US20100188457A1 - Method and apparatus for controlling the temperature of an electrically-heated discharge nozzle - Google Patents
Method and apparatus for controlling the temperature of an electrically-heated discharge nozzle Download PDFInfo
- Publication number
- US20100188457A1 US20100188457A1 US12/580,831 US58083109A US2010188457A1 US 20100188457 A1 US20100188457 A1 US 20100188457A1 US 58083109 A US58083109 A US 58083109A US 2010188457 A1 US2010188457 A1 US 2010188457A1
- Authority
- US
- United States
- Prior art keywords
- heater
- discharge nozzle
- ink
- temperature
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04588—Control methods or devices therefor, e.g. driver circuits, control circuits using a specific waveform
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04598—Pre-pulse
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/1433—Structure of nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17559—Cartridge manufacturing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C15/00—Component parts, details or accessories of machines, pumps or pumping installations, not provided for in groups F04C2/00 - F04C14/00
- F04C15/0042—Systems for the equilibration of forces acting on the machines or pump
- F04C15/0049—Equalization of pressure pulses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
Definitions
- FIG. 6 is an exploded photograph of the physical representation of a resistive heater and a sensor.
- FIG. 6 is a 100 ⁇ magnification of an exemplary heater.
- Resistive heater 630 is shown at the center of FIG. 6 .
- Regions A, B, C and D are also identified as corresponding to nodes A, B, C and D.
- Shaded portions 640 , 650 , 660 and 670 are the bottom portions of the printer-head discharge nozzle.
- platinum was used for nodes A, B, C and D.
- a combination of titanium and platinum was used for the nodes.
- the nodes can also be prepared as a multilayer device having an adhesive layer connecting a heater layer to a pad (substrate) layer.
Abstract
In an embodiment, the disclosure relates to a method and apparatus for fault monitoring and controlling operation of a discharge nozzle in a large array of discharge nozzles. An exemplary apparatus includes a thin, thermally conductive membrane, with an integrated thin-film electrical heater. When a fixed voltage is applied to the heater, and as the heater heats, the resistance of the heater will increase which will cause a concomitant decrease in the electrical current flowing through the heater. By measuring the resistance of the heater it can readily be determined whether the device is functioning properly.
Description
- The instant application claims priority to Provisional Application No. 61/142,575, which was filed on Jan. 5, 2009, and to U.S. patent application Ser. No. 12/139,391, filed Jun. 13, 2008. The disclosures of both applications are incorporated herein in their entirety.
- 1. Field of the Invention
- The disclosure relates to a method and apparatus for sensing and controlling the temperature of an electrically resistive heater which may be integrated with a discharge nozzle of a print-head. More specifically, the disclosure relates to a novel controller for controlling temperature of a discharge nozzle. The discharge nozzle can be used for depositing substantially dry ink on a surface to be used for electronic applications.
- 2. Description of Related Art
- The manufacture of organic light emitting devices (OLEDs) requires depositing one or more organic films on a substrate and coupling the top and bottom of the film stack to electrodes. The film thickness is a prime consideration. The total layer stack thickness is about 100 nm and each layer is optimally deposited uniformly with an accuracy of better than +/−1 nm. Film purity is also important. Conventional apparatuses form the film stack using one of two methods: (1) thermal evaporation of organic material in a relative vacuum environment and subsequent condensation of the organic vapor on the substrate; or (2) dissolution of organic material into a solvent, coating the substrate with the resulting solution, and subsequent removal of the solvent.
- Another consideration in depositing the organic thin films of an OLED is placing the films precisely at the desired location. There are two conventional technologies for performing this task, depending on the method of film deposition. For thermal evaporation, shadow masking is used to form OLED films of a desired configuration. Shadow masking techniques require placing a well-defined mask over a region of the substrate followed by depositing the film over the entire substrate area. Once deposition is complete, the shadow mask is removed. The regions exposed through the mask define the pattern of material deposited on the substrate. This process is inefficient, as the entire substrate must be coated, even though only the regions exposed through the shadow mask require a film. Furthermore, the shadow mask becomes increasingly coated with each use, and must eventually be discarded or cleaned. Finally, the use of shadow masks over large areas is made difficult by the need to use very thin masks (to achieve small feature sizes) that make said masks structurally unstable. However, the vapor deposition technique yields OLED films with high uniformity and purity and excellent thickness control.
- For solvent deposition, ink jet printing can be used to deposit patterns of OLED films. Ink jet printing requires dissolving organic material into a solvent that yields a printable ink. Furthermore, ink jet printing is conventionally limited to the use of single layer OLED film stacks, which typically have lower performance as compared to multilayer stacks. The single-layer limitation arises because printing typically causes destructive dissolution of any underlying organic layers. The ink jet printing technique is capable of providing patterns of OLED films over very large areas with good material efficiency.
- Large area printing capabilities of ink jet printing allow relatively high uniformity, purity, and thickness control for vapor deposition of organic thin films over a large surface area. Large area printing is enabled by arranging a multitude of discharge nozzles in an array formation over a substrate. Ink deposition from the array can be controlled by controlling ink metering discharge at each nozzle.
- Because a discharge array can include as few as 20 and as many as 120 discharge nozzles, monitoring operability of each nozzle is critical. If one or more discharge nozzles should fail in a array of, for example, 120 discharge nozzles, this may not be immediately detected and the printed substrate will prove faulty after much time and labor has been expended. Accordingly, there is a need for fault monitoring of each discharge nozzle in a large array of discharge nozzles.
- The disclosure relates to a method and apparatus for fault monitoring and controlling operation of a discharge nozzle in a large array of discharge nozzles. In one embodiment, the apparatus comprises a thin, thermally conductive membrane, with an integrated thin-film electrical heater. The resistance of the heater and its temperature can have monotonic increasing relationship. When a fixed voltage is applied to the heater, as the heater heats, the resistance of the heater will increase, which will cause a concomitant decrease in the electrical current flowing through the heater. Alternatively, when a fixed electrical current is flown through the heater, the temperature of the heater will increase and so will the resistance of the heater. Thus, the voltage measured across the heater will increase.
- In another embodiment, each discharge nozzle in an array of discharge nozzles is provided with a separate detection circuit for detecting failure mode at the discharge nozzle. Each discharge nozzle communicates with a controller for controlling the temperature of the discharge nozzle. The controller can be interposed between a power supply and the discharge nozzle. By controlling the power supplied to the discharge nozzle, the controller can increase or decrease the temperature of the discharge nozzle. The controller may optionally include a sensor for detecting the temperature of the nozzle either directly or indirectly. The sensor can also detect failure mode at the discharge nozzle. With each nozzle in the array having a sensor, the operator can readily identify a failing sensor in a large array of sensors.
- In another embodiment, the disclosure relates to a method for controlling the temperature of a discharge nozzle. The method includes the steps of: providing a discharge nozzle for dispensing ink, the discharge nozzle having a thermally-conductive membrane with an integrated thin film electric heater and the thin film electric heater defining a resistance; receiving a quantity of ink in liquid-form at the discharge nozzle; energizing the thin-film heater by applying a substantially constant current to the thin-film heater; measuring a voltage across the heater and a current through the heater; and determining temperature of the heater as a function of the voltage and the current; and determining the temperature of the ink droplet as a function of the heater temperature. In one embodiment, the ink drop temperature is determined by measuring the voltage across the heater for a substantially constant current.
- These and other embodiments of the disclosure will be discussed with reference to the following exemplary and non-limiting illustrations, in which like elements are numbered similarly, and where:
-
FIG. 1 is a schematic representation of an exemplary print-head having a thermal ink depositing mechanism according to one embodiment of the disclosure; -
FIG. 2 schematically illustrates a print-head apparatus having multiple discharge nozzles arranged in an array and using thermal ink dispensing elements; -
FIG. 3 is a sideview representation of an embodiment of the invention; -
FIG. 4 is a bottom view representation of an embodiment of the invention; -
FIG. 5 is a circuit diagram for the heater and sensor combination according to one embodiment of the invention; -
FIG. 6 is an exploded photograph of the physical representation of a resistive heater and a sensor; -
FIG. 7 is a representative driving circuit according to one embodiment of the disclosure; -
FIG. 8 shows a closed-loop temperature controller according to an embodiment of the disclosure; -
FIG. 9 is an exemplary control system according to another embodiment of the disclosure; and -
FIG. 10 is a flow-diagram for implementing a method according to one embodiment of the disclosure. -
FIG. 1 is a schematic representation of an exemplary print-head having a thermal ink depositing mechanism according to one embodiment of the disclosure. The exemplary print-head ofFIG. 1 includeschamber 130,orifice 170,nozzle 180, andmicro-porous conduits 160.Chamber 130 receives ink in liquid form and communicates the ink fromorifice 170 to dischargenozzle 180. The ink can comprise suspended or dissolved particles in a carrier liquid. These particles can comprise single molecules or atoms, or aggregations of molecules and/or atoms. The path betweenorifice 170 anddischarge nozzle 180 defines a delivery path. In the embodiment ofFIG. 1A ,discharge nozzle 180 comprisesconduits 160 separated bypartitions 165.Conduits 160 may include micro-porous material therein. A surface ofdischarge nozzle 180 proximal toorifice 170 defines the inlet port to dischargenozzle 180 while the distal surface ofdischarge nozzle 180 defines the outlet port. A substrate (not shown) can be positioned proximal to the outlet port ofdischarge nozzle 180 for receiving ink deposited from the nozzle. - The thermal jet print-head of
FIG. 1 further includesbottom structure 140, which receivesdischarge nozzle 180.Discharge nozzle 180 can be fabricated as part of thebottom structure 140. Alternatively,discharge nozzle 180 can be manufactured separately and later combined withbottom structure 140 to form an integrated structure.Top structure 142 receiveschamber 130.Top structure 142 can be formed with appropriate cavities and conduits to formchamber 130.Top structure 142 andbottom structure 140 are coupled throughbonds 120 to form a housing. The housing allows the thermal jet print-head to operate under pressure or in a vacuum. The housing may further comprise an inlet port (not shown) for accepting a transport gas for carrying the material from the discharge nozzle to the substrate (not shown). - Alternatively, a port (not shown) can be integrated into
top structure 142 to receive transport gases. The port can include a flange adapted to receive a transport gas, which according to one embodiment comprises a substantially inert mixture of one or more gases. The mixture can include gases which are substantially non-reactive with the materials being deposited by the apparatus, such as nitrogen or argon when used with typical organic materials. The transport gas can transport particles fromdischarge nozzle 180 by flowing throughmicro-pores 160. - Heater 110 can be optionally added to
chamber 130 for heating and/or dispensing the ink. InFIG. 1 , heater 110 is positioned insidechamber 130. Heater 110 can be any thermal energy source coupled tochamber 130 for providing pulsating energy to the liquid ink and thereby discharging a droplet of the liquid ink throughorifice 170. In one embodiment, heater 110 delivers heat in pulses having a duration of one second or less. For instance, the heater can be energized with square pulses having a variable duty cycle and a cycle frequency of 1 kHz. Thus, the heater energy can be used to meter the quantity of ink delivered fromchamber 130 to dischargenozzle 180.Chamber 130 may also contain material, other than ink, required for forming a film used in the fabrication of an OLED or transistor.Orifice 170 can be configured such that surface tension of the liquid inchamber 130 prevents discharge of the liquid prior to activation of the mechanism for dispensing the ink. - In the embodiment of
FIG. 1 ,discharge nozzle 180 includes partitions (or rigid portions) 165 separated byconduits 160.Conduits 160 andrigid portions 165 can collectively define a micro-porous environment. The micro-porous environment can be composed of a variety of materials, including micro-porous alumina or solid membranes of silicon or silicon carbide and having micro-fabricated pores.Micro-pores 160 prevent the material dissolved or suspended in the liquid from escaping throughdischarge nozzle 180 until the medium is appropriately activated. - When the discharged droplet of liquid encounters discharge
nozzle 180, the liquid is drawn intomicro-pores 160 with assistance from capillary action. The liquid in the ink may evaporate prior to activation ofdischarge nozzle 180, leaving behind a coating of the suspended or dissolved particles on the micro-pore walls. The liquid in the ink may comprise one or more solvents with a relatively-low vapor pressure. The liquid in the ink may also comprise one or more solvents with a relatively-high vapor pressure. - The evaporation of the liquid in the ink may be accelerated by heating the discharge nozzle. The evaporated liquid can be removed from the chamber and subsequently collected (not shown), for instance, by flowing gas over one or more of the discharge nozzle faces. Depending on the desired application, micro-pores 160 can provide conduits (or passages) having a maximum linear cross-sectional distance W of a few nanometers to hundreds of microns. The micro-porous region comprising
discharge nozzle 180 will take a different a shape and cover a different area depending on the desired application, with a typical maximum linear cross-sectional dimension D ranging from a few hundred nanometers to tens of millimeters. In one embodiment, the ratio of W/D is in a range of about 1/10 to about 1/1000. -
Discharge nozzle 180 can be actuated bynozzle heater 150.Nozzle heater 150 is positioned proximal to dischargenozzle 180.Nozzle heater 150 may comprise a thin metal film. The thin metal film can be comprised of, for example, platinum. When activated,nozzle heater 150 provides pulsating thermal energy to dischargenozzle 180, which acts to dislodge the material contained within micro-pores orconduits 160, which can subsequently flow out from the discharge nozzle. In one embodiment, the pulsations can be variable on a time scale of one minute or less. - Dislodging the ink particles may include vaporization, either through sublimation or melting and subsequent boiling. It should be noted again that the term particles is used generally, and includes anything from a single molecule or atom to a cluster of molecules or atoms. In general, one can employ any energy source coupled to the discharge nozzle that is capable of energizing
discharge nozzle 180 and thereby discharging the material frommicro-pores 160; for instance, mechanical (e.g., vibrational). In one embodiment of the disclosure, a piezoelectric material is used instead of, or in addition to,nozzle heaters 150. -
FIG. 2 schematically illustrates a print-head apparatus having multiple discharge nozzles arranged in an array and using thermal ink dispensing elements. The apparatus ofFIG. 2 includeschamber 230 forhousing liquid 201. Liquid 201 can comprise dissolved or suspended particles for deposition on a substrate.Chamber 230 also includes a plurality of chamber orifices 270. The embodiment ofFIG. 2 comprisesink dispensing heaters 210 for pulsatingly metering liquid ink through each chamber orifice 270 and towardsdischarge nozzles 280.Discharge nozzles 280 are arranged in an array such that eachdischarge nozzle 280 communicates with a corresponding chamber orifice 270.Nozzle heaters 250 are positioned neardischarge nozzles 280 to evaporate substantially all of the carrier liquid and to allow solid particles to be deposited by the discharge nozzle array. - The
array 200 ofFIG. 2 includes a number ofindependent discharge nozzle 280 arranged in one row. A typical array includes several rows of independent discharge nozzles. As shown each nozzle is in thermal communication with at least oneheater 250. In the event that any one heater element should fail, the ink deposit process will be affected. Consequently, the deposited pixel will be faulty. The problem of faulty pixel is significant because it often goes undetected until late in the manufacturing process after much labor and cost have been spent. - To address this and other problems, an embodiment of the invention relates to a thin-film heater and a thin-film temperature sensor in communication with the thin-film heater. The thin-film heater and the temperature sensor can be integrated. The sensor enables immediate detection of the heater's temperature. Moreover, because each heater will have a separate sensor, failure detection can be pinpointed immediately.
-
FIG. 3 is a side view representation of an embodiment of the invention.Device 300 ofFIG. 3 includes print-head chip 310 and a thin-film heater andtemperature sensor 320. The thin-film heater is mounted to a side of the print-head chip proximal to the substrate surface (not shown). Thin-film heater 310 can be integrated with a temperature sensor to form a single device for easier manufacturing and assembly. -
FIG. 4 is a bottom view representation of an embodiment of the invention. InFIG. 4 , the thin-film heater 420 has segments A, B, C and D. Each segment represents a node of the sensor. Print-head chip 410 is shown in the dark shade area, overlapping the sensor. It should be noted that the bottom-view shown inFIG. 4 is the face closest to the substrate (not shown). -
FIG. 5 is a circuit diagram for the heater and sensor combination according to one embodiment of the invention.Circuit 500 ofFIG. 5 comprisesheater 530 connected tocurrent source 510 andvoltmeter 520.Current source 510 is connected toresistive heater 530 through nodes A andB. Voltmeter 520 is connected toresistive heater 530 through nodes C and D. Nodes A, B, C and D are schematically represented inFIG. 4 . -
FIG. 6 is an exploded photograph of the physical representation of a resistive heater and a sensor.FIG. 6 is a 100× magnification of an exemplary heater.Resistive heater 630 is shown at the center ofFIG. 6 . Regions A, B, C and D are also identified as corresponding to nodes A, B, C and D. Shadedportions - A number of different circuits can be used to sense the voltage across the heater. The voltage may be sensed directly as a DC voltage or it may be sensed using one or more operational amplifiers (“op-amp”) which are used to drive the current of the heater while having a high-pass filter let through a high frequency current. The high frequency current can be taken by another op-amp to provide a closed loop signal to a controller. Thus, in
FIGS. 4 , 5 and 6, the current IAB is supplied by the current source I and the voltage VCD is measured across the heater and directly proportional to the temperature of the heater RHeater. -
FIG. 7 is a representative driving circuit according to one embodiment of the disclosure The circuit ofFIG. 7 can define a constant-current driving circuit.Circuit 700 receives drivingsignal 705 atoperational amplifier 730.Operational amplifier 730 drivesheater 710 which includes driving the resistive heater and the thermal sensor circuits.Heater 710 can be co-located with the discharge nozzle (not shown) and can comprise a platinum heater.Resistor 720 is the circuit sensing device connected to the ground. The circuit sensing device provides voltage-proportional to heater current feedback tooperational amplifier 730 and can define a 1 Ohm resistor. As shown inFIG. 7 , the driving circuit can receive, for example, voltage as feedback. The voltage can define the instantaneous temperature of the heater. -
FIG. 8 shows a circuit for a closed-loop temperature controller according to another embodiment of the disclosure. The circuit ofFIG. 8 includesmicroprocessor 800, I/O device 815 andresistance measuring circuit 820. The desired temperature is entered tocontroller 800.Controller 800 correlates the temperature value to a corresponding resistance value. The resistance value for the heater can be stored in a memory circuit associated with the controller. A software algorithm can correlate the resistance value and the temperature. If the desired temperature is less than the measured value,controller 800 can reduce the current supplied toheater 810 in order to heat the discharge nozzle. On the other hand, if the heater temperature is lower than the desired value, the current supplied to the heater can be increased to raise the temperature.Operational amplifier 830 drivesheater 810. In this manner,controller 800 provides a constant temperature control and feedback. Temperature feedback is provided throughamplifier 840 to I/O device 815, which in turn, communicates withcontroller 800. - In
FIGS. 7 and 8 , the controlling circuits can be can be devised independently for each printer-head and can be controlled and monitored from a remote location. Thus, in an array of 50 print-heads arranged in five columns of ten print-heads, each print-head can have an independent control circuit. The independent control circuits can communicated with a master controller (not shown) and ultimately with the technician through a graphic user interface. - According to the principles disclosed herein a driving circuit, such as those represented in
FIG. 5 , 6 or 7, can be used with each discharge nozzle in an array of print-heads. The driving circuit can be integrated with the heater or it may define a separate module. In one embodiment of the invention, the driving circuit is interposed between the heater and a power supply. - The power supply can define an AC or a DC source sufficiently seized to energize the resistive heater. The driving circuit may provide constant current with variable voltage to the resistive heater. Alternatively, the power supply may provide a constant AC voltage with variable pulse width. In such embodiment, the pulse height can define the voltage level and the pulse width can define the duration of voltage supplied to the heater. A feedback to the driving circuit can help adjust the input power by increasing or decreasing the power supplied (or its duration) to the resistive heater.
-
FIG. 9 is an exemplary control system according to one embodiment of the disclosure. The system ofFIG. 9 comprisesprocessor 910 in communication withmemory 920.Memory 920 can contain data relating the resistance of the heater to its temperature.Memory 920 can store data relating the voltage to the temperature ofresistive heater 920.Memory 920 may also contain data relating the current measured across heater 940 to its instantaneous temperature. It will be appreciated by one of ordinary skill in the art that such data is material-dependent and can vary widely from one resistive heater to another.Memory 920 andprocessor 910 can define a firmware. - Driving
circuit 930 can be integrated withprocessor 910 or it can define a separate circuitry. In the embodiment ofFIG. 9 , drivingcircuit 930 is interposed between power supply 950 and heater 940. As discussed, power supply 950 can define an AC or a DC power supply. Drivingcircuit 930 can receive a driving signal fromprocessor 910 and control the power supplied to heater 940. Drivingcircuit 930 also communicates withheater 930 as shown in FIGS. 5, 6 and 7 across nodes C and D. While the embodiment ofFIG. 9 shows a single heater, the disclosed principles are not limited thereto.Processor 910 can control multiple driving circuits and heaters simultaneously. - In an alternative embodiment, the function of the driving and the processor can be combined into a controller as schematically represented by
broken lines 960. The controller can define a single integrated circuit or it can define multiple circuit modules. The controller can receive feedback from heater 940 and determine the temperature of the heater as a function of resistance data stored inmemory 920. The controller can also detect failure mode at the heater as a function of, for example, the voltage across heater 940. In the event of failure detection, the controller can communicate the failure to the operator. Control system 860 can be used to control a multitude of heaters 940 in a large array of print-heads and discharge nozzles (seeFIG. 2 ). -
FIG. 10 is a flow-diagram for implementing a method according to one embodiment of the disclosure. In step 1010 a discharge nozzle in communication with a resistive heating element is provided. The discharge nozzle can be integrated with the heater as one unit. Alternatively, the heater can be mounted or attached to the discharge nozzle. The nozzle may comprise one or more conduits between two surfaces thereof for heating the received ink. Instep 1020, ink is received at the nozzle. The ink can be received at a surface of the nozzle or it can be received at the conduits of the discharge nozzle. Instep 1030, the resistive heater is energized to thereby heat the ink received at the nozzle. The energizing step can comprise supplying AC, DC or voltage pulses to the heater. A control circuit (interchangeably, controller) in communication with the heater and the energy source can dictate the amount of energy supplied to the heater based on the desired ink temperature at deposition. - At the same time, a control circuit can monitor the instantaneous temperature of the heater by detecting the voltage across the resistive heater. If the resistance should exceed a predetermined threshold, the controller may interrupt or decrease the energy supplied to the heater. As stated, the controller may comprise a processor circuit in communication with a memory circuit. The memory circuit can contain data relating the temperature of the resistive heater to its voltage or current. In one embodiment, the memory circuit contains a data table correlating the instantaneous temperature of the heater to the voltage measure across the heater. Using such data, in
step 1050, the processor circuit may increase, decrease or leave unchanged the energy supplied to the resistive heater. The processor circuit can communicate with the operator through a graphic user interface and a keyboard. The operator may dial in different temperatures depending on the type of ink, the resistive heater and the deposition parameters. - While the principles of the disclosure have been illustrated in relation to the exemplary embodiments shown herein, the principles of the disclosure are not limited thereto and include any modification, variation or permutation thereof.
Claims (15)
1. A method for controlling the temperature of a discharge nozzle, the method comprising:
providing a discharge nozzle for dispensing ink, the discharge nozzle having a thermally-conductive membrane with an integrated thin film electric heater and the thin film electric heater defining a resistance;
receiving a quantity of ink in liquid-form at the discharge nozzle;
energizing the thin-film heater by applying a substantially constant current to the thin-film heater;
measuring a voltage across the heater and a current through the heater; and
determining temperature of the heater as a function of the voltage and the current; and
determining the temperature of the ink droplet as a function of the heater temperature.
2. The method of claim 1 , further comprising energizing the thin-film heater by supplying electric current and measuring the ink quantity by measuring a change in the heater temperature.
3. The method of claim 1 , further comprising energizing the thin-film heater by applying a plurality of voltage pulses to the thin-film heater, each voltage pulse providing substantially identical voltage and having varying pulse width.
4. The method of claim 1 , wherein the step of determining temperature of the heater further comprises determining the temperature as a function of the resistance from data specific to said resistor.
5. The method of claim 1 , further comprising varying the voltage to increase the temperature of the heater.
6. A control system for controlling temperature of a discharge nozzle, the control system comprising:
a discharge nozzle having a plurality of conduits for receiving a quantity of liquid ink, the discharge nozzle thermally communicating with a heater;
a first metering device for measuring a voltage across the heater;
a second metering device for measuring a current through the heater;
a processor circuit for determining resistance of the heater as a function of the voltage and the current, the processor circuit controlling at least one of voltage or current input to the heater; and
a memory circuit in communication with the processor circuit, the memory containing data associating resistance with the temperature of the conduits of the discharge nozzle;
wherein the processor increases the voltage supplied to the heater to increase the temperature at the conduits of the discharge nozzle.
7. The control system of claim 6 , wherein the discharge nozzle has a thermally-conductive membrane.
8. The control system of claim 6 , further comprising a power supply in communication with the processor, the processor controlling at least one of voltage or current supplied to the heater.
9. The control system of claim 6 , further comprising a power supply in communication with the processor, the power supply supplying voltage pulses to the heater, wherein the voltage pulses have substantially identical pulse height and varying pulse width.
10. The control system of claim 6 , wherein the resistive heater is integrated with the discharge nozzle.
11. A discharge system for depositing ink on a substrate, the system comprising:
a chamber having a quantity of ink, the ink defined by a plurality of suspended ink particles in a carrier liquid;
a discharge nozzle for receiving a quantity of liquid ink from the chamber;
a heater in thermal communication with the discharge nozzle, the heater evaporating the carrier liquid at the discharge nozzle to deposit a substantially solid quantity of ink particles from the discharge nozzle; and
a controller in communication with the discharge nozzle, the controller maintaining the heater temperature by varying the voltage while maintaining substantially constant current supplied to the heater.
12. The system of claim 11 , wherein the controller supplies a plurality of energy pulses to a heater, each of the plurality of pulses having a substantially constant pulse height and varying pulse width.
13. The system of claim 1 , wherein the controller further comprises a processor circuit programmed with instructions to:
(a) determine one of the amount or the duration of activation required to discharge the quantity of ink particles to the substrate;
(b) energize the discharge nozzle consistent with the amount or duration determined in step (a); and
(c) repeat steps (a) and (b) to discharge additional quantities of ink particles onto the substrate.
14. The system of claim 1 , wherein the controller further comprises at least one processor circuit in communication with a memory for storing instructions.
15. The system of claim 1 , wherein the controller tasks the dispenser to provide the metered quantity of ink by providing pulsating energy to the dispenser, the pulsating energy adapted to exact a metered quantity of ink to the discharge nozzle.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/580,831 US20100188457A1 (en) | 2009-01-05 | 2009-10-16 | Method and apparatus for controlling the temperature of an electrically-heated discharge nozzle |
US13/219,515 US20120056923A1 (en) | 2009-01-05 | 2011-08-26 | Control systems and methods for thermal-jet printing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14257509P | 2009-01-05 | 2009-01-05 | |
US12/580,831 US20100188457A1 (en) | 2009-01-05 | 2009-10-16 | Method and apparatus for controlling the temperature of an electrically-heated discharge nozzle |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/219,515 Continuation-In-Part US20120056923A1 (en) | 2009-01-05 | 2011-08-26 | Control systems and methods for thermal-jet printing |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100188457A1 true US20100188457A1 (en) | 2010-07-29 |
Family
ID=42310645
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/580,831 Abandoned US20100188457A1 (en) | 2009-01-05 | 2009-10-16 | Method and apparatus for controlling the temperature of an electrically-heated discharge nozzle |
US12/652,046 Expired - Fee Related US8235487B2 (en) | 2009-01-05 | 2010-01-05 | Rapid ink-charging of a dry ink discharge nozzle |
US13/535,239 Abandoned US20120282840A1 (en) | 2009-01-05 | 2012-06-27 | Rapid ink-charging of a dry ink discharge nozzle |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/652,046 Expired - Fee Related US8235487B2 (en) | 2009-01-05 | 2010-01-05 | Rapid ink-charging of a dry ink discharge nozzle |
US13/535,239 Abandoned US20120282840A1 (en) | 2009-01-05 | 2012-06-27 | Rapid ink-charging of a dry ink discharge nozzle |
Country Status (6)
Country | Link |
---|---|
US (3) | US20100188457A1 (en) |
EP (1) | EP2376288A2 (en) |
JP (1) | JP5135475B2 (en) |
KR (1) | KR20110100667A (en) |
CN (1) | CN102271922A (en) |
WO (1) | WO2010078587A2 (en) |
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080308037A1 (en) * | 2007-06-14 | 2008-12-18 | Massachusetts Institute Of Technology | Method and apparatus for thermal jet printing |
US20100171780A1 (en) * | 2009-01-05 | 2010-07-08 | Kateeva, Inc. | Rapid Ink-Charging Of A Dry Ink Discharge Nozzle |
US20100201749A1 (en) * | 2008-06-13 | 2010-08-12 | Kateeva, Inc. | Method And Apparatus for Load-Locked Printing |
US20110008541A1 (en) * | 2009-05-01 | 2011-01-13 | Kateeva, Inc. | Method and apparatus for organic vapor printing |
US8556389B2 (en) | 2011-02-04 | 2013-10-15 | Kateeva, Inc. | Low-profile MEMS thermal printhead die having backside electrical connections |
US8632145B2 (en) | 2008-06-13 | 2014-01-21 | Kateeva, Inc. | Method and apparatus for printing using a facetted drum |
US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US8986780B2 (en) | 2004-11-19 | 2015-03-24 | Massachusetts Institute Of Technology | Method and apparatus for depositing LED organic film |
US9005365B2 (en) | 2004-11-19 | 2015-04-14 | Massachusetts Institute Of Technology | Method and apparatus for depositing LED organic film |
US9048344B2 (en) | 2008-06-13 | 2015-06-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US20150380648A1 (en) * | 2014-06-25 | 2015-12-31 | Universal Display Corporation | Systems and methods of modulating flow during vapor jet deposition of organic materials |
WO2016018396A1 (en) * | 2014-07-31 | 2016-02-04 | Hewlett-Packard Development Company, L.P. | Methods and apparatus to control a heater associated with a printing nozzle |
US9604245B2 (en) | 2008-06-13 | 2017-03-28 | Kateeva, Inc. | Gas enclosure systems and methods utilizing an auxiliary enclosure |
US10566534B2 (en) | 2015-10-12 | 2020-02-18 | Universal Display Corporation | Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP) |
WO2020222824A1 (en) * | 2019-04-30 | 2020-11-05 | Hewlett-Packard Development Company, L.P. | Control of printer heating elements based on input voltages |
US11107712B2 (en) | 2013-12-26 | 2021-08-31 | Kateeva, Inc. | Techniques for thermal treatment of electronic devices |
US11267012B2 (en) | 2014-06-25 | 2022-03-08 | Universal Display Corporation | Spatial control of vapor condensation using convection |
US11338319B2 (en) | 2014-04-30 | 2022-05-24 | Kateeva, Inc. | Gas cushion apparatus and techniques for substrate coating |
US11489119B2 (en) | 2014-01-21 | 2022-11-01 | Kateeva, Inc. | Apparatus and techniques for electronic device encapsulation |
US11591686B2 (en) | 2014-06-25 | 2023-02-28 | Universal Display Corporation | Methods of modulating flow during vapor jet deposition of organic materials |
US11633968B2 (en) | 2008-06-13 | 2023-04-25 | Kateeva, Inc. | Low-particle gas enclosure systems and methods |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10442226B2 (en) | 2008-06-13 | 2019-10-15 | Kateeva, Inc. | Gas enclosure assembly and system |
WO2012126016A2 (en) * | 2011-03-17 | 2012-09-20 | Kateeva, Inc. | Apparatus and methods for depositing one or more organic materials on a substrate |
CN103828085B (en) | 2011-08-09 | 2016-08-17 | 科迪华公司 | Prone printing device and method |
US9120344B2 (en) | 2011-08-09 | 2015-09-01 | Kateeva, Inc. | Apparatus and method for control of print gap |
EP2828081B1 (en) * | 2012-07-24 | 2019-10-09 | Hewlett-Packard Company, L.P. | Fluid ejection device with particle tolerant thin-film extension |
US9832428B2 (en) | 2012-12-27 | 2017-11-28 | Kateeva, Inc. | Fast measurement of droplet parameters in industrial printing system |
KR20220001519A (en) | 2012-12-27 | 2022-01-05 | 카티바, 인크. | Techniques for print ink volume control to deposit fluids within precise tolerances |
US9700908B2 (en) | 2012-12-27 | 2017-07-11 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
US11141752B2 (en) | 2012-12-27 | 2021-10-12 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
US11673155B2 (en) | 2012-12-27 | 2023-06-13 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
US9352561B2 (en) | 2012-12-27 | 2016-05-31 | Kateeva, Inc. | Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances |
KR102342098B1 (en) * | 2013-06-10 | 2021-12-21 | 카티바, 인크. | Low-particle gas enclosure systems and methods |
KR102034420B1 (en) | 2013-12-12 | 2019-11-08 | 카티바, 인크. | Ink-based layer fabrication using halftoning to control thickness |
GB2547432B (en) | 2016-02-16 | 2018-09-19 | Archipelago Tech Group Ltd | Fluid ejector |
US10103056B2 (en) * | 2017-03-08 | 2018-10-16 | Lam Research Corporation | Methods for wet metal seed deposition for bottom up gapfill of features |
EP3461639B1 (en) * | 2017-09-27 | 2022-01-12 | HP Scitex Ltd | Printhead nozzles orientation |
Citations (88)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4238807A (en) * | 1977-12-28 | 1980-12-09 | Ing. C. Olivetti & C., S.P.A. | Non-impact printing device |
US4751531A (en) * | 1986-03-27 | 1988-06-14 | Fuji Xerox Co., Ltd. | Thermal-electrostatic ink jet recording apparatus |
US5041161A (en) * | 1988-02-24 | 1991-08-20 | Dataproducts Corporation | Semi-solid ink jet and method of using same |
US5116148A (en) * | 1986-08-27 | 1992-05-26 | Hitachi, Ltd. | Heat transfer ink sheet having a precoating layer which is thermally transferred prior to sublimation of an ink dye |
US5155502A (en) * | 1989-01-13 | 1992-10-13 | Canon Kabushiki Kaisha | Ink-jet cartridge |
US5172139A (en) * | 1989-05-09 | 1992-12-15 | Ricoh Company, Ltd. | Liquid jet head for gradation recording |
US5202659A (en) * | 1984-04-16 | 1993-04-13 | Dataproducts, Corporation | Method and apparatus for selective multi-resonant operation of an ink jet controlling dot size |
US5247190A (en) * | 1989-04-20 | 1993-09-21 | Cambridge Research And Innovation Limited | Electroluminescent devices |
US5405710A (en) * | 1993-11-22 | 1995-04-11 | At&T Corp. | Article comprising microcavity light sources |
US5574485A (en) * | 1994-10-13 | 1996-11-12 | Xerox Corporation | Ultrasonic liquid wiper for ink jet printhead maintenance |
US5623292A (en) * | 1993-12-17 | 1997-04-22 | Videojet Systems International, Inc. | Temperature controller for ink jet printing |
US5703436A (en) * | 1994-12-13 | 1997-12-30 | The Trustees Of Princeton University | Transparent contacts for organic devices |
US5707745A (en) * | 1994-12-13 | 1998-01-13 | The Trustees Of Princeton University | Multicolor organic light emitting devices |
US5731828A (en) * | 1994-10-20 | 1998-03-24 | Canon Kabushiki Kaisha | Ink jet head, ink jet head cartridge and ink jet apparatus |
US5781210A (en) * | 1995-02-17 | 1998-07-14 | Sony Corporation | Recording method and recording solution |
US5801721A (en) * | 1994-09-09 | 1998-09-01 | Signtech U.S.A. Ltd. | Apparatus for producing an image on a first side of a substrate and a mirror image on a second side of the substrate |
US5834893A (en) * | 1996-12-23 | 1998-11-10 | The Trustees Of Princeton University | High efficiency organic light emitting devices with light directing structures |
US5844363A (en) * | 1997-01-23 | 1998-12-01 | The Trustees Of Princeton Univ. | Vacuum deposited, non-polymeric flexible organic light emitting devices |
US5865860A (en) * | 1997-06-20 | 1999-02-02 | Imra America, Inc. | Process for filling electrochemical cells with electrolyte |
US5947022A (en) * | 1997-11-07 | 1999-09-07 | Speedline Technologies, Inc. | Apparatus for dispensing material in a printer |
US5956051A (en) * | 1997-05-29 | 1999-09-21 | Pitney Bowes Inc. | Disabling a mailing machine when a print head is not installed |
US6013982A (en) * | 1996-12-23 | 2000-01-11 | The Trustees Of Princeton University | Multicolor display devices |
US6030238A (en) * | 1997-07-15 | 2000-02-29 | Hon Hai Precision Ind. Co., Ltd. | Ejector mechanism for a card connector having a retractable push button |
US6062668A (en) * | 1996-12-12 | 2000-05-16 | Hitachi Koki Imaging Solutions, Inc. | Drop detector for ink jet apparatus |
US6065825A (en) * | 1997-11-13 | 2000-05-23 | Eastman Kodak Company | Printer having mechanically-assisted ink droplet separation and method of using same |
US6086679A (en) * | 1997-10-24 | 2000-07-11 | Quester Technology, Inc. | Deposition systems and processes for transport polymerization and chemical vapor deposition |
US6086196A (en) * | 1995-04-14 | 2000-07-11 | Sony Corporation | Printing device |
US6087196A (en) * | 1998-01-30 | 2000-07-11 | The Trustees Of Princeton University | Fabrication of organic semiconductor devices using ink jet printing |
US6091195A (en) * | 1997-02-03 | 2000-07-18 | The Trustees Of Princeton University | Displays having mesa pixel configuration |
US6095630A (en) * | 1997-07-02 | 2000-08-01 | Sony Corporation | Ink-jet printer and drive method of recording head for ink-jet printer |
US6097147A (en) * | 1998-09-14 | 2000-08-01 | The Trustees Of Princeton University | Structure for high efficiency electroluminescent device |
US6189989B1 (en) * | 1993-04-12 | 2001-02-20 | Canon Kabushiki Kaisha | Embroidering using ink jet printing apparatus |
US6250747B1 (en) * | 1999-01-28 | 2001-06-26 | Hewlett-Packard Company | Print cartridge with improved back-pressure regulation |
US6257706B1 (en) * | 1997-10-15 | 2001-07-10 | Samsung Electronics Co., Ltd. | Micro injecting device and a method of manufacturing |
US6294398B1 (en) * | 1999-11-23 | 2001-09-25 | The Trustees Of Princeton University | Method for patterning devices |
US6312083B1 (en) * | 1999-12-20 | 2001-11-06 | Xerox Corporation | Printhead assembly with ink monitoring system |
US20010045973A1 (en) * | 2000-01-11 | 2001-11-29 | Eastman Kodak Company | Assisted drop-on-demand inkjet printer |
US6326224B1 (en) * | 1998-04-27 | 2001-12-04 | Motorola, Inc. | Method of purifying a primary color generated by an OED |
US20020008732A1 (en) * | 2000-07-20 | 2002-01-24 | Moon Jae-Ho | Ink-jet printhead |
US6431702B2 (en) * | 1999-06-08 | 2002-08-13 | Hewlett-Packard Company | Apparatus and method using ultrasonic energy to fix ink to print media |
US6444400B1 (en) * | 1999-08-23 | 2002-09-03 | Agfa-Gevaert | Method of making an electroconductive pattern on a support |
US6453810B1 (en) * | 1997-11-07 | 2002-09-24 | Speedline Technologies, Inc. | Method and apparatus for dispensing material in a printer |
US6460972B1 (en) * | 2001-11-06 | 2002-10-08 | Eastman Kodak Company | Thermal actuator drop-on-demand apparatus and method for high frequency |
US6467863B1 (en) * | 1999-06-04 | 2002-10-22 | Canon Kabushiki Kaisha | Ink jet recording head, and ink jet recording device |
US6472692B1 (en) * | 1998-09-10 | 2002-10-29 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US20020191063A1 (en) * | 2000-08-30 | 2002-12-19 | Daniel Gelbart | Method for imaging with UV curable inks |
US6498802B1 (en) * | 1999-12-02 | 2002-12-24 | Electronics And Telecommunications Research Institute | Organic micro-cavity laser |
US20030000476A1 (en) * | 2001-06-28 | 2003-01-02 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus, conveying unit thereof, and semiconductor device fabricating Method |
US6513903B2 (en) * | 2000-12-29 | 2003-02-04 | Eastman Kodak Company | Ink jet print head with capillary flow cleaning |
US6586763B2 (en) * | 1996-06-25 | 2003-07-01 | Northwestern University | Organic light-emitting diodes and methods for assembly and emission control |
US6601936B2 (en) * | 2000-11-14 | 2003-08-05 | Cypress Semiconductor Corp. | Real time adaptive inkjet temperature regulation controller |
US20030175414A1 (en) * | 2002-01-23 | 2003-09-18 | Seiko Epson Corporation | Method of, and apparatus for, manufacturing organic EL device; organic EL device; electronic device; and liquid droplet ejection apparatus |
US6666548B1 (en) * | 2002-11-04 | 2003-12-23 | Eastman Kodak Company | Method and apparatus for continuous marking |
US20040009304A1 (en) * | 2002-07-09 | 2004-01-15 | Osram Opto Semiconductors Gmbh & Co. Ogh | Process and tool with energy source for fabrication of organic electronic devices |
US20040048000A1 (en) * | 2001-09-04 | 2004-03-11 | Max Shtein | Device and method for organic vapor jet deposition |
US20040056244A1 (en) * | 2002-09-23 | 2004-03-25 | Eastman Kodak Company | Device for depositing patterned layers in OLED displays |
US20040086631A1 (en) * | 2002-10-25 | 2004-05-06 | Yu-Kai Han | Ink jet printing device and method |
US20040174116A1 (en) * | 2001-08-20 | 2004-09-09 | Lu Min-Hao Michael | Transparent electrodes |
US20040202794A1 (en) * | 2003-04-11 | 2004-10-14 | Dainippon Screen Mfg. Co., Ltd. | Coating material applying method and coating material applying apparatus for applying a coating material to surfaces of prints, and a printing machine having the coating material applying apparatus |
US6811896B2 (en) * | 2002-07-29 | 2004-11-02 | Xerox Corporation | Organic light emitting device (OLED) with thick (100 to 250 nanometers) porphyrin buffer layer |
US6824262B2 (en) * | 2001-08-10 | 2004-11-30 | Seiko Epson Corporation | Ink set and ink jet recording method |
US20040255249A1 (en) * | 2001-12-06 | 2004-12-16 | Shih-Fu Chang | System and method for extracting text captions from video and generating video summaries |
US20050005850A1 (en) * | 1999-07-23 | 2005-01-13 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating an EL display device, and apparatus for forming a thin film |
US6861800B2 (en) * | 2003-02-18 | 2005-03-01 | Eastman Kodak Company | Tuned microcavity color OLED display |
US6896436B2 (en) * | 2001-02-27 | 2005-05-24 | Incumed, Inc. | Adjustable locking mount and methods of use |
US6896346B2 (en) * | 2002-12-26 | 2005-05-24 | Eastman Kodak Company | Thermo-mechanical actuator drop-on-demand apparatus and method with multiple drop volumes |
US6917159B2 (en) * | 2003-08-14 | 2005-07-12 | Eastman Kodak Company | Microcavity OLED device |
US20060038852A1 (en) * | 2004-08-20 | 2006-02-23 | Cornell Robert W | Mems fluid actuator |
US20060115585A1 (en) * | 2004-11-19 | 2006-06-01 | Vladimir Bulovic | Method and apparatus for depositing LED organic film |
US7077513B2 (en) * | 2001-02-09 | 2006-07-18 | Seiko Epson Corporation | Ink jet recording apparatus, control and ink replenishing method executed in the same, ink supply system incorporated in the same, and method of managing ink amount supplied by the system |
US20070040877A1 (en) * | 2005-08-16 | 2007-02-22 | Fuji Photo Film Co., Ltd. | Ink supply device, ink jet recording apparatus and ink cartridge |
US20070058010A1 (en) * | 2005-09-14 | 2007-03-15 | Fuji Photo Film Co., Ltd. | Liquid ejection head and image forming apparatus |
US20070134512A1 (en) * | 2005-12-13 | 2007-06-14 | Eastman Kodak Company | Electroluminescent device containing an anthracene derivative |
US20070188559A1 (en) * | 2003-11-06 | 2007-08-16 | Canon Kabushiki Kaisha | Printhead substrate, printhead using the substrate, head cartridge including the printhead, method of driving the printhead, and printing apparatus using the printhead |
US7374984B2 (en) * | 2004-10-29 | 2008-05-20 | Randy Hoffman | Method of forming a thin film component |
US7377616B2 (en) * | 2004-09-09 | 2008-05-27 | Brother Kogyo Kabushiki Kaisha | Inkjet printer including discharger with cap |
US20080174235A1 (en) * | 2006-10-13 | 2008-07-24 | Samsung Sdi Co., Ltd. | Mask used to fabricate organic light-emitting diode (oled) display device, method of fabricating oled display device using the mask, oled display device fabricated using the mask, and method of fabricating the mask |
US7406761B2 (en) * | 2005-03-21 | 2008-08-05 | Honeywell International Inc. | Method of manufacturing vibrating micromechanical structures |
US7410240B2 (en) * | 2004-03-04 | 2008-08-12 | Fujifilm Corporation | Inkjet recording head and inkjet recording apparatus |
US20080238310A1 (en) * | 2007-03-30 | 2008-10-02 | Forrest Stephen R | OLED with improved light outcoupling |
US20080299311A1 (en) * | 2001-09-04 | 2008-12-04 | The Trustees Of Princeton University | Process and Apparatus for Organic Vapor Jet Deposition |
US20080308037A1 (en) * | 2007-06-14 | 2008-12-18 | Massachusetts Institute Of Technology | Method and apparatus for thermal jet printing |
US20090045739A1 (en) * | 2007-08-16 | 2009-02-19 | Sam-Il Kho | Organic light emitting diode display device and method of fabricating the same |
US7677690B2 (en) * | 2005-11-22 | 2010-03-16 | Fujifilm Corporation | Liquid ejection apparatus and liquid agitation method |
US20100079513A1 (en) * | 2008-09-26 | 2010-04-01 | Brother Kogyo Kabushiki Kaisha | Liquid-ejection apparatus |
US7857121B2 (en) * | 2005-09-15 | 2010-12-28 | Coreflow Scientific Solutions Ltd. | System and method for enhancing conveying performance of conveyors |
US7883832B2 (en) * | 2005-01-04 | 2011-02-08 | International Business Machines Corporation | Method and apparatus for direct referencing of top surface of workpiece during imprint lithography |
US20110293818A1 (en) * | 2009-11-27 | 2011-12-01 | Kateeva Inc. | Method and Apparatus for Depositing A Film Using A Rotating Source |
Family Cites Families (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61106261A (en) * | 1984-10-30 | 1986-05-24 | Fuji Xerox Co Ltd | Ink jet printer |
JPS623958A (en) * | 1985-06-29 | 1987-01-09 | Toshiba Corp | Recording method |
US6548956B2 (en) * | 1994-12-13 | 2003-04-15 | The Trustees Of Princeton University | Transparent contacts for organic devices |
JPH09248918A (en) * | 1996-03-15 | 1997-09-22 | Sharp Corp | Image recording apparatus |
US6303238B1 (en) * | 1997-12-01 | 2001-10-16 | The Trustees Of Princeton University | OLEDs doped with phosphorescent compounds |
US6337102B1 (en) * | 1997-11-17 | 2002-01-08 | The Trustees Of Princeton University | Low pressure vapor phase deposition of organic thin films |
US6086195A (en) * | 1998-09-24 | 2000-07-11 | Hewlett-Packard Company | Filter for an inkjet printhead |
GB9822963D0 (en) * | 1998-10-20 | 1998-12-16 | Agner Erik | Improvements in or relating to chromatography |
JP2002069650A (en) | 2000-08-31 | 2002-03-08 | Applied Materials Inc | Method and apparatus for vapor phase deposition, and method and device for manufacturing semiconductor device |
US6472962B1 (en) | 2001-05-17 | 2002-10-29 | Institute Of Microelectronics | Inductor-capacitor resonant RF switch |
JP4683772B2 (en) * | 2001-06-15 | 2011-05-18 | 株式会社半導体エネルギー研究所 | Method for manufacturing light emitting device |
WO2003025245A1 (en) * | 2001-09-14 | 2003-03-27 | University Of Delaware | Multiple-nozzle thermal evaporation source |
TWI222423B (en) * | 2001-12-27 | 2004-10-21 | Orbotech Ltd | System and methods for conveying and transporting levitated articles |
US7133905B2 (en) * | 2002-04-09 | 2006-11-07 | Akamai Technologies, Inc. | Method and system for tiered distribution in a content delivery network |
DE10224128A1 (en) | 2002-05-29 | 2003-12-18 | Schmid Rhyner Ag Adliswil | Method of applying coatings to surfaces |
CN100375925C (en) * | 2002-06-10 | 2008-03-19 | 精工爱普生株式会社 | Method for producing toner, toner and aparatus for producing toner |
US20030230980A1 (en) | 2002-06-18 | 2003-12-18 | Forrest Stephen R | Very low voltage, high efficiency phosphorescent oled in a p-i-n structure |
US7759127B2 (en) | 2003-12-05 | 2010-07-20 | Massachusetts Institute Of Technology | Organic materials able to detect analytes |
JP2005172927A (en) * | 2003-12-08 | 2005-06-30 | Seiko Epson Corp | Method for manufacturing electrooptical device, method for manufacturing substrate for electrooptical device, and apparatus for manufacturing substrate for electrooptical device |
KR100590545B1 (en) * | 2004-02-27 | 2006-06-19 | 삼성전자주식회사 | Method of driving inkjet printhead |
JP4423082B2 (en) | 2004-03-29 | 2010-03-03 | 京セラ株式会社 | Gas nozzle, manufacturing method thereof, and thin film forming apparatus using the same |
US7604439B2 (en) * | 2004-04-14 | 2009-10-20 | Coreflow Scientific Solutions Ltd. | Non-contact support platforms for distance adjustment |
US7247394B2 (en) * | 2004-05-04 | 2007-07-24 | Eastman Kodak Company | Tuned microcavity color OLED display |
US7023013B2 (en) * | 2004-06-16 | 2006-04-04 | Eastman Kodak Company | Array of light-emitting OLED microcavity pixels |
JP2006007560A (en) * | 2004-06-25 | 2006-01-12 | Sony Corp | Functional element, its manufacturing method, fluid discharging apparatus, and printer |
KR100659057B1 (en) * | 2004-07-15 | 2006-12-21 | 삼성에스디아이 주식회사 | Mask frame assembly for thin layer vacuum evaporation and organic electro-luminescence display device |
US7431435B2 (en) * | 2004-08-06 | 2008-10-07 | Matthew Grant Lopez | Systems and methods for varying dye concentrations |
KR100668309B1 (en) * | 2004-10-29 | 2007-01-12 | 삼성전자주식회사 | Manufacturing method of nozzle plate |
US7908885B2 (en) * | 2004-11-08 | 2011-03-22 | New Way Machine Components, Inc. | Non-contact porous air bearing and glass flattening device |
JP4459037B2 (en) | 2004-12-01 | 2010-04-28 | キヤノン株式会社 | Liquid discharge head |
US8007927B2 (en) * | 2007-12-28 | 2011-08-30 | Universal Display Corporation | Dibenzothiophene-containing materials in phosphorescent light emitting diodes |
JP2007078973A (en) * | 2005-09-13 | 2007-03-29 | Fujifilm Corp | Color filter manufacturing method and manufacturing method for color filter using same |
JP2007095343A (en) | 2005-09-27 | 2007-04-12 | Toppan Printing Co Ltd | Method of manufacturing printed material, and printed material |
JP2007098805A (en) * | 2005-10-05 | 2007-04-19 | Fujifilm Corp | Liquid delivery apparatus and method for maintaining a liquid |
US20070098891A1 (en) | 2005-10-31 | 2007-05-03 | Eastman Kodak Company | Vapor deposition apparatus and method |
JP2007299616A (en) | 2006-04-28 | 2007-11-15 | Toppan Printing Co Ltd | Manufacturing method of organic el element, and organic el element |
TW200803606A (en) | 2006-06-13 | 2008-01-01 | Itc Inc Ltd | The fabrication of full color OLED panel using micro-cavity structure |
GB2442455A (en) * | 2006-08-04 | 2008-04-09 | Moto Comp Ltd | Motorcycle Grip Pad and Riding Apparel |
US20080098891A1 (en) * | 2006-10-25 | 2008-05-01 | General Electric Company | Turbine inlet air treatment apparatus |
KR101118808B1 (en) * | 2006-12-28 | 2012-03-22 | 유니버셜 디스플레이 코포레이션 | Long lifetime phosphorescent organic light emitting deviceoled structures |
US7966743B2 (en) * | 2007-07-31 | 2011-06-28 | Eastman Kodak Company | Micro-structured drying for inkjet printers |
KR101404546B1 (en) * | 2007-11-05 | 2014-06-09 | 삼성디스플레이 주식회사 | Organic light emitting diode display and method for manufacturing the same |
US20090220680A1 (en) * | 2008-02-29 | 2009-09-03 | Winters Dustin L | Oled device with short reduction |
US8383202B2 (en) * | 2008-06-13 | 2013-02-26 | Kateeva, Inc. | Method and apparatus for load-locked printing |
KR20100026655A (en) * | 2008-09-01 | 2010-03-10 | 삼성모바일디스플레이주식회사 | Mask for thin film deposition and manufacturing method of oled using the same |
US20100188457A1 (en) * | 2009-01-05 | 2010-07-29 | Madigan Connor F | Method and apparatus for controlling the temperature of an electrically-heated discharge nozzle |
EP2425470A2 (en) * | 2009-05-01 | 2012-03-07 | Kateeva, Inc. | Method and apparatus for organic vapor printing |
-
2009
- 2009-10-16 US US12/580,831 patent/US20100188457A1/en not_active Abandoned
-
2010
- 2010-01-05 EP EP10726847A patent/EP2376288A2/en not_active Withdrawn
- 2010-01-05 WO PCT/US2010/020144 patent/WO2010078587A2/en active Application Filing
- 2010-01-05 JP JP2011544660A patent/JP5135475B2/en not_active Expired - Fee Related
- 2010-01-05 CN CN2010800040352A patent/CN102271922A/en active Pending
- 2010-01-05 KR KR1020117017869A patent/KR20110100667A/en not_active Application Discontinuation
- 2010-01-05 US US12/652,046 patent/US8235487B2/en not_active Expired - Fee Related
-
2012
- 2012-06-27 US US13/535,239 patent/US20120282840A1/en not_active Abandoned
Patent Citations (96)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4238807A (en) * | 1977-12-28 | 1980-12-09 | Ing. C. Olivetti & C., S.P.A. | Non-impact printing device |
US5202659A (en) * | 1984-04-16 | 1993-04-13 | Dataproducts, Corporation | Method and apparatus for selective multi-resonant operation of an ink jet controlling dot size |
US4751531A (en) * | 1986-03-27 | 1988-06-14 | Fuji Xerox Co., Ltd. | Thermal-electrostatic ink jet recording apparatus |
US5116148A (en) * | 1986-08-27 | 1992-05-26 | Hitachi, Ltd. | Heat transfer ink sheet having a precoating layer which is thermally transferred prior to sublimation of an ink dye |
US5041161A (en) * | 1988-02-24 | 1991-08-20 | Dataproducts Corporation | Semi-solid ink jet and method of using same |
US5155502A (en) * | 1989-01-13 | 1992-10-13 | Canon Kabushiki Kaisha | Ink-jet cartridge |
US5247190A (en) * | 1989-04-20 | 1993-09-21 | Cambridge Research And Innovation Limited | Electroluminescent devices |
US5172139A (en) * | 1989-05-09 | 1992-12-15 | Ricoh Company, Ltd. | Liquid jet head for gradation recording |
US6189989B1 (en) * | 1993-04-12 | 2001-02-20 | Canon Kabushiki Kaisha | Embroidering using ink jet printing apparatus |
US5405710A (en) * | 1993-11-22 | 1995-04-11 | At&T Corp. | Article comprising microcavity light sources |
US5623292A (en) * | 1993-12-17 | 1997-04-22 | Videojet Systems International, Inc. | Temperature controller for ink jet printing |
US5801721A (en) * | 1994-09-09 | 1998-09-01 | Signtech U.S.A. Ltd. | Apparatus for producing an image on a first side of a substrate and a mirror image on a second side of the substrate |
US5574485A (en) * | 1994-10-13 | 1996-11-12 | Xerox Corporation | Ultrasonic liquid wiper for ink jet printhead maintenance |
US5731828A (en) * | 1994-10-20 | 1998-03-24 | Canon Kabushiki Kaisha | Ink jet head, ink jet head cartridge and ink jet apparatus |
US5703436A (en) * | 1994-12-13 | 1997-12-30 | The Trustees Of Princeton University | Transparent contacts for organic devices |
US5707745A (en) * | 1994-12-13 | 1998-01-13 | The Trustees Of Princeton University | Multicolor organic light emitting devices |
US5781210A (en) * | 1995-02-17 | 1998-07-14 | Sony Corporation | Recording method and recording solution |
US6086196A (en) * | 1995-04-14 | 2000-07-11 | Sony Corporation | Printing device |
US6586763B2 (en) * | 1996-06-25 | 2003-07-01 | Northwestern University | Organic light-emitting diodes and methods for assembly and emission control |
US6062668A (en) * | 1996-12-12 | 2000-05-16 | Hitachi Koki Imaging Solutions, Inc. | Drop detector for ink jet apparatus |
US6013982A (en) * | 1996-12-23 | 2000-01-11 | The Trustees Of Princeton University | Multicolor display devices |
US5834893A (en) * | 1996-12-23 | 1998-11-10 | The Trustees Of Princeton University | High efficiency organic light emitting devices with light directing structures |
US5844363A (en) * | 1997-01-23 | 1998-12-01 | The Trustees Of Princeton Univ. | Vacuum deposited, non-polymeric flexible organic light emitting devices |
US6091195A (en) * | 1997-02-03 | 2000-07-18 | The Trustees Of Princeton University | Displays having mesa pixel configuration |
US5956051A (en) * | 1997-05-29 | 1999-09-21 | Pitney Bowes Inc. | Disabling a mailing machine when a print head is not installed |
US5865860A (en) * | 1997-06-20 | 1999-02-02 | Imra America, Inc. | Process for filling electrochemical cells with electrolyte |
US6095630A (en) * | 1997-07-02 | 2000-08-01 | Sony Corporation | Ink-jet printer and drive method of recording head for ink-jet printer |
US6030238A (en) * | 1997-07-15 | 2000-02-29 | Hon Hai Precision Ind. Co., Ltd. | Ejector mechanism for a card connector having a retractable push button |
US6257706B1 (en) * | 1997-10-15 | 2001-07-10 | Samsung Electronics Co., Ltd. | Micro injecting device and a method of manufacturing |
US6086679A (en) * | 1997-10-24 | 2000-07-11 | Quester Technology, Inc. | Deposition systems and processes for transport polymerization and chemical vapor deposition |
US6453810B1 (en) * | 1997-11-07 | 2002-09-24 | Speedline Technologies, Inc. | Method and apparatus for dispensing material in a printer |
US5947022A (en) * | 1997-11-07 | 1999-09-07 | Speedline Technologies, Inc. | Apparatus for dispensing material in a printer |
US6065825A (en) * | 1997-11-13 | 2000-05-23 | Eastman Kodak Company | Printer having mechanically-assisted ink droplet separation and method of using same |
US6087196A (en) * | 1998-01-30 | 2000-07-11 | The Trustees Of Princeton University | Fabrication of organic semiconductor devices using ink jet printing |
US6326224B1 (en) * | 1998-04-27 | 2001-12-04 | Motorola, Inc. | Method of purifying a primary color generated by an OED |
US6472692B1 (en) * | 1998-09-10 | 2002-10-29 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US6097147A (en) * | 1998-09-14 | 2000-08-01 | The Trustees Of Princeton University | Structure for high efficiency electroluminescent device |
US6250747B1 (en) * | 1999-01-28 | 2001-06-26 | Hewlett-Packard Company | Print cartridge with improved back-pressure regulation |
US6467863B1 (en) * | 1999-06-04 | 2002-10-22 | Canon Kabushiki Kaisha | Ink jet recording head, and ink jet recording device |
US6431702B2 (en) * | 1999-06-08 | 2002-08-13 | Hewlett-Packard Company | Apparatus and method using ultrasonic energy to fix ink to print media |
US20050005850A1 (en) * | 1999-07-23 | 2005-01-13 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating an EL display device, and apparatus for forming a thin film |
US6444400B1 (en) * | 1999-08-23 | 2002-09-03 | Agfa-Gevaert | Method of making an electroconductive pattern on a support |
US6294398B1 (en) * | 1999-11-23 | 2001-09-25 | The Trustees Of Princeton University | Method for patterning devices |
US6498802B1 (en) * | 1999-12-02 | 2002-12-24 | Electronics And Telecommunications Research Institute | Organic micro-cavity laser |
US6312083B1 (en) * | 1999-12-20 | 2001-11-06 | Xerox Corporation | Printhead assembly with ink monitoring system |
US20010045973A1 (en) * | 2000-01-11 | 2001-11-29 | Eastman Kodak Company | Assisted drop-on-demand inkjet printer |
US20020008732A1 (en) * | 2000-07-20 | 2002-01-24 | Moon Jae-Ho | Ink-jet printhead |
US20020191063A1 (en) * | 2000-08-30 | 2002-12-19 | Daniel Gelbart | Method for imaging with UV curable inks |
US6601936B2 (en) * | 2000-11-14 | 2003-08-05 | Cypress Semiconductor Corp. | Real time adaptive inkjet temperature regulation controller |
US6513903B2 (en) * | 2000-12-29 | 2003-02-04 | Eastman Kodak Company | Ink jet print head with capillary flow cleaning |
US7077513B2 (en) * | 2001-02-09 | 2006-07-18 | Seiko Epson Corporation | Ink jet recording apparatus, control and ink replenishing method executed in the same, ink supply system incorporated in the same, and method of managing ink amount supplied by the system |
US6896436B2 (en) * | 2001-02-27 | 2005-05-24 | Incumed, Inc. | Adjustable locking mount and methods of use |
US20030000476A1 (en) * | 2001-06-28 | 2003-01-02 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus, conveying unit thereof, and semiconductor device fabricating Method |
US6824262B2 (en) * | 2001-08-10 | 2004-11-30 | Seiko Epson Corporation | Ink set and ink jet recording method |
US20040174116A1 (en) * | 2001-08-20 | 2004-09-09 | Lu Min-Hao Michael | Transparent electrodes |
US20040048000A1 (en) * | 2001-09-04 | 2004-03-11 | Max Shtein | Device and method for organic vapor jet deposition |
US7404862B2 (en) * | 2001-09-04 | 2008-07-29 | The Trustees Of Princeton University | Device and method for organic vapor jet deposition |
US20080311296A1 (en) * | 2001-09-04 | 2008-12-18 | The Trustees Of Princeton University | Device and Method for Organic Vapor Jet Deposition |
US20080299311A1 (en) * | 2001-09-04 | 2008-12-04 | The Trustees Of Princeton University | Process and Apparatus for Organic Vapor Jet Deposition |
US6460972B1 (en) * | 2001-11-06 | 2002-10-08 | Eastman Kodak Company | Thermal actuator drop-on-demand apparatus and method for high frequency |
US20040255249A1 (en) * | 2001-12-06 | 2004-12-16 | Shih-Fu Chang | System and method for extracting text captions from video and generating video summaries |
US20030175414A1 (en) * | 2002-01-23 | 2003-09-18 | Seiko Epson Corporation | Method of, and apparatus for, manufacturing organic EL device; organic EL device; electronic device; and liquid droplet ejection apparatus |
US20040009304A1 (en) * | 2002-07-09 | 2004-01-15 | Osram Opto Semiconductors Gmbh & Co. Ogh | Process and tool with energy source for fabrication of organic electronic devices |
US6811896B2 (en) * | 2002-07-29 | 2004-11-02 | Xerox Corporation | Organic light emitting device (OLED) with thick (100 to 250 nanometers) porphyrin buffer layer |
US20040056244A1 (en) * | 2002-09-23 | 2004-03-25 | Eastman Kodak Company | Device for depositing patterned layers in OLED displays |
US6911671B2 (en) * | 2002-09-23 | 2005-06-28 | Eastman Kodak Company | Device for depositing patterned layers in OLED displays |
US20040086631A1 (en) * | 2002-10-25 | 2004-05-06 | Yu-Kai Han | Ink jet printing device and method |
US6666548B1 (en) * | 2002-11-04 | 2003-12-23 | Eastman Kodak Company | Method and apparatus for continuous marking |
US6896346B2 (en) * | 2002-12-26 | 2005-05-24 | Eastman Kodak Company | Thermo-mechanical actuator drop-on-demand apparatus and method with multiple drop volumes |
US6861800B2 (en) * | 2003-02-18 | 2005-03-01 | Eastman Kodak Company | Tuned microcavity color OLED display |
US20040202794A1 (en) * | 2003-04-11 | 2004-10-14 | Dainippon Screen Mfg. Co., Ltd. | Coating material applying method and coating material applying apparatus for applying a coating material to surfaces of prints, and a printing machine having the coating material applying apparatus |
US6917159B2 (en) * | 2003-08-14 | 2005-07-12 | Eastman Kodak Company | Microcavity OLED device |
US20070188559A1 (en) * | 2003-11-06 | 2007-08-16 | Canon Kabushiki Kaisha | Printhead substrate, printhead using the substrate, head cartridge including the printhead, method of driving the printhead, and printing apparatus using the printhead |
US7410240B2 (en) * | 2004-03-04 | 2008-08-12 | Fujifilm Corporation | Inkjet recording head and inkjet recording apparatus |
US20060038852A1 (en) * | 2004-08-20 | 2006-02-23 | Cornell Robert W | Mems fluid actuator |
US7377616B2 (en) * | 2004-09-09 | 2008-05-27 | Brother Kogyo Kabushiki Kaisha | Inkjet printer including discharger with cap |
US7374984B2 (en) * | 2004-10-29 | 2008-05-20 | Randy Hoffman | Method of forming a thin film component |
US20060115585A1 (en) * | 2004-11-19 | 2006-06-01 | Vladimir Bulovic | Method and apparatus for depositing LED organic film |
US8128753B2 (en) * | 2004-11-19 | 2012-03-06 | Massachusetts Institute Of Technology | Method and apparatus for depositing LED organic film |
US7883832B2 (en) * | 2005-01-04 | 2011-02-08 | International Business Machines Corporation | Method and apparatus for direct referencing of top surface of workpiece during imprint lithography |
US7406761B2 (en) * | 2005-03-21 | 2008-08-05 | Honeywell International Inc. | Method of manufacturing vibrating micromechanical structures |
US20070040877A1 (en) * | 2005-08-16 | 2007-02-22 | Fuji Photo Film Co., Ltd. | Ink supply device, ink jet recording apparatus and ink cartridge |
US7648230B2 (en) * | 2005-08-16 | 2010-01-19 | Fujifilm Corporation | Ink supply device, ink jet recording apparatus and ink cartridge |
US20070058010A1 (en) * | 2005-09-14 | 2007-03-15 | Fuji Photo Film Co., Ltd. | Liquid ejection head and image forming apparatus |
US7857121B2 (en) * | 2005-09-15 | 2010-12-28 | Coreflow Scientific Solutions Ltd. | System and method for enhancing conveying performance of conveyors |
US7677690B2 (en) * | 2005-11-22 | 2010-03-16 | Fujifilm Corporation | Liquid ejection apparatus and liquid agitation method |
US20070134512A1 (en) * | 2005-12-13 | 2007-06-14 | Eastman Kodak Company | Electroluminescent device containing an anthracene derivative |
US20080174235A1 (en) * | 2006-10-13 | 2008-07-24 | Samsung Sdi Co., Ltd. | Mask used to fabricate organic light-emitting diode (oled) display device, method of fabricating oled display device using the mask, oled display device fabricated using the mask, and method of fabricating the mask |
US20080238310A1 (en) * | 2007-03-30 | 2008-10-02 | Forrest Stephen R | OLED with improved light outcoupling |
US20080308037A1 (en) * | 2007-06-14 | 2008-12-18 | Massachusetts Institute Of Technology | Method and apparatus for thermal jet printing |
US20080311307A1 (en) * | 2007-06-14 | 2008-12-18 | Massachusetts Institute Of Technology | Method and apparatus for depositing films |
US20080311289A1 (en) * | 2007-06-14 | 2008-12-18 | Vladimir Bulovic | Method and apparatus for controlling film deposition |
US20110267390A1 (en) * | 2007-06-14 | 2011-11-03 | Massachusetts Institute Of Technology | Method and apparatus for depositing films |
US20090045739A1 (en) * | 2007-08-16 | 2009-02-19 | Sam-Il Kho | Organic light emitting diode display device and method of fabricating the same |
US20100079513A1 (en) * | 2008-09-26 | 2010-04-01 | Brother Kogyo Kabushiki Kaisha | Liquid-ejection apparatus |
US20110293818A1 (en) * | 2009-11-27 | 2011-12-01 | Kateeva Inc. | Method and Apparatus for Depositing A Film Using A Rotating Source |
Cited By (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9005365B2 (en) | 2004-11-19 | 2015-04-14 | Massachusetts Institute Of Technology | Method and apparatus for depositing LED organic film |
US8986780B2 (en) | 2004-11-19 | 2015-03-24 | Massachusetts Institute Of Technology | Method and apparatus for depositing LED organic film |
US8962073B2 (en) | 2004-11-19 | 2015-02-24 | Massachusetts Institute Of Technology | Method and apparatus for controlling film deposition |
US9385322B2 (en) | 2005-11-21 | 2016-07-05 | Massachusetts Institute Of Technology | Method and apparatus for depositing LED organic film |
US20080308037A1 (en) * | 2007-06-14 | 2008-12-18 | Massachusetts Institute Of Technology | Method and apparatus for thermal jet printing |
US20080311307A1 (en) * | 2007-06-14 | 2008-12-18 | Massachusetts Institute Of Technology | Method and apparatus for depositing films |
US20080311289A1 (en) * | 2007-06-14 | 2008-12-18 | Vladimir Bulovic | Method and apparatus for controlling film deposition |
US9023670B2 (en) | 2007-06-14 | 2015-05-05 | Kateeva, Inc. | Modular printhead for OLED printing |
US8632145B2 (en) | 2008-06-13 | 2014-01-21 | Kateeva, Inc. | Method and apparatus for printing using a facetted drum |
US8875648B2 (en) | 2008-06-13 | 2014-11-04 | Kateeva, Inc. | Method and apparatus for load-locked printing |
US11633968B2 (en) | 2008-06-13 | 2023-04-25 | Kateeva, Inc. | Low-particle gas enclosure systems and methods |
US8720366B2 (en) | 2008-06-13 | 2014-05-13 | Kateeva, Inc. | Method and apparatus for load-locked printing |
US8802195B2 (en) | 2008-06-13 | 2014-08-12 | Kateeva, Inc. | Method and apparatus for load-locked printing |
US8802186B2 (en) | 2008-06-13 | 2014-08-12 | Kateeva, Inc. | Method and apparatus for load-locked printing |
US9248643B2 (en) | 2008-06-13 | 2016-02-02 | Kateeva, Inc. | Method and apparatus for load-locked printing |
US8807071B2 (en) | 2008-06-13 | 2014-08-19 | Kateeva, Inc. | Method and apparatus for load-locked printing |
US8596747B2 (en) | 2008-06-13 | 2013-12-03 | Kateeva, Inc. | Modular printhead for OLED printing |
US9604245B2 (en) | 2008-06-13 | 2017-03-28 | Kateeva, Inc. | Gas enclosure systems and methods utilizing an auxiliary enclosure |
US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US8383202B2 (en) | 2008-06-13 | 2013-02-26 | Kateeva, Inc. | Method and apparatus for load-locked printing |
US9174433B2 (en) | 2008-06-13 | 2015-11-03 | Kateeva, Inc. | Method and apparatus for load-locked printing |
US9048344B2 (en) | 2008-06-13 | 2015-06-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US20100201749A1 (en) * | 2008-06-13 | 2010-08-12 | Kateeva, Inc. | Method And Apparatus for Load-Locked Printing |
US8235487B2 (en) | 2009-01-05 | 2012-08-07 | Kateeva, Inc. | Rapid ink-charging of a dry ink discharge nozzle |
US20100171780A1 (en) * | 2009-01-05 | 2010-07-08 | Kateeva, Inc. | Rapid Ink-Charging Of A Dry Ink Discharge Nozzle |
US20110008541A1 (en) * | 2009-05-01 | 2011-01-13 | Kateeva, Inc. | Method and apparatus for organic vapor printing |
US8808799B2 (en) | 2009-05-01 | 2014-08-19 | Kateeva, Inc. | Method and apparatus for organic vapor printing |
US8815626B2 (en) | 2011-02-04 | 2014-08-26 | Kateeva, Inc. | Low-profile MEMS thermal printhead die having backside electrical connections |
US8556389B2 (en) | 2011-02-04 | 2013-10-15 | Kateeva, Inc. | Low-profile MEMS thermal printhead die having backside electrical connections |
US11107712B2 (en) | 2013-12-26 | 2021-08-31 | Kateeva, Inc. | Techniques for thermal treatment of electronic devices |
US11489119B2 (en) | 2014-01-21 | 2022-11-01 | Kateeva, Inc. | Apparatus and techniques for electronic device encapsulation |
US11338319B2 (en) | 2014-04-30 | 2022-05-24 | Kateeva, Inc. | Gas cushion apparatus and techniques for substrate coating |
US20150380648A1 (en) * | 2014-06-25 | 2015-12-31 | Universal Display Corporation | Systems and methods of modulating flow during vapor jet deposition of organic materials |
US11220737B2 (en) * | 2014-06-25 | 2022-01-11 | Universal Display Corporation | Systems and methods of modulating flow during vapor jet deposition of organic materials |
US11267012B2 (en) | 2014-06-25 | 2022-03-08 | Universal Display Corporation | Spatial control of vapor condensation using convection |
US11591686B2 (en) | 2014-06-25 | 2023-02-28 | Universal Display Corporation | Methods of modulating flow during vapor jet deposition of organic materials |
WO2016018396A1 (en) * | 2014-07-31 | 2016-02-04 | Hewlett-Packard Development Company, L.P. | Methods and apparatus to control a heater associated with a printing nozzle |
US10566534B2 (en) | 2015-10-12 | 2020-02-18 | Universal Display Corporation | Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP) |
US11121322B2 (en) | 2015-10-12 | 2021-09-14 | Universal Display Corporation | Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP) |
WO2020222824A1 (en) * | 2019-04-30 | 2020-11-05 | Hewlett-Packard Development Company, L.P. | Control of printer heating elements based on input voltages |
Also Published As
Publication number | Publication date |
---|---|
WO2010078587A2 (en) | 2010-07-08 |
KR20110100667A (en) | 2011-09-14 |
JP5135475B2 (en) | 2013-02-06 |
EP2376288A2 (en) | 2011-10-19 |
CN102271922A (en) | 2011-12-07 |
US8235487B2 (en) | 2012-08-07 |
JP2012514837A (en) | 2012-06-28 |
US20100171780A1 (en) | 2010-07-08 |
US20120282840A1 (en) | 2012-11-08 |
WO2010078587A3 (en) | 2010-10-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20100188457A1 (en) | Method and apparatus for controlling the temperature of an electrically-heated discharge nozzle | |
US7121642B2 (en) | Drop volume measurement and control for ink jet printing | |
JP5135433B2 (en) | Control method and control apparatus for controlling thin film lamination | |
US20120056923A1 (en) | Control systems and methods for thermal-jet printing | |
TW200935057A (en) | Assay system and method | |
JP2007117833A (en) | Thin film formation method and thin film forming apparatus | |
US7488054B2 (en) | Film forming device, film forming method, and method for manufacturing electronic appliance | |
JP2003286958A (en) | Liquid feed device | |
WO2012138366A1 (en) | Method and apparatus for printing using a facetted drum | |
JP3986854B2 (en) | Chemical solution coating apparatus and chemical solution management method thereof | |
US7963639B2 (en) | Liquid ejection device | |
TWI252813B (en) | Fluid injector device with sensors and method of manufacturing the same | |
KR101037179B1 (en) | Apparatus and method for checking of temperature controller | |
KR100581855B1 (en) | Ink chamber and system for supplying ink therewith | |
JP3832453B2 (en) | Filter manufacturing method, filter manufacturing apparatus, and display device including filter | |
JP2023168256A (en) | Maintenance assembly for inkjet head, maintenance method for inkjet head, and substrate treatment device including maintenance assembly for inkjet head | |
JP2003279725A (en) | Apparatus for forming film and method for manufacturing the same, device, and apparatus for manufacturing the same | |
JP2019081275A (en) | Liquid discharge method and liquid discharge device | |
JP2009240849A (en) | Coating method/device | |
JP2011131387A (en) | Liquid droplet ejection head, liquid droplet ejection device, and method for manufacturing nozzle substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |