US20100280388A1 - CMUT Packaging for Ultrasound System - Google Patents
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Abstract
Description
- This application claims priority from U.S. Provisional Application Ser. No. 60/992,020, filed Dec. 3, 2007 and U.S. Provisional Application Ser. No. 61/024,843, filed Jan. 30, 2008.
- The present application relates to capacitive micromachined ultrasonic transducers (CMUT) and, more particularly to the packaging of CMUT based ultrasonic transducers, devices, and systems
- A catheter allows surgical personnel to diagnose and treat conditions deep within a patient's body by navigating the distal end of the catheter to the site where some condition might exist. Then, surgical personnel can operate various sensors, instruments, etc. at the site to perform certain procedures with minimal intrusive effect on the patient. One type of device that has found widespread use is the ultrasonic scanner. Ultrasonic scanners generate acoustic waves at frequencies selected for their ability to allow the acoustic waves to penetrate various tissues and other biological structures and return echoes there from. Often, it is desired to select frequencies on the order of 20 MHz or higher. Images of the tissue surrounding the ultrasonic scanner can be derived from these returned echoes. Another type of ultrasonic device is used to perform High-Intensity Focused Ultrasound (HIFU) through an ultrasonic transducer equipped catheter; it can safely and effectively ablate atrial fibrillation (AF) from the outside surface of a beating heart. Two types of ultrasonic transducers exist, those which are based on piezoelectric crystals (i.e., a crystal fabricated from a piezoelectric material or a piezoelectric composite material) and those based on capacitive micromachined ultrasonic transducers (CMUTs and embedded spring CMUTS or ESCMUTs).
- CMUTs typically include two spaced apart electrodes with a membrane attached to one of the two electrodes. In operation, an alternating current (AC) signal is used to charge the electrodes to differing voltages. The differential voltage induces movement of the electrode attached to the membrane and hence, the membrane itself. A piezoelectric transducer (PZTs) also applies an AC signal to the crystal therein causing it to vibrate and produce acoustic waves. The echoes returned to the crystal are used to derive images of the surrounding tissue.
- Thus, surgical personnel have found it useful to employ ultrasonic scanner equipped catheters to obtain images of certain tissues (e.g. blood vessels), structures, etc. within human (and animal) patients and to view the effects of therapy thereon. For instance, ultrasonic transducers can provide images which allow medical personnel to determine whether blood is flowing through a particular blood vessel.
- Some catheters include a single ultrasonic transducer situated at, or near, the distal end of the catheter whereas other catheters include arrays of ultrasonic transducers at the distal end of the catheter. These ultrasonic transducer transducers can be arrange along the side of the catheter and can point outward there from. If so they can be referred to as “side looking” transducers. When the catheter only has one side looking transducer the catheter can be rotated to obtain images of the tissue in all directions around the catheter. Otherwise, the catheter can have ultrasonic transducers pointed in all directions around the catheter.
- In other situations, catheters can have ultrasonic transducers arranged at the distal end of the catheter which point in a distal direction from the end of the catheter. These types of ultrasonic transducers can be referred to as “forward looking” transducers. Forward looking transducers can be useful for obtaining images of tissue in front of (i.e. “forward” of) the catheter.
- Since in both ultrasound imaging and ultrasound therapy, the ultrasound system focuses ultrasound in a target zone to achieve either imaging or therapy, a catheter based ultrasound system used for imaging can also be configured to perform therapy by selecting a proper ultrasound frequency and energy input.
- Embodiments provide ultrasonic transducers, device, and systems, (e.g. scanners or HIFU devices) and methods of manufacturing ultrasonic systems. More particularly, a method practiced according to one embodiment includes integrating a flexible electronic device (e.g. an integrated circuit) with a flexible member and integrating a flexible ultrasonic transducer (e.g. a portion of a circular CMUT array) with the flexible member. The integrated flexible electronic device, flexible ultrasonic transducer, and flexible member can form a flexible subassembly which is rolled up to form the ultrasonic transducer. The packaging methods disclosed herein can be used to make miniaturized ultrasonic transducers, devices, and systems. These methods can also be used to make flexible ultrasonic transducers, devices, and systems. Moreover, the resulting ultrasonic transducers, devices, and systems can be mechanically flexible. In some embodiments, these ultrasonic transducers, devices, and systems can also be operationally flexible in that they can be applied to a variety of situations including: IVUS/ICE) imaging and various forms of therapy. For example, these ultrasonic transducers, devices, and systems can be used for, but not limited to, high intensity focused ultrasound (HIFU) ablation for AF on a human patient's heart.
- In some embodiments, the integration of the flexible electronic device and the flexible ultrasonic transducer with the flexible member occurs at the same time. Furthermore, the integration of the ultrasonic transducer can be performed from the side of ultrasonic transducer which includes its active surface. In the alternative, the integration of the flexible electronic device can occur before (or after) the integration of the flexible ultrasonic transducer. Moreover, the integration of the flexible ultrasonic transducer can include using a semiconductor technique. In some embodiments, the rolled up flexible subassembly forms a lumen which can be coupled to the lumen of a catheter. However, the rolled up flexible subassembly can be attached to a lumen of a catheter instead. In some embodiments, the method includes folding a portion of the flexible member (which hosts the flexible ultrasonic transducer) through an angle of about ninety degrees to form a forward looking ultrasonic transducer. The flexible member of some embodiments can include a pair of arms attached to portions of a circular array of CMUT transducers. As the arms (and the rest of the flexible member) are rolled up, the circular CMUT array can be folded through about ninety degrees to form a ring shaped CMUT array. The ring shaped CMUT array can then be used as a forward looking CMUT array.
- One embodiment of an ultrasonic system disclosed herein includes a flexible electronic device (e.g. an integrated circuit), a flexible ultrasonic transducer; and a flexible member with the flexible electronic device and the flexible ultrasonic transducer integrated with the flexible member. The integrated flexible electronic device, the flexible ultrasonic transducer, and the flexible member can form a flexible subassembly which is rolled up to form the ultrasonic scanner. In some embodiments, the rolled up flexible subassembly is a lumen or, instead, can be attached to a lumen of a catheter. The flexible ultrasonic transducer can include a through wafer interconnect and a portion of a circular CMUT array in communication therewith. Moreover, the ultrasonic transducer can be a forward looking, ring shaped CMUT array.
- Accordingly, embodiments provide many advantages over previously available ultrasonic transducers and, more particularly, over PZT based ultrasonic systems. For instance, embodiments provide ultrasonic scanners which can operate at higher frequencies and with wider bandwidths than heretofore possible. Embodiments also provide ultrasonic systems with smaller form factors than those of previously available ultrasonic transducers. In addition, embodiments provide methods of manufacturing ultrasonic scanners which are simpler, less costly, and faster than previously available ultrasonic manufacturing methods.
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FIG. 1 illustrates a perspective view of a CMUT based ultrasonic scanner and of a flexible subassembly for a CMUT based ultrasonic scanner of one embodiment. -
FIG. 2 illustrates a perspective view of another CMUT based ultrasonic scanner and of a flexible subassembly for a CMUT based ultrasonic scanner of one embodiment. -
FIG. 3 illustrates perspective views of a flexible subassembly for a CMUT based ultrasonic scanner of one embodiment. -
FIG. 4 illustrates a method of integrating ICs and CMUT arrays with flexible members for a CMUT based ultrasonic scanner of one embodiment. -
FIG. 5 illustrates another method of integrating ICs and CMUT arrays with flexible members for a CMUT based ultrasonic system of one embodiment. -
FIG. 6 illustrates another method of integrating ICs and CMUT arrays with flexible members for a CMUT based ultrasonic system of one embodiment. -
FIG. 7 illustrates another method of integrating ICs and CMUT arrays with flexible members for a CMUT based ultrasonic scanner of one embodiment. -
FIG. 8 illustrates yet another method of integrating ICs and CMUT arrays with flexible members for a CMUT based ultrasonic scanner of one embodiment. -
FIG. 9 illustrates perspective views of a flexible subassembly for a CMUT based ultrasonic scanner of one embodiment. -
FIG. 10 illustrates a method of manufacturing a flexible IC subassembly for a CMUT based ultrasonic scanner of one embodiment. -
FIG. 11 illustrates another method of manufacturing CMUT arrays and CMUT elements for a CMUT based ultrasonic scanner of one embodiment. -
FIG. 12 illustrates methods of various embodiments of manufacturing CMUT arrays. - One component of a capacitive micromachined ultrasonic transducer (CMUT) based system (e.g. IVUS/ICE scanner, miniature high intensity focus ultrasound (HIFU) device, etc.) of various embodiments is a flexible member with a CMUT array(s) and/or an IC(s) integrated thereon. The integration of the CMUT arrays and ICs can be performed at the same time using semiconductor and MEMS fabrication and packaging techniques (hereinafter “semiconductor” techniques) or can be performed at different times. Semiconductor techniques can be used in batch processes thereby providing relatively simple, reliable, and cost efficient methods of manufacturing CMUT based ultrasonic systems. The integrated flexible members (with the CMUT arrays and/or ICs) can be folded, or otherwise arranged, to fit within limited spaces and can be made to conform to various surfaces (even those with compound curvature). More specifically, the ultrasonic systems disclosed herein can be included on, or in, various types of catheters. More particularly, these batch semiconductor processes can provide methods of manufacturing ultrasonic systems which are simpler, more reliable, and more cost efficient than methods of manufacturing piezoelectric transducer (PZT) based ultrasonic systems.
- Though piezoelectric transducers (PZTs) can perform some desirable diagnostic and therapeutic functions, it remains difficult to obtain piezoelectric transducers (PZTs) with small form factors. More specifically, due to constraints associated with the materials from which PZTs are manufactured, it remains difficult to design and manufacture catheters with PZTs small enough to fit within many catheters designed to be navigated through various cardiovascular vessels, neurovascular vessels, and other biologic structures. Moreover, PZT materials do not lend themselves well to relatively high frequency regimes. For example, it is difficult to design and manufacture a PZT capable of operation in the region near (and above) 20 MHz which is useful for imaging biological tissues.
- Furthermore, to form cylindrical arrays of PZT (such as the cylindrical arrays desirable for inclusion on various catheters) the individual PZTs must be diced from flat sheets of the transducers. The individual PZTs can then be arranged in a cylindrical array on the catheter. As a result, some of the individual PZTs (or groups thereof) can be damaged or contaminated with kerf or other contaminants during the dicing and assembly operations. Additionally, the dicing operation and the assembly of the individual PZTs on to the catheter can lead to variations in the operational characteristics of the individual PZTs. Thus, previously available PZTs have found use in only certain ultrasound applications. This disclosure provides CMUT based ultrasonic systems, and catheters equipped with such CMUTs which address at least some of the shortcomings of PZTs. As discussed herein, the CMUT based ultrasonic systems and catheters disclosed herein also possess other advantages.
- CMUTs transmit and detect acoustic waves in adjacent media using two plate-like structures arranged to form a capacitor. The plates (or electrodes coupled to the plates) can be repetitively charged to displace one plate relative to the other thereby generating the acoustic waves. Typically, an alternating current (AC) charges the plates. In the alternative, the plates may be charged to a selected voltage (with, for example, a direct current or DC signal) and can be used to sense acoustic waves which impinge on the exposed plate and therefore displace that plate relative to the other plate. The displacement of the exposed plate causes a change in the capacitance of the CMUT. The resulting electric signal generated by the CMUT can be analyzed to generate images of the media surrounding the CMUT. Some CMUT based ultrasonic systems include switches so that, when the switch is in one position, the switch allows the CMUT to transmit acoustic waves and, when the switch is in the other position, the switch allows the CMUT to detect acoustic waves.
- CMUTs can be fabricated separately or can be fabricated in various types of arrays. For instance, a one dimensional (1-D) array of CMUTs can be fabricated wherein the various CMUTs are formed in a linear array. 2-D CMUT arrays can also be fabricated in which the various CMUTs are formed in various patterns including, for example, rows and columns. The rows and columns can create arrays which are generally square, rectangular, or other shapes. Moreover, individual CMUTs can be operated separately; can be operated in conjunction with other CMUTs; or can be operated in conjunction with all of the CMUTs in a particular array or scanner. For instance, the signals driving the various CMUTs can be timed to operate a number of the CMUTs as a phased array to direct the acoustic energy in a particular direction(s).
- CMUT arrays can be formed to be flexible so that the array can conform to a surface, cavity, etc. with a desired or given shape or curvature. For instance, CMUT arrays can be fitted to conform to the shape of a particular instrument, catheter, or other device. Similarly, the ICs (or other electronic circuits) used to drive the CMUTs (and sense the signals there from) can be formed to be flexible also. Furthermore, the CMUTs and ICs can be integrated with each other and the instrument at the same time using the same techniques or at separate times using the same (or different) techniques as disclosed herein.
- More particularly, the CMUTs and ICs of some embodiments can be integrated with each other on a flexible member at the same time using semiconductor or micro electromechanical systems (MEMS) fabrication and packaging techniques (hereinafter “semiconductor” techniques). The flexible member, with the CMUTs and/or ICs on it, can be wrapped onto a catheter (or other device) to form a catheter with a CMUT based ultrasonic system. These CMUT based ultrasonic systems serving as ultrasound scanners can be forward looking, side looking, or combinations thereof. They can also be used to perform imaging, therapeutic functions (e.g. tissue ablation), or combinations thereof. In some embodiments, other transducers (e.g., pressure, temperature, etc.) can be fabricated and integrated with the CMUTs and ICs on the flexible membrane.
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FIG. 1A illustrates a perspective view of a flexible subassembly for a capacitive micromachined transducer (CMUT) based ultrasonic system of one embodiment. Theflexible subassembly 108 includes aCMUT array 110,support electronics 120 for theCMUT array 110, and aflexible member 130. In some embodiments, thesupport electronics 120 are in the form of one or more integrated circuits (ICs). Theflexible member 130 mechanically couples theCMUT array 110 and thesupport electronics 120 while allowing theCMUT array 110 and thesupport electronics 120 to move relative to each other during assembly.Flexible member 130 can also provide electrical connectivity between theCMUT array 110 andsupport electronics 120. Moreover, each of the CMUT elements with in theCMUT array 110 are flexibly coupled to each other. Likewise, various portions of thesupport electronics 120 can be flexibly coupled to each other. -
FIG. 1B illustrates a perspective view of a CMUT based ultrasonic system (e.g. scanner) of one embodiment. More particularly, the CMUT basedultrasonic system 109 can be formed from theflexible subassembly 108. In one embodiment,flexible subassembly 108 is rolled into a cylindrical shape as indicated byreference arrow 136 to form CMUT basedultrasonic system 109. As illustrated inFIG. 1B , CMUT basedultrasonic system 109 can be a side looking ultrasonic scanner. CMUT basedultrasonic scanner 109 can be attached to a lumen of a catheter, or other device, and can be used to image tissues within a patient's body. CMUT basedultrasonic scanner 109 can also focus the ultrasound into the region generally adjacent to the scanner to do HIFU ablation. While theflexible subassembly 108 can be wrapped around objects, rolled into a tube, partial lumen, or lumen, or formed into other shapes (even those with compound curves). -
FIG. 2 illustrates a perspective view of another flexible subassembly for a CMUT based ultrasonic system of one embodiment. Theflexible subassembly 208 includes acircular CMUT array 210, supportingICs 220, and aflexible member 230. Theflexible member 230 includes a pair of arcuate arms 232 which project from theICs 220 and to thecircular CMUT array 210. The arms 232 can also define a void 234 which will allow arms 232 to conform to the overall cylindrical shape of the CMUT basedultrasonic system 209 illustrated inFIG. 2B . To form theultrasonic system 209 from theflexible subassembly 208, thecircular CMUT array 210 can be folded inward as theflexible subassembly 208 is rolled into a cylindrical shape. Thus, the individual elements of thecircular CMUT array 210 can point distally from the CMUT basedultrasonic system 209. Accordingly, the CMUT basedultrasonic system 209 can be a forward looking, CMUT based, ultrasonic scanner. CMUT basedultrasonic scanner 209 can also focus the ultrasound into the region forward of the scanner to do HIFU ablation. - With reference now to
FIG. 3A , a perspective view of a flexible subassembly for a CMUT based ultrasonic system of one embodiment is illustrated. Theflexible subassembly 308 includes aCMUT array 310 andICs 320 lying parallel to, and spaced apart from, each other on aflexible member 330. TheCMUT array 310 can be a single element CMUT or a CMUT array (e.g. 1 dimensional, 2 dimensional, 1.5 dimensional, or any other types of CMUT arrays). Thus,portions 350 of theflexible member 330 span the distance between at least some of theICs 320 and theCMUT array 310. Theflexible assembly 308 can be folded at theseportions 350 of theflexible member 330 to form a compact ultrasonic system 309 (seeFIG. 3B ). The compactultrasonic system 309 can resemble a stack ofICs 320 with theCMUT array 310 at one end of the stack and theportions 350 of the flexible member defining layers of the flexible member between theCMUT array 310 and theICs 320. Compactultrasonic system 309 can be made small enough so that it can fit within a catheter and within other similarly limited spaces. While theflexible assembly 308 can be folded into a stack, it can also be wrapped around objects, rolled into a tube or lumen, or formed into other shapes (even those with compound curves). - With reference now to
FIGS. 4-8 , various methods of integrating ICs and CMUT arrays with flexible members are illustrated. These methods can use various semiconductor techniques to perform the integration of the ICs and the CMUT arrays with the flexible members. Indeed, in some embodiments, the same semiconductor techniques are used to integrate the ICs and to integrate the CMUT arrays with the flexible member. In contrast, PZT based ultrasonic scanners require different techniques to integrate the PCT transducers and ICs (or other supporting electronics) of PZT based ultrasonic systems. -
FIG. 4 illustrates a method of integrating ICs and CMUT arrays with flexible members to form aflexible subassembly 408 for CMUT based ultrasonic systems of one embodiment. More particularly, theflexible member 430 can be fabricated on the wafer 400 (or some other substrate) using various semiconductor techniques.FIG. 4 further illustrates that awafer 400 can be used to integratedCMUT arrays 410 andICs 420 with aflexible member 430. During the integration of theCMUT arrays 410 and theICs 420, various structures such as aflexible member 430, comprising at least one insulation layer 431-435, at least one conductive layer 432-434, andbonding pads 439, can be formed. In the method illustrated byFIG. 4 , theCMUT arrays 410 and theICs 420 can be fabricated separately. - Due, in part, to the semiconductor techniques used to fabricate the
flexible member 430, the dimensions of various interconnects to be formed in theflexible member 430 can be controlled to a greater degree than the corresponding dimensions of interconnects in the printed circuit boards (PCBs) used in PZT based ultrasonic systems. Additionally, the method illustrated byFIG. 4 allows interconnect density to be increased (as compared to PZT based ultrasonic transducer interconnect density) by fabricating multiple conductive layers 432-434 with better dimension control. Thus, miniature ultrasonic systems can be manufactured in accordance with various embodiments. - With reference now to
FIG. 4.1 , theinsulation layer 431 can be coated and patterned on to thewafer 400 to form a first layer of theflexible member 430. Note that thewafer 400 can be a silicon wafer, a glass wafer, or some other substrate and that theinsulation layer 431 can be coated or formed, e.g. oxide, nitride, Parylene, polyimide, polymer, PDMS, Kapton, etc. - One of the
conductive layers 432 can be formed and patterned on to the wafer 400 (as illustrated byFIG. 4.2 ) to form various interconnects within theflexible member 430. As noted previously, additional insulation layers 433-435 and additional conductive layers 432-434 can be coated and patterned on to thewafer 400 as desired to form additional interconnects within the flexible member 430 (seeFIG. 4.3 ). The material of the conductive layers 432-434 can be Al, Au, Cr, Ti, Cu, etc. -
FIG. 4.4 illustrates thatbonding pads 439 can be fabricated and patterned from a conductive material on various interconnects previously to mate with corresponding contacts on theCMUT arrays 410, theICs 420, and other components. The material from which thebonding pads 439 can be formed and can be selected based on the techniques which, in the process illustrated inFIGS. 4.4 and 4.5, are selected to integrate theCMUT arrays 410 andICs 420 with theflexible member 430. Thus, as illustrated byFIG. 4.5 theCMUT arrays 410 and theICs 420 can be positioned on thebonding pads 439 and bonded therewith. More specifically, the bonding, either in device level or wafer level, of theCMUT arrays 410 and theICs 420 with thebonding pads 439 can be performed with eutectic bonding, thermal compression bonding, as well as various flip-chip bonding methods. Theflexible subassembly 408, including the flexible member, 430, theCMUT arrays 410 and theICs 420, can then be separated from thewafer 400 as illustrated byFIG. 4.6 . The flexible member comprises the layers 431-435 andbond pads 439. In some embodiments, the integrated flexible subassembly can then subsequently be assembled into an ultrasonic system. Thus, theCMUT arrays 410 can be integrated with theflexible member 430 using the same techniques as are used to integrate theICs 420 with the flexible member 430 (and, more particularly, semiconductor batch-process techniques). -
FIG. 5 illustrates another method of integrating ICs and CMUT arrays with flexible members for a CMUT based ultrasonic system of one embodiment. More particularly, in stead of forming a flexible member on a prime wafer as shown inFIG. 4 , theflexible member 530 inFIG. 5 is formed on a SOI wafer with fabricatedCMUT arrays 510. - With reference now to
FIG. 5.1 ,CMUT arrays 510 are fabricated on aSOI wafer 500. The SOI wafer comprises adevice layer 501, aninsulation layer 502 and ahandling layer 503. InFIG. 5.2 , a first pattern (e.g., trenches or openings) 570, 571 is formed from a top side of the CMUT fabrication substrate. The first pattern includes trenches (or openings) 571 which may define a boundary of eachCMUT array 510 on the wafer and trenches (or openings) 570 which may define a boundary of each CMUT element in aCMUT array 510. The trench's deepest end can reach theinsulation layer 502. The first pattern (e.g., trenches or openings) 570, 571 may be done during or after CMUT fabrication. After this step, the subsequent processing can be similar to the method ofFIG. 4 fromFIG. 4.1 toFIG. 4.4 to form theflexible member 530 on the CMUT array (FIG. 5.3 ). As illustrated byFIG. 5.4 , theICs 520 can be positioned on thebonding pads 539 and bonded therewith. More specifically, the bonding, either in device level or wafer level, of theICs 520 with thebonding pads 539 can be performed with eutectic bonding, thermal compression bonding, as well as various flip-chip bonding methods. Thehandling layer 503 of theSOI wafer 500 may be removed. And then theflexible subassembly 508, including theflexible member 530, theCMUT arrays 510 and theICs 520, can then be separated from thewafer 500 as illustrated byFIG. 5.5 . Furthermore, as illustrated byFIG. 5.5 , the method illustrated byFIG. 5 can result in theCMUT arrays 510 being positioned on one side of the flexible member 530 (e.g., the side which was fabricated onto the wafer 500) and theICs 520 being positioned on the other side of theflexible member 530. -
FIG. 6 illustrates another method of integrating ICs and CMUT arrays with flexible members for a CMUT based ultrasonic system of one embodiment. More particularly, in stead of forming a flexible member on a prime wafer as shown inFIG. 4 , theflexible member 630 inFIG. 6 is formed on a SOI wafer withICs 610 fabricated thereon. - With reference now to
FIG. 6.1 , supportingICs 620 can be fabricated on aSOI wafer 600. The SOI wafer comprises adevice layer 601, aninsulation layer 602 and ahandling layer 603. InFIG. 6.2 , a first pattern (e.g., trenches or openings) 671 can be formed from one side (e.g. the top side) of the IC fabrication substrate. The first pattern includes trenches (or openings) 671 which may define a boundary of eachIC 610 on the wafer. The trench's deepest end can reach theinsulation layer 602. After this step, the subsequent processing can be similar to the method ofFIG. 4 fromFIG. 4.1 toFIG. 4.4 to form theflexible member 630 on the ICs 620 (FIG. 6.3 ). As illustrated byFIG. 6.4 , theCMUT arrays 610 can be positioned on thebonding pads 639 and bonded therewith. More specifically, the bonding, either in the device level or wafer level, of theCMUT arrays 610 with thebonding pads 639 can be performed with eutectic bonding, thermal compression bonding, as well as various flip-chip bonding methods. Thehandling layer 603 of theSOI wafer 600 may be removed. And then theflexible subassembly 608, including theflexible member 630, theCMUT arrays 610 and theICs 620, can then be separated from thewafer 600 as illustrated byFIG. 6.5 . -
FIG. 7 illustrates another method of integrating ICs and CMUT arrays with flexible members for a CMUT based ultrasonic system of one embodiment. In the method illustrated byFIG. 7 , aflexible member 730 can be formed onvarious CMUT arrays 710 andICs 720 using various semiconductor techniques. The method ofFIG. 7 can be used to increase the interconnect density of the resulting ultrasonic systems (as compared to PZT based ultrasonic systems and conventional PCBs) by increasing the number of conductive layers and decreasing line width and separation of conductive wires in theflexible member 730. Moreover, the method ofFIG. 7 can be performed as a batch process thereby taking advantage of the economies of scale associated with batch semiconductor techniques. Thus,many CMUT arrays 710 andICs 720 can be integrated on variousflexible members 730 at the same time. - With reference now to
FIG. 7.1 , the method illustrated therein can use awafer 700 to form theflexible member 730 and to integrate theCMUT arrays 710 and theICs 720 therewith. More particularly,FIG. 7 illustrates that using aSOI wafer 700 can include an embeddedinsulation layer 702 and ahandling layer 703. Furthermore,FIG. 7 illustrates that various structures such aslatch structures 705, insulation layers 731 and 732, andconductive layer 732 can be fabricated on thewafer 700. - More particularly,
FIG. 7.1 illustrates that thelatch structures 705 can be formed onwafer 700. These latch structures can be designed on the wall of thecavities 721 to latch theCMUT arrays 710 and theICs 720 in place incavities 721 formed at locations selected for theCMUT arrays 710 andICs 720. TheCMUT arrays 710 and theICs 720 can be latched in place in theirrespective cavities 721 using the latch structures 705 (FIG. 7.2 ). Theinsulation layer 731 can then be formed and patterned (to provide access to theCMUT arrays 710 and the ICs 720) on thewafer 700 using various semiconductor techniques such as spin-coating, evaporating, sputtering, depositing, etc (FIG. 7.3 ). Moreover, theinsulation layer 731 can be formed from various insulating materials such as Parylene, PMDS, polyimide, polymer, oxide, nitride, etc. - With reference now to
FIG. 7.4 aconductive layer 732 can be formed on thewafer 700 to provide various interconnects within theflexible member 730 and between theCMUT arrays 710, theICs 720, and various other components. Theconductive layer 732 can be formed and patterned on thewafer 700 from various conductive materials such as Al, Au, Cu, Ti, etc. Moreover, theconductive layer 732 can be fabricated using various semiconductor techniques such as evaporation, sputtering, depositing, etc. If desired,additional insulation layers 731 andconductive layers 732 can be formed on thewafer 700 to increase the interconnect density of the resultingflexible member 730. -
FIG. 7.5 illustrates that theflexible insulation layer 733 can be formed and patterned on thewafer 700 as a protection layer of theflexible subassembly 708. Theflexible insulation layer 733 can be formed from various insulating materials such as Parylene, PMDS, polyimide, polymer, oxide, nitride, etc. and can be fabricated via spin-coating, evaporation, sputtering, deposition, etc. Theflexible insulation layer 733 can be fabricated with sufficient thickness and material properties to protect the flexible member 730 (and its various layers 731-732 as well as theCMUT arrays 710 and the ICs 720) from mechanical abuse and from the environment. -
FIG. 7.6 illustrates that, thehandling layer 703 and theinsulation layer 702 can be removed from the surface of thewafer 700 which is opposite the side of thewafer 700 which hosts theCMUT arrays 710, theICs 720, and theflexible member 730. Thus, theflexible subassembly 708 including the integratedflexible member 730, theCMUT arrays 710 andICs 720, can be removed from thewafer 700. Accordingly, the integratedflexible member 730 can be used to assemble various ultrasonic systems. -
FIG. 8 illustrates yet another method of integrating ICs and CMUT arrays with flexible members for a CMUT based ultrasonic scanner of one embodiment. More particularly,FIG. 8.1 illustrates that theCMUT arrays 810 can be fabricated on thewafer 800 first and then the ICs 820 can be latched in place by the latch structures 805 in the wafer with fabricated CMUT arrays. In contrast,FIG. 8.2 illustrates that the ICs 820 can be fabricated on thewafer 800 first and then theCMUT arrays 810 can be latched in place in the wafer with fabricated ICs. In the methods illustrated byFIGS. 8.1 and 8.2, the fabrication of the flexible member 830, and its integration with theCMUT arrays 810 and the ICs 820 can be similar to the method illustrated by FIGS. 7.2-7.6. The finished flexible subassembly can be similar to theflexible subassembly 708 inFIG. 7.6 . -
FIG. 9 illustrates a top view of aflexible assembly 900 in whichmultiple CMUT arrays 910 andmultiple ICs 920 packaged on aflexible member 930 to form multiple CMUT basedflexible subassemblies 908 of one embodiment. Theflexible assembly 900 with multipleflexible subassemblies 908 can be built using the methods illustrates inFIGS. 4-8 . Eachflexible subassembly 908 can be used to built a CMUT based ultrasound system The CMUT based ultrasonicflexible assembly 900 illustrated byFIG. 9 can be manufactured using methods similar to the methods disclosed herein. More particularly, the figure in the zoomed window inFIG. 9 illustrate a perspective view the CMUT based ultrasonic system built from theflexible subassembly 908 can include aCMUT array 910 andICs 920 integrated with theflexible member 930 using various batch semiconductor techniques. Moreover,various contact pads 937 in theflexible member 930 can be fabricated to provide an electronic interface with components external to the CMUT basedultrasonic systems 908. Thus, the interconnects 936 (between theCMUT arrays 910, theICs 920, and various other components) and thecontact pads 937 in theflexible member 930 can be fabricated with the dimensional accuracy provided by various semiconductor techniques at the same time. - In the methods described in
FIGS. 4-8 , at least one of CMUT arrays (e.g. 410, 710) and ICs (e.g. 420, 720) can be separated from a first substrate (e.g. their original fabrication substrate) and then can be integrated on a flexible member (e.g. 430, 730) on a second packaging substrate (e.g. 400, 700). Therefore, at least one of the CMUT arrays and ICs can be fabricated first on their original fabrication substrate and can then be separated and can be ready for the packaged methods described herein. Usually, multiple ICs can be integrated on a flexible member individually. But they can also be integrated with a flexible sub-member on their original fabrication substrate first to form a flexible IC, and then the flexible ICs can be integrated with a CMUT array on the flexible member on the packaging substrate. Usually, CMUT arrays with multiple elements can be made to be flexible before they are integrated with ICs on the flexible member on the packaging substrate.FIGS. 10-12 illustrate several methods to make flexible CMUT arrays (e.g. 410, 720) and flexible ICs (e.g. 410, 720) which can be used in the packaging methods inFIGS. 4-8 as well as other methods. - With reference to
FIGS. 10-12 , it can be desirable to form through wafer interconnects for multiple elements in the CMUT arrays and multiple chips in the electronics (and other components) of various ultrasonic systems. Moreover, it can be desirable to form the interconnections from the inactive side of the flexible CMUT arrays. Thus, it may be desired to fabricate through wafer interconnects in the CMUT arrays and ICs. Flexible - CMUT arrays or ICs which include through wafer interconnections, and methods of fabricating such flexible CMUTs or ICs, are described in International Patent Application No. PCT/IB2006/051566, entitled THROUGH-WAFER INTERCONNECTION, filed on May 18, 2006 by Huang; U.S. patent application Ser. No. 11/425,128, entitled FLEXIBLE MICRO-ELECTRO-MECHANICAL TRANSDUCER, filed on Jun. 19, 2006, by Huang; International Patent Application No. ______, entitled THROUGH-WAFER INTERCONNECT, filed on Dec. 3, 2008 by Huang, and International Patent Application No. ______, entitled PACKAGING AND CONNECTING ELECTROSTATIC TRANSDUCER ARRAYS, filed on Dec. 3, 2008 by Huang which are incorporated herein as if set forth in full.
- As described in the foregoing patent applications, flexible CMUT arrays or ICs can be formed generally as follows. A pattern of separation trenches can be formed in a wafer hosting ICs, CMUT arrays, or a combination thereof. The trenches can be formed from the side of the wafer hosting the ICs or CMUT arrays. These trenches can be formed to a selected depth and can subsequently be filled with a desired material (for example, an insulator). Material can be removed from the side of the wafer opposite the side hosting the ICs or CMUT arrays until the trenches are exposed.
FIGS. 10-12 illustrate various methods of forming flexible CMUTs or ICs of various embodiments. - Now with reference to
FIG. 10 , many ultrasonic scanners contain more than one IC to support the ultrasonic transducers and, perhaps, perform other functions. In accordance with one embodiment, the multiple ICs can be integrated with the flexible member of an ultrasonic scanner using semiconductor techniques. More particularly, the ICs can be fabricated as flexible ICs and then integrated with the flexible member. - Furthermore,
FIG. 10 illustrates that aflexible IC 1020 having a flexible sub-member 1030 s (seeFIG. 10.5 ) andmultiple IC chips 1020 a-1020 c can be fabricated from aSOI wafer 1000 on which various structures are fabricated such as: adevice layer 1001, aninsulation layer 1002, a handling layer 1003, one ormore ICs 1020, aninsulation layer 1031, aconductive layer 1032, andvarious trenches 1070. As illustrated byFIG. 10.1 ,multiple ICs 1020 a-1020 c can be fabricated on theSOI wafer 1000 with a thickness which can be defined by thedevice layer 1001.FIG. 10.2 illustrates that a pattern oftrenches 1070 can be etched through thedevice layer 1001 to reach theinsulation layer 1002. In a subsequent step, the back side of thewafer 1000 including theinsulation layer 1002 and the handling layer 1003 can be removed to reach thetrenches 1070 thereby creating theflexible IC 1020. The insulation layer 1231 can be coated on to thewafer 1000 with a pattern selected to leave various contacts on theICs 1020 a-1220 c exposed (as illustrated byFIG. 10.3 ). Theinsulation layer 1031 may be made of a flexible material such as Parylene, polymer, polyimide, polydimethylsiloxane (PDMS), oxide, nitride, etc. The flexible sub-member 1030 s comprises oneinsulation layer 1031 and oneconductive layer 1032 inFIG. 10.5 . However, the flexible sub-member 1030 s may comprisemultiple insulation layers 1031 and multipleconductive layers 1032 to increase its connection density by repeating the process steps fromFIG. 10.3 andFIG. 10.4 . -
FIG. 10.4 illustrates that theconductive layer 1032 can be coated on to thewafer 1000 in a pattern selected to provide interconnects to theICs 1020. If desired to (for example) increase the density of the interconnects,additional insulation layers 1031 andconductive layers 1032 can be coated on to thewafer 1000. The handling layer 1003 andinsulation layer 1002 can be removed, as illustrated byFIG. 10.5 , to expose thetrenches 1070. Note that with thetrenches 1070 exposed, the only materials connecting the ICs to each other can be the flexible sub-member 1030 s having theinsulation layer 1031 and theconductive layer 1032. Thus, by selecting the dimensions and materials of theselayers various IC chips 1020 to move relative to one another during assembly yet still remain interconnected. Thus, the flexible sub-member 1030 s can be made to be flexible with thelayers flexible IC 1020. Subsequently, various CMUTs, CMUT arrays and other devices can be integrated with theflexible IC 1020 in a flexible member using the methods illustrated inFIGS. 4-8 as well as other methods. - With reference now to
FIG. 11 , another method of manufacturing CMUT arrays with multiple CMUT elements for a CMUT based ultrasonic system of one embodiment is illustrated. The CMUT arrays illustrated byFIG. 11 can be integrated with the flexible member of an ultrasonic system using semiconductor techniques. More particularly, the CMUT arrays can be fabricated as flexible CMUT arrays and then integrated with the flexible member. - Figures at the left side in
FIG. 11 show that themultiple CMUT arrays same substrate 1100. Figures at the right side inFIG. 11 are detailed views of portion of theCMUT array 1110 which show the structure of the CMUT elements 1110-1 and 1110-2 in aCMUT array 1110 in more detail. - More specifically,
FIG. 11.1 illustrates thatflexible CMUT arrays 1110 can be fabricated from a SOI wafer 1100 (including a handling wafer 1103,insulation layer 1102 and the device layer 1101) on which a substrate orbottom electrode 1101, aninsulation layer 1102, CMUT arrays 1110 (or CMUT elements), aninsulation layer 1131, andvarious trenches CMUT arrays 1110 can include aflexible membrane 1111, afirst electrode 1113, acavity 1116, and aspring anchor 1118 among other possible components. Thesecomponents -
FIG. 11.2 illustrates that once theCMUT arrays 1110 have been fabricated, a pattern of trenches 1170 (which separate the CMUT from each other) can be fabricated. Thesetrenches 1170 can be sufficiently deep that they reach theinsulation layer 1102 which, as discussed herein, can be removed to expose the trenches. In some embodiments, thetrenches CMUT arrays 1110. At the same time thattrenches 1170 are formed, another pattern oftrenches 1171 can be fabricated. Thesetrenches 1171 can be formed so that when theinsulation layer 1102 is removed, thetrenches 1171 are also exposed thereby separatingvarious CMUT arrays 1110 from each other. Thetrenches 1170 can define the boundaries of individual CMUT transducer elements 1110-1 and 1110-2. The trenched 1171 can define boundaries of individualCMUT transducer arrays - The
insulation layer 1131 can be patterned and coated on thewafer 1100 to leave the active surfaces of theCMUT arrays 1110 exposed as illustrated inFIG. 11.2 . As theinsulation layer 1131 is fabricated, the material from which it is fabricated may fill thetrenches insulation layer 1131 can be made of various semiconductor materials such as Parylene, polyimide, polymer, PDMS, oxide, nitride, etc. -
FIG. 11.4 illustrates that theinsulation layer 1102 can be removed to expose thetrenches 1170 and 1171 (which can lie between individual CMUT elements andCMUT arrays 1110, respectively). Thus, theCMUT arrays 1110 can have multiple CMUT elements 1110-1 and 1110-2, can be separated from each other as illustrated byFIG. 11.4 . TheseCMUT arrays 1110 and the CMUT elements can subsequently be integrated on various flexible members such asflexible members FIGS. 1-3 ) using the methods illustrated inFIGS. 4-8 . WhileFIG. 11 illustrates that thewafer 1100, from which theCMUT arrays 1110 can be fabricated, can be a silicon-on-oxide wafer, other types of wafers can be used to fabricate theCMUT arrays 1110. For instance, a prime wafer can be used to fabricate the CMUT arrays 1110 (or the CMUT elements). -
FIG. 12 illustrates methods of various embodiments of manufacturing CMUT arrays from prime wafers. More specifically,FIG. 12A illustrates that thetrenches trenches prime wafer 1100 can be separated from each other. - With reference now to
FIG. 12B , another method of manufacturingCMUT arrays 1210 of one embodiment is illustrated. In the method illustrated inFIG. 12B , the method can begin with a wafer 1200 which includes an embedded cavity 1208. TheCMUT arrays 1210 can be fabricated on regions of the wafer 1200 adjacent to the cavities 1208. Thetrenches trenches - With reference now to
FIG. 12C , another method of manufacturingCMUT arrays 1210 of one embodiment is illustrated. Instead of forming thetrenches trenches trenches FIG. 12C can be etched before the formation of themembrane 1212 andtop electrode 1213. According to some embodiments, the trenches embedded under themembrane 1212 can avoid etching thetop electrode 1213 and themembrane 1212 during the trench etching in the method illustrated inFIG. 11.2 . This may be desirable for the implementation of some CMUT systems. After the CMUT arrays with the embeddedtrenches flexible CMUT arrays 1210 and is similar to the process illustrated inFIG. 11 ,FIG. 12A andFIG. 12B . - CMUT based ultrasonic scanners provide several advantages over PZT based ultrasonic scanners. These advantages arise, in part, from the relatively low acoustic impedance of CMUTs. CMUTs typically have lower acoustic impedances than air, water, tissue, etc. As a result, and unlike PZTs, CMUTs can be used without a layer of material to match the acoustic impedance of the CMUTs with the acoustic impedance of the surrounding media.
- PZTs also transmit acoustic energy (i.e., acoustic waves) from both their front and rear surfaces. As a result of this characteristic, PZTs require a backing layer on their rear surface to absorb the acoustic energy emitted there from. Otherwise the acoustic waves transmitted from the rear of the PZTs could reflect from various structures and interfere with the operation of the PZTs. However, in absorbing the acoustic energy transmitted from the rear of the PZTs, the backing layers generate heat. As a result, PZTs can become warm, or even hot, during operation thereby reducing their desirability for use in certain applications such as HIFU. Since CMUTs transmit acoustic energy only from there front surfaces, heating due to misdirected acoustic energy is not a concern for CMUT based ultrasonic scanners. Furthermore, the backing layers (and acoustic matching layers discussed previously) complicate the manufacturing of PZT based ultrasonic systems. In contrast CMUT based ultrasonic systems can omit these layers and the attendant manufacturing steps.
- Moreover, CMUT based ultrasonic scanners can be produced using semiconductor manufacturing techniques. Since these semiconductor techniques benefit from decades of investments by various portions of the semiconductor industry, these techniques can provide relatively high levels of uniformity, precision, repeatability, dimensional control, repeatability, etc. in the CMUTs thereby produced. Further still, many of the foregoing semiconductor techniques can be batch processes. As a result, economies of scale associated with these techniques allow for lower per unit costs for CMUT based ultrasonic systems, particularly when relatively large volumes of ultrasonic systems may be desired. For instance, since all of the features of the CMUT arrays on a particular wafer can be patterned simultaneously, the fabrication of multiple CMUT arrays introduce no (or little) overhead as compared to the fabrication of a single CMUT array.
- Additionally, since CMUT based ultrasonic systems can be produced with semiconductor techniques, integrated circuits (ICs) and other semiconductor devices can be integrated with the CMUT arrays with relative ease. Thus, the CMUT arrays and the ICs can be fabricated on the same wafer at the same time using the same techniques. In the alternative, CMUTs and ICs can be integrated into various transducers at different times. Furthermore, CMUTs and ICs can be fabricated from the same, or similar, biocompatible materials.
- In contrast, the fabrication and integration of PZTs with other components (e.g., ICs) using semiconductor techniques is impracticable due to constraints imposed by the PZT materials Moreover, the available PZT related fabrication and integration techniques suffer from several disadvantages including being labor intensive, being expensive, being subject to manufacturing variations, etc. Furthermore, available PZT techniques meet with additional difficulties as the size of the individual PZT devices approaches the small dimensions (e.g., tens of microns) required for relatively high frequency devices. For instance, separation of the individual PZT devices is dominated by lapping and dicing techniques which lead to device-to-device variability.
- Accordingly, CMUT based ultrasonic systems enjoy both performance and cost advantages over PZT based ultrasonic systems. More particularly, since it is typically desirable for ultrasonic systems to have transducers with both high frequency operating ranges and small physical sizes, CMUT based ultrasonic systems can have several advantages over PZT based ultrasonic systems.
- First, CMUT based ultrasonic systems can be fabricated with better dimensional control than PZT based ultrasonic systems. More particularly, CMUT based ultrasonic systems can be fabricated with minimum dimensions less than about 1 micrometer whereas the minimum dimensions of PZT based ultrasonic systems are greater than about 10 micrometers. Accordingly, CMUT based ultrasonic systems can be fabricated with correspondingly smaller CMUT element pitches. Secondly, the minimum width and pitch of CMUT based ultrasonic system interconnects can be less than about 2-3 micrometers whereas the minimum interconnect width and pitch for PZT based ultrasonic systems is greater than about 25 micrometers. Thus, CMUT based ultrasonic system interconnects can be fabricated at higher densities than PZT based ultrasonic system interconnects. Accordingly, CMUT based ultrasound systems can possess more transducers (for a given system size) or can be smaller (for a given number of transducers) than PZT based ultrasonic systems.
- Moreover, given the improved device size of CMUT based ultrasonic scanners, as compared to PZT based ultrasonic scanners, CMUT based ultrasonic scanners can be created which can operate up to about 100 MHz. In contrast, PZT based ultrasonic scanners are limited to operating regions well below 20 MHz. Furthermore, since the resolution of an ultrasonic transducer depends on its operating frequency, CMUT based ultrasonic scanners can be fabricated with correspondingly improved resolution. For similar reasons, the bandwidth of CMUT based ultrasonic scanners is wider than the bandwidth of PZT based ultrasonic scanners. Accordingly, CMUT based ultrasonic scanners can be applied to more situations than PZT based ultrasonic scanners.
- The simpler design and fabrication of CMUT based ultrasonic systems (as compared with PZT based ultrasonic transducers) also gives rise to certain advantages. For instance, since the ICs used to support the CMUTs and the CMUTs themselves can be fabricated with the same techniques, fabrication of the CMUTs and ICs, taken together, can be simplified. Additionally, because CMUTs do not require matching or backing layers, the manufacturing steps associated with these layers can also be eliminated. Likewise, steps associated with integrating the CMUTs and the ICs can be eliminated or, if not, simplified.
- The present disclosure is described with reference to specific embodiments thereof, but those skilled in the art will recognize that the present disclosure is not limited thereto. Various features and aspects of the above-described disclosure may be used individually or jointly. Further, the present disclosure can be utilized in any number of environments and applications beyond those described herein without departing from the broader spirit and scope of the specification. We claim all such modifications and variations that fall within the scope and spirit of the present disclosure. The specification and drawings are, accordingly, to be regarded as illustrative rather than restrictive.
Claims (33)
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Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100225200A1 (en) * | 2009-03-05 | 2010-09-09 | Mario Kupnik | Monolithic integrated CMUTs fabricated by low-temperature wafer bonding |
US20110255249A1 (en) * | 2010-04-20 | 2011-10-20 | General Electric Company | High density flexible foldable interconnect |
US8324006B1 (en) * | 2009-10-28 | 2012-12-04 | National Semiconductor Corporation | Method of forming a capacitive micromachined ultrasonic transducer (CMUT) |
US8563345B2 (en) | 2009-10-02 | 2013-10-22 | National Semiconductor Corporated | Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements |
US20140005521A1 (en) * | 2010-11-18 | 2014-01-02 | Koninklijke Philips Electronics N.V. | Catheter comprising capacitive micromachined ultrasonic transducers with an adjustable focus |
KR20140035204A (en) * | 2012-09-13 | 2014-03-21 | 삼성전자주식회사 | Micromachined ultrasonic transducer module array |
WO2014105725A1 (en) * | 2012-12-28 | 2014-07-03 | Volcano Corporation | Intravascular ultrasound imaging apparatus, interface architecture, and method of manufacturing |
US8852103B2 (en) | 2011-10-17 | 2014-10-07 | Butterfly Network, Inc. | Transmissive imaging and related apparatus and methods |
WO2015028311A1 (en) * | 2013-08-26 | 2015-03-05 | Koninklijke Philips N.V. | Ultrasound transducer assembly and method for manufacturing an ultrasound transducer assembly |
US20150345987A1 (en) * | 2014-05-30 | 2015-12-03 | Arman HAJATI | Piezoelectric transducer device with flexible substrate |
US9221077B2 (en) | 2012-05-09 | 2015-12-29 | Kolo Technologies, Inc. | CMUT assembly with acoustic window |
WO2016008690A1 (en) * | 2014-07-17 | 2016-01-21 | Koninklijke Philips N.V. | Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system |
WO2016016810A1 (en) * | 2014-08-01 | 2016-02-04 | Koninklijke Philips N.V. | Intravascular ultrasound imaging apparatus, interface architecture, and method of manufacturing |
US9322810B2 (en) | 2012-09-11 | 2016-04-26 | Samsung Electronics Co., Ltd. | Ultrasonic transducers |
US9375850B2 (en) * | 2013-02-07 | 2016-06-28 | Fujifilm Dimatix, Inc. | Micromachined ultrasonic transducer devices with metal-semiconductor contact for reduced capacitive cross-talk |
US9511393B2 (en) | 2012-08-17 | 2016-12-06 | The Boeing Company | Flexible ultrasound inspection system |
WO2017074875A1 (en) * | 2015-10-30 | 2017-05-04 | Georgia Tech Research Corporation | Foldable 2-d cmut-on-cmos arrays |
US9667889B2 (en) | 2013-04-03 | 2017-05-30 | Butterfly Network, Inc. | Portable electronic devices with integrated imaging capabilities |
JP2017514556A (en) * | 2014-03-31 | 2017-06-08 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | IC die, ultrasonic probe, ultrasonic diagnostic system and method |
US9789515B2 (en) | 2014-05-30 | 2017-10-17 | Fujifilm Dimatix, Inc. | Piezoelectric transducer device with lens structures |
US20180028159A1 (en) * | 2016-07-29 | 2018-02-01 | Butterfly Network, Inc. | Rearward acoustic diffusion for ultrasound-on-a-chip transducer array |
US10022751B2 (en) | 2014-05-30 | 2018-07-17 | Fujifilm Dimatix, Inc. | Piezoelectric transducer device for configuring a sequence of operational modes |
US10306820B2 (en) | 2014-08-21 | 2019-05-28 | Samsung Electronics Co., Ltd. | Systems for packaging electronic devices |
WO2020112775A1 (en) * | 2018-11-28 | 2020-06-04 | Butterfly Network, Inc. | Method and apparatus to calibrate ultrasound transducers |
WO2021142554A1 (en) * | 2020-01-17 | 2021-07-22 | The University Of British Columbia | Flexible capacitive micromachined ultrasonic transducer arrays |
KR20220021250A (en) * | 2020-08-13 | 2022-02-22 | 한국과학기술연구원 | Flexible ultrasound transducer and method for manufacturing the same |
US11413008B2 (en) | 2017-06-30 | 2022-08-16 | Koninklijke Philips N.V. | Intraluminal ultrasound imaging device comprising a substrate separated into a plurality of spaced-apart segments, intraluminal ultrasound imaging device comprising a trench, and method of manufacturing |
US20220313205A1 (en) * | 2021-04-05 | 2022-10-06 | GE Precision Healthcare LLC | Methods and systems for an invasive deployable device |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2009239424B9 (en) | 2008-04-21 | 2014-10-09 | Covidien Lp | Braid-ball embolic devices and delivery systems |
US9675482B2 (en) | 2008-05-13 | 2017-06-13 | Covidien Lp | Braid implant delivery systems |
US8545412B2 (en) * | 2009-05-29 | 2013-10-01 | Boston Scientific Scimed, Inc. | Systems and methods for making and using image-guided intravascular and endocardial therapy systems |
WO2011039723A1 (en) * | 2009-09-30 | 2011-04-07 | Paul Anthony Yuen | Performance monitoring apparatus and casing therefor |
US8998947B2 (en) | 2010-09-10 | 2015-04-07 | Medina Medical, Inc. | Devices and methods for the treatment of vascular defects |
JP6087281B2 (en) | 2010-09-10 | 2017-03-01 | メディナ メディカル,インコーポレイテッド | Device and method for treating vascular abnormalities |
US8696581B2 (en) | 2010-10-18 | 2014-04-15 | CardioSonic Ltd. | Ultrasound transducer and uses thereof |
US9310485B2 (en) | 2011-05-12 | 2016-04-12 | Georgia Tech Research Corporation | Compact, energy-efficient ultrasound imaging probes using CMUT arrays with integrated electronics |
CN102793568B (en) * | 2011-05-23 | 2014-12-10 | 香港理工大学 | Annular-array ultrasonic endoscope probe, preparation method thereof and fixing rotating device |
US9271696B2 (en) * | 2011-09-22 | 2016-03-01 | Boston Scientific Scimed, Inc. | Ultrasound imaging systems with bias circuitry and methods of making and using |
CN104349818B (en) * | 2012-04-12 | 2018-05-15 | 皇家飞利浦有限公司 | Medical instrument and its control method with capacitive character micromechanics transducer |
KR101383298B1 (en) | 2012-04-25 | 2014-04-09 | 삼성전자주식회사 | Ultrasonic probe apparatus and method for fabricating ultrasonic probe apparatus |
US11357447B2 (en) | 2012-05-31 | 2022-06-14 | Sonivie Ltd. | Method and/or apparatus for measuring renal denervation effectiveness |
US9113825B2 (en) * | 2012-07-10 | 2015-08-25 | Fujifilm Sonosite, Inc. | Ultrasonic probe and aligned needle guide system |
KR102309795B1 (en) | 2012-11-13 | 2021-10-08 | 코비디엔 엘피 | Occlusive devices |
US20140257262A1 (en) * | 2013-03-11 | 2014-09-11 | Alexandre Carpentier | Interstitial ultrasonic disposable applicator and method for tissue thermal conformal volume ablation and monitoring the same |
US10933259B2 (en) * | 2013-05-23 | 2021-03-02 | CardioSonic Ltd. | Devices and methods for renal denervation and assessment thereof |
US20150082890A1 (en) * | 2013-09-26 | 2015-03-26 | Intel Corporation | Biometric sensors for personal devices |
JP6221582B2 (en) * | 2013-09-30 | 2017-11-01 | セイコーエプソン株式会社 | Ultrasonic device and probe, electronic apparatus and ultrasonic imaging apparatus |
WO2015071051A1 (en) * | 2013-11-15 | 2015-05-21 | Koninklijke Philips N.V. | Integrated circuit array and method for manufacturing an array of integrated circuits |
WO2015135784A2 (en) | 2014-03-12 | 2015-09-17 | Koninklijke Philips N.V. | Ultrasound transducer assembly and method for manufacturing an ultrasound transducer assembly |
EP3142564A4 (en) * | 2014-04-11 | 2017-07-19 | Koninklijke Philips N.V. | Imaging and treatment device |
WO2015164301A1 (en) * | 2014-04-23 | 2015-10-29 | Koninklijke Philips N.V. | Catheter with integrated controller for imaging and pressure sensing |
WO2015169771A1 (en) * | 2014-05-06 | 2015-11-12 | Koninklijke Philips N.V. | Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods |
CN103976743A (en) * | 2014-05-27 | 2014-08-13 | 江西科技师范大学 | CMUT (Capacitive Micro-machined Ultrasonic Transducer) annular array based micro-photoacoustic transducer |
JP6606171B2 (en) * | 2014-08-28 | 2019-11-13 | コーニンクレッカ フィリップス エヌ ヴェ | Intravascular device with reinforced fast exchange port and associated system |
CN105769255A (en) * | 2014-12-25 | 2016-07-20 | 乐普(北京)医疗器械股份有限公司 | Monocrystal multi-acoustic-beam transducer ablation device |
US9375333B1 (en) | 2015-03-06 | 2016-06-28 | Covidien Lp | Implantable device detachment systems and associated devices and methods |
US11766237B2 (en) | 2015-07-02 | 2023-09-26 | Philips Image Guided Therapy Corporation | Multi-mode capacitive micromachined ultrasound transducer and associated devices, systems, and methods for multiple different intravascular sensing capabilities |
US10413938B2 (en) | 2015-11-18 | 2019-09-17 | Kolo Medical, Ltd. | Capacitive micromachined ultrasound transducers having varying properties |
US10413272B2 (en) | 2016-03-08 | 2019-09-17 | Covidien Lp | Surgical tool with flex circuit ultrasound sensor |
US11446000B2 (en) | 2016-03-30 | 2022-09-20 | Philips Image Guided Therapy Corporation | Standalone flex circuit for intravascular imaging device and associated devices, systems, and methods |
CN105852911B (en) * | 2016-05-26 | 2019-11-29 | 苏州佳世达电通有限公司 | Supersonic waveguide and medical system |
US10618078B2 (en) | 2016-07-18 | 2020-04-14 | Kolo Medical, Ltd. | Bias control for capacitive micromachined ultrasonic transducers |
US10478195B2 (en) | 2016-08-04 | 2019-11-19 | Covidien Lp | Devices, systems, and methods for the treatment of vascular defects |
US10399121B2 (en) | 2016-09-12 | 2019-09-03 | Kolo Medical, Ltd. | Bias application for capacitive micromachined ultrasonic transducers |
KR101915255B1 (en) | 2017-01-11 | 2018-11-05 | 삼성메디슨 주식회사 | Method of manufacturing the ultrasonic probe and the ultrasonic probe |
EP3369383A1 (en) * | 2017-03-02 | 2018-09-05 | Koninklijke Philips N.V. | Ultrasound device |
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EP3600434A4 (en) | 2017-03-20 | 2021-01-06 | Sonievie Ltd. | Pulmonary hypertension treatment |
US20180345046A1 (en) * | 2017-05-30 | 2018-12-06 | David A. Gallup | Catheter and method for use |
US10613058B2 (en) | 2017-06-27 | 2020-04-07 | Kolo Medical, Ltd. | CMUT signal separation with multi-level bias control |
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CN111065340B (en) | 2017-09-28 | 2022-09-20 | 波士顿科学国际有限公司 | System and method for adjusting signal path along intravascular ultrasound imaging system based on frequency |
JP2021505263A (en) * | 2017-12-08 | 2021-02-18 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | Retractable flexible substrate with integrated window for intracavitary ultrasound imaging |
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US11931041B2 (en) | 2020-05-12 | 2024-03-19 | Covidien Lp | Devices, systems, and methods for the treatment of vascular defects |
CN114871083B (en) * | 2022-05-22 | 2023-07-11 | 中北大学 | Flexible cylindrical array of capacitive micromachined ultrasonic transducer and preparation method thereof |
CN116269639A (en) * | 2023-03-14 | 2023-06-23 | 上海心弘生命科学有限公司 | Ultrasonic guide core and ultrasonic thrombolysis device |
Citations (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4413520A (en) * | 1980-06-16 | 1983-11-08 | Fujitsu Limited | Ultrasonic imaging apparatus |
US4603589A (en) * | 1983-12-27 | 1986-08-05 | Kabushiki Kaisha Toshiba | Ultrasonic flowmeter |
US5488954A (en) * | 1994-09-09 | 1996-02-06 | Georgia Tech Research Corp. | Ultrasonic transducer and method for using same |
US5870351A (en) * | 1994-10-21 | 1999-02-09 | The Board Of Trustees Of The Leland Stanford Junior University | Broadband microfabriated ultrasonic transducer and method of fabrication |
US5872536A (en) * | 1997-02-19 | 1999-02-16 | Hittite Microwave Corporation | Multi-sensor anticipatory object detection system |
US5906580A (en) * | 1997-05-05 | 1999-05-25 | Creare Inc. | Ultrasound system and method of administering ultrasound including a plurality of multi-layer transducer elements |
US5957851A (en) * | 1996-06-10 | 1999-09-28 | Acuson Corporation | Extended bandwidth ultrasonic transducer |
US6493288B2 (en) * | 1999-12-17 | 2002-12-10 | The Board Of Trustees Of The Leland Stanford Junior University | Wide frequency band micromachined capacitive microphone/hydrophone and method |
US6558330B1 (en) * | 2000-12-06 | 2003-05-06 | Acuson Corporation | Stacked and filled capacitive microelectromechanical ultrasonic transducer for medical diagnostic ultrasound systems |
US6558331B1 (en) * | 2002-05-29 | 2003-05-06 | Koninklijke Philips Electronics N.V. | Apparatus and method for harmonic imaging using an array transducer operated in the k31 mode |
US6632178B1 (en) * | 2000-06-15 | 2003-10-14 | Koninklijke Philips Electronics N.V. | Fabrication of capacitive micromachined ultrasonic transducers by micro-stereolithography |
US20030236443A1 (en) * | 2002-04-19 | 2003-12-25 | Cespedes Eduardo Ignacio | Methods and apparatus for the identification and stabilization of vulnerable plaque |
US6709392B1 (en) * | 2002-10-10 | 2004-03-23 | Koninklijke Philips Electronics N.V. | Imaging ultrasound transducer temperature control system and method using feedback |
US20040085858A1 (en) * | 2002-08-08 | 2004-05-06 | Khuri-Yakub Butrus T. | Micromachined ultrasonic transducers and method of fabrication |
US6776763B2 (en) * | 1994-03-11 | 2004-08-17 | Volcano Therapeutic, Inc. | Ultrasonic transducer array and method of manufacturing the same |
US20040229830A1 (en) * | 1995-03-05 | 2004-11-18 | Katsuro Tachibana | Delivery of therapeutic compositions using ultrasound |
US20050004466A1 (en) * | 2003-07-02 | 2005-01-06 | Hynynen Kullvero H. | Harmonic motion imaging |
US20050015009A1 (en) * | 2000-11-28 | 2005-01-20 | Allez Physionix , Inc. | Systems and methods for determining intracranial pressure non-invasively and acoustic transducer assemblies for use in such systems |
US6854338B2 (en) * | 2000-07-14 | 2005-02-15 | The Board Of Trustees Of The Leland Stanford Junior University | Fluidic device with integrated capacitive micromachined ultrasonic transducers |
US20050137812A1 (en) * | 2003-12-22 | 2005-06-23 | Joe Schaffer | Ultrasonic flowmeter |
US20050177045A1 (en) * | 2004-02-06 | 2005-08-11 | Georgia Tech Research Corporation | cMUT devices and fabrication methods |
US20050197574A1 (en) * | 1997-01-08 | 2005-09-08 | Volcano Corporation | Ultrasound transducer array having a flexible substrate |
US6945115B1 (en) * | 2004-03-04 | 2005-09-20 | General Mems Corporation | Micromachined capacitive RF pressure sensor |
US20050288873A1 (en) * | 2004-06-28 | 2005-12-29 | Nelson Urdaneta | Ultrasonic liquid flow controller |
US20060004289A1 (en) * | 2004-06-30 | 2006-01-05 | Wei-Cheng Tian | High sensitivity capacitive micromachined ultrasound transducer |
US20060084875A1 (en) * | 2004-10-14 | 2006-04-20 | Scimed Life Systems, Inc. | Integrated bias circuitry for ultrasound imaging devices |
US20060229659A1 (en) * | 2004-12-09 | 2006-10-12 | The Foundry, Inc. | Aortic valve repair |
US20070013269A1 (en) * | 2005-06-17 | 2007-01-18 | Yongli Huang | Flexible micro-electro-mechanical transducer |
US20070066902A1 (en) * | 2005-09-22 | 2007-03-22 | Siemens Medical Solutions Usa, Inc. | Expandable ultrasound transducer array |
US20070093702A1 (en) * | 2005-10-26 | 2007-04-26 | Skyline Biomedical, Inc. | Apparatus and method for non-invasive and minimally-invasive sensing of parameters relating to blood |
US7212787B2 (en) * | 2001-11-29 | 2007-05-01 | Nasaco Electronics (Hong Kong) Ltd. | Wireless audio transmission system |
US20070096181A1 (en) * | 2005-10-27 | 2007-05-03 | Optimum Care International Tech. Inc. | Flexible memory module |
US7213468B2 (en) * | 2003-04-21 | 2007-05-08 | Teijin Pharma Limited | Ultrasonic apparatus and method for measuring the concentration and flow rate of gas |
US20070153632A1 (en) * | 2006-01-04 | 2007-07-05 | Industrial Technology Research Institute | Capacitive ultrasonic transducer and method of fabricating the same |
US20070167812A1 (en) * | 2004-09-15 | 2007-07-19 | Lemmerhirt David F | Capacitive Micromachined Ultrasonic Transducer |
US7305883B2 (en) * | 2005-10-05 | 2007-12-11 | The Board Of Trustees Of The Leland Stanford Junior University | Chemical micromachined microsensors |
US7408283B2 (en) * | 2003-12-29 | 2008-08-05 | General Electric Company | Micromachined ultrasonic transducer cells having compliant support structure |
US20090219743A1 (en) * | 1997-04-04 | 2009-09-03 | Leedy Glenn J | Three dimensional structure memory |
US20100013574A1 (en) * | 2005-08-03 | 2010-01-21 | Kolo Technologies, Inc. | Micro-Electro-Mechanical Transducer Having a Surface Plate |
US20100160786A1 (en) * | 2007-06-01 | 2010-06-24 | Koninklijke Philips Electronics N.V. | Wireless Ultrasound Probe User Interface |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7226417B1 (en) * | 1995-12-26 | 2007-06-05 | Volcano Corporation | High resolution intravascular ultrasound transducer assembly having a flexible substrate |
JP4274850B2 (en) * | 2003-05-15 | 2009-06-10 | テルモ株式会社 | catheter |
JP2004350701A (en) * | 2003-05-26 | 2004-12-16 | Olympus Corp | Ultrasonic endoscope apparatus |
JP4379576B2 (en) | 2003-08-04 | 2009-12-09 | 株式会社日立メディコ | Ultrasonic diagnostic equipment |
JP4347885B2 (en) | 2004-06-03 | 2009-10-21 | オリンパス株式会社 | Manufacturing method of capacitive ultrasonic transducer, ultrasonic endoscope apparatus including capacitive ultrasonic transducer manufactured by the manufacturing method, capacitive ultrasonic probe, and capacitive ultrasonic transducer Sonic transducer |
EP1762182B1 (en) * | 2004-06-10 | 2011-08-03 | Olympus Corporation | Electrostatic capacity type ultrasonic probe device |
JP4624763B2 (en) * | 2004-10-27 | 2011-02-02 | オリンパス株式会社 | Capacitive ultrasonic transducer and manufacturing method thereof |
US7375420B2 (en) | 2004-12-03 | 2008-05-20 | General Electric Company | Large area transducer array |
US7449821B2 (en) * | 2005-03-02 | 2008-11-11 | Research Triangle Institute | Piezoelectric micromachined ultrasonic transducer with air-backed cavities |
EP1882127A2 (en) | 2005-05-18 | 2008-01-30 | Kolo Technologies, Inc. | Micro-electro-mechanical transducers |
JP4776349B2 (en) | 2005-11-14 | 2011-09-21 | 株式会社日立メディコ | Ultrasonic imaging device |
US20070167821A1 (en) * | 2005-11-30 | 2007-07-19 | Warren Lee | Rotatable transducer array for volumetric ultrasound |
JP4839099B2 (en) | 2006-03-03 | 2011-12-14 | オリンパスメディカルシステムズ株式会社 | Ultrasonic transducer manufactured by micromachine process, ultrasonic transducer device, ultrasonic diagnostic device in body cavity, and control method thereof |
JP2007251505A (en) | 2006-03-15 | 2007-09-27 | Fuji Xerox Co Ltd | Ultrasonic probe, array probe, and method of manufacturing ultrasonic probe |
JP2007244638A (en) | 2006-03-16 | 2007-09-27 | Matsushita Electric Ind Co Ltd | Ultrasonograph |
JP4958475B2 (en) | 2006-05-19 | 2012-06-20 | 株式会社日立メディコ | Ultrasonic device |
-
2008
- 2008-12-03 WO PCT/US2008/085447 patent/WO2009073753A1/en active Application Filing
- 2008-12-03 EP EP08857728A patent/EP2214560A1/en not_active Withdrawn
- 2008-12-03 WO PCT/US2008/085446 patent/WO2009073752A1/en active Application Filing
- 2008-12-03 JP JP2010536240A patent/JP2011505205A/en active Pending
- 2008-12-03 JP JP2010536241A patent/JP5497657B2/en not_active Expired - Fee Related
- 2008-12-03 CN CN2008801174821A patent/CN101868185B/en active Active
- 2008-12-03 CN CN200880117507A patent/CN101861127A/en active Pending
- 2008-12-03 EP EP08856642A patent/EP2217151A1/en not_active Withdrawn
- 2008-12-03 US US12/745,754 patent/US9408588B2/en active Active
- 2008-12-03 US US12/745,758 patent/US20100262014A1/en not_active Abandoned
Patent Citations (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4413520A (en) * | 1980-06-16 | 1983-11-08 | Fujitsu Limited | Ultrasonic imaging apparatus |
US4603589A (en) * | 1983-12-27 | 1986-08-05 | Kabushiki Kaisha Toshiba | Ultrasonic flowmeter |
US6776763B2 (en) * | 1994-03-11 | 2004-08-17 | Volcano Therapeutic, Inc. | Ultrasonic transducer array and method of manufacturing the same |
US5488954A (en) * | 1994-09-09 | 1996-02-06 | Georgia Tech Research Corp. | Ultrasonic transducer and method for using same |
US5870351A (en) * | 1994-10-21 | 1999-02-09 | The Board Of Trustees Of The Leland Stanford Junior University | Broadband microfabriated ultrasonic transducer and method of fabrication |
US20040229830A1 (en) * | 1995-03-05 | 2004-11-18 | Katsuro Tachibana | Delivery of therapeutic compositions using ultrasound |
US5957851A (en) * | 1996-06-10 | 1999-09-28 | Acuson Corporation | Extended bandwidth ultrasonic transducer |
US20050197574A1 (en) * | 1997-01-08 | 2005-09-08 | Volcano Corporation | Ultrasound transducer array having a flexible substrate |
US5872536A (en) * | 1997-02-19 | 1999-02-16 | Hittite Microwave Corporation | Multi-sensor anticipatory object detection system |
US20090219743A1 (en) * | 1997-04-04 | 2009-09-03 | Leedy Glenn J | Three dimensional structure memory |
US5906580A (en) * | 1997-05-05 | 1999-05-25 | Creare Inc. | Ultrasound system and method of administering ultrasound including a plurality of multi-layer transducer elements |
US6493288B2 (en) * | 1999-12-17 | 2002-12-10 | The Board Of Trustees Of The Leland Stanford Junior University | Wide frequency band micromachined capacitive microphone/hydrophone and method |
US6632178B1 (en) * | 2000-06-15 | 2003-10-14 | Koninklijke Philips Electronics N.V. | Fabrication of capacitive micromachined ultrasonic transducers by micro-stereolithography |
US6854338B2 (en) * | 2000-07-14 | 2005-02-15 | The Board Of Trustees Of The Leland Stanford Junior University | Fluidic device with integrated capacitive micromachined ultrasonic transducers |
US20050015009A1 (en) * | 2000-11-28 | 2005-01-20 | Allez Physionix , Inc. | Systems and methods for determining intracranial pressure non-invasively and acoustic transducer assemblies for use in such systems |
US6558330B1 (en) * | 2000-12-06 | 2003-05-06 | Acuson Corporation | Stacked and filled capacitive microelectromechanical ultrasonic transducer for medical diagnostic ultrasound systems |
US7212787B2 (en) * | 2001-11-29 | 2007-05-01 | Nasaco Electronics (Hong Kong) Ltd. | Wireless audio transmission system |
US20030236443A1 (en) * | 2002-04-19 | 2003-12-25 | Cespedes Eduardo Ignacio | Methods and apparatus for the identification and stabilization of vulnerable plaque |
US6558331B1 (en) * | 2002-05-29 | 2003-05-06 | Koninklijke Philips Electronics N.V. | Apparatus and method for harmonic imaging using an array transducer operated in the k31 mode |
US20040085858A1 (en) * | 2002-08-08 | 2004-05-06 | Khuri-Yakub Butrus T. | Micromachined ultrasonic transducers and method of fabrication |
US6958255B2 (en) * | 2002-08-08 | 2005-10-25 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined ultrasonic transducers and method of fabrication |
US6709392B1 (en) * | 2002-10-10 | 2004-03-23 | Koninklijke Philips Electronics N.V. | Imaging ultrasound transducer temperature control system and method using feedback |
US7213468B2 (en) * | 2003-04-21 | 2007-05-08 | Teijin Pharma Limited | Ultrasonic apparatus and method for measuring the concentration and flow rate of gas |
US20050004466A1 (en) * | 2003-07-02 | 2005-01-06 | Hynynen Kullvero H. | Harmonic motion imaging |
US20050137812A1 (en) * | 2003-12-22 | 2005-06-23 | Joe Schaffer | Ultrasonic flowmeter |
US7408283B2 (en) * | 2003-12-29 | 2008-08-05 | General Electric Company | Micromachined ultrasonic transducer cells having compliant support structure |
US20050177045A1 (en) * | 2004-02-06 | 2005-08-11 | Georgia Tech Research Corporation | cMUT devices and fabrication methods |
US6945115B1 (en) * | 2004-03-04 | 2005-09-20 | General Mems Corporation | Micromachined capacitive RF pressure sensor |
US20050288873A1 (en) * | 2004-06-28 | 2005-12-29 | Nelson Urdaneta | Ultrasonic liquid flow controller |
US20060004289A1 (en) * | 2004-06-30 | 2006-01-05 | Wei-Cheng Tian | High sensitivity capacitive micromachined ultrasound transducer |
US20070167812A1 (en) * | 2004-09-15 | 2007-07-19 | Lemmerhirt David F | Capacitive Micromachined Ultrasonic Transducer |
US20060084875A1 (en) * | 2004-10-14 | 2006-04-20 | Scimed Life Systems, Inc. | Integrated bias circuitry for ultrasound imaging devices |
US20060229659A1 (en) * | 2004-12-09 | 2006-10-12 | The Foundry, Inc. | Aortic valve repair |
US20070013269A1 (en) * | 2005-06-17 | 2007-01-18 | Yongli Huang | Flexible micro-electro-mechanical transducer |
US7880565B2 (en) * | 2005-08-03 | 2011-02-01 | Kolo Technologies, Inc. | Micro-electro-mechanical transducer having a surface plate |
US8018301B2 (en) * | 2005-08-03 | 2011-09-13 | Kolo Technologies, Inc. | Micro-electro-mechanical transducer having a surface plate |
US20100013574A1 (en) * | 2005-08-03 | 2010-01-21 | Kolo Technologies, Inc. | Micro-Electro-Mechanical Transducer Having a Surface Plate |
US20110136284A1 (en) * | 2005-08-03 | 2011-06-09 | Kolo Technologies, Inc. | Micro-Electro-Mechanical Transducer Having a Surface Plate |
US20070066902A1 (en) * | 2005-09-22 | 2007-03-22 | Siemens Medical Solutions Usa, Inc. | Expandable ultrasound transducer array |
US7305883B2 (en) * | 2005-10-05 | 2007-12-11 | The Board Of Trustees Of The Leland Stanford Junior University | Chemical micromachined microsensors |
US20070093702A1 (en) * | 2005-10-26 | 2007-04-26 | Skyline Biomedical, Inc. | Apparatus and method for non-invasive and minimally-invasive sensing of parameters relating to blood |
US20070096181A1 (en) * | 2005-10-27 | 2007-05-03 | Optimum Care International Tech. Inc. | Flexible memory module |
US20070153632A1 (en) * | 2006-01-04 | 2007-07-05 | Industrial Technology Research Institute | Capacitive ultrasonic transducer and method of fabricating the same |
US20100160786A1 (en) * | 2007-06-01 | 2010-06-24 | Koninklijke Philips Electronics N.V. | Wireless Ultrasound Probe User Interface |
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US9408588B2 (en) | 2016-08-09 |
JP2011505206A (en) | 2011-02-24 |
US20100262014A1 (en) | 2010-10-14 |
EP2214560A1 (en) | 2010-08-11 |
WO2009073752A1 (en) | 2009-06-11 |
CN101868185B (en) | 2013-12-11 |
JP5497657B2 (en) | 2014-05-21 |
CN101868185A (en) | 2010-10-20 |
EP2217151A1 (en) | 2010-08-18 |
JP2011505205A (en) | 2011-02-24 |
CN101861127A (en) | 2010-10-13 |
WO2009073753A1 (en) | 2009-06-11 |
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