US20110185758A1 - Cooling system for electronic apparatus - Google Patents
Cooling system for electronic apparatus Download PDFInfo
- Publication number
- US20110185758A1 US20110185758A1 US13/020,160 US201113020160A US2011185758A1 US 20110185758 A1 US20110185758 A1 US 20110185758A1 US 201113020160 A US201113020160 A US 201113020160A US 2011185758 A1 US2011185758 A1 US 2011185758A1
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- Prior art keywords
- evaporator
- electronic apparatus
- refrigerant
- casing
- cooling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/202—Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20609—Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger
Definitions
- the presently disclosed subject matter relates to a cooling system for an electronic apparatus, and particularly relates to a cooling system for an electronic apparatus for efficiently cooling an electronic apparatus such as a computer or a server which is required to perform a precise operation and generates a large amount of heat from itself.
- a rack-mount method is the method in which the racks housing electronic apparatuses by dividing the apparatuses according to functional units are stacked on a cabinet. A number of the cabinets (server racks) are aligned and disposed on the floor of a server room. The electronic apparatuses which process information are rapidly improved in processing speed and throughput and the amount of heat generation from the electronic apparatuses is steadily increasing.
- Japanese Patent Application Laid-Open No. 2009-081439 proposes the art for efficiently cooling an electronic apparatus.
- Japanese Patent Application Laid-Open No. 2009-081439 discloses a cooling unit (evaporator) which is a steam compression heat exchange system for promoting cooling of a server rack, and includes an evaporator coil at an outlet door which is hinge-mounted to an air outlet side of the server rack.
- the cooling unit in Japanese Patent Application Laid-Open No. 2009-081439 is hinge-fixed to the server rack. Therefore, machining is required for the server rack. Further, it is necessary to prepare an exclusive cooling unit adapted to the shape of the server rack.
- the cooling unit is sometimes in contact with the adjacent server rack at the time of opening and closing of the cooling unit, and the movable range of the cooling unit may be limited.
- the presently disclosed subject matter is made in view of the above circumstances, and has an object to provide a cooling system for an electronic apparatus which can efficiently cool an electronic apparatus such as a computer or a server which is required to perform a precise operation and generates a large amount of heat from itself, with a cooling unit (evaporator) which can be easily installed.
- a cooling unit evaporator
- a first aspect of the presently disclosed subject matter provides a cooling system for an electronic apparatus, including: a casing in which the electronic apparatus is housed; an evaporator which is disposed at a rear surface side of the casing, and cools heat released from the electronic apparatus by a refrigerant; a slide mechanism which connects the casing and the evaporator to be movable in a longitudinal direction with respect to the casing; at least any one of a cooling tower which is provided at a higher place than the evaporator and condenses the refrigerant by cooling of external air and sprinkled water, and a heat exchanger which cools the refrigerant by using chilled water; a circulation line which moves the refrigerant between the evaporator and at least one of the cooling tower and the heat exchanger; and a piping which connects the circulation line and the evaporator, and is extendable and contractible in response to movement of the evaporator.
- the high-temperature heat which is generated (discharged) from an electronic apparatus (usually having a fan which takes in air of the apparatus room and discharges the air) is directly subjected to heat exchange with the refrigerant which flows in the evaporator while the heat is in the high-temperature state, and evaporation of the refrigerant is promoted, whereby the transport power for transporting the evaporated refrigerant gas to the cooling tower installed at a higher place than the evaporator or the heat exchanger.
- the refrigerant gas evaporated in the evaporator has a high temperature, and thereby, the cooling capacity to condense the evaporated refrigerant gas to make the refrigerant gas a refrigerant liquid can be made small.
- the refrigerant liquid which is cooled and condensed flows down to the evaporator located below the cooling tower, and thereby, the circulation line in which the refrigerant naturally circulates between the evaporator and the cooling tower is constructed.
- the cooling tower which cools the refrigerant with external air and sprinkled water at the cooling side of the circulation line, the heat source load for cooling can be significantly reduced, and the running cost for cooling the refrigerant can be significantly reduced.
- the evaporator slides in the longitudinal direction relatively to the casing, and therefore, does not interfere with the adjacent server rack. Therefore, the space for carrying-in, wiring, maintenance and the like of the electronic apparatus can be ensured at the rear surface side of the casing. Further, the evaporator is not directly mounted to the casing, and therefore, a special evaporator does not have to be prepared in accordance with the shape of each casing.
- a second aspect of the presently disclosed subject matter provides a cooling system for an electronic apparatus, including: a casing in which the electronic apparatus is housed; an evaporator which is disposed at a rear surface side of the casing, and cools heat released from the electronic apparatus by a refrigerant; a slide mechanism which connects the casing and the evaporator to be movable in a longitudinal direction with respect to the casing; a cooling tower which is provided at a higher place than the evaporator and condenses the refrigerant by cooling of external air and sprinkled water; a heat exchanger which cools the refrigerant by using chilled water; a circulation line which moves the refrigerant between the evaporator and the cooling tower; a parallel line which is a channel of the refrigerant, is connected to the circulation line, and is provided so that the heat exchanger and the cooling tower have a parallel relation; a parallelizing control mechanism which controls a refrigerant amount of the refriger
- the heat exchanger which cools the refrigerant is connected in parallel to the circulation line to be configured to have a parallel relation with the cooling tower, in addition to the cooling tower, and the refrigerant amount which is passed to the heat exchanger is controlled with the paralleling control mechanism.
- a third aspect of the presently disclosed subject matter provides the cooling system for an electronic apparatus according to the first or second aspect, wherein the evaporator includes a fan. According to the presently disclosed subject matter, the efficiency of the evaporator can be enhanced by providing the fan in the evaporator.
- a fourth aspect of the presently disclosed subject matter provides the cooling system according to any one of the first to third aspects, wherein the slide mechanism is fixed to the casing by a clamp.
- the slide mechanism is fixed to the casing by the clamp, and thereby, the slide mechanism can be fixed to the casing without working the casing. More specifically, the slide mechanism can be fixed to the casing with the electronic apparatus operated. Accordingly, the evaporator can be mounted to the casing with the electronic apparatus operated.
- a fifth aspect of the presently disclosed subject matter provides the cooling system according to any one of the first to fourth aspects, wherein the evaporator includes a caster adjustable in height at a bottom part of the evaporator.
- the evaporator includes a caster adjustable in height at a bottom part of the evaporator.
- the caster provided at the bottom part of the evaporator, the evaporator can be easily moved in the longitudinal direction with respect to the casing.
- the caster includes the height adjusting function, and therefore, the evaporator can be disposed to correspond to the height of the opening portion of the casing.
- a sixth aspect of the presently disclosed subject matter provides the cooling system for an electronic apparatus according to any one of the first to the fifth aspects, further including: a stopper which fixes positions of the evaporator and the casing. According to the presently disclosed subject matter, the state in which the evaporator is closely attached to the casing can be kept by the stopper. Thereby, the heat generated from the electronic apparatus can be efficiently cooled with the evaporator.
- the evaporator When the electronic apparatus is carried in, carried out and the like, the evaporator is usually moved to separate from the casing. By fixing the position of the evaporator in this position by the stopper, an accident that the evaporator moves at the time of operation and hurts the operator can be prevented.
- a seventh aspect of the presently disclosed subject matter provides the cooling system for an electronic apparatus according to any one of the first to sixth aspects, further including: a frame body which is mounted to an outer periphery of the evaporator and adjusts a size with the casing. According to the presently disclosed subject matter, by mounting the frame body to the outer periphery of the evaporator, the difference in size from the casing can be adjusted. Accordingly, one evaporator can be mounted to a plurality of casings differing in size.
- a cooling system for an electronic apparatus can be provided, which can efficiently cool an electronic apparatus such as a computer or a server, which is required to perform a precise operation and generates a large amount of heat from itself, with an evaporator which can be easily installed.
- FIG. 1 is a conceptual view explaining an embodiment of a cooling system for an electronic apparatus of the presently disclosed subject matter
- FIG. 2 is an explanatory view explaining one mode of a server rack and an evaporator according to the presently disclosed subject matter
- FIG. 3 is a view illustrating one mode for fixing positions of the evaporator and the server rack
- FIG. 4 is a view illustrating another mode for fixing the positions of the evaporator and the server rack
- FIGS. 5A and 5B are explanatory views illustrating mounting states of the evaporator, the server rack and piping.
- FIG. 6 is an explanatory view illustrating the evaporator, a frame body and the server rack.
- FIG. 1 is a conceptual view illustrating a cooling system 10 for an electronic apparatus of the embodiment of the presently disclosed subject matter.
- a server room 14 is provided in a building 12 .
- an underfloor chamber 22 is formed on the back side of a floor surface 20 .
- a plurality of air outlets are disposed, and cold air from an air-conditioner (not illustrated) is blown off to the server room 14 from the floor surface 20 through the underfloor chamber 22 .
- the air outlets are preferably disposed near a server rack (casing) 26 .
- the cold air which is blown out is supplied to an electronic apparatus (not illustrated) which is housed in the server rack 26 . Accordingly, the electronic apparatus is efficiently cooled by cold air.
- an evaporator 34 is disposed at a rear surface side of the server rack 26 .
- the evaporator 34 and the server rack 26 are connected by a slide mechanism 50 .
- the slide mechanism 50 By the slide mechanism 50 , the evaporator 34 becomes movable in the longitudinal direction with respect to the server rack 26 .
- the evaporator 34 includes a caster 52 on the bottom surface. The evaporator 34 can be easily moved by the caster 52 .
- the evaporator 34 includes a cooling coil 36 therein.
- a refrigerant liquid flowing in the cooling coil 36 is evaporated by high-temperature air generated from the electronic apparatus housed in the server rack 26 , and thereby, deprives the surroundings of heat of vaporization to be gasified. Thereby, the electronic apparatus and the high-temperature air discharged from the electronic apparatus are cooled.
- a cooling tower 38 is installed on the roof of the building 12 .
- a circulation line 40 in which a refrigerant naturally circulates is formed between the cooling tower 38 and the evaporator 34 .
- the cooling tower 38 includes therein spiral piping 41 in which the refrigerant flows, and a water sprinkling pipe 42 which is located above the spiral piping 41 and sprinkles water to the spiral piping 41 .
- the cooling tower 38 includes a fan 44 above the water sprinkling pipe 42 .
- the fan 44 takes in external air from an opening in the side surface of the cooling tower 38 , and discharge the external air from an opening on a top surface.
- a counter current is formed by the sprinkled water and the external air taken in. Thereby, the external air is cooled to be lower than the temperature of the external air when it is taken in.
- the cooling coil 36 and the spiral piping 41 are connected by return piping 46 (refrigerant gas piping) for returning the refrigerant gas which is gasified in the evaporator 34 to the cooling tower 38 , and supply piping 48 (refrigerant liquid piping) which supplies the refrigerant liquid which is liquefied by cooling and condensing the refrigerant gas in the cooling tower 38 to the evaporator 34 .
- the circulation line 40 is configured by the return piping 46 and the supply piping 48 .
- the return piping 46 and the supply piping 48 are installed on a ceiling surface 16 of the server room 14 .
- the return piping 46 and the cooling coil 36 of the evaporator 34 are connected by flexible piping 78 .
- the supply piping 48 and the cooling coil 36 of the evaporator 34 are connected by flexible piping 80 .
- the flexible piping 78 and the flexible piping 80 are extendable and contractible, and therefore, even if the evaporator 34 moves relatively to the server rack 26 , connection of the return piping 46 and the evaporator 34 , and connection of the supply piping 48 and the evaporator 34 are kept.
- the amount of heat generation from the electronic apparatuses of recent years has rapidly increased.
- the high-temperature heat which is generated (discharged) from the electronic apparatus is directly subjected to heat exchange with the refrigerant flowing in the evaporator 34 while the heat is in the high-temperature state to promote evaporation of the refrigerant, whereby a transport power can be obtained, which transports the evaporated refrigerant gas to the cooling tower 38 installed on the place higher than the evaporator 34 .
- a chlorofluorocarbon, HFC (hydrofluorocarbon) as an alternative chlorofluorocarbon or the like can be used.
- water can be used, if used at a lower pressure than the atmospheric pressure.
- expression of the refrigerant includes both a refrigerant gas in a gaseous state and a refrigerant liquid in a liquid state
- the direction of the flow of the refrigerant gas is illustrated by the white arrows
- the direction of the flow of the refrigerant liquid is illustrated by the black arrows.
- the circulation line 40 for the refrigerant to circulate naturally is formed between the evaporator 34 and the cooling tower 38 .
- a powerless heat pipe in which the refrigerant is sealed is constructed. Further, the amount of heat generation from the electronic apparatus becomes large, and the high-temperature refrigerant gas can be formed.
- the cooling temperature which condenses the refrigerant gas can be set to be high, and the refrigerant gas can be condensed even with the cooling capacity by the cooling tower 38 .
- the condensed refrigerant liquid flows down to the evaporator 34 located below the cooling tower 38 .
- the evaporator 34 is provided with a temperature sensor (not illustrated) which measures the temperature of the air after the high-temperature air discharged from the electronic apparatus is cooled by the cooling coil 36 .
- the outlet port of the cooling coil 36 is provided with a flow rate regulating device (not illustrated) for regulating the supply flow rate (refrigerant flow rate) of the refrigerant to be supplied to the cooling coil 36 .
- the opening of the flow regulating device (valve) is automatically regulated based on the measured temperature by the temperature sensor. Thereby, when the temperature of the air after cooled in the evaporator 34 becomes excessively lower than the set temperature, the opening of the flow rate regulating device is reduced, and the supply flow rate of the refrigerant is decreased.
- the supply flow rate of the refrigerant is not increased more than necessary, and thereby, the cooling load for cooling the refrigerant can be made small. Accordingly, sufficient cooling capacity can be exhibited with only the cooling in the cooling tower 38 .
- the air in the server room 14 is taken into the server rack 26 which houses the electronic apparatus, and is heated by the heat generated from the electronic apparatus. Heat exchange is performed between the heated high-temperature air and the refrigerant in the evaporator 34 , and the cooled air is measured by a temperature sensor (not illustrated).
- the condensing temperature which is lower than the vaporization (evaporation) temperature is required, unlike the conventional compression type air-conditioning system. Therefore, if the evaporation temperature can be set to be high, the condensing temperature, namely, the temperature of the external air used in the cooling tower 38 can be made high. This means that the cooling capacity in the cooling tower 38 also can be achieved in the condition of the external air at a higher temperature. In the intermediate periods (the spring period and autumn period) when the external air temperature is relatively high, cooling with only the cooling tower can be performed. Thereby, the operation of a chiller 68 is suppressed to realize reduction in running cost.
- a heat exchanger 54 with a larger cooling capacity than the cooling tower 38 is installed, in addition to the cooling tower 38 .
- the heat exchanger 54 is provided in a branch circulation line 64 which is branched from the circulation line 40 .
- a paralleling return piping 58 and a paralleling supply piping 60 which are branched from the return piping 46 and the supply piping 48 respectively are connected to a secondary side coil 62 of the heat exchanger 54 .
- the heat exchanger 54 is disposed with a parallel relation in the flow of the refrigerant with respect to the cooling tower 38 .
- a primary side coil 66 of the heat exchanger 54 is connected to chilled water supply piping 70 and chilled water return piping 72 from the chiller 68 .
- the chilled water supply piping 70 is provided with a delivery pump 74 .
- the chilled water (primary refrigerant) made by the chiller 68 exchanges heat with the refrigerant (secondary refrigerant) in the heat exchanger 54 , and cools the refrigerant.
- the chiller 68 , and a cooling tower 76 which is different from the cooling tower 38 are connected, and the cooling tower 76 is used as a heat sink of the chiller 68 , whereby the working electric power of the chiller 68 can be reduced.
- the cooling tower 76 has a similar structure to that of the cooling tower 38 .
- the paralleling return piping 58 is provided with a paralleling valve 59 , and a shut-off valve 61 is provided near the cooling tower 38 in the supply piping 48 .
- a valve 69 is also provided in the chilled water supply piping 70 in which chilled water flows.
- an external air temperature sensor 63 which measures an external air temperature is provided in the vicinity of the cooling tower 38 .
- a cooling tower outlet (at the refrigerant liquid side) and a heat exchanger outlet (at the refrigerant liquid side) are respectively provided with temperature sensors 65 and 67 . The measurement results of the respective temperature sensors 63 , 65 and 67 are inputted into a paralleling control unit 71 one by one.
- the paralleling control unit 71 controls the respective valves 59 , 61 and 69 . Thereby, a paralleling control mechanism is formed.
- the temperature sensors 65 and 67 are provided at the cooling tower outlet and the heat exchanger outlet, but a pressure sensor (not illustrated) which measures the pressure of the refrigerant which flows in the piping can be provided. Further, both the liquid temperature sensors 65 and 67 and the pressure sensor may be provided.
- the paralleling control unit 71 calculates the capacity of being able to cooling the refrigerant in the cooling tower 38 from the measurement result of the external air temperature sensor 63 .
- the amount of the opening of the paralleling valve 59 is regulated from the calculation result, and thereby, the amount of refrigerant which is fed to the heat exchanger 54 is controlled.
- the cooling tower 38 and the heat exchanger 54 can be efficiently used so that the running cost becomes the lowest in accordance with the cooling load required for condensing the refrigerant gas which is evaporated in the evaporator 34 .
- the cooling capacity of the cooling tower 38 significantly depends on the external air temperature. By performing the control as described above, part of the refrigerant flowing in the circulation line 40 can be made to flow automatically into the heat exchanger 54 in accordance with the variation of the external air temperature. Only the insufficient amount of the cooling capacity of the cooling tower 38 is supplemented by the heat exchanger 54 . Thereby, the running cost can be further reduced.
- the paralleling control unit 71 regulates the amount of the opening of the paralleling valve 59 so that the measurement result of the temperature sensor 65 at the cooling tower outlet becomes a set value. Accordingly, the amount of the refrigerant to be fed to the heat exchanger 54 is controlled. As a result, by measuring the temperature of the refrigerant at the outlet of the cooling tower, the cooling capacity which the cooling tower 38 has at the time point of measurement can be grasped (estimated).
- part of the refrigerant flowing in the circulation line 40 can be made to flow automatically into the heat exchanger 54 , and therefore, only the insufficient amount of the cooling capacity of the cooling tower 38 is supplemented by the heat exchanger 54 . As a result, the running cost can be further reduced.
- the temperature sensor 67 which is provided at the outlet of the heat exchanger is measured, and thereby, the temperature of the refrigerant to be supplied to the evaporator 34 can be measured. Accordingly, by controlling the amount of the opening of the valve 69 of the cooling water supply piping 70 based on the measurement result, the refrigerant can be prevented from being cooled more than necessary with the heat exchanger 54 .
- the combined use of the cooling tower 38 and the heat exchanger 54 may be rather disadvantageous in the aspect of the running cost, and therefore, in such a case, when the measurement temperature of the external air temperature sensor 63 reaches a set value or more, the shut-off valve 61 is closed, whereby the running cost can be further reduced.
- the two cooling devices that is, the cooling tower 38 and the heat exchanger 54 , and causing them to play the respective roles, the stable operation of the cooling system can be ensured, and the running cost for cooling the refrigerant can be reduced.
- FIG. 2 illustrates one mode of the server rack and the evaporator according to the presently disclosed subject matter.
- the server rack 26 includes a rack main body 100 , and an inlet door 110 mounted to the rack main body 100 .
- the rack main body 100 is configured by a bottom plate 101 , a side wall 102 and a ceiling plate 103 , and opening portions are formed at a front and a rear.
- the rack main body 100 has the shape of a square pole as a whole.
- the rack main body 100 includes a mount angle (not illustrated) for mounting an electronic apparatus therein.
- the electronic apparatus to be mounted includes a fan therein. External air is fed to the outlet port side (rear surface side) from the inlet port side (front surface side) of the rack main body 100 .
- the bottom plate 101 , the side wall 102 and the ceiling plate 103 are made of a material such as stainless steel, a steel material, or a metal subjected to electrolytic plating.
- the evaporator 34 is disposed at the rear surface side of the rack main body 100 .
- the evaporator 34 and the rack main body 100 are connected by the slide mechanism 50 .
- the slide mechanism 50 includes a fixed frame 120 , and slide rails 122 mounted to both sides of the fixed frame 120 .
- the fixed frame 120 is fixed to the ceiling plate 103 by a clamp which fastens the ceiling plate 103 .
- the clamp is configured by a fixed clamp member 124 and a movable clamp member 126 . Actual mounting is performed by fixing the fixed clamp member 124 to one end of the ceiling plate 103 , adjusting the movable clamp member 126 to the length of the ceiling plate 103 , and fastening the movable clamp member 126 with a bolt or the like.
- the slide mechanism 50 and the ceiling plate 103 can be mounted to each other without applying work to the rack main body 100 . Thereby, a boring work or the like to the rack is not required, the adverse effect on the electronic apparatus such as short which is caused by metal cuttings which are generated during work such as boring can be prevented, and the mounting operation can be performed even during operation of the electronic apparatus.
- the slide rail 122 is fixed to the evaporator 34 at the end at the side opposite from the fixed frame 120 .
- the slide mechanism 50 enables the evaporator 34 to move in the longitudinal direction with respect to the server rack 26 .
- a space for carrying in/out, wiring, maintenance and the like of the electronic apparatus can be secured at the rear surface side of the server rack 26 .
- the opening range of a certain evaporator may be limited because the evaporator is in contact with the adjacent server rack, or for the other reasons.
- the conventional method needs to provide a cutout at the hinge side of the evaporator.
- the range for installation of the cooling coil becomes small due to the cutout, and the capacity of the evaporator may become the problem.
- the evaporator 34 capable of sliding movement of the presently disclosed subject matter is not influenced by the adjacent server rack, and therefore, the cooling coil 36 can be installed in the evaporator 34 without any limitation.
- flexible piping 78 is mounted to the evaporator 34 .
- flexible piping 80 is mounted to the evaporator 34 . Since the flexible piping 78 and the flexible piping 80 are extendable and contractible, the flexible piping 78 and the flexible piping 80 extend and contract to follow the movement of the evaporator 34 . Thereby, connection of the return piping and the evaporator 34 , and connection of the supply piping and the evaporator 34 are kept.
- the evaporator 34 of the presently disclosed subject matter is configured to be slidable, and therefore, it is important that the piping which connects the return piping and the evaporator 34 and the piping which connects the supply piping and the evaporator 34 are extendable and contractible.
- a caster 52 with a height adjusting function is mounted to a bottom part of the evaporator 34 .
- the caster 52 enables the evaporator 34 to move easily. Further, by adjusting the height of the caster 52 , the heights of the evaporator 34 and the rack main body 100 can be adjusted.
- a fan 30 is installed at a side opposite from a side of the evaporator 34 , which opposes the server rack 26 .
- the external air which is taken into the server rack 26 is fed out to the evaporator 34 by the fan 30 . Accordingly, the heat generated from the electronic apparatus is efficiently cooled by the evaporator 34 .
- FIG. 3 is a view illustrating one mode for fixing the positions of the evaporator and the server rack.
- the description of the components similar to those described with FIGS. 1 and 2 may be omitted by being assigned with the same reference numerals and characters.
- the evaporator 34 is disposed at the position close to the server rack 26 .
- An L-shaped hook 130 is mounted to a rear surface side of the fixed frame 120 fixed to the ceiling plate 103 .
- An arm 132 engaged with the hook 130 is rotatably mounted to the evaporator 34 .
- the evaporator 34 is fixed to the fixed frame 120 .
- the evaporator 34 is restrained from sliding movement.
- the evaporator 34 is closely fixed to the server rack 26 , and therefore, heat from the electronic apparatus can be efficiently cooled. Further, unintentional slide movement of the evaporator 34 is restricted, and an accident and the like can be prevented.
- the evaporator 34 becomes movable.
- FIG. 4 is a view illustrating another mode for fixing the positions of the evaporator and the server rack. The description of the components similar to those already described may be omitted by assigning the components with the same reference numerals and characters.
- FIG. 4 illustrates the state in which the slide rail 122 is the most extended with respect to the fixed frame 120 .
- a plate 142 having a guide hole 144 , and a metal clasp 140 supported by the guide hole 144 are mounted to the slide rail 122 .
- the metal clasp 140 can freely move along the guide hole 144 .
- the metal clasp 140 is moved to the lowest position along the guide hole 144 .
- the metal clasp 140 is projected from the plate 142 .
- the metal clasp 140 is in contact with the server rack 26 .
- the metal clasp 140 restrains movement of the slide rail 122 . Unintentional slide movement of the evaporator is restricted, and an accident or the like can be prevented.
- the metal clasp 140 is moved to the highest position along the guide hole 144 .
- the metal clasp 140 is not projected from the plate 142 , and the slide rail 122 is in the movable state.
- FIGS. 5A and 5B illustrate mounting states of the server rack and piping.
- the description of the components which are similar to those already described may be omitted by assigning the components with the same reference numerals and characters.
- FIG. 5A illustrates the state in which the evaporator 34 is disposed at the position which is the closest to the server rack 26 .
- the flexible piping 78 and the flexible piping 80 are mounted to the evaporator 34 . In order to facilitate the description, only one of the flexible piping is illustrated on the drawing.
- the flexible piping 78 and the flexible piping 80 are connected to the evaporator 34 at one ends of them. Further, the flexible piping 78 and the flexible piping 80 are fixed so that parts of them are along the slide rail 122 . By fixing the parts of the flexible piping 78 and the flexible piping 80 to the slide rail 122 , a load to the joint portion of the flexible piping 78 and the flexible piping 80 and the evaporator 34 can be reduced. Further, the flexible piping 78 and the flexible piping 80 are bundled in a ring shape to be able to contract the diameter between the return piping and the supply piping, and the evaporator 34 .
- FIG. 5B illustrates the state in which the evaporator 34 is disposed at the position which is the most distant from the server rack 26 .
- the flexible piping 78 and the flexible piping 80 are bundled into a ring shape so as to be able to be reduced in diameter. Accordingly, with the slide movement of the evaporator 34 , the diameter of the bundled ring becomes small, and thereby, the flexible piping 78 and the flexible piping 80 extend as they follow the evaporator 34 .
- the evaporator, and the return piping and the supply piping can be connected.
- FIG. 6 illustrates the evaporator, the frame body and the server rack.
- the server rack 26 has a structure larger than the evaporator 34 .
- a frame body 150 is mounted to the outer periphery of the evaporator 34 .
- the slide rail 122 is mounted to the frame body 150 .
- the server rack 26 becomes larger, the number of electronic apparatuses to be housed there in becomes larger. With this, the heat generation amount also increases, but this can be dealt with by regulating the flow rate and the like of the refrigerant flowing in the evaporator 34 .
Abstract
A cooling system for an electronic apparatus, includes: a casing in which the electronic apparatus is housed; an evaporator which is disposed at a rear surface side of the casing, and cools heat released from the electronic apparatus by a refrigerant; a slide mechanism which connects the casing and the evaporator to be movable in a longitudinal direction with respect to the casing; at least any one of a cooling tower which is provided at a higher place than the evaporator and condenses the refrigerant by cooling of external air and sprinkled water, and a heat exchanger which cools the refrigerant by using chilled water; a circulation line which moves the refrigerant between the evaporator and at least one of the cooling tower and the heat exchanger; and a piping which connects the circulation line and the evaporator, and is extendable and contractible in response to movement of the evaporator.
Description
- 1. Field of the Invention
- The presently disclosed subject matter relates to a cooling system for an electronic apparatus, and particularly relates to a cooling system for an electronic apparatus for efficiently cooling an electronic apparatus such as a computer or a server which is required to perform a precise operation and generates a large amount of heat from itself.
- 2. Description of the Related Art
- In recent years, with improvement of the information processing technique and development of the Internet environments, the information processing amount which is required has been increased, and data processing centers for processing various kinds of information in large volume have been attracting attention as a business. In, for example, the server room of the data processing center, a large number of electronic apparatuses such as a computer and a server are installed in a concentrated state, and are continuously operated day and night. In general, a rack-mount method is mainstream for installation of the electronic apparatuses in server rooms. A rack-mount method is the method in which the racks housing electronic apparatuses by dividing the apparatuses according to functional units are stacked on a cabinet. A number of the cabinets (server racks) are aligned and disposed on the floor of a server room. The electronic apparatuses which process information are rapidly improved in processing speed and throughput and the amount of heat generation from the electronic apparatuses is steadily increasing.
- In such circumstances, Japanese Patent Application Laid-Open No. 2009-081439 proposes the art for efficiently cooling an electronic apparatus. Japanese Patent Application Laid-Open No. 2009-081439 discloses a cooling unit (evaporator) which is a steam compression heat exchange system for promoting cooling of a server rack, and includes an evaporator coil at an outlet door which is hinge-mounted to an air outlet side of the server rack.
- Incidentally, the cooling unit in Japanese Patent Application Laid-Open No. 2009-081439 is hinge-fixed to the server rack. Therefore, machining is required for the server rack. Further, it is necessary to prepare an exclusive cooling unit adapted to the shape of the server rack.
- Further, in the hinge-fixed cooling unit, the cooling unit is sometimes in contact with the adjacent server rack at the time of opening and closing of the cooling unit, and the movable range of the cooling unit may be limited.
- The presently disclosed subject matter is made in view of the above circumstances, and has an object to provide a cooling system for an electronic apparatus which can efficiently cool an electronic apparatus such as a computer or a server which is required to perform a precise operation and generates a large amount of heat from itself, with a cooling unit (evaporator) which can be easily installed.
- In order to attain the above-described object, a first aspect of the presently disclosed subject matter provides a cooling system for an electronic apparatus, including: a casing in which the electronic apparatus is housed; an evaporator which is disposed at a rear surface side of the casing, and cools heat released from the electronic apparatus by a refrigerant; a slide mechanism which connects the casing and the evaporator to be movable in a longitudinal direction with respect to the casing; at least any one of a cooling tower which is provided at a higher place than the evaporator and condenses the refrigerant by cooling of external air and sprinkled water, and a heat exchanger which cools the refrigerant by using chilled water; a circulation line which moves the refrigerant between the evaporator and at least one of the cooling tower and the heat exchanger; and a piping which connects the circulation line and the evaporator, and is extendable and contractible in response to movement of the evaporator.
- According to the presently disclosed subject matter, the high-temperature heat which is generated (discharged) from an electronic apparatus (usually having a fan which takes in air of the apparatus room and discharges the air) is directly subjected to heat exchange with the refrigerant which flows in the evaporator while the heat is in the high-temperature state, and evaporation of the refrigerant is promoted, whereby the transport power for transporting the evaporated refrigerant gas to the cooling tower installed at a higher place than the evaporator or the heat exchanger. Furthermore, the refrigerant gas evaporated in the evaporator has a high temperature, and thereby, the cooling capacity to condense the evaporated refrigerant gas to make the refrigerant gas a refrigerant liquid can be made small. The refrigerant liquid which is cooled and condensed flows down to the evaporator located below the cooling tower, and thereby, the circulation line in which the refrigerant naturally circulates between the evaporator and the cooling tower is constructed.
- By constructing the natural circulation line like this, the power cost for transporting the refrigerant is not required. The cooling tower is used, which cools the refrigerant with external air and sprinkled water at the cooling side of the circulation line, the heat source load for cooling can be significantly reduced, and the running cost for cooling the refrigerant can be significantly reduced.
- Further, the evaporator slides in the longitudinal direction relatively to the casing, and therefore, does not interfere with the adjacent server rack. Therefore, the space for carrying-in, wiring, maintenance and the like of the electronic apparatus can be ensured at the rear surface side of the casing. Further, the evaporator is not directly mounted to the casing, and therefore, a special evaporator does not have to be prepared in accordance with the shape of each casing.
- In order to attain the aforementioned object, a second aspect of the presently disclosed subject matter provides a cooling system for an electronic apparatus, including: a casing in which the electronic apparatus is housed; an evaporator which is disposed at a rear surface side of the casing, and cools heat released from the electronic apparatus by a refrigerant; a slide mechanism which connects the casing and the evaporator to be movable in a longitudinal direction with respect to the casing; a cooling tower which is provided at a higher place than the evaporator and condenses the refrigerant by cooling of external air and sprinkled water; a heat exchanger which cools the refrigerant by using chilled water; a circulation line which moves the refrigerant between the evaporator and the cooling tower; a parallel line which is a channel of the refrigerant, is connected to the circulation line, and is provided so that the heat exchanger and the cooling tower have a parallel relation; a parallelizing control mechanism which controls a refrigerant amount of the refrigerant which is passed to the parallel line from the circulation line; and a piping which connects the circulation line and the evaporator and is extendable and contractible in response to movement of the evaporator.
- According to the presently disclosed subject matter, as the device which cools the refrigerant, the heat exchanger which cools the refrigerant is connected in parallel to the circulation line to be configured to have a parallel relation with the cooling tower, in addition to the cooling tower, and the refrigerant amount which is passed to the heat exchanger is controlled with the paralleling control mechanism. Thereby, the cooling tower and the heat exchanger can be efficiently used so that the running cost can be minimized in accordance with the cooling load necessary for condensing the refrigerant gas evaporated in the evaporator.
- A third aspect of the presently disclosed subject matter provides the cooling system for an electronic apparatus according to the first or second aspect, wherein the evaporator includes a fan. According to the presently disclosed subject matter, the efficiency of the evaporator can be enhanced by providing the fan in the evaporator.
- A fourth aspect of the presently disclosed subject matter provides the cooling system according to any one of the first to third aspects, wherein the slide mechanism is fixed to the casing by a clamp. According to the presently disclosed subject matter, the slide mechanism is fixed to the casing by the clamp, and thereby, the slide mechanism can be fixed to the casing without working the casing. More specifically, the slide mechanism can be fixed to the casing with the electronic apparatus operated. Accordingly, the evaporator can be mounted to the casing with the electronic apparatus operated.
- A fifth aspect of the presently disclosed subject matter provides the cooling system according to any one of the first to fourth aspects, wherein the evaporator includes a caster adjustable in height at a bottom part of the evaporator. According to the presently disclosed subject matter, by the caster provided at the bottom part of the evaporator, the evaporator can be easily moved in the longitudinal direction with respect to the casing. Further, the caster includes the height adjusting function, and therefore, the evaporator can be disposed to correspond to the height of the opening portion of the casing.
- A sixth aspect of the presently disclosed subject matter provides the cooling system for an electronic apparatus according to any one of the first to the fifth aspects, further including: a stopper which fixes positions of the evaporator and the casing. According to the presently disclosed subject matter, the state in which the evaporator is closely attached to the casing can be kept by the stopper. Thereby, the heat generated from the electronic apparatus can be efficiently cooled with the evaporator.
- When the electronic apparatus is carried in, carried out and the like, the evaporator is usually moved to separate from the casing. By fixing the position of the evaporator in this position by the stopper, an accident that the evaporator moves at the time of operation and hurts the operator can be prevented.
- A seventh aspect of the presently disclosed subject matter provides the cooling system for an electronic apparatus according to any one of the first to sixth aspects, further including: a frame body which is mounted to an outer periphery of the evaporator and adjusts a size with the casing. According to the presently disclosed subject matter, by mounting the frame body to the outer periphery of the evaporator, the difference in size from the casing can be adjusted. Accordingly, one evaporator can be mounted to a plurality of casings differing in size.
- According to the presently disclosed subject matter, a cooling system for an electronic apparatus can be provided, which can efficiently cool an electronic apparatus such as a computer or a server, which is required to perform a precise operation and generates a large amount of heat from itself, with an evaporator which can be easily installed.
-
FIG. 1 is a conceptual view explaining an embodiment of a cooling system for an electronic apparatus of the presently disclosed subject matter; -
FIG. 2 is an explanatory view explaining one mode of a server rack and an evaporator according to the presently disclosed subject matter; -
FIG. 3 is a view illustrating one mode for fixing positions of the evaporator and the server rack; -
FIG. 4 is a view illustrating another mode for fixing the positions of the evaporator and the server rack; -
FIGS. 5A and 5B are explanatory views illustrating mounting states of the evaporator, the server rack and piping; and -
FIG. 6 is an explanatory view illustrating the evaporator, a frame body and the server rack. - Hereinafter, a preferred embodiment of the presently disclosed subject matter will be described in accordance with the attached drawings. The presently disclosed subject matter will be described according to the following preferred embodiment, but the presently disclosed subject matter can be modified by a number of methods without departing from the range of the presently disclosed subject matter, and embodiments other than the present embodiment can be used. Accordingly, all modifications in the range of the presently disclosed subject matter are included in claims.
- Hereinafter, a preferred embodiment of a cooling system for an electronic apparatus according to the presently disclosed subject matter will be described in detail in accordance with the attached drawings. As one example of the electronic apparatus, an example of the server placed in a server room will be described.
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FIG. 1 is a conceptual view illustrating acooling system 10 for an electronic apparatus of the embodiment of the presently disclosed subject matter. As illustrated inFIG. 1 , aserver room 14 is provided in abuilding 12. On the back side of afloor surface 20, anunderfloor chamber 22 is formed. On thefloor surface 20, a plurality of air outlets (not illustrated) are disposed, and cold air from an air-conditioner (not illustrated) is blown off to theserver room 14 from thefloor surface 20 through theunderfloor chamber 22. The air outlets are preferably disposed near a server rack (casing) 26. Thereby, the cold air which is blown out is supplied to an electronic apparatus (not illustrated) which is housed in theserver rack 26. Accordingly, the electronic apparatus is efficiently cooled by cold air. - As illustrated in
FIG. 1 , anevaporator 34 is disposed at a rear surface side of theserver rack 26. Theevaporator 34 and theserver rack 26 are connected by aslide mechanism 50. By theslide mechanism 50, theevaporator 34 becomes movable in the longitudinal direction with respect to theserver rack 26. Theevaporator 34 includes acaster 52 on the bottom surface. Theevaporator 34 can be easily moved by thecaster 52. - The
evaporator 34 includes a coolingcoil 36 therein. A refrigerant liquid flowing in the coolingcoil 36 is evaporated by high-temperature air generated from the electronic apparatus housed in theserver rack 26, and thereby, deprives the surroundings of heat of vaporization to be gasified. Thereby, the electronic apparatus and the high-temperature air discharged from the electronic apparatus are cooled. - A
cooling tower 38 is installed on the roof of thebuilding 12. Acirculation line 40 in which a refrigerant naturally circulates is formed between the coolingtower 38 and theevaporator 34. Thecooling tower 38 includes therein spiral piping 41 in which the refrigerant flows, and awater sprinkling pipe 42 which is located above thespiral piping 41 and sprinkles water to thespiral piping 41. Thecooling tower 38 includes afan 44 above thewater sprinkling pipe 42. Thefan 44 takes in external air from an opening in the side surface of thecooling tower 38, and discharge the external air from an opening on a top surface. A counter current is formed by the sprinkled water and the external air taken in. Thereby, the external air is cooled to be lower than the temperature of the external air when it is taken in. - The cooling
coil 36 and thespiral piping 41 are connected by return piping 46 (refrigerant gas piping) for returning the refrigerant gas which is gasified in theevaporator 34 to thecooling tower 38, and supply piping 48 (refrigerant liquid piping) which supplies the refrigerant liquid which is liquefied by cooling and condensing the refrigerant gas in thecooling tower 38 to theevaporator 34. Thecirculation line 40 is configured by the return piping 46 and thesupply piping 48. - The return piping 46 and the
supply piping 48 are installed on aceiling surface 16 of theserver room 14. The return piping 46 and the coolingcoil 36 of theevaporator 34 are connected byflexible piping 78. Further, thesupply piping 48 and the coolingcoil 36 of theevaporator 34 are connected byflexible piping 80. Theflexible piping 78 and theflexible piping 80 are extendable and contractible, and therefore, even if theevaporator 34 moves relatively to theserver rack 26, connection of the return piping 46 and theevaporator 34, and connection of thesupply piping 48 and theevaporator 34 are kept. - The amount of heat generation from the electronic apparatuses of recent years has rapidly increased. The high-temperature heat which is generated (discharged) from the electronic apparatus is directly subjected to heat exchange with the refrigerant flowing in the
evaporator 34 while the heat is in the high-temperature state to promote evaporation of the refrigerant, whereby a transport power can be obtained, which transports the evaporated refrigerant gas to thecooling tower 38 installed on the place higher than theevaporator 34. As the refrigerant for use, a chlorofluorocarbon, HFC (hydrofluorocarbon) as an alternative chlorofluorocarbon or the like can be used. Further, water can be used, if used at a lower pressure than the atmospheric pressure. Here, expression of the refrigerant includes both a refrigerant gas in a gaseous state and a refrigerant liquid in a liquid state, and inFIG. 1 , the direction of the flow of the refrigerant gas is illustrated by the white arrows, and the direction of the flow of the refrigerant liquid is illustrated by the black arrows. - The
circulation line 40 for the refrigerant to circulate naturally is formed between the evaporator 34 and thecooling tower 38. By theevaporator 34, thecooling tower 38 and thecirculation line 40, a powerless heat pipe in which the refrigerant is sealed is constructed. Further, the amount of heat generation from the electronic apparatus becomes large, and the high-temperature refrigerant gas can be formed. Thereby, the cooling temperature which condenses the refrigerant gas can be set to be high, and the refrigerant gas can be condensed even with the cooling capacity by thecooling tower 38. The condensed refrigerant liquid flows down to theevaporator 34 located below thecooling tower 38. - The
evaporator 34 is provided with a temperature sensor (not illustrated) which measures the temperature of the air after the high-temperature air discharged from the electronic apparatus is cooled by the coolingcoil 36. The outlet port of the coolingcoil 36 is provided with a flow rate regulating device (not illustrated) for regulating the supply flow rate (refrigerant flow rate) of the refrigerant to be supplied to the coolingcoil 36. The opening of the flow regulating device (valve) is automatically regulated based on the measured temperature by the temperature sensor. Thereby, when the temperature of the air after cooled in theevaporator 34 becomes excessively lower than the set temperature, the opening of the flow rate regulating device is reduced, and the supply flow rate of the refrigerant is decreased. The supply flow rate of the refrigerant is not increased more than necessary, and thereby, the cooling load for cooling the refrigerant can be made small. Accordingly, sufficient cooling capacity can be exhibited with only the cooling in thecooling tower 38. - Describing this in more detail, the air in the
server room 14 is taken into theserver rack 26 which houses the electronic apparatus, and is heated by the heat generated from the electronic apparatus. Heat exchange is performed between the heated high-temperature air and the refrigerant in theevaporator 34, and the cooled air is measured by a temperature sensor (not illustrated). - Meanwhile, in the refrigerant natural circulation system, a condensing temperature which is lower than the vaporization (evaporation) temperature is required, unlike the conventional compression type air-conditioning system. Therefore, if the evaporation temperature can be set to be high, the condensing temperature, namely, the temperature of the external air used in the
cooling tower 38 can be made high. This means that the cooling capacity in thecooling tower 38 also can be achieved in the condition of the external air at a higher temperature. In the intermediate periods (the spring period and autumn period) when the external air temperature is relatively high, cooling with only the cooling tower can be performed. Thereby, the operation of achiller 68 is suppressed to realize reduction in running cost. - Further, on the roof of the
building 12, aheat exchanger 54 with a larger cooling capacity than thecooling tower 38 is installed, in addition to thecooling tower 38. Theheat exchanger 54 is provided in abranch circulation line 64 which is branched from thecirculation line 40. As illustrated inFIG. 1 , a paralleling return piping 58 and a parallelingsupply piping 60 which are branched from the return piping 46 and thesupply piping 48 respectively are connected to asecondary side coil 62 of theheat exchanger 54. Thereby, theheat exchanger 54 is disposed with a parallel relation in the flow of the refrigerant with respect to thecooling tower 38. - A
primary side coil 66 of theheat exchanger 54 is connected to chilledwater supply piping 70 and chilled water return piping 72 from thechiller 68. The chilledwater supply piping 70 is provided with adelivery pump 74. Thereby, the chilled water (primary refrigerant) made by thechiller 68 exchanges heat with the refrigerant (secondary refrigerant) in theheat exchanger 54, and cools the refrigerant. Thechiller 68, and acooling tower 76 which is different from thecooling tower 38 are connected, and thecooling tower 76 is used as a heat sink of thechiller 68, whereby the working electric power of thechiller 68 can be reduced. Thecooling tower 76 has a similar structure to that of thecooling tower 38. - The paralleling return piping 58 is provided with a paralleling
valve 59, and a shut-offvalve 61 is provided near thecooling tower 38 in thesupply piping 48. Avalve 69 is also provided in the chilledwater supply piping 70 in which chilled water flows. Meanwhile, an externalair temperature sensor 63 which measures an external air temperature is provided in the vicinity of thecooling tower 38. A cooling tower outlet (at the refrigerant liquid side) and a heat exchanger outlet (at the refrigerant liquid side) are respectively provided withtemperature sensors respective temperature sensors paralleling control unit 71 one by one. Based on the measurement result, the parallelingcontrol unit 71 controls therespective valves temperature sensors liquid temperature sensors - Here, a preferred mode of a control method according to the paralleling control mechanism will be described. The first control method will be described. The paralleling
control unit 71 calculates the capacity of being able to cooling the refrigerant in thecooling tower 38 from the measurement result of the externalair temperature sensor 63. The amount of the opening of the parallelingvalve 59 is regulated from the calculation result, and thereby, the amount of refrigerant which is fed to theheat exchanger 54 is controlled. Thereby, thecooling tower 38 and theheat exchanger 54 can be efficiently used so that the running cost becomes the lowest in accordance with the cooling load required for condensing the refrigerant gas which is evaporated in theevaporator 34. - The cooling capacity of the
cooling tower 38 significantly depends on the external air temperature. By performing the control as described above, part of the refrigerant flowing in thecirculation line 40 can be made to flow automatically into theheat exchanger 54 in accordance with the variation of the external air temperature. Only the insufficient amount of the cooling capacity of thecooling tower 38 is supplemented by theheat exchanger 54. Thereby, the running cost can be further reduced. - The second control method will be described. The paralleling
control unit 71 regulates the amount of the opening of the parallelingvalve 59 so that the measurement result of thetemperature sensor 65 at the cooling tower outlet becomes a set value. Accordingly, the amount of the refrigerant to be fed to theheat exchanger 54 is controlled. As a result, by measuring the temperature of the refrigerant at the outlet of the cooling tower, the cooling capacity which thecooling tower 38 has at the time point of measurement can be grasped (estimated). Accordingly, by automatically regulating the amount of the opening of the parallelingvalve 59 based on the measurement result, part of the refrigerant flowing in thecirculation line 40 can be made to flow automatically into theheat exchanger 54, and therefore, only the insufficient amount of the cooling capacity of thecooling tower 38 is supplemented by theheat exchanger 54. As a result, the running cost can be further reduced. - Further, when these control methods are performed, the
temperature sensor 67 which is provided at the outlet of the heat exchanger is measured, and thereby, the temperature of the refrigerant to be supplied to theevaporator 34 can be measured. Accordingly, by controlling the amount of the opening of thevalve 69 of the coolingwater supply piping 70 based on the measurement result, the refrigerant can be prevented from being cooled more than necessary with theheat exchanger 54. Further, in the summer period when the cooling capacity of thecooling tower 38 reduces the most, the combined use of thecooling tower 38 and theheat exchanger 54 may be rather disadvantageous in the aspect of the running cost, and therefore, in such a case, when the measurement temperature of the externalair temperature sensor 63 reaches a set value or more, the shut-offvalve 61 is closed, whereby the running cost can be further reduced. - In this manner, by having the two cooling devices, that is, the
cooling tower 38 and theheat exchanger 54, and causing them to play the respective roles, the stable operation of the cooling system can be ensured, and the running cost for cooling the refrigerant can be reduced. -
FIG. 2 illustrates one mode of the server rack and the evaporator according to the presently disclosed subject matter. Theserver rack 26 includes a rack main body 100, and aninlet door 110 mounted to the rack main body 100. The rack main body 100 is configured by abottom plate 101, aside wall 102 and aceiling plate 103, and opening portions are formed at a front and a rear. The rack main body 100 has the shape of a square pole as a whole. The rack main body 100 includes a mount angle (not illustrated) for mounting an electronic apparatus therein. The electronic apparatus to be mounted includes a fan therein. External air is fed to the outlet port side (rear surface side) from the inlet port side (front surface side) of the rack main body 100. Thebottom plate 101, theside wall 102 and theceiling plate 103 are made of a material such as stainless steel, a steel material, or a metal subjected to electrolytic plating. - The
evaporator 34 is disposed at the rear surface side of the rack main body 100. Theevaporator 34 and the rack main body 100 are connected by theslide mechanism 50. Theslide mechanism 50 includes a fixedframe 120, and sliderails 122 mounted to both sides of the fixedframe 120. The fixedframe 120 is fixed to theceiling plate 103 by a clamp which fastens theceiling plate 103. The clamp is configured by a fixedclamp member 124 and amovable clamp member 126. Actual mounting is performed by fixing the fixedclamp member 124 to one end of theceiling plate 103, adjusting themovable clamp member 126 to the length of theceiling plate 103, and fastening themovable clamp member 126 with a bolt or the like. - By fixing the
slide mechanism 50 to theceiling plate 103 with the clamp, theslide mechanism 50 and theceiling plate 103 can be mounted to each other without applying work to the rack main body 100. Thereby, a boring work or the like to the rack is not required, the adverse effect on the electronic apparatus such as short which is caused by metal cuttings which are generated during work such as boring can be prevented, and the mounting operation can be performed even during operation of the electronic apparatus. - The
slide rail 122 is fixed to theevaporator 34 at the end at the side opposite from the fixedframe 120. Theslide mechanism 50 enables theevaporator 34 to move in the longitudinal direction with respect to theserver rack 26. By sliding theevaporator 34 in the direction to be away from theserver rack 26, a space for carrying in/out, wiring, maintenance and the like of the electronic apparatus can be secured at the rear surface side of theserver rack 26. In the conventional method which hinge-mounts the evaporator to the server rack, when a plurality of server racks are disposed in parallel, the opening range of a certain evaporator may be limited because the evaporator is in contact with the adjacent server rack, or for the other reasons. In order to avoid the limitation, the conventional method needs to provide a cutout at the hinge side of the evaporator. However, the range for installation of the cooling coil becomes small due to the cutout, and the capacity of the evaporator may become the problem. - Meanwhile, the
evaporator 34 capable of sliding movement of the presently disclosed subject matter is not influenced by the adjacent server rack, and therefore, the coolingcoil 36 can be installed in theevaporator 34 without any limitation. - In order to connect the return piping and the cooling
coil 36,flexible piping 78 is mounted to theevaporator 34. Further, in order to connect the supply piping and the coolingcoil 36,flexible piping 80 is mounted to theevaporator 34. Since theflexible piping 78 and theflexible piping 80 are extendable and contractible, theflexible piping 78 and theflexible piping 80 extend and contract to follow the movement of theevaporator 34. Thereby, connection of the return piping and theevaporator 34, and connection of the supply piping and theevaporator 34 are kept. Theevaporator 34 of the presently disclosed subject matter is configured to be slidable, and therefore, it is important that the piping which connects the return piping and theevaporator 34 and the piping which connects the supply piping and theevaporator 34 are extendable and contractible. - A
caster 52 with a height adjusting function is mounted to a bottom part of theevaporator 34. Thecaster 52 enables theevaporator 34 to move easily. Further, by adjusting the height of thecaster 52, the heights of theevaporator 34 and the rack main body 100 can be adjusted. - A
fan 30 is installed at a side opposite from a side of theevaporator 34, which opposes theserver rack 26. The external air which is taken into theserver rack 26 is fed out to theevaporator 34 by thefan 30. Accordingly, the heat generated from the electronic apparatus is efficiently cooled by theevaporator 34. -
FIG. 3 is a view illustrating one mode for fixing the positions of the evaporator and the server rack. The description of the components similar to those described withFIGS. 1 and 2 may be omitted by being assigned with the same reference numerals and characters. As illustrated inFIG. 3 , theevaporator 34 is disposed at the position close to theserver rack 26. An L-shapedhook 130 is mounted to a rear surface side of the fixedframe 120 fixed to theceiling plate 103. Anarm 132 engaged with thehook 130 is rotatably mounted to theevaporator 34. When thearm 132 is engaged with thehook 130, theevaporator 34 is fixed to the fixedframe 120. Thereby, theevaporator 34 is restrained from sliding movement. Theevaporator 34 is closely fixed to theserver rack 26, and therefore, heat from the electronic apparatus can be efficiently cooled. Further, unintentional slide movement of theevaporator 34 is restricted, and an accident and the like can be prevented. - By rotating the
arm 132 to release the engaged state of thehook 130, theevaporator 34 becomes movable. -
FIG. 4 is a view illustrating another mode for fixing the positions of the evaporator and the server rack. The description of the components similar to those already described may be omitted by assigning the components with the same reference numerals and characters.FIG. 4 illustrates the state in which theslide rail 122 is the most extended with respect to the fixedframe 120. Aplate 142 having aguide hole 144, and ametal clasp 140 supported by theguide hole 144 are mounted to theslide rail 122. Themetal clasp 140 can freely move along theguide hole 144. In the state in which theslide rail 122 is the most extended with respect to the fixedframe 120, themetal clasp 140 is moved to the lowest position along theguide hole 144. Themetal clasp 140 is projected from theplate 142. Thereby, even if a force is applied in the direction to contract theslide rail 122, themetal clasp 140 is in contact with theserver rack 26. Themetal clasp 140 restrains movement of theslide rail 122. Unintentional slide movement of the evaporator is restricted, and an accident or the like can be prevented. - Meanwhile, when the evaporator is moved, the
metal clasp 140 is moved to the highest position along theguide hole 144. Themetal clasp 140 is not projected from theplate 142, and theslide rail 122 is in the movable state. -
FIGS. 5A and 5B illustrate mounting states of the server rack and piping. The description of the components which are similar to those already described may be omitted by assigning the components with the same reference numerals and characters.FIG. 5A illustrates the state in which theevaporator 34 is disposed at the position which is the closest to theserver rack 26. Theflexible piping 78 and theflexible piping 80 are mounted to theevaporator 34. In order to facilitate the description, only one of the flexible piping is illustrated on the drawing. - The
flexible piping 78 and theflexible piping 80 are connected to theevaporator 34 at one ends of them. Further, theflexible piping 78 and theflexible piping 80 are fixed so that parts of them are along theslide rail 122. By fixing the parts of theflexible piping 78 and theflexible piping 80 to theslide rail 122, a load to the joint portion of theflexible piping 78 and theflexible piping 80 and theevaporator 34 can be reduced. Further, theflexible piping 78 and theflexible piping 80 are bundled in a ring shape to be able to contract the diameter between the return piping and the supply piping, and theevaporator 34. -
FIG. 5B illustrates the state in which theevaporator 34 is disposed at the position which is the most distant from theserver rack 26. Theflexible piping 78 and theflexible piping 80 are bundled into a ring shape so as to be able to be reduced in diameter. Accordingly, with the slide movement of theevaporator 34, the diameter of the bundled ring becomes small, and thereby, theflexible piping 78 and theflexible piping 80 extend as they follow theevaporator 34. With the relatively simple configuration, the evaporator, and the return piping and the supply piping can be connected. -
FIG. 6 illustrates the evaporator, the frame body and the server rack. In the present embodiment, with respect to the width direction and the height direction, theserver rack 26 has a structure larger than theevaporator 34. In order to supplement the difference in size between theserver rack 26 and theevaporator 34, aframe body 150 is mounted to the outer periphery of theevaporator 34. Theslide rail 122 is mounted to theframe body 150. Thereby, the difference in size of theserver rack 26, theevaporator 34 and the casing can be adjusted. Accordingly, even oneevaporator 34 can be adapted to a plurality ofserver racks 26 differing in size by mounting theframe body 150 to theevaporator 34. - As the
server rack 26 becomes larger, the number of electronic apparatuses to be housed there in becomes larger. With this, the heat generation amount also increases, but this can be dealt with by regulating the flow rate and the like of the refrigerant flowing in theevaporator 34.
Claims (12)
1. A cooling system for an electronic apparatus, comprising:
a casing in which the electronic apparatus is housed;
an evaporator which is disposed at a rear surface side of the casing, and cools heat released from the electronic apparatus by a refrigerant;
a slide mechanism which connects the casing and the evaporator to be movable in a longitudinal direction with respect to the casing;
at least any one of a cooling tower which is provided at a higher place than the evaporator and condenses the refrigerant by cooling of external air and sprinkled water, and a heat exchanger which cools the refrigerant by using chilled water;
a circulation line which moves the refrigerant between the evaporator and at least one of the cooling tower and the heat exchanger; and
a piping which connects the circulation line and the evaporator, and is extendable and contractible in response to movement of the evaporator.
2. A cooling system for an electronic apparatus, comprising:
a casing in which the electronic apparatus is housed;
an evaporator which is disposed at a rear surface side of the casing, and cools heat released from the electronic apparatus by a refrigerant;
a slide mechanism which connects the casing and the evaporator to be movable in a longitudinal direction with respect to the casing;
a cooling tower which is provided at a higher place than the evaporator and condenses the refrigerant by cooling of external air and sprinkled water;
a heat exchanger which cools the refrigerant by using chilled water;
a circulation line which moves the refrigerant between the evaporator and the cooling tower;
a parallel line which is a channel of the refrigerant, is connected to the circulation line, and is provided so that the heat exchanger and the cooling tower have a parallel relation;
a parallelizing control mechanism which controls a refrigerant amount of the refrigerant which is passed to the parallel line from the circulation line; and
a piping which connects the circulation line and the evaporator and is extendable and contractible in response to movement of the evaporator.
3. The cooling system for an electronic apparatus according to claim 1 , wherein the evaporator includes a fan.
4. The cooling system for an electronic apparatus according to claim 2 , wherein the evaporator includes a fan.
5. The cooling system for an electronic apparatus according to claim 1 , wherein the slide mechanism is fixed to the casing by a clamp.
6. The cooling system for an electronic apparatus according to claim 2 , wherein the slide mechanism is fixed to the casing by a clamp.
7. The cooling system for an electronic apparatus according to claim 1 ,
wherein the evaporator includes a caster adjustable in height at a bottom part of the evaporator.
8. The cooling system for an electronic apparatus according to claim 2 ,
wherein the evaporator includes a caster adjustable in height at a bottom part of the evaporator.
9. The cooling system for an electronic apparatus according to claim 1 , further comprising:
a stopper which fixes positions of the evaporator and the casing.
10. The cooling system for an electronic apparatus according to claim 2 , further comprising:
a stopper which fixes positions of the evaporator and the casing.
11. The cooling system for an electronic apparatus according to claim 1 , further comprising:
a frame body which is mounted to an outer periphery of the evaporator and adjusts a size with the casing.
12. The cooling system for an electronic apparatus according to claim 2 , further comprising:
a frame body which is mounted to an outer periphery of the evaporator and adjusts a size with the casing.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2010-023307 | 2010-02-04 | ||
JP2010023307A JP5460362B2 (en) | 2010-02-04 | 2010-02-04 | Electronic equipment cooling system |
Publications (1)
Publication Number | Publication Date |
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US20110185758A1 true US20110185758A1 (en) | 2011-08-04 |
Family
ID=44227485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US13/020,160 Abandoned US20110185758A1 (en) | 2010-02-04 | 2011-02-03 | Cooling system for electronic apparatus |
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US (1) | US20110185758A1 (en) |
EP (1) | EP2357878A3 (en) |
JP (1) | JP5460362B2 (en) |
CN (1) | CN102149267A (en) |
SG (1) | SG173295A1 (en) |
Cited By (7)
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GB2505060A (en) * | 2012-06-28 | 2014-02-19 | Hitachi Ltd | Cooling system |
US20140332184A1 (en) * | 2013-05-09 | 2014-11-13 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation system and rack-mount server using the same |
US20140362520A1 (en) * | 2013-06-06 | 2014-12-11 | International Business Machines Corporation | Dynamic surface area expansion in a rear door heat exchanger |
US9033687B2 (en) | 2010-03-01 | 2015-05-19 | Ulrich Gmbh & Co. Kg | Hose pump with planetary gear |
US9200628B2 (en) | 2010-03-01 | 2015-12-01 | Ulrich Gmbh & Co. Kg | Peristaltic pump with adjusting ring |
US9532487B1 (en) * | 2015-06-17 | 2016-12-27 | Amazon Technologies, Inc. | Computer room air filtration and cooling unit |
CN113654301A (en) * | 2021-08-27 | 2021-11-16 | 中山市凯腾电器有限公司 | Double-evaporator refrigeration system and refrigeration equipment |
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JP5857964B2 (en) * | 2010-08-31 | 2016-02-10 | 日本電気株式会社 | Electronic equipment cooling system |
US9027360B2 (en) | 2011-05-06 | 2015-05-12 | International Business Machines Corporation | Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system |
US9307674B2 (en) | 2011-05-06 | 2016-04-05 | International Business Machines Corporation | Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component |
US8687364B2 (en) | 2011-10-28 | 2014-04-01 | International Business Machines Corporation | Directly connected heat exchanger tube section and coolant-cooled structure |
US9043035B2 (en) | 2011-11-29 | 2015-05-26 | International Business Machines Corporation | Dynamically limiting energy consumed by cooling apparatus |
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JP5986064B2 (en) | 2013-12-25 | 2016-09-06 | Necプラットフォームズ株式会社 | Cooling system and electronic equipment |
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- 2011-01-25 CN CN2011100310540A patent/CN102149267A/en active Pending
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US9033687B2 (en) | 2010-03-01 | 2015-05-19 | Ulrich Gmbh & Co. Kg | Hose pump with planetary gear |
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Also Published As
Publication number | Publication date |
---|---|
SG173295A1 (en) | 2011-08-29 |
JP2011165707A (en) | 2011-08-25 |
CN102149267A (en) | 2011-08-10 |
EP2357878A2 (en) | 2011-08-17 |
JP5460362B2 (en) | 2014-04-02 |
EP2357878A3 (en) | 2014-06-25 |
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Owner name: HITACHI PLANT TECHNOLOGIES, LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SHIMOKAWA, RYOJI;SENDA, MASAKATSU;KASHIRAJIMA, YASUHIRO;AND OTHERS;REEL/FRAME:025738/0370 Effective date: 20110117 |
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