US20100025013A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20100025013A1 US20100025013A1 US12/326,112 US32611208A US2010025013A1 US 20100025013 A1 US20100025013 A1 US 20100025013A1 US 32611208 A US32611208 A US 32611208A US 2010025013 A1 US2010025013 A1 US 2010025013A1
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- US
- United States
- Prior art keywords
- airflow
- guiding
- fin
- heat dissipation
- dissipation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the disclosure relates to heat dissipation devices, and particularly to a heat dissipation device with improved fin structure for achieving a high heat-dissipation efficiency.
- FIG. 8 shows a conventional heat dissipation device 1 .
- the heat dissipation device 1 includes a fin unit 2 , a heat pipe 4 extending through the fin unit 2 , and a cooling fan (not shown) arranged at a side of the fin unit 2 so as to generate an airflow towards the fin unit 2 .
- the fin unit 2 includes a plurality of fins stacked together. Each fin is planar and parallel to each other. A flow channel 3 is formed between two adjacent fins.
- the heat pipe 4 includes an evaporating section for thermally connecting with a heat-generating component and condensing sections extending into through holes of the fin unit 2 and thermally connecting with the fins.
- the heat pipe 4 absorbs heat generated by the heat-generating component.
- the heat is transferred from the evaporating section to the condensing sections and then on to the fins of the fin unit 2 .
- the airflow generated by the cooling fan flows through the flow channels 3 to exchange heat with the fins.
- the heat is dissipated to the surrounding environment by the airflow.
- heat dissipation of the heat-generating component is accomplished.
- the heat dissipation area of the fin unit 2 needs to be increased.
- One way to increase the heat dissipation area of the fin unit 2 is to accommodate more fins or to increase the size of each fin. However, this increases the weight of the heat dissipation device 1 , which conflicts with the requirement for light weight and compactness.
- Another way to increase the heat dissipation area of the fin unit 2 is reducing the spacing distance of two adjacent fins, so that the fin unit 2 can accommodate more fins.
- a laminar air envelope may form at lateral sides of each fin, when the airflow flows through the fin unit 2 .
- the flowing speed of the airflow in the laminar envelope is nearly zero; in the laminar envelope, the main way of heat dissipation of the fins is by heat radiation and the heat exchange effect between the fin unit 2 and the airflow is thus greatly reduced. Accordingly, the heat dissipation effectiveness of the conventional heat dissipation device 1 is limited.
- the heat dissipation device includes a plurality of parallel fins, a heat pipe extending through the fins, and a guiding structure.
- An airflow channel is formed between every two neighboring fins for an airflow flowing therethough.
- the guiding structure is formed on each of the fins for guiding the airflow flowing to the heat pipe.
- a space is defined between the guiding structure and has a width decreasing gradually along a flowing direction of the airflow.
- At least one opening is defined in the guiding structure for communicating airflow at two opposite sides of each fin.
- a height of the guiding structure decreases gradually from the at least one opening towards other sides of the guiding structure.
- FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with a first embodiment.
- FIG. 2 is an isometric view of a fin of the heat dissipation device of FIG. 1 .
- FIG. 3 is a view similar to FIG. 2 , but shown from a different aspect.
- FIG. 4 is an isometric view of a fin in accordance with a second embodiment.
- FIG. 5 is a view similar to FIG. 4 , but shown from a different aspect.
- FIG. 6 is an isometric view of a fin in accordance with a third embodiment.
- FIG. 7 is a view similar to FIG. 6 , but shown from a different aspect.
- FIG. 8 is a side view of a conventional heat dissipation device.
- a heat dissipation device includes a heat sink 10 and a heat pipe 12 .
- the heat pipe 12 includes an evaporation section 121 thermally contacting with an electronic component 14 and a condenser section 122 extending through a central portion of the heat sink 10 .
- the evaporation section 121 absorbs heat generated by the electronic component 14 .
- the heat is transferred from the evaporation section 121 to the condenser section 122 , and then on to the heat sink 10 .
- a cooling fan (not shown) is arranged at one side (i.e., right side of this embodiment) of the heat sink 10 for generating an airflow towards the heat sink 10 as indicated by arrows F.
- the heat sink 10 includes a plurality of fins 11 arranged side by side and parallel to each other.
- each of the fins 11 includes a rectangular main body 110 which has a reference surface 1101 and a base surface 1102 .
- a flow channel 13 is formed between every two neighboring fins 11 to channel the airflow generated by the fan.
- a through hole 1104 is defined in each of the main body 110 of the fins 11 for receiving the condenser section 122 of the heat pipe 12 . The shape and size of the through hole 1104 can change according to the heat pipe 12 .
- a circular flange 1105 extends outwardly from a border of the through hole 1104 of the reference surface 1101 of each fin 11 towards the base surface 1102 of an adjacent fin 11 , and a length of the flange 1105 is nearly equal to a distance between the two adjacent fins 11 .
- the through holes 1104 cooperatively form a columned space for the heat pipe 12 extending through, and the flanges 1105 enclose and contact with the heat pipe 12 , which enlarges the contacting surface area between the heat pipe 12 and the fins 11 . So, heat absorbed by the heat pipe 12 can be quickly transferred to the fins 11 for further dissipation.
- a guiding structure 113 includes two spaced first and second guiding members 1131 , 1132 located adjacent the through hole 1104 and protruding from the reference surface 1101 of each fin 11 .
- Two concave hollows 1151 , 1152 corresponding to the two guiding members 1131 , 1132 are formed in the base surface 1102 of the fin 11 .
- the first guiding member 1131 and the second guiding member 1132 locate at a top side and a bottom side of the through hole 1104 , respectively.
- the first and second guiding members 1131 , 1132 are substantially symmetric to a horizontal axis X-X ( FIG. 3 ) which extends through a center of the through hole 1104 of the fin 11 .
- Each of the first guiding member 1131 and the second guiding member 1132 is substantially straight, and extends aslant from a position adjacent to the flange 1105 towards a corner of the main body 110 , i.e., the first guiding member 1131 extending upward and rightward towards a top corner located at a right side of the fin 11 adjacent to the fan, the second guiding member 1132 extending downward and rightward towards a bottom corner located at the right side of the fin 11 adjacent to the fan.
- a distance between the first guiding member 1131 and the axis X-X decreases gradually along the direction of the airflow (as indicated by the arrows F).
- a distance between the second guiding member 1132 and the axis X-X also decreases gradually along the direction of the airflow.
- the first guiding member 1131 and the second guiding member 1132 cooperatively define a tapered space 1133 therebetween.
- the first guiding member 1131 and the second guiding member 1132 cooperatively form a converged side 114 adjacent to the flange 1105 and a diverged side 118 facing the airflow.
- the airflow flows into the tapered space 1133 via the diverged side 118 of the guiding members 1131 , 1132 .
- the first guiding member 1131 and the second guiding member 1132 guide the airflow towards the converged side 114 .
- the airflow is concentrated at the area of each fin 11 near to the heat pipe 12 . That is, the airflow first flows through the diverged side 118 of the guiding members 1131 , 1132 , then the converged side 114 and finally the heat pipe 12 .
- Each of the first and second guiding members 1131 , 1132 includes a linear inner side 116 facing the space 1133 and an opposite curved outer side 117 away from the space 1133 .
- the inner sides 116 of the guiding members 1131 , 1132 extend aslant along the main body 110 and face the airflow to guide the airflow to the flange 1105 and the through hole 1104 .
- the inner sides 116 function as windward sides of the guiding members 1131 , 1132 .
- the outer side 117 is about C-shaped and smoothly connects with the main body 110 of each fin 11 .
- Each of the first and second guiding members 1131 , 1132 defines an opening 112 in the inner side 116 for communicating with the space 1131 .
- Airflow channels 13 at opposite sides of each fin 11 communicate with each other via the openings 112 .
- a height of each of the guiding members 1131 , 1132 decrease from the inner side 116 towards the outer side 117 .
- a maximal height of each of the guiding members 1131 , 1132 is smaller than the distance between two adjacent fins 11 .
- the maximal height of each of the guiding members 1131 , 1132 equals to a half of the distance between two adjacent fins 11 , and an outmost surface of each of the guiding members 1131 , 1132 is located at a middle of the airflow channel 13 between the two adjacent fins 11 .
- the evaporation section 121 of the heat pipe 12 absorbs heat generated by the heat-generating component 14 .
- Working fluid contained in the heat pipe 12 absorbs heat and evaporates substantially and moves to the condenser section 122 .
- Evaporated working fluid at the condenser section 122 releases the heat to the fins 11 and thus is condensed.
- the condensed working fluid flows back to the evaporation section 121 to begin another cycle. By this way, the working fluid absorbs/releases amounts of heat.
- the heat generated by the heat-generating component 14 is thus transferred by the heat pipe 12 to the fins 11 almost immediately.
- a hot area is formed around the through holes 1104 , which is adjacent to condenser section 122 of the heat pipe 12 in the fins 11 .
- the temperature in this hot area is higher compared to the rest of the fins 11 .
- the first guiding member 1131 and the second guiding member 1132 guide a part of the airflow, which is closer to the reference surface 1101 of each fin 11 , to flow to the hot area around the heat pipe 12 .
- the heat in this area can be efficiently carried away by the portion of airflow.
- Width of the space 1133 formed between the first guiding member 1131 and the second guiding member 1132 decreases gradually along the direction of the airflow, which results in the speed of the airflow being increased to thereby increasing heat dissipation efficiency of the heat sink 10 . Due to the influence of viscosity, a laminar air envelope will be formed on the reference surface 1101 of each fin 11 , when the airflow passes through the flow channel 13 , but if the airflow meets a barrier during its flowing process, a vortex is formed around the barrier.
- the guiding members 1131 , 1132 act as a barrier arranged in the airflow channel 13 , which cause the airflow to form turbulences, thereby destroying the laminar air envelope possibly formed on the reference surface 1101 of each fin 11 .
- the other part of the airflow which is closer to the base surface 1102 of each fin 11 , passes through the airflow channel 13 near the base surface 1102 .
- Arrangement of the concave hollows 1151 , 1152 which function as the guiding members 1131 , 1132 , causes the other part of the airflow to generate turbulences, thereby to prevent the possible laminar air envelop from forming on the base surface 1102 . Heat exchange effect between the airflow and the fins 11 is therefore improved. The heat dissipation efficiency of the heat sink 10 is thus increased.
- the concave hollows 1151 , 1152 are formed when the fin 11 is stamped to form the first and second guiding members 1131 , 1132 .
- FIG. 4 and FIG. 5 illustrate a fin 11 a in accordance with an alternative embodiment.
- the difference of the second embodiment over the first embodiment is that the first and the second guiding members 1131 a, 1132 a are curved, and surround a part of the through hole 1104 .
- Two concave hollows 1151 a, 1152 a corresponding to the two guiding members 1131 a, 1132 a are formed in the base surface 1102 of the fin 11 a.
- Each of the first and second guiding members 1131 a, 1132 a includes an curved inner side 116 a facing the space 1133 a, an opposite curved outer side 117 a away from the space 1133 a, a linear windward side 111 interconnected between ends of the inner side 116 a and the outer side 117 a adjacent to the fan, and a linear leeward side 119 interconnected between ends of the inner side 116 a and the outer side 117 a away from the fan.
- a distance between the inner sides 116 a of the first and the second guiding members 1131 a, 1132 a decreases from the windward sides 111 towards the leeward sides 119 .
- each of the first and the second guiding members 1131 a, 1132 a also decreases from the windward side 111 towards the leeward side 119 .
- the leeward sides 119 of the first and the second guiding members 1131 a, 1132 a connect smoothly with the main body 110 of each fin 11 a.
- An opening 112 a is defined in the windward side 111 of each of the first and the second guiding members 1131 a, 1132 a and faces the airflow.
- Airflow channels 13 at opposite sides of each fin 11 communicate with each other via the openings 112 a.
- the first guiding member 1131 a and the second guiding member 1132 a cooperatively form a converged side 114 a in rear of the flange 1105 and a diverged side 118 a facing the airflow.
- the airflow first flows through the diverged sides 118 a of the guiding members 1131 a, 1132 a, then the heat pipe 12 and finally the converged sides 114 a. That is, the first guiding member 1131 a and the second guiding member 1132 a are capable of guiding the airflow to flow to and concentrate at the area near the heat pipe 12 in each fin 11 a.
- the airflow flows through the space 1133 a, the airflow is concentrated.
- the concentrated airflow with a higher speed flows through the flanges 1105 to take the heat away from condenser section 122 the heat pipe 12 timely.
- FIG. 6 and FIG. 7 illustrate a fin 11 b in accordance with another alternative embodiment.
- the difference of the third embodiment over the second embodiment is that the first guiding member 1131 a and the second guiding member 1132 a are integrated together at the leeward sides 119 of the second embodiment to form an integral guiding structure 113 b of the third embodiment.
- a concave hollow 115 b corresponding to the guiding structure 113 b is formed in the base surface 1102 of each fin 11 b.
- the guiding structure 113 b is generally arc-shaped, and includes a middle portion 1131 b and two sloping side portions 1132 b extending forwardly from the middle portion 1131 b.
- the middle portion 1131 b is curved and forms a converged side 114 b in rear of the heat pipe 12 .
- the two sloping side portions 1132 b each including a linear windward side 111 b facing the airflow.
- a diverged side 118 b is defined between the windward sides 11 lb.
- Two openings 112 b are defined in the windward sides 111 b of the sloping side portions 1132 b respectively.
- the height of the guiding structure 113 b decreases gradually from the windward sides 111 b of the sloping side portions 1132 b towards the middle portion 1131 a.
Abstract
An exemplary heat dissipation device includes a plurality of parallel fins, a heat pipe extending through the fins, and a guiding structure formed on each of the fins. An airflow channel is formed between every two neighboring fins for an airflow flowing therethough. The guiding structure is formed for guiding the airflow to flow to the heat pipe. A space is defined within the guiding structure and has a width decreasing gradually along a flowing direction of the airflow. An opening is defined in the guiding structure for communicating airflow at two opposite sides of each fin. A height of the guiding structure decreases gradually from the opening towards other sides of the guiding structure.
Description
- 1. Technical Field
- The disclosure relates to heat dissipation devices, and particularly to a heat dissipation device with improved fin structure for achieving a high heat-dissipation efficiency.
- 2. Description of related art
- With the advance of large scale integrated circuit technology, and the wide spread of use of computers in all trades and occupations, in order to meet the required improvement in data processing load and request-response times, high speed processors have become faster and faster, which causes the processors to generate redundant heat. Redundant heat which is not quickly removed will have tremendous influence on the system security and performance. Usually, people install a heat sink on the central processor to assist its heat dissipation, whilst also installing a fan on the heat sink, to provide a forced airflow to increase the heat dissipation.
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FIG. 8 shows a conventionalheat dissipation device 1. Theheat dissipation device 1 includes afin unit 2, aheat pipe 4 extending through thefin unit 2, and a cooling fan (not shown) arranged at a side of thefin unit 2 so as to generate an airflow towards thefin unit 2. Thefin unit 2 includes a plurality of fins stacked together. Each fin is planar and parallel to each other. Aflow channel 3 is formed between two adjacent fins. Theheat pipe 4 includes an evaporating section for thermally connecting with a heat-generating component and condensing sections extending into through holes of thefin unit 2 and thermally connecting with the fins. - During operation of the heat-generating component, the
heat pipe 4 absorbs heat generated by the heat-generating component. The heat is transferred from the evaporating section to the condensing sections and then on to the fins of thefin unit 2. At the same time, the airflow generated by the cooling fan flows through theflow channels 3 to exchange heat with the fins. The heat is dissipated to the surrounding environment by the airflow. Thus, heat dissipation of the heat-generating component is accomplished. - For enhancing the heat dissipation effectiveness of this
heat dissipation device 1, the heat dissipation area of thefin unit 2 needs to be increased. One way to increase the heat dissipation area of thefin unit 2 is to accommodate more fins or to increase the size of each fin. However, this increases the weight of theheat dissipation device 1, which conflicts with the requirement for light weight and compactness. Another way to increase the heat dissipation area of thefin unit 2 is reducing the spacing distance of two adjacent fins, so that thefin unit 2 can accommodate more fins. This way may avoid increasing the volume ofheat dissipation device 1; however, reducing the spacing between two adjacent fins of thefin unit 2 will increase the flow resistance, which not only influences the heat dissipation effect but also increases the noise. Also, due to the planar shape of each fin of thefin unit 2, the airflow flows evenly through every part of the fin. However, such an even airflow distribution on the fin cannot effectively take heat from the fin which usually is concentrated at a particular portion of the fin. Thus, the airflow of the conventionalheat dissipation device 1 cannot effectively dissipate the heat in the fins of thefin unit 2. Therefore, the airflow flowing through thefin unit 2 cannot sufficiently assist the heat dissipation of the heat-generating component. Furthermore, due to the influence of viscosity, a laminar air envelope may form at lateral sides of each fin, when the airflow flows through thefin unit 2. The flowing speed of the airflow in the laminar envelope is nearly zero; in the laminar envelope, the main way of heat dissipation of the fins is by heat radiation and the heat exchange effect between thefin unit 2 and the airflow is thus greatly reduced. Accordingly, the heat dissipation effectiveness of the conventionalheat dissipation device 1 is limited. - It is thus desirable to provide a heat dissipation device which can overcome the described limitations.
- The present invention relates to a heat dissipation device. According to an exemplary embodiment of the present invention, the heat dissipation device includes a plurality of parallel fins, a heat pipe extending through the fins, and a guiding structure. An airflow channel is formed between every two neighboring fins for an airflow flowing therethough. The guiding structure is formed on each of the fins for guiding the airflow flowing to the heat pipe. A space is defined between the guiding structure and has a width decreasing gradually along a flowing direction of the airflow. At least one opening is defined in the guiding structure for communicating airflow at two opposite sides of each fin. A height of the guiding structure decreases gradually from the at least one opening towards other sides of the guiding structure.
- Other advantages and novel features of the present invention will become more apparent from the following detailed description of embodiment when taken in conjunction with the accompanying drawings.
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FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with a first embodiment. -
FIG. 2 is an isometric view of a fin of the heat dissipation device ofFIG. 1 . -
FIG. 3 is a view similar toFIG. 2 , but shown from a different aspect. -
FIG. 4 is an isometric view of a fin in accordance with a second embodiment. -
FIG. 5 is a view similar toFIG. 4 , but shown from a different aspect. -
FIG. 6 is an isometric view of a fin in accordance with a third embodiment. -
FIG. 7 is a view similar toFIG. 6 , but shown from a different aspect. -
FIG. 8 is a side view of a conventional heat dissipation device. - Reference will now be made to the drawings to describe the various embodiments in detail.
- Referring to
FIG. 1 , a heat dissipation device according to a first embodiment includes aheat sink 10 and aheat pipe 12. Theheat pipe 12 includes anevaporation section 121 thermally contacting with anelectronic component 14 and acondenser section 122 extending through a central portion of theheat sink 10. Theevaporation section 121 absorbs heat generated by theelectronic component 14. The heat is transferred from theevaporation section 121 to thecondenser section 122, and then on to theheat sink 10. A cooling fan (not shown) is arranged at one side (i.e., right side of this embodiment) of theheat sink 10 for generating an airflow towards theheat sink 10 as indicated by arrows F. - The
heat sink 10 includes a plurality offins 11 arranged side by side and parallel to each other. Referring toFIG. 2 andFIG. 3 , each of thefins 11 includes a rectangularmain body 110 which has areference surface 1101 and abase surface 1102. Aflow channel 13 is formed between every two neighboringfins 11 to channel the airflow generated by the fan. A throughhole 1104 is defined in each of themain body 110 of thefins 11 for receiving thecondenser section 122 of theheat pipe 12. The shape and size of thethrough hole 1104 can change according to theheat pipe 12. Acircular flange 1105 extends outwardly from a border of the throughhole 1104 of thereference surface 1101 of eachfin 11 towards thebase surface 1102 of anadjacent fin 11, and a length of theflange 1105 is nearly equal to a distance between the twoadjacent fins 11. When theheat sink 10 is assembled together, theflanges 1105 of eachfin 11 contact the border of thethrough hole 1104 of thebase surface 1102 of theadjacent fin 11. Thus, the throughholes 1104 cooperatively form a columned space for theheat pipe 12 extending through, and theflanges 1105 enclose and contact with theheat pipe 12, which enlarges the contacting surface area between theheat pipe 12 and thefins 11. So, heat absorbed by theheat pipe 12 can be quickly transferred to thefins 11 for further dissipation. - A guiding
structure 113 includes two spaced first andsecond guiding members hole 1104 and protruding from thereference surface 1101 of eachfin 11. Twoconcave hollows members base surface 1102 of thefin 11. Thefirst guiding member 1131 and thesecond guiding member 1132 locate at a top side and a bottom side of the throughhole 1104, respectively. The first andsecond guiding members FIG. 3 ) which extends through a center of the throughhole 1104 of thefin 11. Each of thefirst guiding member 1131 and thesecond guiding member 1132 is substantially straight, and extends aslant from a position adjacent to theflange 1105 towards a corner of themain body 110, i.e., thefirst guiding member 1131 extending upward and rightward towards a top corner located at a right side of thefin 11 adjacent to the fan, thesecond guiding member 1132 extending downward and rightward towards a bottom corner located at the right side of thefin 11 adjacent to the fan. A distance between thefirst guiding member 1131 and the axis X-X decreases gradually along the direction of the airflow (as indicated by the arrows F). Similarly, a distance between thesecond guiding member 1132 and the axis X-X also decreases gradually along the direction of the airflow. Thus, thefirst guiding member 1131 and thesecond guiding member 1132 cooperatively define a taperedspace 1133 therebetween. - The
first guiding member 1131 and thesecond guiding member 1132 cooperatively form a convergedside 114 adjacent to theflange 1105 and a divergedside 118 facing the airflow. The airflow flows into the taperedspace 1133 via the divergedside 118 of the guidingmembers first guiding member 1131 and thesecond guiding member 1132 guide the airflow towards the convergedside 114. Thus, the airflow is concentrated at the area of eachfin 11 near to theheat pipe 12. That is, the airflow first flows through the divergedside 118 of the guidingmembers side 114 and finally theheat pipe 12. - Each of the first and
second guiding members inner side 116 facing thespace 1133 and an opposite curvedouter side 117 away from thespace 1133. Theinner sides 116 of the guidingmembers main body 110 and face the airflow to guide the airflow to theflange 1105 and the throughhole 1104. Theinner sides 116 function as windward sides of the guidingmembers outer side 117 is about C-shaped and smoothly connects with themain body 110 of eachfin 11. Each of the first andsecond guiding members opening 112 in theinner side 116 for communicating with thespace 1131.Airflow channels 13 at opposite sides of eachfin 11 communicate with each other via theopenings 112. A height of each of the guidingmembers inner side 116 towards theouter side 117. A maximal height of each of the guidingmembers adjacent fins 11. When theheat sink 10 is assembled together, the guidingmembers adjacent fin 11. In this embodiment, the maximal height of each of the guidingmembers adjacent fins 11, and an outmost surface of each of the guidingmembers airflow channel 13 between the twoadjacent fins 11. - During operation of the heat dissipation device, the
evaporation section 121 of theheat pipe 12 absorbs heat generated by the heat-generatingcomponent 14. Working fluid contained in theheat pipe 12 absorbs heat and evaporates substantially and moves to thecondenser section 122. Evaporated working fluid at thecondenser section 122 releases the heat to thefins 11 and thus is condensed. Finally, the condensed working fluid flows back to theevaporation section 121 to begin another cycle. By this way, the working fluid absorbs/releases amounts of heat. The heat generated by the heat-generatingcomponent 14 is thus transferred by theheat pipe 12 to thefins 11 almost immediately. - As the
fins 11 are likely to have significant heat resistance, a hot area is formed around the throughholes 1104, which is adjacent tocondenser section 122 of theheat pipe 12 in thefins 11. The temperature in this hot area is higher compared to the rest of thefins 11. After the forced airflow generated by the fan flows into theairflow channel 13, thefirst guiding member 1131 and thesecond guiding member 1132 guide a part of the airflow, which is closer to thereference surface 1101 of eachfin 11, to flow to the hot area around theheat pipe 12. Thus, the heat in this area can be efficiently carried away by the portion of airflow. Width of thespace 1133 formed between thefirst guiding member 1131 and thesecond guiding member 1132 decreases gradually along the direction of the airflow, which results in the speed of the airflow being increased to thereby increasing heat dissipation efficiency of theheat sink 10. Due to the influence of viscosity, a laminar air envelope will be formed on thereference surface 1101 of eachfin 11, when the airflow passes through theflow channel 13, but if the airflow meets a barrier during its flowing process, a vortex is formed around the barrier. The guidingmembers airflow channel 13, which cause the airflow to form turbulences, thereby destroying the laminar air envelope possibly formed on thereference surface 1101 of eachfin 11. The other part of the airflow, which is closer to thebase surface 1102 of eachfin 11, passes through theairflow channel 13 near thebase surface 1102. Arrangement of theconcave hollows members base surface 1102. Heat exchange effect between the airflow and thefins 11 is therefore improved. The heat dissipation efficiency of theheat sink 10 is thus increased. Theconcave hollows fin 11 is stamped to form the first andsecond guiding members -
FIG. 4 andFIG. 5 illustrate afin 11 a in accordance with an alternative embodiment. The difference of the second embodiment over the first embodiment is that the first and thesecond guiding members hole 1104. Twoconcave hollows members base surface 1102 of thefin 11 a. Each of the first andsecond guiding members inner side 116 a facing thespace 1133 a, an opposite curvedouter side 117 a away from thespace 1133 a, a linearwindward side 111 interconnected between ends of theinner side 116 a and theouter side 117 a adjacent to the fan, and a linearleeward side 119 interconnected between ends of theinner side 116 a and theouter side 117 a away from the fan. A distance between theinner sides 116 a of the first and thesecond guiding members windward sides 111 towards theleeward sides 119. The height of each of the first and thesecond guiding members windward side 111 towards theleeward side 119. Theleeward sides 119 of the first and thesecond guiding members main body 110 of eachfin 11 a. Anopening 112 a is defined in thewindward side 111 of each of the first and thesecond guiding members Airflow channels 13 at opposite sides of eachfin 11 communicate with each other via theopenings 112 a. - The
first guiding member 1131 a and thesecond guiding member 1132 a cooperatively form a convergedside 114 a in rear of theflange 1105 and a divergedside 118 a facing the airflow. The airflow first flows through the divergedsides 118 a of the guidingmembers heat pipe 12 and finally the convergedsides 114 a. That is, thefirst guiding member 1131 a and thesecond guiding member 1132 a are capable of guiding the airflow to flow to and concentrate at the area near theheat pipe 12 in eachfin 11 a. When the airflow flows through thespace 1133 a, the airflow is concentrated. The concentrated airflow with a higher speed flows through theflanges 1105 to take the heat away fromcondenser section 122 theheat pipe 12 timely. -
FIG. 6 andFIG. 7 illustrate afin 11 b in accordance with another alternative embodiment. The difference of the third embodiment over the second embodiment is that thefirst guiding member 1131 a and thesecond guiding member 1132 a are integrated together at theleeward sides 119 of the second embodiment to form anintegral guiding structure 113 b of the third embodiment. A concave hollow 115 b corresponding to the guidingstructure 113 b is formed in thebase surface 1102 of eachfin 11 b. The guidingstructure 113 b is generally arc-shaped, and includes amiddle portion 1131 b and twosloping side portions 1132 b extending forwardly from themiddle portion 1131 b. Themiddle portion 1131 b is curved and forms a convergedside 114 b in rear of theheat pipe 12. The twosloping side portions 1132 b each including a linearwindward side 111 b facing the airflow. A divergedside 118 b is defined between thewindward sides 11 lb. Twoopenings 112 b are defined in thewindward sides 111 b of thesloping side portions 1132 b respectively. The height of the guidingstructure 113 b decreases gradually from thewindward sides 111 b of thesloping side portions 1132 b towards themiddle portion 1131 a. - It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (14)
1. A heat dissipation device comprising:
a plurality of parallel fins with an airflow channel formed between every two neighboring fins for an airflow flowing therethough;
a heat pipe extending through the fins; and
a guiding structure being formed on each of the fins for guiding the airflow flowing to the heat pipe, a space being defined within the guiding structure and having a width decreasing gradually along a flowing direction of the airflow, at least one opening being defined in the guiding structure for communicating airflow at two opposite sides of each fin, a height of the guiding structure decreasing gradually from the at least one opening towards other sides of the guiding structure.
2. The heat dissipation device of claim 1 , wherein the guiding structure comprises two guiding members protruding from a reference surface of each fin, the two guiding members arranged symmetrically to the heat pipe.
3. The heat dissipation device of claim 2 , wherein each of the guiding members comprises a linear inner side facing the space and an opposite curved outer side, the at least one opening having two in number, the openings being defined in the inner sides of the two guiding members respectively, the height of each guiding member with respect to the reference surface of the each fin decreasing gradually from the inner side towards the outer side.
4. The heat dissipation device of claim 3 , wherein the outer sides of the guiding members smoothly connect with the reference surface of each fin.
5. The heat dissipation device of claim 3 , wherein the guiding members cooperatively form a converged side adjacent to the heat pipe and a diverged side facing the airflow, the airflow flowing first into the space via the diverged side, then being guided towards the converged side, and finally being concentrated at an area of each fin near to the heat pipe.
6. The heat dissipation device of claim 2 , wherein each of the guiding members comprises a curved inner side facing the space, an opposite curved outer side away from the space, a windward side interconnected between ends of the inner side and the outer side facing the airflow, and a leeward side interconnected between ends of the inner side and the outer side away from the airflow, the at least one opening having two in number, the openings being defined in the windward sides of the guiding members respectively.
7. The heat dissipation device of claim 6 , wherein the height of each guiding member with respect to the reference surface of each fin decreases gradually from the windward side towards the leeward side.
8. The heat dissipation device of claim 7 , wherein the leeward sides of the guiding members smoothly connect with the reference surface of each fin.
9. The heat dissipation device of claim 6 , wherein the guiding members cooperatively form a diverged side facing the airflow and a converged side in rear of the heat pipe, and the airflow flows into the space via the diverged side and then is concentrated at the converged side after flowing through the heat pipe.
10. The heat dissipation device of claim 1 , wherein the guiding structure comprises a middle portion and two sloping side portions extending from the middle portion, and the middle portion is curved and forms a converged side in rear of the heat pipe, the two sloping side portions each comprising a linear windward side facing the airflow, the at least one opening having two in number, the openings being defined in the windward sides of the sloping side portions, respectively, a diverged side being formed between the linear windward sides of the sloping side portions.
11. The heat dissipation device of claim 10 , wherein the guiding structure protrudes from a reference surface of each fin, the height of the guiding structure decreasing gradually from the windward sides of the sloping side portions towards the middle portion.
12. A heat dissipation device comprising:
a plurality of fins arranged side by side, each fin defining a hole, a flange extending from a reference surface of the each fin around the hole, an airflow channel being formed between every two neighboring fins for an airflow flowing therethough;
a heat pipe extending through the hole and thermally connecting with the flange; and
two guiding members protruding from the reference surface for guiding the airflow flowing to the heat pipe, a space being defined between the two guiding members and having a width decreasing gradually along a flowing direction of the airflow, each of the guiding members comprising a linear windward side facing the airflow, two openings being defined in the windward sides of the two guiding members respectively, the openings being configured for communicating the airflow at two opposite sides of each fin.
13. The heat dissipation device of claim 12 , wherein the two guiding members are arranged symmetrically to the heat pipe, each of the guiding members comprising a linear inner side functioning as the windward side and an opposite curved outer side, the openings being defined in the inner sides of the two guiding members respectively, a height of each guiding member decreasing gradually from the inner side towards the outer side.
14. The heat dissipation device of claim 12 , wherein the two guiding members are arranged symmetrically to the heat pipe, each of the guiding members comprising a curved inner side facing the space, an opposite curved outer side away from the space, the windward side interconnected between ends of the inner side and the outer side facing the airflow, and a leeward side interconnected between ends of the inner side and the outer side away from the airflow, a height of each guiding member decreasing gradually from the windward side towards the leeward side.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810303275.7 | 2008-07-31 | ||
CN2008103032757A CN101641005B (en) | 2008-07-31 | 2008-07-31 | Radiating device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100025013A1 true US20100025013A1 (en) | 2010-02-04 |
Family
ID=41607144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/326,112 Abandoned US20100025013A1 (en) | 2008-07-31 | 2008-12-02 | Heat dissipation device |
Country Status (2)
Country | Link |
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US (1) | US20100025013A1 (en) |
CN (1) | CN101641005B (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US20100181051A1 (en) * | 2009-01-20 | 2010-07-22 | Wistron Corporation | Heat-Dissipating Fin, Heat-Dissipating Device, And Method For Enhancing Heat Dissipation Effect Of A Heat-Dissipating Fin |
US20120103573A1 (en) * | 2010-11-03 | 2012-05-03 | Enermax Technology Corpof | Heat dissipating apparatus with vortex generator |
US20120103572A1 (en) * | 2010-11-03 | 2012-05-03 | Enermax Technology Corporation | Heat dissipating apparatus with vortex generator |
US9299906B2 (en) * | 2010-09-29 | 2016-03-29 | Valeo Systemes Thermiques | Thermoelectric device, in particular intended to generate an electric current in a motor vehicle |
US20170248326A1 (en) * | 2016-02-25 | 2017-08-31 | Halton Oy | Apparatus for conditioning a space |
US20170278198A1 (en) * | 2011-10-19 | 2017-09-28 | Facebook, Inc. | Social Ad Hoc Networking Protocol and Presentation Layer |
CN114111120A (en) * | 2021-11-18 | 2022-03-01 | 珠海格力电器股份有限公司 | Falling film type finned tube heat exchanger and air conditioning system |
US20220136784A1 (en) * | 2020-10-30 | 2022-05-05 | Asrock Inc. | Heat dissipation fin and heat dissipation module |
Families Citing this family (3)
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CN104949315B (en) * | 2015-06-24 | 2017-12-22 | 珠海格力电器股份有限公司 | Radiator, controller and air conditioner |
CN107678235B (en) * | 2016-08-01 | 2021-03-09 | 台达电子工业股份有限公司 | Fluorescent color wheel |
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US6364009B1 (en) * | 1999-11-24 | 2002-04-02 | 3Com Corporation | Cooling devices |
US6349761B1 (en) * | 2000-12-27 | 2002-02-26 | Industrial Technology Research Institute | Fin-tube heat exchanger with vortex generator |
US20040200608A1 (en) * | 2003-04-11 | 2004-10-14 | Baldassarre Gregg J. | Plate fins with vanes for redirecting airflow |
US20070188992A1 (en) * | 2006-02-10 | 2007-08-16 | Foxconn Technology Co., Ltd. | Heat sink |
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Publication number | Priority date | Publication date | Assignee | Title |
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US20100181051A1 (en) * | 2009-01-20 | 2010-07-22 | Wistron Corporation | Heat-Dissipating Fin, Heat-Dissipating Device, And Method For Enhancing Heat Dissipation Effect Of A Heat-Dissipating Fin |
US9299906B2 (en) * | 2010-09-29 | 2016-03-29 | Valeo Systemes Thermiques | Thermoelectric device, in particular intended to generate an electric current in a motor vehicle |
US20120103573A1 (en) * | 2010-11-03 | 2012-05-03 | Enermax Technology Corpof | Heat dissipating apparatus with vortex generator |
US20120103572A1 (en) * | 2010-11-03 | 2012-05-03 | Enermax Technology Corporation | Heat dissipating apparatus with vortex generator |
US9163884B2 (en) * | 2010-11-03 | 2015-10-20 | Enermax Technology Corporation | Heat dissipating apparatus with vortex generator |
US20170278198A1 (en) * | 2011-10-19 | 2017-09-28 | Facebook, Inc. | Social Ad Hoc Networking Protocol and Presentation Layer |
US20170248326A1 (en) * | 2016-02-25 | 2017-08-31 | Halton Oy | Apparatus for conditioning a space |
US11262085B2 (en) * | 2016-02-25 | 2022-03-01 | Halton Oy | Apparatus for conditioning a space |
US20220136784A1 (en) * | 2020-10-30 | 2022-05-05 | Asrock Inc. | Heat dissipation fin and heat dissipation module |
US11781818B2 (en) * | 2020-10-30 | 2023-10-10 | Asrock Inc. | Heat dissipation fin and heat dissipation module |
CN114111120A (en) * | 2021-11-18 | 2022-03-01 | 珠海格力电器股份有限公司 | Falling film type finned tube heat exchanger and air conditioning system |
Also Published As
Publication number | Publication date |
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CN101641005B (en) | 2011-08-31 |
CN101641005A (en) | 2010-02-03 |
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