US7547850B2 - Semiconductor device assemblies with compliant spring contact structures - Google Patents
Semiconductor device assemblies with compliant spring contact structures Download PDFInfo
- Publication number
- US7547850B2 US7547850B2 US11/476,471 US47647106A US7547850B2 US 7547850 B2 US7547850 B2 US 7547850B2 US 47647106 A US47647106 A US 47647106A US 7547850 B2 US7547850 B2 US 7547850B2
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- substrate
- conductive trace
- free
- cantilevered portion
- semiconductor device
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
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- H—ELECTRICITY
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- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (62)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/476,471 US7547850B2 (en) | 2004-06-18 | 2006-06-28 | Semiconductor device assemblies with compliant spring contact structures |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US10/871,153 US7649145B2 (en) | 2004-06-18 | 2004-06-18 | Compliant spring contact structures |
US11/476,471 US7547850B2 (en) | 2004-06-18 | 2006-06-28 | Semiconductor device assemblies with compliant spring contact structures |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/871,153 Division US7649145B2 (en) | 2004-06-18 | 2004-06-18 | Compliant spring contact structures |
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US20060243483A1 US20060243483A1 (en) | 2006-11-02 |
US7547850B2 true US7547850B2 (en) | 2009-06-16 |
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US11/476,460 Abandoned US20060242828A1 (en) | 2004-06-18 | 2006-06-28 | Fabrication of compliant spring contact structures and use thereof |
US11/476,471 Active US7547850B2 (en) | 2004-06-18 | 2006-06-28 | Semiconductor device assemblies with compliant spring contact structures |
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Application Number | Title | Priority Date | Filing Date |
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US10/871,153 Active 2024-07-28 US7649145B2 (en) | 2004-06-18 | 2004-06-18 | Compliant spring contact structures |
US11/476,460 Abandoned US20060242828A1 (en) | 2004-06-18 | 2006-06-28 | Fabrication of compliant spring contact structures and use thereof |
Country Status (1)
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100300742A1 (en) * | 2009-05-28 | 2010-12-02 | Shinko Electric Industries Co., Ltd. | Substrate having leads |
US20140179031A1 (en) * | 2012-12-26 | 2014-06-26 | Advanced Inquiry Systems, Inc. | Designed asperity contactors, including nanospikes, for semiconductor test using a package, and associated systems and methods |
US20140268596A1 (en) * | 2013-03-13 | 2014-09-18 | Palo Alto Research Center Incorporated | Flexible Metal Interconnect Structure |
US20170064832A1 (en) * | 2015-08-26 | 2017-03-02 | SK Hynix Inc. | Flexible device including sliding interconnection structure |
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US6956389B1 (en) * | 2004-08-16 | 2005-10-18 | Jem America Corporation | Highly resilient cantilever spring probe for testing ICs |
US20060180927A1 (en) * | 2005-02-14 | 2006-08-17 | Daisuke Takai | Contact structure and method for manufacturing the same |
US7742817B2 (en) * | 2005-03-04 | 2010-06-22 | Boston Scientific Neuromodulation Corporation | Hermetic implantable stimulator |
US7550855B2 (en) * | 2005-12-02 | 2009-06-23 | Palo Alto Research Center Incorporated | Vertically spaced plural microsprings |
US20100165562A1 (en) * | 2006-01-12 | 2010-07-01 | Para Kanagasabai Segaram | Memory module |
US7982290B2 (en) | 2006-01-12 | 2011-07-19 | Palo Alto Research Center, Inc. | Contact spring application to semiconductor devices |
KR20090057328A (en) * | 2006-09-26 | 2009-06-04 | 알프스 덴키 가부시키가이샤 | Elastic contact and method for bonding between metal terminals using the same |
JP5079456B2 (en) * | 2007-11-06 | 2012-11-21 | 新光電気工業株式会社 | Semiconductor device and manufacturing method thereof |
US7927905B2 (en) * | 2007-12-21 | 2011-04-19 | Palo Alto Research Center Incorporated | Method of producing microsprings having nanowire tip structures |
US9129955B2 (en) * | 2009-02-04 | 2015-09-08 | Texas Instruments Incorporated | Semiconductor flip-chip system having oblong connectors and reduced trace pitches |
US8218334B2 (en) | 2010-03-09 | 2012-07-10 | Oracle America, Inc. | Multi-chip module with multi-level interposer |
WO2012034993A1 (en) * | 2010-09-13 | 2012-03-22 | Imec | Method for fabricating thin photovoltaic cells |
US8441808B2 (en) | 2010-09-22 | 2013-05-14 | Palo Alto Research Center Incorporated | Interposer with microspring contacts |
US8519534B2 (en) * | 2010-09-22 | 2013-08-27 | Palo Alto Research Center Incorporated | Microsprings partially embedded in a laminate structure and methods for producing same |
DE102011056261B4 (en) | 2011-12-12 | 2013-09-19 | Harting Ag | spring contact |
US8686552B1 (en) * | 2013-03-14 | 2014-04-01 | Palo Alto Research Center Incorporated | Multilevel IC package using interconnect springs |
CN105408747A (en) | 2013-05-23 | 2016-03-16 | 快速诊断技术公司 | Resonator sensor module system and method |
WO2014190240A1 (en) | 2013-05-23 | 2014-11-27 | Rapid Diagnostek | Interconnect device and module using same |
US9248611B2 (en) * | 2013-10-07 | 2016-02-02 | David A. Divine | 3-D printed packaging |
US11079406B2 (en) | 2016-08-31 | 2021-08-03 | International Business Machines Corporation | Semiconductor micro probe array having compliance |
CN107402318A (en) * | 2017-08-31 | 2017-11-28 | 京东方科技集团股份有限公司 | Probe assembly and test equipment |
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- 2006-06-28 US US11/476,471 patent/US7547850B2/en active Active
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100300742A1 (en) * | 2009-05-28 | 2010-12-02 | Shinko Electric Industries Co., Ltd. | Substrate having leads |
US8735737B2 (en) * | 2009-05-28 | 2014-05-27 | Shinko Electric Industries Co., Ltd. | Substrate having leads |
US20140179031A1 (en) * | 2012-12-26 | 2014-06-26 | Advanced Inquiry Systems, Inc. | Designed asperity contactors, including nanospikes, for semiconductor test using a package, and associated systems and methods |
US9494618B2 (en) * | 2012-12-26 | 2016-11-15 | Translarity, Inc. | Designed asperity contactors, including nanospikes, for semiconductor test using a package, and associated systems and methods |
US20170074904A1 (en) * | 2012-12-26 | 2017-03-16 | Translarity, Inc. | Designed asperity contactors, including nanospikes, for semiconductor test using a package, and associated systems and methods |
US9733272B2 (en) * | 2012-12-26 | 2017-08-15 | Translarity, Inc. | Designed asperity contactors, including nanospikes, for semiconductor test using a package, and associated systems and methods |
US20140268596A1 (en) * | 2013-03-13 | 2014-09-18 | Palo Alto Research Center Incorporated | Flexible Metal Interconnect Structure |
US8969735B2 (en) * | 2013-03-13 | 2015-03-03 | Palo Alto Research Center Incorporated | Flexible metal interconnect structure |
US20170064832A1 (en) * | 2015-08-26 | 2017-03-02 | SK Hynix Inc. | Flexible device including sliding interconnection structure |
US9888567B2 (en) * | 2015-08-26 | 2018-02-06 | SK Hynix Inc. | Flexible device including sliding interconnection structure |
Also Published As
Publication number | Publication date |
---|---|
US7649145B2 (en) | 2010-01-19 |
US20060242828A1 (en) | 2006-11-02 |
US20060243483A1 (en) | 2006-11-02 |
US20050279530A1 (en) | 2005-12-22 |
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