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Patents

Referenced by

Citing PatentFiling dateIssue dateOriginal AssigneeTitle
US409476413 Sep 197613 Jun 1978Commissariat a l'Energie Atomique
Agence Nationale de Valorisation de la Recherche (ANVAR)
Device for cathodic sputtering at a high deposition rate
US44077121 Jun 19824 Oct 1983The United States of America as represented by the Secretary of the ArmyHollow cathode discharge source of metal vapor
US559131330 Jun 19957 Jan 1997Tabco Technologies, Inc.Apparatus and method for localized ion sputtering
US571650021 Jun 199610 Feb 1998Surfcoat OyMethod and an apparatus for generation of a discharge in own vapors of a radio frequency electrode for sustained self-sputtering and evaporation of the electrode
US593539730 Apr 199810 Aug 1999Rockwell Semiconductor Systems, Inc.Physical vapor deposition chamber
US633700116 Jul 19978 Jan 2002Unaxis Balzers AktiengesellschaftProcess for sputter coating, a sputter coating source, and sputter coating apparatus with at least one such source
US636501310 Jul 20002 Apr 2002Siemens AktiengesellschaftCoating method and device
US716619918 Dec 200223 Jan 2007Cardinal CG CompanyMagnetron sputtering systems including anodic gas distribution systems
US785082815 Sep 200614 Dec 2010Cardinal CG CompanyEnhanced virtual anode

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