US8258681B2 - Heat dissipating device for lightings - Google Patents

Heat dissipating device for lightings Download PDF

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US8258681B2
US8258681B2 US12/833,248 US83324810A US8258681B2 US 8258681 B2 US8258681 B2 US 8258681B2 US 83324810 A US83324810 A US 83324810A US 8258681 B2 US8258681 B2 US 8258681B2
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Prior art keywords
heat dissipating
light source
substrate
heat sink
heat
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US20110057551A1 (en
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Tsung-Lung Lee
Kuo-Sung Huang
Cheng-Tao Lee
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Elements Performance Materials Ltd
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Elements Performance Materials Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a heat dissipating device for lightings; in particular, a heat dissipating device that directs the airflow to increase heat dissipation.
  • a light emitting diode has several advantages such as being eco-friendly, high brightness, energy saving, and long service life. Therefore, it has been widely used in various lighting applications. However, it produces high temperature during light emitting. If the heat cannot be dissipated properly, the illumination performance would be adversely affected and even burn out the lightings.
  • the light source module 7 includes at least one light source 71 , a circuit board 72 , and a lens 73 .
  • the light source 71 is a light emitting diode (LED) and is located on the circuit board 72 .
  • the lens 73 is mounted under the light source 71 . When the light source 71 is turned on, light is emitted through the lens 73 .
  • the heat sink 8 is connected to the light source module 7 .
  • the heat sink 8 has a substrate 81 and a plurality of heat dissipating fins 82 extending outward from the outer edge of the substrate 81 .
  • a plurality of channels 83 is formed between the heat dissipating fins 82 for air to flow through to take away heat from the heat sink 8 .
  • a connector 84 is connected to the middle or bottom of the substrate 81 .
  • the light source 71 and the circuit board 72 of the light source module 7 are located on the connector 84 , so that the heat generated from the light source module 7 can be transferred to the heat sink 8 .
  • the converter 9 is connected to the top of the heat sink 8 .
  • the converter 9 of the MR16 lighting has an insulating socket 91 and two pins 92 .
  • the two pins 92 are electrically connected to the light source 71 and the circuit board 72 of the light source module 7 , so as to transmit the power to the light source 71 and the circuit board 72 .
  • the converter 9 of the E27 lighting has an insulating socket 93 and an electrically conductive terminal 94 .
  • the conductive terminal 94 is electrically connected to the light source 71 and the circuit board 72 of the light source module 7 , so as to transmit the power to the light source 71 and the circuit board 72 .
  • the channels 83 of the conventional heat sink 8 can only direct the airflow between the heat dissipating fins 82 along the outer edge of the heat sink 8 .
  • the airflow cannot enter the centre of the heat sink 8 .
  • the resulting heat dissipating effect is significantly weakened.
  • the object of the present invention is to provide a heat dissipating device for lightings, which can effectively direct the airflow into the centre of a heat sink so as to enhance the heat dissipating effect of the heat sink.
  • a heat dissipating device for lightings includes a light source module, having at least one light source; a heat sink connected to the light source module with a substrate and a plurality of heat dissipating fins extending outward from the substrate, wherein a plurality of channels is formed between the heat dissipating fins, where on the inside of each channel having a port open to the centre of the heat sink; and a converter, connected to the heat sink.
  • the heat dissipating device for lightings includes a light source module having at least one light source; a heat sink, connected to the light source module and having a plurality of heat dissipating fins with a connecting section connected to the bottom of the heat dissipating fins, wherein a plurality of channels is formed between the heat dissipating fins, with the inside of every channel having a port open to the centre of the heat sink; and a converter, connected to the heat sink.
  • the invention offers the following advantages.
  • the channels of the heat sink can direct the air to flow along the heat dissipating fins at the outer edge of the heat sink. Additionally, the air can also flow toward the center of the heat sink so as to enter the centre of the heat sink and outside the converter, enhancing the heat dissipating effect of the heat sink.
  • FIG. 1 shows a cross-sectional view of a conventional heat dissipating device for lightings
  • FIG. 2 is a cross-sectional view of another conventional heat dissipating device for lightings
  • FIG. 3 is a perspective, exploded view of a heat dissipating device for lightings according to a first embodiment of the invention
  • FIG. 4 is a perspective, exploded view of a heat dissipating device for lightings at different angle of view of FIG. 3 ;
  • FIG. 5 is a perspective view of a heat dissipating device for lightings according to a first embodiment of the invention
  • FIG. 6 is a cross-sectional view of a heat dissipating device for lightings according to a first embodiment of the invention
  • FIG. 7 is a perspective view of a heat dissipating device for lightings having a top ring according to a first embodiment of the invention
  • FIG. 8 is a perspective view of a heat dissipating device for lightings having a bottom ring according to a first embodiment of the invention
  • FIG. 9 is a perspective, exploded view of a heat dissipating device for lightings according to a second embodiment of the invention.
  • FIG. 10 is a perspective, exploded view of a heat dissipating device for lightings from a different angle of view of FIG. 9 ;
  • FIG. 11 is a perspective view of a heat dissipating device for lightings according to a second embodiment of the invention.
  • FIG. 12 is a cross-sectional view of a heat dissipating device for lightings according to a second embodiment of the invention.
  • a heat dissipating device for a lighting of type MR16 includes a light source module 1 , a heat sink 2 , and a converter 3 .
  • the light source module 1 has at least one light source 11 , a circuit board 12 , and a lens 13 .
  • the light source 11 is a light emitting diode (LED), and is located on the circuit board 12 in a manner to electrically connect to the circuit board 12 .
  • the lens 13 is located below the light source 11 . When the light source 11 is on, the light generated from the light source 11 is emitted through the lens 13 .
  • the heat sink 2 is connected to the light source module 1 . It is made of highly thermal conductive material. It has a substrate 21 and a plurality of heat dissipating fins 22 extending outward from the substrate 21 .
  • the substrate 21 has an outer curved surface 241 .
  • the heat dissipating fins 22 can be flat or curved. These heat dissipating fins 22 are spaced in intervals around the outer surface of the substrate 21 .
  • a plurality of channels 23 is formed between the heat dissipating fins 22 for air to flow through and take away the heat from the heat sink 2 .
  • Bottoms, tops, and outer sides of these channels 23 can be arranged in a flared position and opened shape to further allow the airflow.
  • At least one of the heat dissipating fins 22 has an inner edge 221 disconnected from the substrate 21 .
  • Between the channels 23 have a plurality of port 231 , which is arranged in a flared position above the substrate 21 .
  • the converter 3 has one end connected to the heat sink 2 .
  • a gap is formed between the inner edges 221 of the heat dissipating fins 22 and the converter 3 , or between the inner edges 221 of the heat dissipating fins 22 and the outer curved surface 241 of the substrate 21 .
  • the gap defines a ring-shaped air passage W, and the air passage W is communicated with the ports 231 of the channels 23 between the heat dissipating fins 22 .
  • the top of the substrate 21 is connected to a connecting section 24 on which the light source 11 and the circuit board 12 of the light source module 1 are attached.
  • the heat generated by the light source module 1 can be passed to the heat sink 2 via the connecting section 24 .
  • the substrate 21 of the heat sink 2 has a first space 25 therein.
  • the first space 25 is located under the connecting section 24 to accommodate the light source module 1 .
  • a second space 26 is formed above the connecting section 24 of the heat sink 2 to accommodate the converter 3 .
  • the converter 3 is connected to the top of the heat sink 2 .
  • the converter 3 is of type MR 16 and has an insulating socket 31 and two pins 32 .
  • the two pins 32 are fixed to one end (top) of the insulating socket 31 .
  • the two pins 32 are further electrically connected to the circuit board 12 of the light source module 1 so as to transmit the power to the circuit board 12 and the light source 11 .
  • the lower part of the converter 3 is accommodated in the second space 26 of the heat sink 2 .
  • the converter 3 is properly secured onto the connecting section 24 . Thereby, a heat dissipating device for lightings according to the invention is accomplished.
  • the channels 23 of the heat sink 2 can direct the airflow A to move along the heat dissipating fins 22 at the outer edge of the heat sink 2 .
  • the airflow A can also flow through the ports 231 of the channels 23 toward the air passage W, which is formed between the heat dissipating fins 22 and the converter 3 or between the heat dissipating fins 22 and the substrate 21 , so as airflow A enter the centre of the heat sink 2 next to the converter 3 or a periphery of the substrate 21 of the heat sink 2 , enhancing the heat dissipating effect of the heat sink 2 . Therefore, the light source 11 of the light source module 1 can emit light at proper temperature, without adversely affecting the illumination performance.
  • a ring 27 can be further added to the top (in FIG. 7 ) or the bottom (in FIG. 8 ) of the heat sink 2 .
  • both the top and the bottom of the heat sink 2 can be added with the ring 27 , which are not shown.
  • the ring 27 connects to the top or the bottom end of the heat dissipating fins 22 to increase the area for heat dissipation.
  • a heat dissipating device for lightings of type E27 includes a light source module 4 , a heat sink 5 , and a converter 6 .
  • the light source module 4 has at least one light source 41 , a circuit board 42 , and a lens 43 .
  • the light source 41 is a light emitting diode (LED), and is located on the circuit board 42 in a manner to electrically connect to the circuit board 42 .
  • the lens 43 is located below the light source 41 .
  • the heat sink 5 is connected to the light source module 4 .
  • the heat sink 5 has a plurality of heat dissipating fins 52 and a connecting section 54 connecting to the bottom of the heat dissipating fins 52 .
  • the heat dissipating fins 52 can be flat or curved. These heat dissipating fins 52 are spaced in intervals on top of the connecting section 54 .
  • a plurality of channels 53 is formed between the heat dissipating fins 52 for the air to flow through and take away the heat from the heat sink 5 .
  • each of the channels 53 has a port 531 arranged in flared position to connect the channels 53 internally with the centre of the heat sink 5 .
  • the light source 41 , the circuit board 42 , and the lens 43 of the light source module 4 are attached to the connecting section 54 so that the heat generated by the light source module 4 can be passed onto the heat sink 5 via the connecting section 54 .
  • the heat sink 5 has a space 55 above the connecting section 54 for accommodating the converter 6 .
  • the converter 6 can be connected to the top of the heat sink 5 or onto the connecting section 54 .
  • the converter 6 is of type E27, and has an insulating socket 61 and an electrically conductive terminal 62 .
  • the electrically conductive terminal 62 is electrically connected to the light source 41 and the circuit board 42 of the light source module 4 so as to transmit the power to the circuit board 42 and the light source 41 .
  • the lower part of the converter 6 is accommodated in the space 55 of the heat sink 5 .
  • the converter 6 is properly secured onto the heat sink 5 .
  • the channels 53 of the heat sink 5 can direct the airflow A to move along the heat dissipating fins 52 at the outer edge of the heat sink 5 . Additionally, the airflow A can also flow toward the center of the heat sink 5 so as to enter the centre of the heat sink 5 next to the converter 6 , enhancing the heat dissipating effect of the heat sink 5 . Therefore, the light source 41 of the light source module 4 can emit light at proper temperature, without adversely affecting the illumination performance.

Abstract

A heat dissipating device for lightings includes a light source module, a heat sink, and a converter. The heat sink has a substrate and a plurality of heat dissipating fins extending outward from the substrate. A plurality of channels is formed between the heat dissipating fins. Insides of the channels respectively have a port open to the center of the heat sink. Thereby, the channels of the heat sink can effectively direct the airflow into the center of the heat sink, enhancing the heat dissipating effect of the heat sink.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat dissipating device for lightings; in particular, a heat dissipating device that directs the airflow to increase heat dissipation.
2. Description of Related Art
A light emitting diode (LED) has several advantages such as being eco-friendly, high brightness, energy saving, and long service life. Therefore, it has been widely used in various lighting applications. However, it produces high temperature during light emitting. If the heat cannot be dissipated properly, the illumination performance would be adversely affected and even burn out the lightings.
Referring to FIG. 1 and FIG. 2, which illustrate a conventional heat dissipating devices of type MR16 and E27 respectively. Both devices include a light source module 7, a heat sink 8, and a converter 9. The light source module 7 includes at least one light source 71, a circuit board 72, and a lens 73. The light source 71 is a light emitting diode (LED) and is located on the circuit board 72. The lens 73 is mounted under the light source 71. When the light source 71 is turned on, light is emitted through the lens 73.
The heat sink 8 is connected to the light source module 7. The heat sink 8 has a substrate 81 and a plurality of heat dissipating fins 82 extending outward from the outer edge of the substrate 81. A plurality of channels 83 is formed between the heat dissipating fins 82 for air to flow through to take away heat from the heat sink 8. A connector 84 is connected to the middle or bottom of the substrate 81. The light source 71 and the circuit board 72 of the light source module 7 are located on the connector 84, so that the heat generated from the light source module 7 can be transferred to the heat sink 8.
The converter 9 is connected to the top of the heat sink 8. As shown in FIG. 1, the converter 9 of the MR16 lighting has an insulating socket 91 and two pins 92. The two pins 92 are electrically connected to the light source 71 and the circuit board 72 of the light source module 7, so as to transmit the power to the light source 71 and the circuit board 72.
Referring to FIG. 2, the converter 9 of the E27 lighting has an insulating socket 93 and an electrically conductive terminal 94. The conductive terminal 94 is electrically connected to the light source 71 and the circuit board 72 of the light source module 7, so as to transmit the power to the light source 71 and the circuit board 72.
However, the channels 83 of the conventional heat sink 8 can only direct the airflow between the heat dissipating fins 82 along the outer edge of the heat sink 8. The airflow cannot enter the centre of the heat sink 8. The resulting heat dissipating effect is significantly weakened.
Therefore, there is a need of a novel structure which overcomes the above disadvantages.
SUMMARY OF THE INVENTION
The object of the present invention is to provide a heat dissipating device for lightings, which can effectively direct the airflow into the centre of a heat sink so as to enhance the heat dissipating effect of the heat sink.
In order to achieve the aforementioned objects, according to an aspect of the present invention, a heat dissipating device for lightings includes a light source module, having at least one light source; a heat sink connected to the light source module with a substrate and a plurality of heat dissipating fins extending outward from the substrate, wherein a plurality of channels is formed between the heat dissipating fins, where on the inside of each channel having a port open to the centre of the heat sink; and a converter, connected to the heat sink.
According to another aspect of the invention, the heat dissipating device for lightings includes a light source module having at least one light source; a heat sink, connected to the light source module and having a plurality of heat dissipating fins with a connecting section connected to the bottom of the heat dissipating fins, wherein a plurality of channels is formed between the heat dissipating fins, with the inside of every channel having a port open to the centre of the heat sink; and a converter, connected to the heat sink.
The invention offers the following advantages. The channels of the heat sink can direct the air to flow along the heat dissipating fins at the outer edge of the heat sink. Additionally, the air can also flow toward the center of the heat sink so as to enter the centre of the heat sink and outside the converter, enhancing the heat dissipating effect of the heat sink.
In order to further the understanding regarding the present invention, the following embodiments are provided along with illustrations to facilitate the disclosure of the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows a cross-sectional view of a conventional heat dissipating device for lightings;
FIG. 2 is a cross-sectional view of another conventional heat dissipating device for lightings;
FIG. 3 is a perspective, exploded view of a heat dissipating device for lightings according to a first embodiment of the invention;
FIG. 4 is a perspective, exploded view of a heat dissipating device for lightings at different angle of view of FIG. 3;
FIG. 5 is a perspective view of a heat dissipating device for lightings according to a first embodiment of the invention;
FIG. 6 is a cross-sectional view of a heat dissipating device for lightings according to a first embodiment of the invention;
FIG. 7 is a perspective view of a heat dissipating device for lightings having a top ring according to a first embodiment of the invention;
FIG. 8 is a perspective view of a heat dissipating device for lightings having a bottom ring according to a first embodiment of the invention;
FIG. 9 is a perspective, exploded view of a heat dissipating device for lightings according to a second embodiment of the invention;
FIG. 10 is a perspective, exploded view of a heat dissipating device for lightings from a different angle of view of FIG. 9;
FIG. 11 is a perspective view of a heat dissipating device for lightings according to a second embodiment of the invention; and
FIG. 12 is a cross-sectional view of a heat dissipating device for lightings according to a second embodiment of the invention.
 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The aforementioned illustrations and following detailed descriptions are exemplary for the purpose of further explaining the scope of the present invention. Other objectives and advantages related to the present invention will be illustrated in the subsequent descriptions and appended drawings.
Referring to FIG. 3 through FIG. 6, a heat dissipating device for a lighting of type MR16 according to a first embodiment of the invention includes a light source module 1, a heat sink 2, and a converter 3. The light source module 1 has at least one light source 11, a circuit board 12, and a lens 13. The light source 11 is a light emitting diode (LED), and is located on the circuit board 12 in a manner to electrically connect to the circuit board 12. The lens 13 is located below the light source 11. When the light source 11 is on, the light generated from the light source 11 is emitted through the lens 13.
The heat sink 2 is connected to the light source module 1. It is made of highly thermal conductive material. It has a substrate 21 and a plurality of heat dissipating fins 22 extending outward from the substrate 21. The substrate 21 has an outer curved surface 241. The heat dissipating fins 22 can be flat or curved. These heat dissipating fins 22 are spaced in intervals around the outer surface of the substrate 21. A plurality of channels 23 is formed between the heat dissipating fins 22 for air to flow through and take away the heat from the heat sink 2.
Bottoms, tops, and outer sides of these channels 23 can be arranged in a flared position and opened shape to further allow the airflow. At least one of the heat dissipating fins 22 has an inner edge 221 disconnected from the substrate 21. Between the channels 23 have a plurality of port 231, which is arranged in a flared position above the substrate 21. The converter 3 has one end connected to the heat sink 2. A gap is formed between the inner edges 221 of the heat dissipating fins 22 and the converter 3, or between the inner edges 221 of the heat dissipating fins 22 and the outer curved surface 241 of the substrate 21. The gap defines a ring-shaped air passage W, and the air passage W is communicated with the ports 231 of the channels 23 between the heat dissipating fins 22.
The top of the substrate 21 is connected to a connecting section 24 on which the light source 11 and the circuit board 12 of the light source module 1 are attached. The heat generated by the light source module 1 can be passed to the heat sink 2 via the connecting section 24. The substrate 21 of the heat sink 2 has a first space 25 therein. The first space 25 is located under the connecting section 24 to accommodate the light source module 1. A second space 26 is formed above the connecting section 24 of the heat sink 2 to accommodate the converter 3.
The converter 3 is connected to the top of the heat sink 2. In this embodiment, the converter 3 is of type MR 16 and has an insulating socket 31 and two pins 32. The two pins 32 are fixed to one end (top) of the insulating socket 31. The two pins 32 are further electrically connected to the circuit board 12 of the light source module 1 so as to transmit the power to the circuit board 12 and the light source 11. The lower part of the converter 3 is accommodated in the second space 26 of the heat sink 2. The converter 3 is properly secured onto the connecting section 24. Thereby, a heat dissipating device for lightings according to the invention is accomplished.
Referring to FIG. 6, the channels 23 of the heat sink 2 can direct the airflow A to move along the heat dissipating fins 22 at the outer edge of the heat sink 2. Additionally, the airflow A can also flow through the ports 231 of the channels 23 toward the air passage W, which is formed between the heat dissipating fins 22 and the converter 3 or between the heat dissipating fins 22 and the substrate 21, so as airflow A enter the centre of the heat sink 2 next to the converter 3 or a periphery of the substrate 21 of the heat sink 2, enhancing the heat dissipating effect of the heat sink 2. Therefore, the light source 11 of the light source module 1 can emit light at proper temperature, without adversely affecting the illumination performance.
Referring to FIG. 7 and FIG. 8, in this embodiment, a ring 27 can be further added to the top (in FIG. 7) or the bottom (in FIG. 8) of the heat sink 2. Alternatively, both the top and the bottom of the heat sink 2 can be added with the ring 27, which are not shown. The ring 27 connects to the top or the bottom end of the heat dissipating fins 22 to increase the area for heat dissipation.
Referring to FIG. 9 through FIG. 12, a heat dissipating device for lightings of type E27 according to a second embodiment of the invention includes a light source module 4, a heat sink 5, and a converter 6. The light source module 4 has at least one light source 41, a circuit board 42, and a lens 43. The light source 41 is a light emitting diode (LED), and is located on the circuit board 42 in a manner to electrically connect to the circuit board 42. The lens 43 is located below the light source 41.
The heat sink 5 is connected to the light source module 4. The heat sink 5 has a plurality of heat dissipating fins 52 and a connecting section 54 connecting to the bottom of the heat dissipating fins 52. The heat dissipating fins 52 can be flat or curved. These heat dissipating fins 52 are spaced in intervals on top of the connecting section 54. A plurality of channels 53 is formed between the heat dissipating fins 52 for the air to flow through and take away the heat from the heat sink 5.
The tops and outer edges of these channels 53 can be arranged in a flared positions to promote airflow. Each of the channels 53 has a port 531 arranged in flared position to connect the channels 53 internally with the centre of the heat sink 5.
The light source 41, the circuit board 42, and the lens 43 of the light source module 4 are attached to the connecting section 54 so that the heat generated by the light source module 4 can be passed onto the heat sink 5 via the connecting section 54. The heat sink 5 has a space 55 above the connecting section 54 for accommodating the converter 6.
The converter 6 can be connected to the top of the heat sink 5 or onto the connecting section 54. In this embodiment, the converter 6 is of type E27, and has an insulating socket 61 and an electrically conductive terminal 62. The electrically conductive terminal 62 is electrically connected to the light source 41 and the circuit board 42 of the light source module 4 so as to transmit the power to the circuit board 42 and the light source 41. The lower part of the converter 6 is accommodated in the space 55 of the heat sink 5. The converter 6 is properly secured onto the heat sink 5.
Referring to FIG. 12, the channels 53 of the heat sink 5 can direct the airflow A to move along the heat dissipating fins 52 at the outer edge of the heat sink 5. Additionally, the airflow A can also flow toward the center of the heat sink 5 so as to enter the centre of the heat sink 5 next to the converter 6, enhancing the heat dissipating effect of the heat sink 5. Therefore, the light source 41 of the light source module 4 can emit light at proper temperature, without adversely affecting the illumination performance.
The descriptions illustrated supra set forth simply the preferred embodiments of the present invention; however, the characteristics of the present invention are by no means restricted thereto. All changes, alternations, or modifications conveniently considered by those skilled in the art are deemed to be encompassed within the scope of the present invention delineated by the following claims.

Claims (10)

1. A heat dissipating device for lightings, comprising:
a light source module, having at least one light source;
a heat sink, connected to the light source module and having a substrate and a plurality of heat dissipating fins extending outward from the substrate, wherein the substrate has an outer curved surface, wherein a plurality of channels is formed between the heat dissipating fins, wherein bottoms, tops and outer sides of the channels are opened, wherein at least one of the heat dissipating fins has an inner edge disconnected from the substrate, wherein the channels respectively have a port formed at an inner side thereof; and
a converter, having one end connected to the heat sink;
wherein a gap is formed between the inner edge of the heat dissipating fins and the converter, and between the inner edge of the heat dissipating fins and the outer curved surface of the substrate alternatively, the gap defines a ring-shaped air passage, the air passage is communicated with the ports of the channels between the heat dissipating fins.
2. The heat dissipating device of claim 1, wherein the light source is a light emitting diode.
3. The heat dissipating device of claim 1, wherein the ports are located above the substrate.
4. The heat dissipating device of claim 1, wherein the heat dissipating fins are formed by extending from the outer edges of the substrate; the heat dissipating fins are flat or curved and spaced in intervals around the outer part of the substrate; and bottoms, tops and side parts of the channels are arranged in flared positions.
5. The heat dissipating device of claim 1, wherein the light source module has a circuit board and a lens; the light source is located on the circuit board; and the lens is located below the light source.
6. The heat dissipating device of claim 5, wherein the substrate has a connecting section on which the light source and circuit board of the light source module are attached.
7. The heat dissipating device of claim 6, wherein the substrate of the heat sink has a first space therein; the first space is located under the connecting section; and the light source module is accommodated in the first space.
8. The heat dissipating device of claim 6, wherein a second space is defined above the connecting section of the heat sink to accommodate the lower part of the converter.
9. The heat dissipating device of claim 1, wherein the heat dissipating fins are respectively connected to a ring.
10. The heat dissipating device of claim 1, wherein the converter is of type MR16 and has an insulating socket and two pins; the two pins are fixed to one end of the insulating socket; and the two pins are electrically connected to the light source module.
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JP5411088B2 (en) 2014-02-12
JP2011060754A (en) 2011-03-24

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