US8981629B2 - Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby - Google Patents
Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby Download PDFInfo
- Publication number
- US8981629B2 US8981629B2 US13/802,401 US201313802401A US8981629B2 US 8981629 B2 US8981629 B2 US 8981629B2 US 201313802401 A US201313802401 A US 201313802401A US 8981629 B2 US8981629 B2 US 8981629B2
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- Prior art keywords
- led chips
- lighting assembly
- heat sink
- pcb
- pedestal
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (21)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/802,401 US8981629B2 (en) | 2008-08-26 | 2013-03-13 | Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby |
PCT/US2014/026746 WO2014160470A2 (en) | 2013-03-13 | 2014-03-13 | Methods of integrating led chips with heat sinks, and led-based lighting assemblies made thereby |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/198,662 US7791089B2 (en) | 2008-08-26 | 2008-08-26 | LED packaging methods and LED-based lighting products |
US23430909P | 2009-08-16 | 2009-08-16 | |
US12/857,472 US8058659B2 (en) | 2008-08-26 | 2010-08-16 | LED chip-based lighting products and methods of building |
US13/287,796 US8338197B2 (en) | 2008-08-26 | 2011-11-02 | LED chip-based lighting products and methods of building |
US13/718,755 US8558255B2 (en) | 2008-08-26 | 2012-12-18 | LED chip-based lighting products and methods of building |
US13/802,401 US8981629B2 (en) | 2008-08-26 | 2013-03-13 | Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/718,755 Continuation-In-Part US8558255B2 (en) | 2008-08-26 | 2012-12-18 | LED chip-based lighting products and methods of building |
Publications (2)
Publication Number | Publication Date |
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US20140125213A1 US20140125213A1 (en) | 2014-05-08 |
US8981629B2 true US8981629B2 (en) | 2015-03-17 |
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US13/802,401 Expired - Fee Related US8981629B2 (en) | 2008-08-26 | 2013-03-13 | Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby |
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