|Publication number||US7294209 B2|
|Application number||US 10/336,621|
|Publication date||13 Nov 2007|
|Filing date||2 Jan 2003|
|Priority date||2 Jan 2003|
|Also published as||US20040131761|
|Publication number||10336621, 336621, US 7294209 B2, US 7294209B2, US-B2-7294209, US7294209 B2, US7294209B2|
|Original Assignee||Cymbet Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (103), Non-Patent Citations (24), Referenced by (29), Classifications (12), Legal Events (5)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This invention is related to U.S. patent application Ser. No. 09/816,602 (now U.S. Pat. No. 6,986,965) entitled “Device Enclosures with Integrated Batteries” filed Mar. 23, 2001, U.S. patent application Ser. No. 09/815,884 entitled “Battery-Operated Wireless-Communication Apparatus and Method,” filed Mar. 23, 2001, and U.S. patent application Ser. No. 10/336,620 now U.S. Pat. No. 6,906,436) entitled “Solid State Activity-Activated Battery Device and Method” filed on even date herewith, and U.S. patent application Ser. No 10/336,619 entitled “APPARATUS AND METHOD FOR DEPOSITING MATERIAL ONTO MULTIPLE INDEPENDENTLY MOVING SUBSTRATES IN A CHAMBER” filed on even date herewith, and U.S. patent application Ser. No. 10/336,662 entitled “ACTIVE WIRELESS TAGGING SYSTEM ON PEEL AND STICK SUBSTRATE” filed on even date herewith, each of which is incorporated by reference.
The present invention relates to solid-state energy-storage devices and integration of these devices with an electronic circuit. More particularly, this invention relates to methods and systems for providing an active Radio Frequency (RF) tagging system for peel-and-stick applications. The present invention also relates to the making and using of thin-film solid-state energy-storage devices that include an adhesive.
Electronics have been incorporated into many low-profile tags for property tracking, security, finance, access, etc. Conventional methods of tagging typically involve passive devices, i.e., devices that receive their power from an outside source, e.g., from received RF energy. This limits the functionality of the tag. One drawback to using batteries is that batteries must have sufficient capacity to power the device for at least the length of time the device is in use. Having sufficient battery capacity can result in a power supply that is quite heavy or large compared to the rest of the device. In other words, conventional batteries generally are rather large and cannot be incorporated into small packages, such as tags. There is a need for small batteries in devices that can be formed for use with tags attachable to small packages.
Most batteries today are fairly expensive. As a result, economics prevent widespread use of batteries in ultra-cheap disposable devices. In other words, currently, retailers would avoid providing a battery as part of a property-tag system. Typically, batteries may be provided as part of the product shipped but not as part of the packaging. Thus, there is a further need for a battery that can be made inexpensively and mass-produced.
The present invention provides a roll-to-roll deposition system that uses a roll-to-roll mask having a plurality of different masking patterns for various deposition operations.
This summary is intended to provide an overview of the subject matter of the present patent application. It is not intended to provide an exclusive or exhaustive explanation of the invention. The detailed description is included to provide further information about the subject matter of the present patent application.
In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings that form a part hereof, and in which are shown, by way of illustration, specific embodiments in which the invention may be practiced. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the present invention.
It is to be understood that in different embodiments of the invention, each battery in the Figures or the description can be implemented using one or more cells, and if a plurality of cells is implemented, the cells can be wired in parallel or in series. Thus, where a battery or more than one cell is shown or described, other embodiments use a single cell, and where a single cell is shown or described, other embodiments use a battery or more than one cell. Further, the references to relative terms such as top, bottom, upper, lower, and other relative terms refer to an example orientation such as used in the Figures, and not necessarily an orientation used during fabrication or use.
The terms wafer and substrate as used herein include any structure having an exposed surface onto which a film or layer is deposited, for example, to form an integrated circuit (IC) structure or an energy-storage device. The term substrate is understood to include semiconductor wafers, plastic film, metal foil, molded plastic cases, and other structures on which an energy-storage device may be fabricated according to the teachings of the present disclosure. The term substrate is also used to refer to structures during processing that include other layers that have previously or subsequently been fabricated thereupon. In some embodiments, both wafer and substrate include doped and undoped semiconductors, epitaxial semiconductor layers supported by a base semiconductor or insulator, as well as other semiconductor structures well known to one skilled in the art. Substrate is also used herein as describing any starting material that is useable with the fabrication method as described herein.
The term “battery” used herein refers to one example of an energy-storage device. A battery may be formed of a single cell or a plurality of cells connected in series or in parallel. A cell is a galvanic unit that converts chemical energy, e.g., ionic energy, to electrical energy. The cell typically includes two electrodes of dissimilar material isolated from each other by an electrolyte through which ions can move.
The term “task” used herein refers broadly to software or firmware routines, state machines, and/or combinatorial logic that are adaptable to perform a particular function when exercised or executed.
The term “adatom” as used herein refers to a particle, molecule, or ion of material that has not yet been formed into a structure or film.
The term “Radio-Frequency (RF)” as used herein includes very low frequency electromagnetic signals coupled by, e.g., mutual inductance, as well as transmitted radio signals ranging from kHz to MHz to GHz.
In another embodiment of the system 100 as shown in
In another embodiment of the system 100 as shown in
In another embodiment of the system 100 as shown in
In another embodiment of the system 100 as shown in
In one embodiment, the electrolyte film 261 includes LiPON. As used herein, LiPON refers generally to lithium phosphorus oxynitride materials. One example is Li3PO4N. Other examples incorporate higher ratios of nitrogen in order to increase lithium ion mobility across the electrolyte.
A method for fabricating the solid-state battery 220 is discussed in U.S. patent application Ser. No. 10/336,620 (now U.S. Pat. No. 6,906,436) entitled “Solid State Activity-Activated Battery Device and Method” and is incorporated herein by reference.
In some embodiments, the solid-state battery 220 is formed in five or six stages. A first stage begins with a pre-cleaning of the substrate using a Mk II Ion Gun system in an atmosphere of argon flowing through the ion gun at a rate of 5 sccm for four minutes at 70V and 2A. A 2500 Å cathode metal layer of nickel is then formed on the substrate 210 by depositing nickel with an electron beam gun using 200 mA and 6500V. A second stage begins with a sputter etch of the nickel cathode collector for one minute at a power of 250W in argon at 12 mT pressure followed by a target burn-in period of five minutes at a power of 1200W in an atmosphere of 80% oxygen and 20% argon ambient at 15 mT. A cathode layer 259 is then formed on the cathode metal layer by a deposition of LiCoO2 at a power of t1200W for sixty minutes in an atmosphere of 80% oxygen and 20% argon at a pressure of 15 mT. A third stage begins with a target burn-in period of five minutes at a power of 750W in nitrogen at a pressure of 5 mT. An electrolyte layer 261 is then formed by a deposition of Li3PO4 at a power of 750W for fifty-seven minutes in an atmosphere of 40 sccm of nitrogen at 5 mT. In other embodiments, an anode deposition stage is then performed to deposit an anode. A fourth stage begins with a pre-cleaning of the previously formed layers using a Mk II Ion Gun system in an atmosphere of argon flowing through the ion gun at a rate of 5 sccm for four minutes at 70V and 2A. A 2500 Å anode metal layer of copper is then formed on the electrolyte layer by depositing copper with an electron beam using 150 mA and 7600V. A fifth stage begins with a pre-cleaning of the previously formed layers using a Mk II Ion Gun system in an atmosphere of argon flowing through the ion gun at a rate of 5 sccm for four minutes at 70V and 2A. A 5000 Å passivation layer of SiN is then formed with an electron beam gun using 150 mA and 7600V while coincidentally bombarding the growing film with an Mk II Ion Gun system at 90V and 2A and a gas flow of 18 sccm of nitrogen flowing through the gun.
It should be noted that the solid-state battery 320 shown in
Certain needs exist within industry that would benefit from the integration of energy, storage and electronics on a single platform.
The present invention provides a device that integrates electronics (including RF electronics) and solid-state batteries in a single device. In many instances, the system or platform has a very small form factor.
One example or use of this particular RFID device is marking the time of the beginning of a warranty period. For example, if the RFID device is attached to a product, RF energy could activate the device at the time a product is purchased, and a clock could be started to mark the beginning of the warranty or time frame. Alternatively, the RF energy would transmit a time stamp that is permanently stored in the device. This allows for very close proximity or a very close approximation of when the warranty period was started. At a later time when a consumer wished to return a product covered under a warranty, a requirement of the warranty could be that the package or label is returned along with the product. The time of the warranty could then be checked. This would prevent consumers from ordering another product and returning it as a new product underneath a warranty period. In some embodiments, the system, which includes an RF-activated switch, could be included in a peel off label or a shipping label that could be either attached directly to the product or directly to a package for the product.
Another example would be to use the RFID device in a mailing or shipping label 410 for detecting and logging the time of shipping and delivery related events. An RF transmitting device would activate the RF-activated switch 350 and start timing circuit 336 to detect and log the beginning of the shipping duration. Another example or use of this particular RFID device includes use as a backup to, or supplement to, the information on the printed label. If the printed information becomes no longer readable, or unavailable due to loss, the RFID device could transmit stored information to an RF receiving device when prompted.
Another example is to use the RFID device in a product label 410′ to tag and track property. Remote RF transmitting and receiving devices could be placed at various stations in a warehouse or shipping and receiving area. The remote RF devices then detect and log when a package passes the station. In another example, the RFID device is also used to locate property with a portable RF transmitting and receiving device. The remote RF device, in some embodiments, transmits an interrogation code for a particular RFID device. The RF energy from the interrogation would activate the RFID device, and the RFID device then analyzes the interrogation code and responds by transmitting the RFID identification code, thereby indicating the presence of the particular RFID device to the remote RF device.
Another example is to use the RFID device in a drug treatment system that uses drug patches adhered to the skin to deliver drugs by a method such as iontophoresis. Use of a thin-film solid-state battery allows electronic circuits to be used in the iontophoretic device while maintaining a low device-profile so as to not interfere with a patient's clothing. In this example, the RFID device is attached to a drug patch that contains a drug reservoir. The electronic circuit 330 activates the device to begin a delivery of a bolus of drug. Microprocessor 332 stores information in memory 334 such as when the device was activated, when a bolus of drug was delivered, and how many boluses were delivered. Timing circuit 336 is optionally used to prevent the patient or caregiver from administering doses too often. A caregiver optionally uses the remote RF device to transmit RF energy to initiate a delivery of a bolus of drug, or to interrogate the RFID device to determine the history of drug therapy provided by the device. In some embodiments, the RFID device is activated when the RF device activates an RF-actuated switch. In other embodiments, the RFID device is switch-activated when the RFID portion of the device is attached to the drug reservoir portion of the device.
In another embodiment, such as shown in
Another method, shown in
In another embodiment as shown in
In other embodiments, the battery is deposited on the substrate using ion assist energy between 70 eV to 90 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 65 eV to 70 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 70 eV to 75 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 75 eV to 80 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 80 eV to 85 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 85 eV to 90 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 90 eV to 95 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 65 eV to 95 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 65 eV to 85 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 65 eV to 75 eV. In other embodiments, one or both of the endpoints of the above ranges is approximate. In other embodiments, the battery is deposited on the substrate using ion assist energy of about 65 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy of about 70 eV.
In some embodiments, the battery deposited on the flexible substrate is a rechargeable battery.
Another aspect of the invention provides a flexible peel-and-stick battery-operated device. An embodiment of the device 170 is shown in
In another embodiment of the device, the electronic circuit 130 includes an RF-enabled switch that electrically activates the electronic circuit 130. In another embodiment the RF-enabled switch includes a MEMs device. In another embodiment, the RF antenna 140 of the device is integrated into the substrate 110. In another embodiment, the battery 120 of the device is a rechargeable battery. One aspect of forming the RFID devices as shown in
Another aspect of the invention provides a system for making an RFID device as shown in
In some embodiments, the deposition of the electrolyte film includes directing an electrolyte material to a location at least partially in contact with the cathode film, while simultaneously supplying energy to the electrolyte material. In one embodiment, the energy is supplied by energized particles. In some such embodiments, the energized particles are energized ions. In some such embodiments, the energized particles from the assist source are of a different material than the electrolyte material, such as, for example, an inert gas. In other embodiments, the energized ions react with other components of the deposition to become part of the deposited layer. The energized particles supply energy to the electrolyte first material to assist in the growth of a desirable, solid electrolyte-film structure. Moreover, this controls the stoichiometry of the growing electrolyte film.
In some embodiments, the first material deposition station 811, or first source, provides Li3PO4 in a nitrogen atmosphere. In other embodiments, the first source 811 provides Li3PO4 in a vacuum environment wherein the background pressure is less than about 0.001 Torr. The assist source 817, or second source, provides energized particles from a source gas. In some embodiments, the secondary source 817 is an ion source supplying energetic ions from a source gas including oxygen (e.g., O2) and/or nitrogen (e.g., N2). The source gas, in other embodiments, comprises a noble gas, e.g., argon, xenon, helium, neon, and/or krypton. The energized particles and/or ions increase the energy of the material forming the electrolyte film 261 of the battery in
An embodiment for forming a LiPON electrolyte film 261 includes the first source providing Li3PO4 at or to the location where the LiPON electrolyte film is to be formed and second source providing energized nitrogen particles to or near the same location. The energized nitrogen particles react with Li3PO4 provided at the location for forming the electrolyte film. This increases the amount of nitrogen in the LiPON electrolyte film. Increasing the nitrogen content is desirable, in some embodiments, to increase lithium ion mobility across the electrolyte.
In a further embodiment, the chamber in which the substrate 809 is positioned has a nitrogen-enhanced atmosphere. A LiPON electrolyte film is formed by the Li3PO4 supplied by the first source reacting with the nitrogen in the chamber. The second source provides energized particles assisting in the formation of the electrolyte film. In another embodiment, the second source also provides nitrogen to the Li3PO4 at the location. Thus, the Li3PO4 reacts with both the nitrogen in the chamber and with energized, nitrogen-containing particles supplied by the second source. This increases the nitrogen content of the electrolyte film 261. In some embodiments, increasing the nitrogen content in the electrolyte film 261 is desirable since published data from the Department of Energy lab at Oak Ridge, Tenn. indicates an increase in nitrogen content increases the ion conductivity or mobility in the electrolyte film.
The crystalline structure of a thin film formed according to the teachings herein has a higher order than those achieved by conventional cathode film forming techniques. Conventional techniques rely on a high-temperature, post-cathode-deposition anneal to reorder and crystallize the structure of a conventional cathode film. Unfortunately, such conventional techniques anneal the entire structure to the same temperatures, which is undesirable in that the substrate must withstand such temperatures that eliminate many otherwise suitable substrate materials from consideration. Further, different layers cannot be provided with different anneals suited to their different requirements. A highly ordered crystalline cathode film is desirably achieved according to the teachings described herein by providing the required energy to form the desired, high-order and appropriately oriented crystal structure without subjecting the substrate, and other layers formed on the substrate including the cathode-contact film to a high-temperature anneal. Further, each layer can be annealed using a different anneal process (such as using ion-assist beams having different energies for different layers, or depositing and annealing at different rates or for different durations). Further, by annealing the surface layer of the previous layer, a subsequent layer can be deposited onto a surface that has been ordered in a specific way (for example, to achieve a specific crystal orientation, or a specific ion-bonding surface) that enhances the quality of that subsequent layer.
As will be understood by reading the present invention, the systems shown herein for depositing films are adaptable to form the electrolyte film 261 according to the present invention. Examples of some such systems are shown in
In the system of
In one embodiment, the supply reels 810 hold strips of different material. In another embodiment, the supply reels 810 hold strips one component wide. Providing multiple supply reels allows the tension and speed of each reel's substrate material to be individually controlled, as well as enabling multiple different component designs to be simultaneously loaded and processed.
In another embodiment, the thermal control surface 815 and the thermal source 825 are provided on a drum and the drum controls the rate of movement of the substrates under the deposition stations 811 and assist source 817. One advantage of using multiple strips of material that are each one component wide is that it alleviates the problem of uneven tension distributed across a drum that is sometimes seen using wide strips with multiple components. In processes involving multiple different component designs all components have to pass over the drum at the same rate. Thus, multiple component designs would otherwise have identical layers and layer thicknesses applied to them.
In another embodiment, the plurality of substrates 809 run in front of the deposition stations 811 and assist sources 817 at different speeds, thus allowing layers of differing thickness to be applied to different strips. In one embodiment, the different speeds are achieved by providing multiple drums for controlling the speed of strips of substrate.
Another embodiment of the system combines the systems shown in
One aspect of the present invention provides a radio-frequency identification (RFID) device having a thin-film battery. A system 100, such as shown in
An embodiment of the RFID device 170 that includes an RF-activated switch is shown in
Another aspect of the invention provides a method 500 as shown in
Another method, such as shown in
Another aspect of the invention provides a flexible peel-and-stick battery-operated device. An embodiment of the device 170 such as shown in
Another aspect of the invention, such as shown in
Some embodiments provide a system that includes a vacuum chamber, a plurality of pairs of source and take-up reels within the vacuum chamber, including a first source reel that supplies a first strip of substrate material and a first take-up reel, and a second source reel that supplies a first mask strip having a plurality of different masks and a second take-up reel, a first deposition station configured to deposit material onto the first strip of substrate running between the first source reel and the first take-up reel, as defined by the first mask strip running between the second source reel and the second take-up reel, and a controller operatively coupled to run the first strip of substrate between the first source reel and the first take-up reel at a first independent rate and tension, and to run the mask strip between the second source reel and the second take-up reel.
Some embodiment further include a third source reel that supplies a second strip of substrate material and a third take-up reel, wherein the controller is coupled to run the second strip of substrate between the third source reel and the third take-up reel at a second independent rate and tension.
In some embodiments, the first mask strip provides masking for both the first and second substrate strips.
Some embodiment further include a fourth source reel that supplies a second mask strip having a plurality of different masks and a fourth take-up reel, a second deposition station configured to deposit material onto the second strip of substrate running between the third source reel and the third take-up reel, as defined by the second mask strip running between the fourth source reel and the fourth take-up reel; and wherein the controller is operatively coupled to run the second strip of substrate at a second independent rate and tension.
In some embodiments, the controller is operatively coupled to run the second mask strip at a rate and tension based on the second independent rate and tension.
Other embodiments provide a method that includes supplying a first strip of substrate material through a deposition station, moving a first mask strip through the deposition station, depositing a first layer of material from the deposition station onto the first substrate material in a pattern defined by a first area of the first mask strip, and depositing a second layer of material from the deposition station onto the first substrate material in a pattern defined by a second area of the first mask strip.
Some embodiment of this method further include supplying a second strip of substrate material through the deposition station, moving a second mask strip through the deposition station, depositing a first layer of material from the deposition station onto the second substrate material in a pattern defined by a first area of the second mask strip, and depositing a second layer of material from the deposition station onto the second substrate material in a pattern defined by a second area of the second mask strip.
In some embodiments, the first and second strips of substrate material are moved at different rates.
In some embodiments, the first and second strips of substrate material are moved at different tensions.
Some embodiment of this method further include depositing an adhesive and a release layer onto the substrate.
Some embodiment of this method further include adhering a pressuresensitive adhesive layer to the substrate.
Still other embodiments provide a method that includes providing a flexible substrate, depositing a battery, including depositing an anode, a cathode, and an electrolyte separating the anode and cathode each defined by a different mask area on a mask strip, depositing a wiring layer, placing an electronic circuit onto the deposited layers, wherein the electronic circuit is operatively connected to the battery by the wiring layer, depositing a pressure sensitive adhesive to allow peel-and-and-stick applications, and covering the device.
In some embodiments, a layer order arrangement of the elements of the RFID device includes the cover, the electronic circuit, the wiring layer, the battery, the substrate, and the pressure sensitive adhesive in this order.
Some embodiment of this method further include forming a printed label on the device.
In some embodiments, the depositing of the battery on the flexible substrate includes using an energy between about 50 eV and about 95 eV.
In some embodiments, the depositing of the battery on the flexible substrate includes using an energy between 70 eV and 90 eV.
In some embodiments, the battery deposited on the flexible substrate is rechargeable.
Another aspect of the invention provides embodiments that include a plurality of layers wherein the layers are held to one another as a single package, wherein the layers include: a flexible substrate, an electronic circuit, a thin-film battery operatively coupled to the electronic circuit to provide power, a radio frequency (RF) antenna operatively coupled to the electronic circuit; and an adhesive layer.
In some embodiments, the electronic circuit includes an RF-enabled switch that electrically activates the electronic circuit.
In some embodiments, the RF-enabled switch includes a MEMS device.
In some embodiments, the layers are stacked in the order the adhesive layer wherein the adhesive layer is pressure sensitive and covered by a peel-able release layer, the flexible substrate, the thin-film battery deposited on the flexible substrate, the wiring layer including an RF antenna deposited on the previous layers, and the electronic circuit including an RF-enabled switch deposited on the wiring layer.
In some of these embodiments, the RF antenna is integrated into the substrate.
In some of these embodiments, the battery is rechargeable.
In some embodiments, the invention includes a rolled release layer having releasably affixed thereon a plurality of any of the above devices.
In some embodiments, the adhesive layer is pressure sensitive adhesive and is covered by a peel-able release layer.
In some embodiments, the layers are stacked in an order from the group consisting of the adhesive layer, the substrate layer, the battery layer, the electronic circuit layer, and the RF antenna layer.
In some embodiments, the layers are stacked in an order from the group consisting of the substrate layer, the battery layer, a layer including the electronic circuit and the RF antenna, and the adhesive layer.
In some embodiments, the layers are stacked in an order from the group consisting of the substrate layer, a layer including a) the battery, b) the electronic circuit and c) the RF antenna, and the adhesive layer.
Other embodiments include a system for making an RFID device, the system including one or more supply reels that feed one or more source substrates, one or more supply reels that feed one or more electronic circuits and an RF antenna, one or more deposition stations that deposit layers onto the one or more substrates, wherein the layers include, layers to form a solid-state lithium-based battery, the battery layers including a cathode layer, an electrolyte layer, an anode layer, a wiring layer to couple the battery to the electronic circuit layer, and to couple the RF antenna to the electronic circuit, a movable mask strip having a plurality of different mask areas used for different deposition operations, a supply reel that feeds a peel-and-and-stick adhesive layer, and a vacuum chamber that contains the supply reels and the deposition station.
It is to be understood that the above description is intended to be illustrative, and not restrictive. Although numerous characteristics and advantages of various embodiments as described herein have been set forth in the foregoing description, together with details of the structure and function of various embodiments, many other embodiments and changes to details will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US3419487||24 Jan 1966||31 Dec 1968||Dow Corning||Method of growing thin film semiconductors using an electron beam|
|US4207119||2 Jun 1978||10 Jun 1980||Eastman Kodak Company||Polycrystalline thin film CdS/CdTe photovoltaic cell|
|US4299890||18 Jun 1980||10 Nov 1981||Duracell International Inc.||Solid state cell|
|US4328262||28 Jul 1980||4 May 1982||Fujitsu Limited||Method of manufacturing semiconductor devices having photoresist film as a permanent layer|
|US4333808||13 Feb 1981||8 Jun 1982||International Business Machines Corporation||Method for manufacture of ultra-thin film capacitor|
|US4353160||24 Nov 1980||12 Oct 1982||Spire Corporation||Solar cell junction processing system|
|US4365107||19 Feb 1981||21 Dec 1982||Sharp Kabushiki Kaisha||Amorphous film solar cell|
|US4435445||13 May 1982||6 Mar 1984||Energy Conversion Devices, Inc.||Photo-assisted CVD|
|US4440108||24 Sep 1982||3 Apr 1984||Spire Corporation||Ion beam coating apparatus|
|US4481265||8 Jun 1983||6 Nov 1984||Hitachi, Ltd.||Photovoltaic-storage battery device|
|US4520039||23 Sep 1982||28 May 1985||Sovonics Solar Systems||Compositionally varied materials and method for synthesizing the materials|
|US4539660||16 Dec 1981||3 Sep 1985||Hitachi, Ltd.||Semiconductor integrated circuit|
|US4633129||30 Apr 1985||30 Dec 1986||International Business Machines Corporation||Hollow cathode|
|US4645726||21 Nov 1985||24 Feb 1987||Hitachi, Ltd.||Solid state lithium battery|
|US4684848||15 Oct 1985||4 Aug 1987||Kaufman & Robinson, Inc.||Broad-beam electron source|
|US4696671||11 Jun 1986||29 Sep 1987||Omni-Flow, Inc.||Infusion system having plural fluid input ports and at least one patient output port|
|US4730383||5 May 1986||15 Mar 1988||Minko Balkanski||Integrable solid state battery and process for producing same|
|US4740431||22 Dec 1986||26 Apr 1988||Spice Corporation||Integrated solar cell and battery|
|US4798574||9 Dec 1987||17 Jan 1989||Bagcraft Corporation Of America||Method of making a bag with a barrier material|
|US4832463||8 Sep 1987||23 May 1989||Tufts University||Thin film ion conducting coating|
|US4862032||20 Oct 1986||29 Aug 1989||Kaufman Harold R||End-Hall ion source|
|US5017550||30 Mar 1988||21 May 1991||Sumitomo Electric Industries, Ltd.||Method for producing thin film of oxide superconductor|
|US5022930||20 Jun 1989||11 Jun 1991||Photon Energy, Inc.||Thin film photovoltaic panel and method|
|US5051274||11 Sep 1989||24 Sep 1991||Tufts University||Ion-beam based deposition of coatings for electrochromic devices|
|US5064520||14 Feb 1990||12 Nov 1991||Hitachi, Ltd.||Method and apparatus for forming a film|
|US5089104||3 Dec 1990||18 Feb 1992||Hitachi, Ltd.||Method and apparatus for forming a multiple-element thin film based on ion beam sputtering|
|US5098737||9 May 1990||24 Mar 1992||Board Of Regents The University Of Texas System||Amorphic diamond material produced by laser plasma deposition|
|US5115378||11 Feb 1991||19 May 1992||Isuzu Motors Limited||Electric double layer capacitor|
|US5126031||2 Mar 1988||30 Jun 1992||Gordon Arnold Z||Coprecipitated hydrogels in pressure tolerant gas diffusion electrodes|
|US5151848||24 Aug 1990||29 Sep 1992||The United States Of America As Represented By The Secretary Of The Air Force||Supercapacitor|
|US5166009||28 Mar 1991||24 Nov 1992||The United States Of America As Represented By The Secretary Of The Navy||Mixed polymer electrolyte and mixed polymer electrolyte battery|
|US5171413||16 Sep 1991||15 Dec 1992||Tufts University||Methods for manufacturing solid state ionic devices|
|US5180645||1 Mar 1991||19 Jan 1993||Motorola, Inc.||Integral solid state embedded power supply|
|US5189550||13 Dec 1991||23 Feb 1993||Tufts University||Ion-beam based deposition of coatings for electrochromic devices|
|US5192947||2 Feb 1990||9 Mar 1993||Simon Neustein||Credit card pager apparatus|
|US5202196||26 Apr 1991||13 Apr 1993||Lianxiang Wang||High capacity colloidal storage battery, a collodial electrolyte used in it, and the processes for producing them|
|US5202201||2 Nov 1989||13 Apr 1993||Centre National De La Recherche Scientifique||Composite element having a titanium chalcogenide or oxychalcogenide layer, more particularly usable as the positive electrode in a thin film electrochemical cell|
|US5261968||13 Jan 1992||16 Nov 1993||Photon Energy, Inc.||Photovoltaic cell and method|
|US5273837||23 Dec 1992||28 Dec 1993||Corning Incorporated||Solid electrolyte fuel cells|
|US5296122||18 Feb 1992||22 Mar 1994||Teruaki Katsube||Apparatus for forming thin film|
|US5314765||14 Oct 1993||24 May 1994||Martin Marietta Energy Systems, Inc.||Protective lithium ion conducting ceramic coating for lithium metal anodes and associate method|
|US5338625||29 Jul 1992||16 Aug 1994||Martin Marietta Energy Systems, Inc.||Thin film battery and method for making same|
|US5348703||11 Oct 1991||20 Sep 1994||The Secretary Of The State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland||Vapor deposition apparatus and method|
|US5393572||11 Jul 1994||28 Feb 1995||Southwest Research Institute||Ion beam assisted method of producing a diamond like carbon coating|
|US5411592||6 Jun 1994||2 May 1995||Ovonic Battery Company, Inc.||Apparatus for deposition of thin-film, solid state batteries|
|US5415717||24 Apr 1992||16 May 1995||Molnlycke Ab||Method and apparatus for depositing particles on a moving web of material|
|US5425966||27 Oct 1994||20 Jun 1995||Wayne State University||Process for coating with single source precursors|
|US5426561||31 Mar 1994||20 Jun 1995||The United States Of America As Represented By The United States National Aeronautics And Space Administration||High energy density and high power density ultracapacitors and supercapacitors|
|US5433096||26 Aug 1993||18 Jul 1995||Strattec Security Corporation||Key assembly for vehicle ignition locks|
|US5445126||24 Jun 1994||29 Aug 1995||Eaton Corporation||Accelerator pedal calibration and fault detection|
|US5445906||3 Aug 1994||29 Aug 1995||Martin Marietta Energy Systems, Inc.||Method and system for constructing a rechargeable battery and battery structures formed with the method|
|US5448110||14 Sep 1993||5 Sep 1995||Micron Communications, Inc.||Enclosed transceiver|
|US5449994||12 Feb 1992||12 Sep 1995||Institut National Polytechnique De Grenoble||Supply component of the credit card type|
|US5455126||25 May 1994||3 Oct 1995||Martin Marietta Energy Systems, Inc.||Electra-optical device including a nitrogen containing electrolyte|
|US5468521||2 Nov 1994||21 Nov 1995||Canon Kabushiki Kaisha||Method for forming a photoelectric deposited film|
|US5482611||8 Oct 1993||9 Jan 1996||Helmer; John C.||Physical vapor deposition employing ion extraction from a plasma|
|US5494762||9 Feb 1995||27 Feb 1996||Nippondenso Co., Ltd.||Non-aqueous electrolyte lithium secondary cell|
|US5501175||1 Jul 1994||26 Mar 1996||Sumitomo Electric Industries, Ltd.||Process for preparing high crystallinity oxide thin film|
|US5501924||7 Jun 1995||26 Mar 1996||Eveready Battery Company, Inc.||Alkaline cell having a cathode including a tin dioxide additive|
|US5510209||5 Jan 1995||23 Apr 1996||Eic Laboratories, Inc.||Solid polymer electrolyte-based oxygen batteries|
|US5512147||25 May 1994||30 Apr 1996||Martin Marietta Energy Systems, Inc.||Method of making an electrolyte for an electrochemical cell|
|US5523179||23 Nov 1994||4 Jun 1996||Polyplus Battery Company||Rechargeable positive electrode|
|US5528222||9 Sep 1994||18 Jun 1996||International Business Machines Corporation||Radio frequency circuit and memory in thin flexible package|
|US5529671||27 Jul 1994||25 Jun 1996||Litton Systems, Inc.||Apparatus and method for ion beam polishing and for in-situ ellipsometric deposition of ion beam films|
|US5536333||15 Aug 1995||16 Jul 1996||Solar Cells, Inc.||Process for making photovoltaic devices and resultant product|
|US5549989||20 Dec 1993||27 Aug 1996||Motorola, Inc.||Electrochemical capacitor having a proton conducting solid electrolyte|
|US5558953||7 Oct 1994||24 Sep 1996||Matsushita Electric Industrial Co., Ltd.||Electrocrystallized lithuim metal, method for producing the same, and lithium secondary battery|
|US5561004||25 Feb 1994||1 Oct 1996||Bates; John B.||Packaging material for thin film lithium batteries|
|US5567210||12 Jul 1994||22 Oct 1996||Martin Marietta Energy Systems, Inc.||Method for making an electrochemical cell|
|US5569520||7 Jun 1995||29 Oct 1996||Martin Marietta Energy Systems, Inc.||Rechargeable lithium battery for use in applications requiring a low to high power output|
|US5569564||7 Jun 1995||29 Oct 1996||Eveready Battery Company, Inc.||Alkaline cell having a cathode including a titanate additive|
|US5571749||28 Dec 1994||5 Nov 1996||Canon Kabushiki Kaisha||Method and apparatus for forming deposited film|
|US5582623||7 Jun 1995||10 Dec 1996||Polyplus Battery Company, Inc.||Methods of fabricating rechargeable positive electrodes|
|US5585999||30 Sep 1994||17 Dec 1996||The United States Of America As Represented By The Secretary Of The Air Force||Supercapacitor electrochemical cell|
|US5593551||28 Feb 1995||14 Jan 1997||Varian Associates, Inc.||Magnetron sputtering source for low pressure operation|
|US5597660||25 May 1994||28 Jan 1997||Martin Marietta Energy Systems, Inc.||Electrolyte for an electrochemical cell|
|US5599644||7 Jun 1995||4 Feb 1997||Eveready Battery Company, Inc.||Cathodes for electrochemical cells having additives|
|US5601652||3 Aug 1989||11 Feb 1997||United Technologies Corporation||Apparatus for applying ceramic coatings|
|US5612152||17 Apr 1996||18 Mar 1997||Martin Marietta Energy Systems, Inc.||Rechargeable lithium battery for use in applications requiring a low to high power output|
|US5626976||24 Jul 1995||6 May 1997||Motorola, Inc.||Flexible energy storage device with integral charging unit|
|US5644207||16 Apr 1996||1 Jul 1997||The Johns Hopkins University||Integrated power source|
|US5654084||22 Jul 1994||5 Aug 1997||Martin Marietta Energy Systems, Inc.||Protective coatings for sensitive materials|
|US5654111||13 Jun 1995||5 Aug 1997||Sony Corporation||Electronic device having a battery and a battery therefor|
|US5686201||26 Jul 1996||11 Nov 1997||Polyplus Battery Company, Inc.||Rechargeable positive electrodes|
|US5695873||5 Jun 1995||9 Dec 1997||The University Of Dayton||Polymer-ceramic composite electrolytes|
|US5695885||6 Dec 1995||9 Dec 1997||Texas Instruments Incorporated||External battery and photoyoltaic battery charger|
|US5705293||9 Jan 1997||6 Jan 1998||Lockheed Martin Energy Research Corporation||Solid state thin film battery having a high temperature lithium alloy anode|
|US5714404||18 Nov 1993||3 Feb 1998||Regents Of The University Of California||Fabrication of polycrystalline thin films by pulsed laser processing|
|US5763058||7 Oct 1995||9 Jun 1998||Paramount Packaging Corporation||Electrical circuit component formed of a conductive liquid printed directly onto a substrate|
|US5789108||11 Mar 1997||4 Aug 1998||Polyplus Battery Company, Inc.||Rechargeable positive electrodes|
|US5814420||10 Oct 1997||29 Sep 1998||Polyplus Battery Company, Inc.||Rechargeable positive electrodes|
|US5830331||23 Sep 1994||3 Nov 1998||Seagate Technology, Inc.||Apparatus and method for sputtering carbon|
|US5849426||20 Sep 1996||15 Dec 1998||Motorola, Inc.||Hybrid energy storage system|
|US5863337||5 Jun 1995||26 Jan 1999||Ppg Industries, Inc.||Apparatus for coating a moving glass substrate|
|US5868914||12 Apr 1996||9 Feb 1999||Odme International B.V.||Magnetron sputtering system|
|US5872080||19 Apr 1995||16 Feb 1999||The Regents Of The University Of California||High temperature superconducting thick films|
|US5914507||30 Oct 1996||22 Jun 1999||Regents Of The University Of Minnesota||PZT microdevice|
|US5925483||6 May 1996||20 Jul 1999||Kejha; Joseph B.||Multi-layer polymeric electrolytes for electrochemical devices|
|US5932284||15 Sep 1997||3 Aug 1999||Kimberly-Clark Worldwide, Inc.||Method of applying adhesive to an edge of moving web|
|US6924164 *||29 Mar 2004||2 Aug 2005||Cymbet Corporation||Method of continuous processing of thin-film batteries and like devices|
|US20010033952 *||23 Mar 2001||25 Oct 2001||Integrated Power Solutions Inc.||Method and apparatus for integrated-battery devices|
|US20020037756 *||23 Mar 2001||28 Mar 2002||Integrated Power Solutions Inc.||Battery-operated wireless-communication apparatus and method|
|GB2318127A *||Title not available|
|1||Abraham, K M., et al., "A Polymer Electrolyte-Based Rechargeable Lithium/Oxygen Battery", Journal of the Electrochemical Society, vol. 143, (1996),1-5.|
|2||Aramoto, T. , et al., "16.0% Efficient Thin-Film CdS/CdTe Solar Cells", Jpn. J. Appl. Phys., vol. 36, Pt. 1, No. 10, (1997),pp. 6304-6305.|
|3||Birkmire, R. W., et al., "Polycrystalline Thin Film Solar Cells: Present Status and Future Potential", Annu. Rev. Mater. Sci., 27, (1997),pp. 625-653.|
|4||Chu, T. L., et al., "13.4% efficient thin-film CdS/CdTe solar cells", J. Appl. Phys., 70(12), (Dec. 15, 1991),pp. 7608-7612.|
|5||Dobley, Arthur , et al., "Non-aqueous Lithium-Air Batteries with an Advanced Cathode Structure", Yardley Technical Products, Inc. / Lithion, Inc. Pawcatuck, CT 41st Power Sources Conference Proceedings, Philadelphia, PA, (Dec. 10, 2003).|
|6||Dobley, Arthur, et al., "High Capacity Cathodes for Lithium-Air Batteries", Yardney Technical Products, Inc./ Lithion, Inc. Pawcatuck, CT <http://www2.electrochem.org/cgi-bin/abs?mtg=206&abs=0496>.|
|7||Dudney, N. J., et al., "Nanocrystalline LixMn2-yO4 Cathodes for Solid-State Thin-Film Rechargeable Lithium Batteries", Journal of the Electrochemical Society, 146(7), (1999),pp. 2455-2464.|
|8||Dudney, Nancy J., "Addition of a thin-film inorganic solid electolyte (Lipon) as a protective film in lithium batteries with a liquid electrolyte", Journal of Power Sources, vol. 89, (2000),176-179.|
|9||Dunn, D. , et al., "MoS2 Deposited by ion beam assisted deposition: 2H or random layer structure.", Naval Research Laboratory, (1998),pp. 3001-3007.|
|10||Goldner, R. , et al., "Ambient Temperature Synthesis of Polycrystalline Thin Films of Lithium Cobalt Oxide with Controlled Crystallites' Orientation", Mat. Res. Soc. Symp. Proc., 548, (1998),pp. 131-136.|
|11||Goldner, R. , et al., "Ambient Temperature Synthesis of Polycrystalline Thin Films of Lithium Cobalt Oxide with Controlled Crystallites Orientations", Electrochemical Soc. Proceedings, 98, (1999),268-273.|
|12||Jacobson, A. J., "Intercalation Chemistry", In: Encyclopedia of Inorganic Chemistry, vol. 3, John Wiley & Sons,(1994),pp. 1556-1602.|
|13||Kyokane, J. , et al., "Organic Solid Capacitor with Conducting Thin Films as Elecrolyte by Ion-Beam-Assisted Deposition", Journal of Power Sources, 60, (1996),pp. 151-155.|
|14||Liu, W. , et al., "Deposition, Structural Characterization, and Broadband (1KHz-40GHz) Dielectri Behavior of BaxTi2-xOy Thin Films", Mat. Res. Soc. Symp. Proc., 310, (1993),pp. 157-162.|
|15||Lugscheider, E. , et al., "Comparison of the Structure of PVD-Thin Films Deposited WIth Different Deposition Energies", Surface and Coatings Technology, 86-87 (1-3), (Dec. 1, 1996),177-183.|
|16||Martin, P. J., et al., "Modification of the Optical and Structural Properties of Dielectric ZrO2 Films by Ion-assisted Deposition", Journal of Applied Physics, 55, (1984),235-241.|
|17||McKenzie, D. R., et al., "New Technology for PACVD", Surface and Coatings Technology, 82 (3), (1996),326-333.|
|18||Nomoto, S. , et al., "Back-up Performance of Electric Double-Layer Capacitors for Rechargeable Batteries", Electrochemical Society Proceedings, vol. 96-25,(1997),268-279.|
|19||Read, J , "Characterization of the Lithium/Oxygen Organic Electrolyte Battery", Journal of the Electrochemical Society, 149, (2002),A1190-A1195.|
|20||Shodai, T , et al., "Reaction Mechanisms of Li(2.6)Co(0.4) Anode Material", Solid State Ionics, 122,(1999),85-93.|
|21||Shukla, A. K., et al., "Electrochemical supercapacitors: Energy storage beyond batteries", Current Science, vol. 79, No. 12, (Dec. 25, 2000), 1656-1661.|
|22||Vereda, F. , et al., "A Study of Electronic Shorting in IBDA-deposited Lipon Films", Journal of Power Sources, 89, (2000),201-205.|
|23||Yoshida, T. , "Photovoltaic Properties of Screen-Printed CdTe/CdS Solar Cells on Indium-Tin-Oxide Coated Glass Substrates", J. Electrochem. Soc., 142 (9), (Sep. 1995),pp. 3232-3237.|
|24||Zeitler, M. , et al., "In Situ Stress Analysis of Boron Nitride Films Prepared by Ion Beam Assisted Deposition", Nuclear Instruments and Methods in Physics Research B, 139, (1998),pp. 327-331.|
|Citing Patent||Filing date||Publication date||Applicant||Title|
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|US8268475||18 Sep 2012||Blue Spark Technologies, Inc.||Thin printable electrochemical cell and methods of making the same|
|US8301285||31 Oct 2011||30 Oct 2012||Sakti3, Inc.||Computer aided solid state battery design method and manufacture of same using selected combinations of characteristics|
|US8357464||22 Jan 2013||Sakti3, Inc.||Electric vehicle propulsion system and method utilizing solid-state rechargeable electrochemical cells|
|US8441411 *||18 Jul 2008||14 May 2013||Blue Spark Technologies, Inc.||Integrated electronic device and methods of making the same|
|US8520457||27 Jan 2012||27 Aug 2013||Semiconductor Energy Laboratory Co., Ltd.||Semiconductor device|
|US8574754||18 Dec 2008||5 Nov 2013||Blue Spark Technologies, Inc.||High current thin electrochemical cell and methods of making the same|
|US8722233||24 Apr 2006||13 May 2014||Blue Spark Technologies, Inc.||RFID antenna-battery assembly and the method to make the same|
|US8722235||20 Apr 2005||13 May 2014||Blue Spark Technologies, Inc.||Thin printable flexible electrochemical cell and method of making the same|
|US8734980||25 Apr 2012||27 May 2014||Blue Spark Technologies, Inc.||Electrical device-battery assembly and the method to make the same|
|US8750058||17 Aug 2011||10 Jun 2014||Semiconductor Energy Laboratory Co., Ltd.||Semiconductor device, method for inspecting the same, and method for driving the same|
|US8765284||21 May 2013||1 Jul 2014||Blue Spark Technologies, Inc.||Multi-cell battery|
|US8889285||18 Nov 2013||18 Nov 2014||Sakti3, Inc.||Electric vehicle propulsion system and method utilizing solid-state rechargeable electrochemical cells|
|US9013937||4 Jun 2014||21 Apr 2015||Semiconductor Energy Laboratory Co., Ltd.||Semiconductor device, method for inspecting the same, and method for driving the same|
|US9027242||24 Sep 2012||12 May 2015||Blue Spark Technologies, Inc.||Cell attachment method|
|US9127344||8 Nov 2011||8 Sep 2015||Sakti3, Inc.||Thermal evaporation process for manufacture of solid state battery devices|
|US9249502||15 Jun 2009||2 Feb 2016||Sakti3, Inc.||Method for high volume manufacture of electrochemical cells using physical vapor deposition|
|US9303315||6 May 2011||5 Apr 2016||Sakti3, Inc.||Method for high volume manufacture of electrochemical cells using physical vapor deposition|
|US9312522||13 Mar 2013||12 Apr 2016||Ambri Inc.||Electrochemical energy storage devices|
|US9444078||27 Nov 2013||13 Sep 2016||Blue Spark Technologies, Inc.||Battery cell construction|
|US20090325063 *||31 Dec 2009||Sakti3, Inc.||Method for high volume manufacture of electrochemical cells using physical vapor deposition|
|US20100196744 *||18 Jul 2008||5 Aug 2010||Blue Spark Technologies, Inc.||Integrated Electronic Device and Methods of Making the Same|
|US20100302887 *||2 Dec 2010||Semiconductor Energy Laboratory Co., Ltd.||Semiconductor device|
|US20110051641 *||30 Aug 2009||3 Mar 2011||Yang Pan||Low Power Consumption Wireless Sensory and Data Transmission System|
|US20110202159 *||18 Aug 2011||Sakti3, Inc.||Computational method for design and manufacture of electrochemical systems|
|US20110212268 *||1 Sep 2011||Sakti3, Inc.||Method for high volume manufacture of electrochemical cells using physical vapor deposition|
|US20110217578 *||8 Sep 2011||Sakti3, Inc.||Method for high volume manufacture of electrochemical cells using physical vapor deposition|
|US20110221578 *||9 Sep 2009||15 Sep 2011||Panasonic Electric Works Co., Ltd.||Wireless identification card|
|US20160104581 *||8 Oct 2014||14 Apr 2016||Analog Devices, Inc.||Integrated Super-Capacitor|
|U.S. Classification||118/729, 429/7, 257/E27.001, 429/162|
|International Classification||C23C16/00, G06K19/077|
|Cooperative Classification||G06K19/0776, G06K19/077, G06K19/0702|
|European Classification||G06K19/07A2, G06K19/077T3A, G06K19/077|
|4 Jun 2003||AS||Assignment|
Owner name: CYMBET CORPORATION, MINNESOTA
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|26 Jun 2015||REMI||Maintenance fee reminder mailed|
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Effective date: 20151113