US7565259B2 - System and method for reducing temperature variation during burn in - Google Patents
System and method for reducing temperature variation during burn in Download PDFInfo
- Publication number
- US7565259B2 US7565259B2 US11/881,006 US88100607A US7565259B2 US 7565259 B2 US7565259 B2 US 7565259B2 US 88100607 A US88100607 A US 88100607A US 7565259 B2 US7565259 B2 US 7565259B2
- Authority
- US
- United States
- Prior art keywords
- integrated circuit
- under test
- ambient temperature
- bias voltage
- circuit under
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000012360 testing method Methods 0.000 claims abstract description 123
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 description 12
- 238000009826 distribution Methods 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 230000002939 deleterious effect Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910001338 liquidmetal Inorganic materials 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
Abstract
Description
Tjunction=Tambient+Pθi (Relation 1)
where T is temperature, P is power consumed by the integrated circuit. “θi” is the lumped thermal resistance of the integrated circuit package comprising, for example, a thermal resistance from the integrated circuit to a coupled heatsink to ambient and/or a thermal resistance from the integrated circuit to a circuit board.
Claims (15)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/881,006 US7565259B2 (en) | 2004-03-01 | 2007-07-24 | System and method for reducing temperature variation during burn in |
US12/488,379 US20090316750A1 (en) | 2004-03-01 | 2009-06-19 | System and method for reducing temperature variation during burn in |
US12/506,070 US8843344B2 (en) | 2004-03-01 | 2009-07-20 | System and method for reducing temperature variation during burn in |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/791,099 US7248988B2 (en) | 2004-03-01 | 2004-03-01 | System and method for reducing temperature variation during burn in |
US11/881,006 US7565259B2 (en) | 2004-03-01 | 2007-07-24 | System and method for reducing temperature variation during burn in |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/791,099 Continuation US7248988B2 (en) | 2004-03-01 | 2004-03-01 | System and method for reducing temperature variation during burn in |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/488,379 Division US20090316750A1 (en) | 2004-03-01 | 2009-06-19 | System and method for reducing temperature variation during burn in |
US12/506,070 Continuation US8843344B2 (en) | 2004-03-01 | 2009-07-20 | System and method for reducing temperature variation during burn in |
Publications (2)
Publication Number | Publication Date |
---|---|
US20070271061A1 US20070271061A1 (en) | 2007-11-22 |
US7565259B2 true US7565259B2 (en) | 2009-07-21 |
Family
ID=34887569
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/791,099 Active 2024-07-10 US7248988B2 (en) | 2004-03-01 | 2004-03-01 | System and method for reducing temperature variation during burn in |
US11/881,006 Expired - Lifetime US7565259B2 (en) | 2004-03-01 | 2007-07-24 | System and method for reducing temperature variation during burn in |
US12/488,379 Abandoned US20090316750A1 (en) | 2004-03-01 | 2009-06-19 | System and method for reducing temperature variation during burn in |
US12/506,070 Active 2024-09-30 US8843344B2 (en) | 2004-03-01 | 2009-07-20 | System and method for reducing temperature variation during burn in |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/791,099 Active 2024-07-10 US7248988B2 (en) | 2004-03-01 | 2004-03-01 | System and method for reducing temperature variation during burn in |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/488,379 Abandoned US20090316750A1 (en) | 2004-03-01 | 2009-06-19 | System and method for reducing temperature variation during burn in |
US12/506,070 Active 2024-09-30 US8843344B2 (en) | 2004-03-01 | 2009-07-20 | System and method for reducing temperature variation during burn in |
Country Status (4)
Country | Link |
---|---|
US (4) | US7248988B2 (en) |
JP (1) | JP4768710B2 (en) |
CN (1) | CN1926439B (en) |
WO (1) | WO2005085884A2 (en) |
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US7834648B1 (en) * | 2004-03-01 | 2010-11-16 | Eric Chen-Li Sheng | Controlling temperature in a semiconductor device |
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US8123782B2 (en) | 2004-10-20 | 2012-02-28 | Vertiflex, Inc. | Interspinous spacer |
US8123807B2 (en) | 2004-10-20 | 2012-02-28 | Vertiflex, Inc. | Systems and methods for posterior dynamic stabilization of the spine |
US8152837B2 (en) | 2004-10-20 | 2012-04-10 | The Board Of Trustees Of The Leland Stanford Junior University | Systems and methods for posterior dynamic stabilization of the spine |
US8167944B2 (en) | 2004-10-20 | 2012-05-01 | The Board Of Trustees Of The Leland Stanford Junior University | Systems and methods for posterior dynamic stabilization of the spine |
US8273108B2 (en) | 2004-10-20 | 2012-09-25 | Vertiflex, Inc. | Interspinous spacer |
US8277488B2 (en) | 2004-10-20 | 2012-10-02 | Vertiflex, Inc. | Interspinous spacer |
US8292922B2 (en) | 2004-10-20 | 2012-10-23 | Vertiflex, Inc. | Interspinous spacer |
US8317864B2 (en) | 2004-10-20 | 2012-11-27 | The Board Of Trustees Of The Leland Stanford Junior University | Systems and methods for posterior dynamic stabilization of the spine |
US8409282B2 (en) | 2004-10-20 | 2013-04-02 | Vertiflex, Inc. | Systems and methods for posterior dynamic stabilization of the spine |
US8425559B2 (en) | 2004-10-20 | 2013-04-23 | Vertiflex, Inc. | Systems and methods for posterior dynamic stabilization of the spine |
US8613747B2 (en) | 2004-10-20 | 2013-12-24 | Vertiflex, Inc. | Spacer insertion instrument |
US8628574B2 (en) | 2004-10-20 | 2014-01-14 | Vertiflex, Inc. | Systems and methods for posterior dynamic stabilization of the spine |
US8740948B2 (en) | 2009-12-15 | 2014-06-03 | Vertiflex, Inc. | Spinal spacer for cervical and other vertebra, and associated systems and methods |
US8845726B2 (en) | 2006-10-18 | 2014-09-30 | Vertiflex, Inc. | Dilator |
US9023084B2 (en) | 2004-10-20 | 2015-05-05 | The Board Of Trustees Of The Leland Stanford Junior University | Systems and methods for stabilizing the motion or adjusting the position of the spine |
US9119680B2 (en) | 2004-10-20 | 2015-09-01 | Vertiflex, Inc. | Interspinous spacer |
US9155572B2 (en) | 2004-10-20 | 2015-10-13 | Vertiflex, Inc. | Minimally invasive tooling for delivery of interspinous spacer |
US9161783B2 (en) | 2004-10-20 | 2015-10-20 | Vertiflex, Inc. | Interspinous spacer |
US9393055B2 (en) | 2004-10-20 | 2016-07-19 | Vertiflex, Inc. | Spacer insertion instrument |
US9675303B2 (en) | 2013-03-15 | 2017-06-13 | Vertiflex, Inc. | Visualization systems, instruments and methods of using the same in spinal decompression procedures |
US10524772B2 (en) | 2014-05-07 | 2020-01-07 | Vertiflex, Inc. | Spinal nerve decompression systems, dilation systems, and methods of using the same |
US11838014B1 (en) * | 2022-07-28 | 2023-12-05 | Micron Technology, Inc. | Semiconductor device having voltage generator generating well potential |
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US7248988B2 (en) * | 2004-03-01 | 2007-07-24 | Transmeta Corporation | System and method for reducing temperature variation during burn in |
US6897671B1 (en) * | 2004-03-01 | 2005-05-24 | Transmeta Corporation | System and method for reducing heat dissipation during burn-in |
US7376849B2 (en) * | 2004-06-30 | 2008-05-20 | Intel Corporation | Method, apparatus and system of adjusting one or more performance-related parameters of a processor |
US7141998B1 (en) * | 2005-05-19 | 2006-11-28 | International Business Machines Corporation | Method and apparatus for burn-in optimization |
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US7583535B2 (en) * | 2006-12-30 | 2009-09-01 | Sandisk Corporation | Biasing non-volatile storage to compensate for temperature variations |
US7468920B2 (en) | 2006-12-30 | 2008-12-23 | Sandisk Corporation | Applying adaptive body bias to non-volatile storage |
US7554853B2 (en) * | 2006-12-30 | 2009-06-30 | Sandisk Corporation | Non-volatile storage with bias based on selective word line |
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Also Published As
Publication number | Publication date |
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CN1926439A (en) | 2007-03-07 |
US7248988B2 (en) | 2007-07-24 |
JP2007526486A (en) | 2007-09-13 |
JP4768710B2 (en) | 2011-09-07 |
US20090316750A1 (en) | 2009-12-24 |
WO2005085884A9 (en) | 2006-02-09 |
US20050192773A1 (en) | 2005-09-01 |
CN1926439B (en) | 2010-06-09 |
WO2005085884A3 (en) | 2006-08-03 |
US8843344B2 (en) | 2014-09-23 |
US20070271061A1 (en) | 2007-11-22 |
US20090289654A1 (en) | 2009-11-26 |
WO2005085884A2 (en) | 2005-09-15 |
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