Manufacturing Co., Ltd. | Multilayer capacitor |
US7554189B1 (en) * | 2008-03-03 | 2009-06-30 | Universal Scientific Industrial Co., Ltd. | Wireless communication module |
US7576968B2 (en) * | 2002-04-15 | 2009-08-18 | Avx Corporation | Plated terminations and method of forming using electrolytic plating |
US7599166B2 (en) * | 2005-11-17 | 2009-10-06 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip capacitor |
US7612443B1 (en) * | 2003-09-04 | 2009-11-03 | University Of Notre Dame Du Lac | Inter-chip communication |
US7616427B2 (en) * | 2006-05-22 | 2009-11-10 | Murata Manufacturing Co., Ltd. | Monolithic ceramic capacitor |
USD605613S1 (en) * | 2008-05-15 | 2009-12-08 | Adc Gmbh | Printed circuit board for electrical connector |
USD616373S1 (en) * | 2007-07-24 | 2010-05-25 | Omron Corporation | Connector for flexible printed circuit board |
US20100146780A1 (en) * | 2003-05-06 | 2010-06-17 | Yong Poo Chia | Method for packaging circuits and packaged circuits |
US7750441B2 (en) * | 2006-06-29 | 2010-07-06 | Intel Corporation | Conductive interconnects along the edge of a microelectronic device |
US7791173B2 (en) * | 2007-01-23 | 2010-09-07 | Samsung Electronics Co., Ltd. | Chip having side pad, method of fabricating the same and package using the same |
US7829977B2 (en) * | 2007-11-15 | 2010-11-09 | Advanced Semiconductor Engineering, Inc. | Low temperature co-fired ceramics substrate and semiconductor package |
US7843115B2 (en) * | 2003-11-25 | 2010-11-30 | Eta Sa Manufacture Horlogère Suisse | Electronic component having a resonator element arranged in an hermetically closed housing and method for manufacturing such an electronic component |
US7888185B2 (en) * | 2006-08-17 | 2011-02-15 | Micron Technology, Inc. | Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device |
US7932786B2 (en) * | 2005-11-30 | 2011-04-26 | Nihon Dempa Kogyo Co., Ltd. | Surface mount type crystal oscillator |
USD643040S1 (en) * | 2010-10-26 | 2011-08-09 | Hon Hai Precision Ind. Co., Ltd. | Electrical card |
US8113888B2 (en) * | 2008-05-15 | 2012-02-14 | Adc Gmbh | Circuit board for electrical connector and electrical connector |
US8138617B2 (en) * | 2001-10-08 | 2012-03-20 | Round Rock Research, Llc | Apparatus and method for packaging circuits |
US8159813B2 (en) * | 2008-04-01 | 2012-04-17 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip capacitor, motherboard apparatus having the same, and power distribution network |
-
2011
- 2011-11-15 US US29/406,462 patent/USD692896S1/en active Active
Patent Citations (236)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2706742A (en) * | 1950-10-14 | 1955-04-19 | Sprague Electric Co | Resin sealed elastomeric housing for electrical components |
US3185947A (en) * | 1959-11-16 | 1965-05-25 | Arf Products | Inductive module for electronic devices |
US3357099A (en) * | 1962-10-29 | 1967-12-12 | North American Aviation Inc | Providing plated through-hole connections with the plating resist extending to the hole edges |
US3398232A (en) * | 1965-10-19 | 1968-08-20 | Amp Inc | Circuit board with interconnected signal conductors and interconnected shielding conductors |
US3747210A (en) * | 1971-09-13 | 1973-07-24 | Int Standard Electric Corp | Method of producing terminal pins of a printed circuit board |
US3760091A (en) * | 1971-11-16 | 1973-09-18 | Ibm | Multilayer circuit board |
US3887783A (en) * | 1972-11-09 | 1975-06-03 | Honeywell Bull Sa | Devices for welding of integrated-circuit wafers |
US3964087A (en) * | 1975-05-15 | 1976-06-15 | Interdyne Company | Resistor network for integrated circuit |
US4029531A (en) * | 1976-03-29 | 1977-06-14 | Rca Corporation | Method of forming grooves in the [011] crystalline direction |
US4074340A (en) * | 1976-10-18 | 1978-02-14 | Vitramon, Incorporated | Trimmable monolithic capacitors |
US4288840A (en) * | 1978-09-26 | 1981-09-08 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board |
US4313157A (en) * | 1978-09-26 | 1982-01-26 | Draloric Electronic Gmbh | Capacitive network |
USD254687S (en) * | 1979-01-25 | 1980-04-08 | Mcdonnell Douglas Corporation | Biochemical card for use with an automated microbial identification machine |
US4312026A (en) * | 1979-04-11 | 1982-01-19 | Tdk Electronics Co., Ltd. | Chip ceramic capacitor |
USD267094S (en) * | 1979-04-12 | 1982-11-30 | Sharp Corporation | Magnetic card for microwave oven |
US4223321A (en) * | 1979-04-30 | 1980-09-16 | The Mead Corporation | Planar-faced electrode for ink jet printer and method of manufacture |
US4522449A (en) * | 1979-08-07 | 1985-06-11 | Hayward C Michael | Matrix board |
US4400762A (en) * | 1980-08-25 | 1983-08-23 | Allen-Bradley Company | Edge termination for an electrical circuit device |
US4437141A (en) * | 1981-09-14 | 1984-03-13 | Texas Instruments Incorporated | High terminal count integrated circuit device package |
US4419714A (en) * | 1982-04-02 | 1983-12-06 | International Business Machines Corporation | Low inductance ceramic capacitor and method for its making |
US4551746A (en) * | 1982-10-05 | 1985-11-05 | Mayo Foundation | Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation |
US4430690A (en) * | 1982-10-07 | 1984-02-07 | International Business Machines Corporation | Low inductance MLC capacitor with metal impregnation and solder bar contact |
US4630171A (en) * | 1983-11-22 | 1986-12-16 | Eurofarad-Efd | Support for a high-speed component, in particular a microwave frequency component, the support including incorporated decoupling members |
US4616655A (en) * | 1984-01-20 | 1986-10-14 | Cordis Corporation | Implantable pulse generator having a single printed circuit board and a chip carrier |
US4627533A (en) * | 1984-10-29 | 1986-12-09 | Hughes Aircraft Company | Ceramic package for compensated crystal oscillator |
US4750246A (en) * | 1984-10-29 | 1988-06-14 | Hughes Aircraft Company | Method of making compensated crystal oscillator |
US4775917A (en) * | 1985-12-03 | 1988-10-04 | Wells Manufacturing Company | Thermal compensated circuit board interconnect apparatus and method of forming the same |
USD299139S (en) * | 1985-12-04 | 1988-12-27 | Interlego | Interface panel |
US4661884A (en) * | 1986-03-10 | 1987-04-28 | American Technical Ceramics Corp. | Miniature, multiple layer, side mounting high frequency blocking capacitor |
US4821007A (en) * | 1987-02-06 | 1989-04-11 | Tektronix, Inc. | Strip line circuit component and method of manufacture |
US4790894A (en) * | 1987-02-19 | 1988-12-13 | Hitachi Condenser Co., Ltd. | Process for producing printed wiring board |
US4842184A (en) * | 1988-06-23 | 1989-06-27 | Ltv Aerospace & Defense Company | Method and apparatus for applying solder preforms |
US4853826A (en) * | 1988-08-01 | 1989-08-01 | Rogers Corporation | Low inductance decoupling capacitor |
US4947286A (en) * | 1988-08-11 | 1990-08-07 | Murata Manufacturing Co., Ltd. | Multilayer capacitor device |
US4963843A (en) * | 1988-10-31 | 1990-10-16 | Motorola, Inc. | Stripline filter with combline resonators |
US4956694A (en) * | 1988-11-04 | 1990-09-11 | Dense-Pac Microsystems, Inc. | Integrated circuit chip stacking |
US4852227A (en) * | 1988-11-25 | 1989-08-01 | Sprague Electric Company | Method for making a multilayer ceramic capacitor with buried electrodes and terminations at a castellated edge |
US4978639A (en) * | 1989-01-10 | 1990-12-18 | Avantek, Inc. | Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips |
US5428885A (en) * | 1989-01-14 | 1995-07-04 | Tdk Corporation | Method of making a multilayer hybrid circuit |
US5239198A (en) * | 1989-09-06 | 1993-08-24 | Motorola, Inc. | Overmolded semiconductor device having solder ball and edge lead connective structure |
US5224021A (en) * | 1989-10-20 | 1993-06-29 | Matsushita Electric Industrial Co., Ltd. | Surface-mount network device |
US5206495A (en) * | 1989-10-24 | 1993-04-27 | Angewandte Digital Elektronik Gmbh | Chip card |
US5225969A (en) * | 1989-12-15 | 1993-07-06 | Tdk Corporation | Multilayer hybrid circuit |
US5140745A (en) * | 1990-07-23 | 1992-08-25 | Mckenzie Jr Joseph A | Method for forming traces on side edges of printed circuit boards and devices formed thereby |
US5092035A (en) * | 1990-09-10 | 1992-03-03 | Codex Corporation | Method of making printed circuit board assembly |
US5126286A (en) * | 1990-10-05 | 1992-06-30 | Micron Technology, Inc. | Method of manufacturing edge connected semiconductor die |
US5138115A (en) * | 1990-10-12 | 1992-08-11 | Atmel Corporation | Carrierles surface mounted integrated circuit die |
US5621619A (en) * | 1990-10-25 | 1997-04-15 | Cts Corporation | All ceramic surface mount sip and dip networks having spacers and solder barriers |
US5293067A (en) * | 1991-05-23 | 1994-03-08 | Motorola, Inc. | Integrated circuit chip carrier |
US5309326A (en) * | 1991-12-06 | 1994-05-03 | Rohm Co., Ltd. | Circuit module having stacked circuit boards |
US5386087A (en) * | 1992-02-17 | 1995-01-31 | E. I. Du Pont De Nemours And Company | Printed circuit board having U-shaped solder mask layer separating respective contacts |
US5502885A (en) * | 1992-02-25 | 1996-04-02 | Rohm Co., Ltd. | Method of manfacturing a chip-type composite electronic part |
US5376778A (en) * | 1992-02-26 | 1994-12-27 | Angewandte Digital Electronik Gmbh | Contact-free chip card for remote transmission |
US5313096A (en) * | 1992-03-16 | 1994-05-17 | Dense-Pac Microsystems, Inc. | IC chip package having chip attached to and wire bonded within an overlying substrate |
US5266833A (en) * | 1992-03-30 | 1993-11-30 | Capps David F | Integrated circuit bus structure |
USD350125S (en) * | 1992-04-24 | 1994-08-30 | Sento Krei | Data containing rocket card |
US5247423A (en) * | 1992-05-26 | 1993-09-21 | Motorola, Inc. | Stacking three dimensional leadless multi-chip module and method for making the same |
US5635670A (en) * | 1992-07-27 | 1997-06-03 | Murata Manufacturing Co., Ltd. | Multilayer electronic component |
US5488765A (en) * | 1992-07-27 | 1996-02-06 | Murata Manufacturing Co., Ltd. | Method of measuring characteristics of a multilayer electronic component |
US5644107A (en) * | 1992-07-27 | 1997-07-01 | Murata Manufacturing Co., Ltd. | Method of manufacturing a multilayer electronic component |
US5625935A (en) * | 1992-07-27 | 1997-05-06 | Murata Manufacturing Co., Ltd. | Method of manufacturing a multilayer electronic component |
US5635669A (en) * | 1992-07-27 | 1997-06-03 | Murata Manufacturing Co., Ltd. | Multilayer electronic component |
US5604328A (en) * | 1992-07-27 | 1997-02-18 | Murata Manufacturing Co., Ltd. | Multilayer electronic component |
US5854534A (en) * | 1992-08-05 | 1998-12-29 | Fujitsu Limited | Controlled impedence interposer substrate |
US5740010A (en) * | 1992-10-21 | 1998-04-14 | Devoe; Daniel F. | Printing and adhering patterned metal on laid-up multi-layer green wafer before firing so as to later form precise integral co-fired conductive traces and pads on top and bottom surfaces of monolithic, buried-substrate, capacitors |
US5367430A (en) * | 1992-10-21 | 1994-11-22 | Presidio Components, Inc. | Monolithic multiple capacitor |
US5599413A (en) * | 1992-11-25 | 1997-02-04 | Matsushita Electric Industrial Co., Ltd. | Method of producing a ceramic electronic device |
US5714239A (en) * | 1993-03-15 | 1998-02-03 | Murata Manufacturing Co., Ltd. | Composite component |
US5493769A (en) * | 1993-08-05 | 1996-02-27 | Murata Manufacturing Co., Ltd. | Method of manufacturing electronic component and measuring characteristics of same |
US6147876A (en) * | 1993-09-14 | 2000-11-14 | Kabushiki Kaisha Toshiba | Multi-chip module having printed wiring board comprising circuit pattern for IC chip |
US6418030B1 (en) * | 1993-09-14 | 2002-07-09 | Kabushiki Kaisha Toshiba | Multi-chip module |
US5383095A (en) * | 1993-10-29 | 1995-01-17 | The Whitaker Corporation | Circuit board and edge-mountable connector therefor, and method of preparing a circuit board edge |
US5471368A (en) * | 1993-11-16 | 1995-11-28 | International Business Machines Corporation | Module having vertical peripheral edge connection |
US5570505A (en) * | 1993-11-16 | 1996-11-05 | International Business Machines Corporation | Method of manufacturing a circuit module |
US5773812A (en) * | 1994-02-08 | 1998-06-30 | Angewandte Digital Elektronik Gmbh | Chip card capable of both contact and contactless operation including a contact block |
US5752182A (en) * | 1994-05-09 | 1998-05-12 | Matsushita Electric Industrial Co., Ltd. | Hybrid IC |
US6218628B1 (en) * | 1994-05-18 | 2001-04-17 | Dyconex Patente Ag | Foil circuit boards and semifinished products and method for the manufacture thereof |
US6287949B1 (en) * | 1994-06-20 | 2001-09-11 | Fujitsu Limited | Multi-chip semiconductor chip module |
US5729437A (en) * | 1994-06-22 | 1998-03-17 | Seiko Epson Corporation | Electronic part including a thin body of molding resin |
US5600101A (en) * | 1994-07-21 | 1997-02-04 | Murata Manufacturing Co., Ltd. | Multilayer electronic component and method of manufacturing the same |
US5434745A (en) * | 1994-07-26 | 1995-07-18 | White Microelectronics Div. Of Bowmar Instrument Corp. | Stacked silicon die carrier assembly |
US5661420A (en) * | 1995-03-08 | 1997-08-26 | Etymotic Research, Inc. | Mounting configuration for monolithic integrated circuit |
US5514907A (en) * | 1995-03-21 | 1996-05-07 | Simple Technology Incorporated | Apparatus for stacking semiconductor chips |
US5832600A (en) * | 1995-06-06 | 1998-11-10 | Seiko Epson Corporation | Method of mounting electronic parts |
US5979048A (en) * | 1995-06-21 | 1999-11-09 | Polyplastics, Co., Inc. | Method of manufacturing connectors |
US5877561A (en) * | 1995-07-28 | 1999-03-02 | Lg Semicon Co., Ltd. | Plate and column type semiconductor package having heat sink |
US6181560B1 (en) * | 1995-07-28 | 2001-01-30 | Hyundai Electronics Industries Co., Ltd. | Semiconductor package substrate and semiconductor package |
US6383835B1 (en) * | 1995-09-01 | 2002-05-07 | Canon Kabushiki Kaisha | IC package having a conductive material at least partially filling a recess |
US5847930A (en) * | 1995-10-13 | 1998-12-08 | Hei, Inc. | Edge terminals for electronic circuit modules |
US5731709A (en) * | 1996-01-26 | 1998-03-24 | Motorola, Inc. | Method for testing a ball grid array semiconductor device and a device for such testing |
US6084780A (en) * | 1996-02-06 | 2000-07-04 | Kabushiki Kaisha Toshiba | Printed circuit board with high electronic component density |
US5841217A (en) * | 1996-03-14 | 1998-11-24 | Citizen Watch Co., Ltd. | Surface mounting crystal unit |
US5949294A (en) * | 1996-09-20 | 1999-09-07 | Matsushita Electric Industrial Co., Ltd. | Reference frequency source oscillator formed from first and second containers |
US6144090A (en) * | 1997-02-13 | 2000-11-07 | Fujitsu Limited | Ball grid array package having electrodes on peripheral side surfaces of a package board |
US6046409A (en) * | 1997-02-26 | 2000-04-04 | Ngk Spark Plug Co., Ltd. | Multilayer microelectronic circuit |
US6388264B1 (en) * | 1997-03-28 | 2002-05-14 | Benedict G Pace | Optocoupler package being hermetically sealed |
US5966052A (en) * | 1997-04-09 | 1999-10-12 | Murata Manufacturing Co., Ltd. | Voltage-controlled oscillator with input and output on opposite corners of substrate |
US5917709A (en) * | 1997-06-16 | 1999-06-29 | Eastman Kodak Company | Multiple circuit board assembly having an interconnect mechanism that includes a flex connector |
US5991162A (en) * | 1997-06-27 | 1999-11-23 | Nec Corporation | High-frequency integrated circuit device and manufacture method thereof |
US7041527B2 (en) * | 1997-07-29 | 2006-05-09 | Harvatek Corp. | Charge coupled device package |
US5811799A (en) * | 1997-07-31 | 1998-09-22 | Wu; Liang-Chung | Image sensor package having a wall with a sealed cover |
US6058004A (en) * | 1997-09-08 | 2000-05-02 | Delaware Capital Formation, Inc. | Unitized discrete electronic component arrays |
US20010055191A1 (en) * | 1997-11-10 | 2001-12-27 | Murata Manufacturing Co., Ltd. | Multilayer capacitor |
US6057597A (en) * | 1997-12-15 | 2000-05-02 | Micron Technology, Inc. | Semiconductor package with pre-fabricated cover |
US6624505B2 (en) * | 1998-02-06 | 2003-09-23 | Shellcase, Ltd. | Packaged integrated circuits and methods of producing thereof |
US6278178B1 (en) * | 1998-02-10 | 2001-08-21 | Hyundai Electronics Industries Co., Ltd. | Integrated device package and fabrication methods thereof |
US6803251B2 (en) * | 1998-02-10 | 2004-10-12 | Hyundai Electronics Industries Co., Ltd. | Integrated device package and fabrication methods thereof |
US6665930B2 (en) * | 1998-03-04 | 2003-12-23 | Koninklijke Philips Electronics N.V. | Printed circuit board with SMD components |
US20020029904A1 (en) * | 1998-03-04 | 2002-03-14 | Peter Matuschik | Printed circuit board with smd components |
US6115262A (en) * | 1998-06-08 | 2000-09-05 | Ford Motor Company | Enhanced mounting pads for printed circuit boards |
USD416236S (en) * | 1998-09-02 | 1999-11-09 | Citizen Electronics Co., Ltd. | Integrated circuit package |
US6452112B1 (en) * | 1998-10-19 | 2002-09-17 | Alps Electric Co., Ltd. | Electronic circuit unit useful for portable telephone, etc., and a method of manufacturing the same |
US7045386B2 (en) * | 1999-02-03 | 2006-05-16 | Rohm Co., Ltd. | Semiconductor device and semiconductor chip for use therein |
US7126226B2 (en) * | 1999-02-03 | 2006-10-24 | Rohm Co., Ltd. | Semiconductor device and semiconductor chip for use therein |
US6601295B2 (en) * | 1999-03-03 | 2003-08-05 | Mamoru Maekawa | Method of producing chip-type electronic devices |
USD429704S (en) * | 1999-03-10 | 2000-08-22 | Keonil Kang | Printed circuit board for wireless telephones |
US6407904B1 (en) * | 1999-05-10 | 2002-06-18 | Murata Manufacturing Co., Ltd. | Multi-layer capacitor |
US6601296B1 (en) * | 1999-07-06 | 2003-08-05 | Visteon Global Technologies, Inc. | Multi-shot injection molding process for making electrical connectors and three-dimensional circuits |
US6670700B1 (en) * | 1999-08-19 | 2003-12-30 | Seiko Epson Corporation | Interconnect substrate and semiconductor device electronic instrument |
US6534726B1 (en) * | 1999-10-25 | 2003-03-18 | Murata Manufacturing Co., Ltd. | Module substrate and method of producing the same |
US6407906B1 (en) * | 1999-12-06 | 2002-06-18 | Tdk Corporation | Multiterminal-multilayer ceramic capacitor |
US6657848B2 (en) * | 2000-01-28 | 2003-12-02 | Tdk Corporation | Multilayer electronic device and method for producing same |
US20020171997A1 (en) * | 2000-01-28 | 2002-11-21 | Tdk Corporation | Multilayer electronic device and method for producing same |
US6528870B2 (en) * | 2000-01-28 | 2003-03-04 | Kabushiki Kaisha Toshiba | Semiconductor device having a plurality of stacked wiring boards |
US20020123213A1 (en) * | 2000-02-24 | 2002-09-05 | Williams Vernon M. | Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
US6288345B1 (en) * | 2000-03-22 | 2001-09-11 | Raytheon Company | Compact z-axis DC and control signals routing substrate |
US6714420B2 (en) * | 2000-05-30 | 2004-03-30 | Alps Electric Co., Ltd. | Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment |
USD455125S1 (en) * | 2000-06-30 | 2002-04-02 | Molex Incorporated | Board to board plug connector |
USD453734S1 (en) * | 2000-06-30 | 2002-02-19 | Molex Incorporated | Board to board receptacle connector |
US6576999B2 (en) * | 2000-07-06 | 2003-06-10 | Murata Manufacturing Co., Ltd. | Mounting structure for an electronic component having an external terminal electrode |
US6934145B2 (en) * | 2000-07-06 | 2005-08-23 | Phycomp Holding B.V. | Ceramic multilayer capacitor array |
USD444132S1 (en) * | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
US6751101B2 (en) * | 2000-11-02 | 2004-06-15 | Murata Manufacturing Co., Ltd. | Electronic component and method of producing the same |
US6760227B2 (en) * | 2000-11-02 | 2004-07-06 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component and manufacturing method thereof |
US7506438B1 (en) * | 2000-11-14 | 2009-03-24 | Freescale Semiconductor, Inc. | Low profile integrated module interconnects and method of fabrication |
US6583981B2 (en) * | 2000-11-29 | 2003-06-24 | Murata Manufacturing Co., Ltd. | Ceramic condenser module |
US6456168B1 (en) * | 2000-12-29 | 2002-09-24 | Cts Corporation | Temperature compensated crystal oscillator assembled on crystal base |
US6862190B2 (en) * | 2001-01-17 | 2005-03-01 | Honeywell International, Inc. | Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers |
US6378757B1 (en) * | 2001-01-31 | 2002-04-30 | Agilent Technologies, Inc. | Method for edge mounting flex media to a rigid PC board |
US6828656B2 (en) * | 2001-02-08 | 2004-12-07 | Micron Technology, Inc. | High performance silicon contact for flip chip and a system using same |
US20020116668A1 (en) * | 2001-02-20 | 2002-08-22 | Matrix Semiconductor, Inc. | Memory card with enhanced testability and methods of making and using the same |
US6462408B1 (en) * | 2001-03-27 | 2002-10-08 | Staktek Group, L.P. | Contact member stacking system and method |
USD471167S1 (en) * | 2001-04-27 | 2003-03-04 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit board |
USD466093S1 (en) * | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
USD474773S1 (en) * | 2001-07-10 | 2003-05-20 | Sony Corporation | Information recording element |
US6724083B2 (en) * | 2001-07-16 | 2004-04-20 | Ars Electronics Co., Ltd. | Method of producing semiconductor packages by cutting via holes into half when separating substrate |
US6700794B2 (en) * | 2001-07-26 | 2004-03-02 | Harris Corporation | Decoupling capacitor closely coupled with integrated circuit |
US7304377B2 (en) * | 2001-09-25 | 2007-12-04 | Tdk Corporation | Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device |
US7151310B2 (en) * | 2001-09-25 | 2006-12-19 | Tdk Corporation | Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device |
US6566611B2 (en) * | 2001-09-26 | 2003-05-20 | Intel Corporation | Anti-tombstoning structures and methods of manufacture |
US7098081B2 (en) * | 2001-09-27 | 2006-08-29 | Hamamatsu Photonics K.K. | Semiconductor device and method of manufacturing the device |
US6496355B1 (en) * | 2001-10-04 | 2002-12-17 | Avx Corporation | Interdigitated capacitor with ball grid array (BGA) terminations |
US6639311B2 (en) * | 2001-10-05 | 2003-10-28 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component |
US8138617B2 (en) * | 2001-10-08 | 2012-03-20 | Round Rock Research, Llc | Apparatus and method for packaging circuits |
US20030071341A1 (en) * | 2001-10-16 | 2003-04-17 | Jeung Boon Suan | Apparatus and method for leadless packaging of semiconductor devices |
US6713868B2 (en) * | 2001-11-30 | 2004-03-30 | Kabushiki Kaisha Toshiba | Semiconductor device having leadless package structure |
US20030117784A1 (en) * | 2001-12-05 | 2003-06-26 | Kenji Fukunabe | Circuit board device and mounting method therefor |
US6949819B2 (en) * | 2001-12-27 | 2005-09-27 | Alps Electric Co., Ltd. | Jumper chip component and mounting structure therefor |
US7098531B2 (en) * | 2001-12-27 | 2006-08-29 | Alps Electric Co., Ltd. | Jumper chip component and mounting structure therefor |
US6759940B2 (en) * | 2002-01-10 | 2004-07-06 | Lamina Ceramics, Inc. | Temperature compensating device with integral sheet thermistors |
US7024947B2 (en) * | 2002-03-07 | 2006-04-11 | Alps Electric Co., Ltd. | Detection device including circuit component |
USD476962S1 (en) * | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
US7189083B2 (en) * | 2002-04-01 | 2007-03-13 | Interplex Nas, Inc, | Method of retaining a solder mass on an article |
US7576968B2 (en) * | 2002-04-15 | 2009-08-18 | Avx Corporation | Plated terminations and method of forming using electrolytic plating |
US7177137B2 (en) * | 2002-04-15 | 2007-02-13 | Avx Corporation | Plated terminations |
US7067172B2 (en) * | 2002-04-15 | 2006-06-27 | Avx Corporation | Component formation via plating technology |
US7152291B2 (en) * | 2002-04-15 | 2006-12-26 | Avx Corporation | Method for forming plated terminations |
US20040218344A1 (en) * | 2002-04-15 | 2004-11-04 | Ritter Andrew P. | Plated terminations |
US6960366B2 (en) * | 2002-04-15 | 2005-11-01 | Avx Corporation | Plated terminations |
US6956252B2 (en) * | 2002-04-24 | 2005-10-18 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
US8106488B2 (en) * | 2002-06-14 | 2012-01-31 | Micron Technology, Inc. | Wafer level packaging |
US7820484B2 (en) * | 2002-06-14 | 2010-10-26 | Micron Technology, Inc | Wafer level packaging |
US20080211113A1 (en) * | 2002-06-14 | 2008-09-04 | Micron Technology, Inc. | Wafer level packaging |
US20030232462A1 (en) * | 2002-06-18 | 2003-12-18 | Poo Chia Yong | Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods |
US6818977B2 (en) * | 2002-06-18 | 2004-11-16 | Micron Technology, Inc. | Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages |
US7226809B2 (en) * | 2002-06-18 | 2007-06-05 | Micron Technology, Inc. | Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods |
US7285850B2 (en) * | 2002-06-18 | 2007-10-23 | Micron Technology, Inc. | Support elements for semiconductor devices with peripherally located bond pads |
US6727116B2 (en) * | 2002-06-18 | 2004-04-27 | Micron Technology, Inc. | Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods |
US6606237B1 (en) * | 2002-06-27 | 2003-08-12 | Murata Manufacturing Co., Ltd. | Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same |
US20050130345A1 (en) * | 2002-08-28 | 2005-06-16 | Micron Technology, Inc. | Castellation wafer level packaging of integrated circuit chips |
US6855572B2 (en) * | 2002-08-28 | 2005-02-15 | Micron Technology, Inc. | Castellation wafer level packaging of integrated circuit chips |
US6822321B2 (en) * | 2002-09-30 | 2004-11-23 | Cree Microwave, Inc. | Packaged RF power transistor having RF bypassing/output matching network |
US6929974B2 (en) * | 2002-10-18 | 2005-08-16 | Motorola, Inc. | Feedthrough design and method for a hermetically sealed microdevice |
US6987315B2 (en) * | 2002-11-25 | 2006-01-17 | Samsung Electro-Mechanics Co., Ltd. | Ceramic multilayer substrate |
USD493152S1 (en) * | 2002-11-27 | 2004-07-20 | International Business Machines Corporation | Server blade chassis midplane printed circuit board with cover |
US6998926B2 (en) * | 2002-12-17 | 2006-02-14 | Seiko Epson Corporation | Piezoelectric oscillator, portable phone employing piezoelectric oscillator, and electronic apparatus employing piezoelectric oscillator |
US20040157410A1 (en) * | 2003-01-16 | 2004-08-12 | Seiko Epson Corporation | Semiconductor device, semiconductor module, electronic equipment, method for manufacturing semiconductor device, and method for manufacturing semiconductor module |
US6795294B2 (en) * | 2003-01-31 | 2004-09-21 | Murata Manufacturing Co., Ltd. | Laminated capacitor, printed circuit board, decoupling circuit, and high-frequency circuit |
US20040207049A1 (en) * | 2003-02-27 | 2004-10-21 | Infineon Technologies Ag | Electronic component and semiconductor wafer, and method for producing the same |
US7420262B2 (en) * | 2003-02-27 | 2008-09-02 | Infineon Technologies Ag | Electronic component and semiconductor wafer, and method for producing the same |
US6906907B2 (en) * | 2003-04-15 | 2005-06-14 | Kemet Electronics Corporation | Monolithic multi-layer capacitor with improved lead-out structure |
US7273765B2 (en) * | 2003-04-28 | 2007-09-25 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device and method for producing the same |
US20100146780A1 (en) * | 2003-05-06 | 2010-06-17 | Yong Poo Chia | Method for packaging circuits and packaged circuits |
US8065792B2 (en) * | 2003-05-06 | 2011-11-29 | Micron Technology, Inc. | Method for packaging circuits |
USD499379S1 (en) * | 2003-08-08 | 2004-12-07 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector |
USD501448S1 (en) * | 2003-08-19 | 2005-02-01 | Japan Aviation Electronics Industry, Limited | Electrical connector |
US7168161B2 (en) * | 2003-08-25 | 2007-01-30 | Renesas Technology Corp. | Manufacturing method of solid-state image sensing device |
US7429501B1 (en) * | 2003-08-25 | 2008-09-30 | Xilinx, Inc. | Lid and method of employing a lid on an integrated circuit |
US7247509B2 (en) * | 2003-09-03 | 2007-07-24 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing solid-state imaging devices |
US8021965B1 (en) * | 2003-09-04 | 2011-09-20 | University Of Norte Dame Du Lac | Inter-chip communication |
US7612443B1 (en) * | 2003-09-04 | 2009-11-03 | University Of Notre Dame Du Lac | Inter-chip communication |
US7335951B2 (en) * | 2003-10-06 | 2008-02-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US7843115B2 (en) * | 2003-11-25 | 2010-11-30 | Eta Sa Manufacture Horlogère Suisse | Electronic component having a resonator element arranged in an hermetically closed housing and method for manufacturing such an electronic component |
USD508235S1 (en) * | 2003-12-05 | 2005-08-09 | Nichia Corporation | Light emitting diode |
US6933209B2 (en) * | 2003-12-24 | 2005-08-23 | Super Talent Electronics Inc. | Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges |
USD508682S1 (en) * | 2004-02-23 | 2005-08-23 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD521952S1 (en) * | 2004-02-23 | 2006-05-30 | Kabushiki Kaisha Toshiba | Semiconductor device |
US7050288B2 (en) * | 2004-03-11 | 2006-05-23 | Tdk Corporation | Laminated ceramic capacitor |
US7291235B2 (en) * | 2004-04-16 | 2007-11-06 | Kemet Electronics Corporation | Thermal dissipating capacitor and electrical component comprising same |
US7068490B2 (en) * | 2004-04-16 | 2006-06-27 | Kemet Electronics Corporation | Thermal dissipating capacitor and electrical component comprising same |
US7123108B2 (en) * | 2004-08-26 | 2006-10-17 | Nihon Dempa Kogyo Co., Ltd. | Surface mount crystal oscillator |
USD536309S1 (en) * | 2004-12-08 | 2007-02-06 | Nichia Corporation | Light emitting diode board |
US7212395B2 (en) * | 2004-12-28 | 2007-05-01 | Intel Corporation | Capacitor design for controlling equivalent series resistance |
US20070205017A1 (en) * | 2005-01-31 | 2007-09-06 | Sanyo Electric Co., Ltd. | Circuit device and method of manufacturing the same |
US7433172B2 (en) * | 2005-03-10 | 2008-10-07 | Tdk Corporation | Multilayer capacitor |
US7599166B2 (en) * | 2005-11-17 | 2009-10-06 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip capacitor |
US7232318B2 (en) * | 2005-11-22 | 2007-06-19 | Lih Duo International Co., Ltd. | IC embedding seat |
US7508647B2 (en) * | 2005-11-22 | 2009-03-24 | Murata Manufacturing Co., Ltd. | Multilayer capacitor |
US7466535B2 (en) * | 2005-11-22 | 2008-12-16 | Murata Manufacturing Co., Ltd. | Multilayer capacitor |
US7932786B2 (en) * | 2005-11-30 | 2011-04-26 | Nihon Dempa Kogyo Co., Ltd. | Surface mount type crystal oscillator |
US7616427B2 (en) * | 2006-05-22 | 2009-11-10 | Murata Manufacturing Co., Ltd. | Monolithic ceramic capacitor |
US7750441B2 (en) * | 2006-06-29 | 2010-07-06 | Intel Corporation | Conductive interconnects along the edge of a microelectronic device |
US7411776B2 (en) * | 2006-07-12 | 2008-08-12 | Tdk Corporation | Multilayer capacitor array |
US7888185B2 (en) * | 2006-08-17 | 2011-02-15 | Micron Technology, Inc. | Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device |
USD544447S1 (en) * | 2006-09-26 | 2007-06-12 | Cheng Uei Precision Industry Co., Ltd. | Board to board connector |
US7791173B2 (en) * | 2007-01-23 | 2010-09-07 | Samsung Electronics Co., Ltd. | Chip having side pad, method of fabricating the same and package using the same |
USD582852S1 (en) * | 2007-05-31 | 2008-12-16 | Omron Corporation | Plug |
USD582858S1 (en) * | 2007-05-31 | 2008-12-16 | Omron Corporation | Socket |
USD616373S1 (en) * | 2007-07-24 | 2010-05-25 | Omron Corporation | Connector for flexible printed circuit board |
US7502216B2 (en) * | 2007-08-06 | 2009-03-10 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip capacitor |
US7829977B2 (en) * | 2007-11-15 | 2010-11-09 | Advanced Semiconductor Engineering, Inc. | Low temperature co-fired ceramics substrate and semiconductor package |
US7554189B1 (en) * | 2008-03-03 | 2009-06-30 | Universal Scientific Industrial Co., Ltd. | Wireless communication module |
US8159813B2 (en) * | 2008-04-01 | 2012-04-17 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip capacitor, motherboard apparatus having the same, and power distribution network |
US8113888B2 (en) * | 2008-05-15 | 2012-02-14 | Adc Gmbh | Circuit board for electrical connector and electrical connector |
USD605613S1 (en) * | 2008-05-15 | 2009-12-08 | Adc Gmbh | Printed circuit board for electrical connector |
USD643040S1 (en) * | 2010-10-26 | 2011-08-09 | Hon Hai Precision Ind. Co., Ltd. | Electrical card |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
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