US5097117A - Electronic microcircuit card and method for its manufacture - Google Patents
Electronic microcircuit card and method for its manufacture Download PDFInfo
- Publication number
- US5097117A US5097117A US07/342,537 US34253789A US5097117A US 5097117 A US5097117 A US 5097117A US 34253789 A US34253789 A US 34253789A US 5097117 A US5097117 A US 5097117A
- Authority
- US
- United States
- Prior art keywords
- printed circuit
- plate
- face
- foil
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR879380 | 1987-07-02 | ||
FR8709380A FR2617666B1 (en) | 1987-07-02 | 1987-07-02 | ELECTRONIC MICROCIRCUIT CARD AND MANUFACTURING METHOD THEREOF |
Publications (1)
Publication Number | Publication Date |
---|---|
US5097117A true US5097117A (en) | 1992-03-17 |
Family
ID=9352792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/342,537 Expired - Lifetime US5097117A (en) | 1987-07-02 | 1988-07-01 | Electronic microcircuit card and method for its manufacture |
Country Status (9)
Country | Link |
---|---|
US (1) | US5097117A (en) |
EP (1) | EP0297991B2 (en) |
JP (1) | JPH0678038B2 (en) |
CA (1) | CA1303241C (en) |
DE (1) | DE3869492D1 (en) |
ES (1) | ES2031258T5 (en) |
FR (1) | FR2617666B1 (en) |
HK (1) | HK92295A (en) |
WO (1) | WO1989000340A1 (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5264990A (en) * | 1990-05-11 | 1993-11-23 | U.S. Philips Corporation | Integrated circuit card that aids in reducing stress on an integrated circuit |
DE19611237A1 (en) * | 1996-03-21 | 1997-09-25 | Siemens Ag | Multichip card e.g. telephone card |
US5817207A (en) * | 1995-10-17 | 1998-10-06 | Leighton; Keith R. | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
US5861897A (en) * | 1991-01-19 | 1999-01-19 | Canon Kabushiki Kaisha | Inkjet recording apparatus with a memory device disposed substantially within boundaries if a recording head unit |
US6036099A (en) * | 1995-10-17 | 2000-03-14 | Leighton; Keith | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
DE19959364A1 (en) * | 1999-12-09 | 2001-06-13 | Orga Kartensysteme Gmbh | Chip card has circuit unit electrically connected to contact areas on separate carrying body via conducting tracks in chip card body |
US6259022B1 (en) * | 1995-05-29 | 2001-07-10 | Sgs-Thomson Microelectronics S.A. | Chip card micromodule as a surface-mount device |
US6441736B1 (en) | 1999-07-01 | 2002-08-27 | Keith R. Leighton | Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices |
US20070034999A1 (en) * | 2005-08-11 | 2007-02-15 | Infineon Technologies Ag | Chip module and chip card |
USD758372S1 (en) | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
USD759022S1 (en) * | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
USD780184S1 (en) | 2013-03-13 | 2017-02-28 | Nagrastar Llc | Smart card interface |
USD780763S1 (en) | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
US9647997B2 (en) | 2013-03-13 | 2017-05-09 | Nagrastar, Llc | USB interface for performing transport I/O |
US9769521B2 (en) | 2013-03-13 | 2017-09-19 | Nagrastar, Llc | Systems and methods for performing transport I/O |
USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
US10820418B2 (en) * | 2014-01-06 | 2020-10-27 | Thales Dis France Sa | Electronic module, method for manufacturing same and electronic device comprising a module of said type |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2559834B2 (en) * | 1989-01-12 | 1996-12-04 | 三菱電機株式会社 | IC card |
DE3912891A1 (en) * | 1989-04-19 | 1990-11-08 | Siemens Ag | IC mount and contacts for credit card - with flush contacts for electronic reader and pref. PVC carrier foil |
JP2875562B2 (en) * | 1989-12-22 | 1999-03-31 | 沖電気工業株式会社 | Semiconductor device and manufacturing method thereof |
US5250470A (en) * | 1989-12-22 | 1993-10-05 | Oki Electric Industry Co., Ltd. | Method for manufacturing a semiconductor device with corrosion resistant leads |
JP2560895B2 (en) * | 1990-07-25 | 1996-12-04 | 三菱電機株式会社 | IC card manufacturing method and IC card |
DE4038126C2 (en) * | 1990-11-27 | 1993-12-16 | Mannesmann Ag | Method and device for producing a decorated chip card |
DE4224103A1 (en) * | 1992-07-22 | 1994-01-27 | Manfred Dr Ing Michalk | Miniature housing with electronic components |
KR100209259B1 (en) * | 1996-04-25 | 1999-07-15 | 이해규 | Ic card and method for manufacture of the same |
US6124546A (en) * | 1997-12-03 | 2000-09-26 | Advanced Micro Devices, Inc. | Integrated circuit chip package and method of making the same |
EP2824704A1 (en) * | 2013-07-12 | 2015-01-14 | Gemalto SA | Electronic module and method for manufacturing same |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4216577A (en) * | 1975-12-31 | 1980-08-12 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card |
US4222516A (en) * | 1975-12-31 | 1980-09-16 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull | Standardized information card |
FR2523335A1 (en) * | 1982-03-10 | 1983-09-16 | Flonic Sa | Contact building method for card-borne integrated circuits - uses conductive pad welded onto foil used as contact to integrated circuit, creating more durable contact |
US4549247A (en) * | 1980-11-21 | 1985-10-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element for IC-modules |
WO1987000486A1 (en) * | 1985-07-17 | 1987-01-29 | Ibiden Co., Ltd. | Printed wiring board for ic cards |
US4682017A (en) * | 1984-12-29 | 1987-07-21 | Kyodo Printing Co., Ltd. | Shock-resistant integrated circuit card |
US4737620A (en) * | 1985-03-28 | 1988-04-12 | Flonic | Method of manufacturing cards having an electronic memory and cards obtained by performing said method |
US4792843A (en) * | 1983-10-24 | 1988-12-20 | Haghiri Tehrani Yahya | Data carrier having an integrated circuit and method for producing same |
US4795895A (en) * | 1985-07-10 | 1989-01-03 | Casio Computer Co., Ltd. | Multi-layered electronic card carrying integrated circuit pellet and having two-pad layered structure for electrical connection thereto |
US4822989A (en) * | 1986-05-21 | 1989-04-18 | Hitachi, Ltd. | Semiconductor device and method of manufacturing thereof |
-
1987
- 1987-07-02 FR FR8709380A patent/FR2617666B1/en not_active Expired
-
1988
- 1988-06-30 CA CA000570870A patent/CA1303241C/en not_active Expired - Lifetime
- 1988-07-01 WO PCT/FR1988/000350 patent/WO1989000340A1/en unknown
- 1988-07-01 EP EP88401699A patent/EP0297991B2/en not_active Expired - Lifetime
- 1988-07-01 ES ES88401699T patent/ES2031258T5/en not_active Expired - Lifetime
- 1988-07-01 JP JP63505881A patent/JPH0678038B2/en not_active Expired - Lifetime
- 1988-07-01 DE DE8888401699T patent/DE3869492D1/en not_active Expired - Lifetime
- 1988-07-01 US US07/342,537 patent/US5097117A/en not_active Expired - Lifetime
-
1995
- 1995-06-08 HK HK92295A patent/HK92295A/en not_active IP Right Cessation
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4216577A (en) * | 1975-12-31 | 1980-08-12 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card |
US4222516A (en) * | 1975-12-31 | 1980-09-16 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull | Standardized information card |
US4549247A (en) * | 1980-11-21 | 1985-10-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element for IC-modules |
FR2523335A1 (en) * | 1982-03-10 | 1983-09-16 | Flonic Sa | Contact building method for card-borne integrated circuits - uses conductive pad welded onto foil used as contact to integrated circuit, creating more durable contact |
US4792843A (en) * | 1983-10-24 | 1988-12-20 | Haghiri Tehrani Yahya | Data carrier having an integrated circuit and method for producing same |
US4682017A (en) * | 1984-12-29 | 1987-07-21 | Kyodo Printing Co., Ltd. | Shock-resistant integrated circuit card |
US4737620A (en) * | 1985-03-28 | 1988-04-12 | Flonic | Method of manufacturing cards having an electronic memory and cards obtained by performing said method |
US4795895A (en) * | 1985-07-10 | 1989-01-03 | Casio Computer Co., Ltd. | Multi-layered electronic card carrying integrated circuit pellet and having two-pad layered structure for electrical connection thereto |
WO1987000486A1 (en) * | 1985-07-17 | 1987-01-29 | Ibiden Co., Ltd. | Printed wiring board for ic cards |
US4822989A (en) * | 1986-05-21 | 1989-04-18 | Hitachi, Ltd. | Semiconductor device and method of manufacturing thereof |
Non-Patent Citations (2)
Title |
---|
IEEE International Electronic Manufacturing Technology Symposium, San Francisco, 15 17 Sep. 1986, M. Ohuchi et al.: A New LSI Interconnection Method for IC Card , pp. 30 33. * |
IEEE International Electronic Manufacturing Technology Symposium, San Francisco, 15-17 Sep. 1986, M. Ohuchi et al.: "A New LSI Interconnection Method for IC Card", pp. 30-33. |
Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5264990A (en) * | 1990-05-11 | 1993-11-23 | U.S. Philips Corporation | Integrated circuit card that aids in reducing stress on an integrated circuit |
US5861897A (en) * | 1991-01-19 | 1999-01-19 | Canon Kabushiki Kaisha | Inkjet recording apparatus with a memory device disposed substantially within boundaries if a recording head unit |
US6259022B1 (en) * | 1995-05-29 | 2001-07-10 | Sgs-Thomson Microelectronics S.A. | Chip card micromodule as a surface-mount device |
US6514367B1 (en) | 1995-10-17 | 2003-02-04 | Keith R. Leighton | Hot lamination process for the manufacture of a combination contact/contactless smart card |
US6036099A (en) * | 1995-10-17 | 2000-03-14 | Leighton; Keith | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
US6214155B1 (en) | 1995-10-17 | 2001-04-10 | Keith R. Leighton | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
US5817207A (en) * | 1995-10-17 | 1998-10-06 | Leighton; Keith R. | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
USRE40145E1 (en) | 1995-10-17 | 2008-03-11 | Leighton Technologies Llc | Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices |
DE19611237A1 (en) * | 1996-03-21 | 1997-09-25 | Siemens Ag | Multichip card e.g. telephone card |
US6441736B1 (en) | 1999-07-01 | 2002-08-27 | Keith R. Leighton | Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices |
DE19959364A1 (en) * | 1999-12-09 | 2001-06-13 | Orga Kartensysteme Gmbh | Chip card has circuit unit electrically connected to contact areas on separate carrying body via conducting tracks in chip card body |
US20070034999A1 (en) * | 2005-08-11 | 2007-02-15 | Infineon Technologies Ag | Chip module and chip card |
US7605453B2 (en) | 2005-08-11 | 2009-10-20 | Infineon Technologies Ag | Chip module and chip card |
USD759022S1 (en) * | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
US9769521B2 (en) | 2013-03-13 | 2017-09-19 | Nagrastar, Llc | Systems and methods for performing transport I/O |
USD780184S1 (en) | 2013-03-13 | 2017-02-28 | Nagrastar Llc | Smart card interface |
USD949864S1 (en) * | 2013-03-13 | 2022-04-26 | Nagrastar Llc | Smart card interface |
US9647997B2 (en) | 2013-03-13 | 2017-05-09 | Nagrastar, Llc | USB interface for performing transport I/O |
USD792410S1 (en) | 2013-03-13 | 2017-07-18 | Nagrastar Llc | Smart card interface |
USD792411S1 (en) | 2013-03-13 | 2017-07-18 | Nagrastar Llc | Smart card interface |
USD758372S1 (en) | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
US9774908B2 (en) | 2013-03-13 | 2017-09-26 | Nagrastar, Llc | Systems and methods for performing transport I/O |
US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
US10070176B2 (en) | 2013-03-13 | 2018-09-04 | Nagrastar, Llc | Systems and methods for performing transport I/O |
USD840404S1 (en) | 2013-03-13 | 2019-02-12 | Nagrastar, Llc | Smart card interface |
US10382816B2 (en) | 2013-03-13 | 2019-08-13 | Nagrastar, Llc | Systems and methods for performing transport I/O |
US10820418B2 (en) * | 2014-01-06 | 2020-10-27 | Thales Dis France Sa | Electronic module, method for manufacturing same and electronic device comprising a module of said type |
USD780763S1 (en) | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
Also Published As
Publication number | Publication date |
---|---|
CA1303241C (en) | 1992-06-09 |
EP0297991B1 (en) | 1992-03-25 |
FR2617666A1 (en) | 1989-01-06 |
EP0297991A1 (en) | 1989-01-04 |
FR2617666B1 (en) | 1989-10-27 |
JPH0678038B2 (en) | 1994-10-05 |
ES2031258T3 (en) | 1992-12-01 |
HK92295A (en) | 1995-06-16 |
WO1989000340A1 (en) | 1989-01-12 |
DE3869492D1 (en) | 1992-04-30 |
EP0297991B2 (en) | 1995-10-04 |
ES2031258T5 (en) | 1996-10-01 |
JPH01502101A (en) | 1989-07-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5097117A (en) | Electronic microcircuit card and method for its manufacture | |
US4774633A (en) | Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electronic microcircuit card incorporating said device | |
US5729053A (en) | Apparatus and method for flat circuit assembly | |
US5041395A (en) | Method of encapsulating an integrated circuit using a punched metal grid attached to a perforated dielectric strip | |
EP0068539B1 (en) | Micropackage for identification card | |
US4719140A (en) | Electronic memory card | |
US4483067A (en) | Method of manufacturing an identification card and an identification manufactured, for example, by this method | |
US5255430A (en) | Method of assembling a module for a smart card | |
EP0163534B1 (en) | Ic card and method for manufacturing the same | |
US4943464A (en) | Electronic component support for memory card and product obtained thereby | |
US6200829B1 (en) | Microelectronic assembly with connection to a buried electrical element, and method for forming same | |
US20020170974A1 (en) | Hybrid IC card | |
JPH022100A (en) | Structure of ic card | |
JPH05270183A (en) | Carrier element for ic module | |
KR19990035992A (en) | Data carrier and its manufacturing method | |
US4907061A (en) | Electronic device | |
US6031724A (en) | IC card and method of manufacturing the same | |
US6521985B1 (en) | Method for the production of a portable integrated circuit electronic device comprising a low-cost dielectric | |
USRE36356E (en) | Electronic component support for memory card and product obtained thereby | |
JP4422494B2 (en) | IC card and SIM | |
US4941257A (en) | Method for fixing an electronic component and its contacts to a support | |
US5856912A (en) | Microelectronic assembly for connection to an embedded electrical element, and method for forming same | |
KR19990035991A (en) | Non-contact action card type data carrier with non-contact action transmission system and components, and production method of such card type data carrier and its module | |
JPH0216233B2 (en) | ||
JP4170491B2 (en) | Method for manufacturing contact-type non-contact type shared IC card |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: BULL CP8, TRAPPES, FRANCE, A CORP. OF THE REP. OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:CHAMPAGNE, DANIEL;LE LOC'H, ALAIN;REEL/FRAME:005084/0025 Effective date: 19890113 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 12 |
|
REMI | Maintenance fee reminder mailed | ||
AS | Assignment |
Owner name: CP8 TECHNOLOGIES, FRANCE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:BULL CP8;REEL/FRAME:014981/0001 Effective date: 20001230 |