US3327776A - Heat exchanger - Google Patents
Heat exchanger Download PDFInfo
- Publication number
- US3327776A US3327776A US504895A US50489565A US3327776A US 3327776 A US3327776 A US 3327776A US 504895 A US504895 A US 504895A US 50489565 A US50489565 A US 50489565A US 3327776 A US3327776 A US 3327776A
- Authority
- US
- United States
- Prior art keywords
- cooling
- columns
- plates
- column
- packing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0062—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements
- F28D9/0068—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements with means for changing flow direction of one heat exchange medium, e.g. using deflecting zones
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2240/00—Spacing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (1)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US504895A US3327776A (en) | 1965-10-24 | 1965-10-24 | Heat exchanger |
GB21564/66A GB1114066A (en) | 1965-10-24 | 1966-05-16 | An improved cooling plate |
BE681699D BE681699A (en) | 1965-10-24 | 1966-05-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US504895A US3327776A (en) | 1965-10-24 | 1965-10-24 | Heat exchanger |
Publications (1)
Publication Number | Publication Date |
---|---|
US3327776A true US3327776A (en) | 1967-06-27 |
Family
ID=24008162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US504895A Expired - Lifetime US3327776A (en) | 1965-10-24 | 1965-10-24 | Heat exchanger |
Country Status (3)
Country | Link |
---|---|
US (1) | US3327776A (en) |
BE (1) | BE681699A (en) |
GB (1) | GB1114066A (en) |
Cited By (76)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3650310A (en) * | 1970-07-16 | 1972-03-21 | Stewart & Stevenson Serv Inc | Combination boat trim tab and heat exchanger |
US3865183A (en) * | 1973-10-23 | 1975-02-11 | Control Data Corp | Cooling systems for electronic modules |
US4085728A (en) * | 1976-08-16 | 1978-04-25 | Tomchak Sigfrid A | Solar energy heater |
US4170220A (en) * | 1976-10-29 | 1979-10-09 | Smith Henry C | Solar heat collector |
US4270604A (en) * | 1978-11-17 | 1981-06-02 | Sumitomo Precision Products Co. Ltd. | Heat sink |
US4478277A (en) * | 1982-06-28 | 1984-10-23 | The Trane Company | Heat exchanger having uniform surface temperature and improved structural strength |
US4513812A (en) * | 1981-06-25 | 1985-04-30 | Papst-Motoren Gmbh & Co. Kg | Heat sink for electronic devices |
US4519447A (en) * | 1980-08-04 | 1985-05-28 | Fine Particle Technology Corporation | Substrate cooling |
US4631635A (en) * | 1984-10-31 | 1986-12-23 | The United States Of America As Represented By The Secretary Of The Air Force | Vibration isolated cold plate assembly |
US4697427A (en) * | 1985-05-10 | 1987-10-06 | Sundstrand Corporation | Forced flow evaporator for unusual gravity conditions |
US4753290A (en) * | 1986-07-18 | 1988-06-28 | Unisys Corporation | Reduced-stress heat sink device |
US4884168A (en) * | 1988-12-14 | 1989-11-28 | Cray Research, Inc. | Cooling plate with interboard connector apertures for circuit board assemblies |
US4922573A (en) * | 1989-04-14 | 1990-05-08 | Grumman Aerospace Corporation | Compression fitted bushing installation |
US4938280A (en) * | 1988-11-07 | 1990-07-03 | Clark William E | Liquid-cooled, flat plate heat exchanger |
US5088005A (en) * | 1990-05-08 | 1992-02-11 | Sundstrand Corporation | Cold plate for cooling electronics |
WO1992017040A1 (en) * | 1991-03-15 | 1992-10-01 | In-Touch Products Co. | Parenteral fluid warmer cassette, system and methods |
US5269146A (en) * | 1990-08-28 | 1993-12-14 | Kerner James M | Thermoelectric closed-loop heat exchange system |
US5275235A (en) * | 1989-07-28 | 1994-01-04 | Cesaroni Anthony Joseph | Panel heat exchanger |
US5316077A (en) * | 1992-12-09 | 1994-05-31 | Eaton Corporation | Heat sink for electrical circuit components |
US5343359A (en) * | 1992-11-19 | 1994-08-30 | Cray Research, Inc. | Apparatus for cooling daughter boards |
US5381510A (en) * | 1991-03-15 | 1995-01-10 | In-Touch Products Co. | In-line fluid heating apparatus with gradation of heat energy from inlet to outlet |
US5469915A (en) * | 1992-05-29 | 1995-11-28 | Anthony J. Cesaroni | Panel heat exchanger formed from tubes and sheets |
EP0706212A3 (en) * | 1994-10-03 | 1997-02-12 | Sumitomo Metal Ind | Heat sink fin assembly for an LSI package |
US5638900A (en) * | 1995-01-27 | 1997-06-17 | Ail Research, Inc. | Heat exchange assembly |
US5669437A (en) * | 1990-02-05 | 1997-09-23 | International Business Machines Corporation | High efficiency thermal interposer |
US5737387A (en) * | 1994-03-11 | 1998-04-07 | Arch Development Corporation | Cooling for a rotating anode X-ray tube |
US5804761A (en) * | 1996-05-02 | 1998-09-08 | Chrysler Corporation | Water cooled DC bus structure |
US5846224A (en) * | 1996-10-01 | 1998-12-08 | Baxter International Inc. | Container for use with blood warming apparatus |
US5983997A (en) * | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
US6047108A (en) * | 1996-10-01 | 2000-04-04 | Baxter International Inc. | Blood warming apparatus |
US6305463B1 (en) * | 1996-02-22 | 2001-10-23 | Silicon Graphics, Inc. | Air or liquid cooled computer module cold plate |
WO2002042703A2 (en) * | 2000-11-21 | 2002-05-30 | Thermal Corp. | Liquid cooled heat exchanger with enhanced flow |
US20020189794A1 (en) * | 2001-05-25 | 2002-12-19 | Agilent Technologies, Inc. | Cooler for electrical and/ or electronic components, linked to present cooling needs |
US6508301B2 (en) * | 2000-04-19 | 2003-01-21 | Thermal Form & Function | Cold plate utilizing fin with evaporating refrigerant |
US6563709B2 (en) * | 2000-07-21 | 2003-05-13 | Mitsubishi Materials Corporation | Liquid-cooled heat sink and manufacturing method thereof |
US6615590B1 (en) * | 1999-12-16 | 2003-09-09 | Smc Corporation | Heat exchanger for temperature control |
US6648062B2 (en) * | 2000-07-31 | 2003-11-18 | Honda Giken Kogyo Kabushiki Kaisha | Heat sink-type cooling device |
US6729389B2 (en) * | 2000-02-24 | 2004-05-04 | Sts Corporation | Heat transfer apparatus with zigzag passage |
US20040182544A1 (en) * | 2002-12-27 | 2004-09-23 | Lee Hsieh Kun | Cooling device utilizing liquid coolant |
US6843310B1 (en) * | 2004-03-03 | 2005-01-18 | Chin-Ping Chen | Semi-closed air cooling type radiator |
US20050028967A1 (en) * | 2003-08-06 | 2005-02-10 | Albert Pedoeem | Heat dissipating housing with interlocking chamfers and ESD resistance |
US20050178533A1 (en) * | 2004-02-16 | 2005-08-18 | Rintaro Minamitani | Liquid cooling system and an electronic apparatus having the same therein |
US20050274505A1 (en) * | 2004-06-11 | 2005-12-15 | Risto Laurila | Cooling element |
US20050284609A1 (en) * | 2004-05-28 | 2005-12-29 | Ixys Corporation | Heatsink for power devices |
US20060118279A1 (en) * | 2004-12-07 | 2006-06-08 | Eric Stafford | Water cooling system for computer components |
US20060175043A1 (en) * | 2005-02-07 | 2006-08-10 | Hung-Tao Peng | Temperature conductor and method of making same |
US20060219388A1 (en) * | 2005-03-31 | 2006-10-05 | Shuichi Terakado | Cooling jacket |
US7134484B2 (en) * | 2000-12-07 | 2006-11-14 | International Business Machines Corporation | Increased efficiency in liquid and gaseous planar device cooling technology |
US20070023168A1 (en) * | 2005-07-27 | 2007-02-01 | Behr Industry Gmbh & Co. Kg | Apparatus for cooling electronic components |
US20070119581A1 (en) * | 2003-09-30 | 2007-05-31 | Soichi Kato | Heat exchanger tube |
US20070261830A1 (en) * | 2006-05-12 | 2007-11-15 | Seiko Epson Corporation | Heat exchanger, light source apparatus, and projector |
US20080029260A1 (en) * | 2006-08-02 | 2008-02-07 | Man Zai Industrial Co., Ltd. | Liquid cooled heat sink |
US20080128117A1 (en) * | 2006-11-29 | 2008-06-05 | Wyatt William G | Multi-orientation single or two phase coldplate with positive flow characteristics |
US20090080159A1 (en) * | 2005-01-14 | 2009-03-26 | Mitsubishi Denki Kabushiki Kaisha | Heat sink and cooling unit using the same |
US20090107655A1 (en) * | 2007-10-25 | 2009-04-30 | Katsuyuki Kajiura | Semiconductor cooling apparatus |
US20100002392A1 (en) * | 2008-07-07 | 2010-01-07 | I-Ming Liu | Assembled Heat Sink Structure |
US20100101512A1 (en) * | 2007-03-20 | 2010-04-29 | Conti Temic Microelectronic Gmbh | Control Appliance For Using In The Engine Compartment Or In The Transmission Of A Motor Vehicle And Cooling System For Such A Control Appliance |
US20100147289A1 (en) * | 2008-12-16 | 2010-06-17 | Yan Krzysztof Kunczynski | Solar Water Heater |
US20100147290A1 (en) * | 2008-12-16 | 2010-06-17 | Yan Krzysztof Kunczynski | Solar Water Heater |
US20100172104A1 (en) * | 2009-01-08 | 2010-07-08 | Toyota Jidosha Kabushiki Kaisha | Heat dissipation device and power module |
US20100296247A1 (en) * | 2009-05-22 | 2010-11-25 | Ls Industrial Systems Co., Ltd. | Water-cooling type cooler and inverter having the same |
US20110149517A1 (en) * | 2006-09-06 | 2011-06-23 | Airbus Operations Gmbh | Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System |
US20110232879A1 (en) * | 2010-03-29 | 2011-09-29 | Zaffetti Mark A | Compact two sided cold plate with transfer tubes |
CN103155142A (en) * | 2010-08-23 | 2013-06-12 | 三樱工业株式会社 | Cooling device |
WO2014036476A2 (en) * | 2012-08-31 | 2014-03-06 | State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University | System and method for storing energy and purifying fluid |
US20140069615A1 (en) * | 2011-05-12 | 2014-03-13 | Toyota Jidosha Kabushiki Kaisha | Cooler and method for producing the same |
US20140090824A1 (en) * | 2012-09-28 | 2014-04-03 | Behr Gmbh & Co. Kg | Apparatus for conducting a fluid |
US20150189789A1 (en) * | 2013-12-30 | 2015-07-02 | Samsung Display Co., Ltd. | Heat radiation member for electronic device |
US20150377562A1 (en) * | 2013-06-27 | 2015-12-31 | Dana Canada Corporation | Fluid channels having performance enhancement features and devices incorporating same |
US20160348980A1 (en) * | 2015-05-28 | 2016-12-01 | Hamilton Sundstrand Corporation | Heat exchanger with improved flow at mitered corners |
CN106705701A (en) * | 2015-08-18 | 2017-05-24 | 珠海格力节能环保制冷技术研究中心有限公司 | Heat dissipater and manufacturing method thereof |
US20170186667A1 (en) * | 2015-12-26 | 2017-06-29 | Intel Corporation | Cooling of electronics using folded foil microchannels |
US20170234627A1 (en) * | 2016-02-16 | 2017-08-17 | Omron Automotive Electronics Co., Ltd. | Cooler and flow path unit |
US9743563B2 (en) | 2007-03-20 | 2017-08-22 | Conti Temic Microelectronic Gmbh | Control appliance for using in the engine compartment or in the transmission of a motor vehicle and cooling system for such a control appliance |
CN111477997A (en) * | 2020-03-25 | 2020-07-31 | 安徽沃博源科技有限公司 | Liquid cooling plate and liquid cooling device |
DE102021208579A1 (en) | 2021-08-06 | 2023-02-09 | Zf Friedrichshafen Ag | Transmission for a motor vehicle |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2616997B1 (en) * | 1987-06-16 | 1989-08-25 | Thomson Csf | SUPPORT FOR A PRINTED CIRCUIT, FORMING A THERMAL DRAIN WITH CONTROLLED EXPANSION, AND MANUFACTURING METHOD |
DE4131739C2 (en) * | 1991-09-24 | 1996-12-19 | Behr Industrietech Gmbh & Co | Cooling device for electrical components |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2912624A (en) * | 1957-07-29 | 1959-11-10 | Itt | Fluid cooled electronic chassis |
US3048374A (en) * | 1958-11-10 | 1962-08-07 | United Aircraft Prod | Cooled mounting plate for electronic equipment |
US3135321A (en) * | 1960-03-07 | 1964-06-02 | Trane Co | Heat exchanger |
FR1363913A (en) * | 1963-02-25 | 1964-06-19 | Ygnis Sa | element traversed by a fluid in the longitudinal direction and intended to promote heat exchange |
-
1965
- 1965-10-24 US US504895A patent/US3327776A/en not_active Expired - Lifetime
-
1966
- 1966-05-16 GB GB21564/66A patent/GB1114066A/en not_active Expired
- 1966-05-27 BE BE681699D patent/BE681699A/xx unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2912624A (en) * | 1957-07-29 | 1959-11-10 | Itt | Fluid cooled electronic chassis |
US3048374A (en) * | 1958-11-10 | 1962-08-07 | United Aircraft Prod | Cooled mounting plate for electronic equipment |
US3135321A (en) * | 1960-03-07 | 1964-06-02 | Trane Co | Heat exchanger |
FR1363913A (en) * | 1963-02-25 | 1964-06-19 | Ygnis Sa | element traversed by a fluid in the longitudinal direction and intended to promote heat exchange |
Cited By (110)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3650310A (en) * | 1970-07-16 | 1972-03-21 | Stewart & Stevenson Serv Inc | Combination boat trim tab and heat exchanger |
US3865183A (en) * | 1973-10-23 | 1975-02-11 | Control Data Corp | Cooling systems for electronic modules |
US4085728A (en) * | 1976-08-16 | 1978-04-25 | Tomchak Sigfrid A | Solar energy heater |
US4170220A (en) * | 1976-10-29 | 1979-10-09 | Smith Henry C | Solar heat collector |
US4270604A (en) * | 1978-11-17 | 1981-06-02 | Sumitomo Precision Products Co. Ltd. | Heat sink |
US4519447A (en) * | 1980-08-04 | 1985-05-28 | Fine Particle Technology Corporation | Substrate cooling |
US4513812A (en) * | 1981-06-25 | 1985-04-30 | Papst-Motoren Gmbh & Co. Kg | Heat sink for electronic devices |
US4478277A (en) * | 1982-06-28 | 1984-10-23 | The Trane Company | Heat exchanger having uniform surface temperature and improved structural strength |
US4631635A (en) * | 1984-10-31 | 1986-12-23 | The United States Of America As Represented By The Secretary Of The Air Force | Vibration isolated cold plate assembly |
US4697427A (en) * | 1985-05-10 | 1987-10-06 | Sundstrand Corporation | Forced flow evaporator for unusual gravity conditions |
US4753290A (en) * | 1986-07-18 | 1988-06-28 | Unisys Corporation | Reduced-stress heat sink device |
US4938280A (en) * | 1988-11-07 | 1990-07-03 | Clark William E | Liquid-cooled, flat plate heat exchanger |
US4884168A (en) * | 1988-12-14 | 1989-11-28 | Cray Research, Inc. | Cooling plate with interboard connector apertures for circuit board assemblies |
US4922573A (en) * | 1989-04-14 | 1990-05-08 | Grumman Aerospace Corporation | Compression fitted bushing installation |
US5275235A (en) * | 1989-07-28 | 1994-01-04 | Cesaroni Anthony Joseph | Panel heat exchanger |
US5915462A (en) * | 1990-02-05 | 1999-06-29 | International Business Machines Corporation | High efficiency thermal interposer |
US5669437A (en) * | 1990-02-05 | 1997-09-23 | International Business Machines Corporation | High efficiency thermal interposer |
US5088005A (en) * | 1990-05-08 | 1992-02-11 | Sundstrand Corporation | Cold plate for cooling electronics |
US5269146A (en) * | 1990-08-28 | 1993-12-14 | Kerner James M | Thermoelectric closed-loop heat exchange system |
US5245693A (en) * | 1991-03-15 | 1993-09-14 | In-Touch Products Co. | Parenteral fluid warmer apparatus and disposable cassette utilizing thin, flexible heat-exchange membrane |
US5381510A (en) * | 1991-03-15 | 1995-01-10 | In-Touch Products Co. | In-line fluid heating apparatus with gradation of heat energy from inlet to outlet |
WO1992017040A1 (en) * | 1991-03-15 | 1992-10-01 | In-Touch Products Co. | Parenteral fluid warmer cassette, system and methods |
US5469915A (en) * | 1992-05-29 | 1995-11-28 | Anthony J. Cesaroni | Panel heat exchanger formed from tubes and sheets |
US5343359A (en) * | 1992-11-19 | 1994-08-30 | Cray Research, Inc. | Apparatus for cooling daughter boards |
US5316077A (en) * | 1992-12-09 | 1994-05-31 | Eaton Corporation | Heat sink for electrical circuit components |
US5737387A (en) * | 1994-03-11 | 1998-04-07 | Arch Development Corporation | Cooling for a rotating anode X-ray tube |
EP0706212A3 (en) * | 1994-10-03 | 1997-02-12 | Sumitomo Metal Ind | Heat sink fin assembly for an LSI package |
EP1011140A2 (en) * | 1994-10-03 | 2000-06-21 | Sumitomo Metal Industries, Ltd. | Heat sink fin assembly for cooling an LSI package |
EP1028461A1 (en) * | 1994-10-03 | 2000-08-16 | Sumitomo Metal Industries, Ltd. | Heat sink fin assembly for cooling an LSI package |
EP1011140A3 (en) * | 1994-10-03 | 2000-07-26 | Sumitomo Metal Industries, Ltd. | Heat sink fin assembly for cooling an LSI package |
US5638900A (en) * | 1995-01-27 | 1997-06-17 | Ail Research, Inc. | Heat exchange assembly |
US6305463B1 (en) * | 1996-02-22 | 2001-10-23 | Silicon Graphics, Inc. | Air or liquid cooled computer module cold plate |
US5804761A (en) * | 1996-05-02 | 1998-09-08 | Chrysler Corporation | Water cooled DC bus structure |
US6047108A (en) * | 1996-10-01 | 2000-04-04 | Baxter International Inc. | Blood warming apparatus |
US5846224A (en) * | 1996-10-01 | 1998-12-08 | Baxter International Inc. | Container for use with blood warming apparatus |
US5983997A (en) * | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
US6615590B1 (en) * | 1999-12-16 | 2003-09-09 | Smc Corporation | Heat exchanger for temperature control |
US6729389B2 (en) * | 2000-02-24 | 2004-05-04 | Sts Corporation | Heat transfer apparatus with zigzag passage |
US6508301B2 (en) * | 2000-04-19 | 2003-01-21 | Thermal Form & Function | Cold plate utilizing fin with evaporating refrigerant |
US6563709B2 (en) * | 2000-07-21 | 2003-05-13 | Mitsubishi Materials Corporation | Liquid-cooled heat sink and manufacturing method thereof |
US6648062B2 (en) * | 2000-07-31 | 2003-11-18 | Honda Giken Kogyo Kabushiki Kaisha | Heat sink-type cooling device |
WO2002042703A2 (en) * | 2000-11-21 | 2002-05-30 | Thermal Corp. | Liquid cooled heat exchanger with enhanced flow |
WO2002042703A3 (en) * | 2000-11-21 | 2002-07-18 | Thermal Corp | Liquid cooled heat exchanger with enhanced flow |
US6578626B1 (en) * | 2000-11-21 | 2003-06-17 | Thermal Corp. | Liquid cooled heat exchanger with enhanced flow |
US6719039B2 (en) | 2000-11-21 | 2004-04-13 | Thermal Corp. | Liquid cooled heat exchanger with enhanced flow |
US7134484B2 (en) * | 2000-12-07 | 2006-11-14 | International Business Machines Corporation | Increased efficiency in liquid and gaseous planar device cooling technology |
US20020189794A1 (en) * | 2001-05-25 | 2002-12-19 | Agilent Technologies, Inc. | Cooler for electrical and/ or electronic components, linked to present cooling needs |
US6935412B2 (en) * | 2001-05-25 | 2005-08-30 | Agilent Technologies, Inc. | Cooler for electrical and/ or electronic components, linked to present cooling needs |
US20040182544A1 (en) * | 2002-12-27 | 2004-09-23 | Lee Hsieh Kun | Cooling device utilizing liquid coolant |
US20050028967A1 (en) * | 2003-08-06 | 2005-02-10 | Albert Pedoeem | Heat dissipating housing with interlocking chamfers and ESD resistance |
US7111674B2 (en) * | 2003-08-06 | 2006-09-26 | Fujitsu Limited | Heat dissipating housing with interlocking chamfers and ESD resistance |
US20070119581A1 (en) * | 2003-09-30 | 2007-05-31 | Soichi Kato | Heat exchanger tube |
US20050178533A1 (en) * | 2004-02-16 | 2005-08-18 | Rintaro Minamitani | Liquid cooling system and an electronic apparatus having the same therein |
US7624789B2 (en) * | 2004-02-16 | 2009-12-01 | Hitachi, Ltd. | Liquid cooling system and an electronic apparatus having the same therein |
US6843310B1 (en) * | 2004-03-03 | 2005-01-18 | Chin-Ping Chen | Semi-closed air cooling type radiator |
US20050284609A1 (en) * | 2004-05-28 | 2005-12-29 | Ixys Corporation | Heatsink for power devices |
US7243706B2 (en) * | 2004-05-28 | 2007-07-17 | Ixys Corporation | Heatsink for power devices |
US7059390B2 (en) * | 2004-06-11 | 2006-06-13 | Abb Oy | Cooling element |
US20050274505A1 (en) * | 2004-06-11 | 2005-12-15 | Risto Laurila | Cooling element |
US20060118279A1 (en) * | 2004-12-07 | 2006-06-08 | Eric Stafford | Water cooling system for computer components |
US8225854B2 (en) * | 2005-01-14 | 2012-07-24 | Mitsubishi Denki Kabushiki Kaisha | Heat sink and cooling unit using the same |
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Also Published As
Publication number | Publication date |
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GB1114066A (en) | 1968-05-15 |
BE681699A (en) | 1966-10-31 |
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