US20100002384A1 - Heat dissipating device and supporting element thereof - Google Patents
Heat dissipating device and supporting element thereof Download PDFInfo
- Publication number
- US20100002384A1 US20100002384A1 US12/237,710 US23771008A US2010002384A1 US 20100002384 A1 US20100002384 A1 US 20100002384A1 US 23771008 A US23771008 A US 23771008A US 2010002384 A1 US2010002384 A1 US 2010002384A1
- Authority
- US
- United States
- Prior art keywords
- circuit board
- pair
- heat
- sidewalls
- bracket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
Definitions
- the present invention relates to a heat dissipating device and a supporting element thereof.
- the number of electronic components in a server continually increases to meet demands for high performance while at the same time efforts are made to reduce or at least maintain the same amount of space occupied by the components.
- the servers usually have a plurality of receiving spaces to receive hard disk drives. However, if the receiving spaces are not occupied, dummy blocks are used to keep air flow in the server enclosure uniform thereby limiting the flowrate of air into the enclosure.
- FIG. 1 is an exploded view of a first embodiment of a heat dissipating device.
- FIG. 2 is an assembled view of the heat dissipating device of FIG. 1 .
- FIG. 3 is an exploded view of a second embodiment of a heat dissipating device.
- a first embodiment of a heat dissipating device 100 includes a supporting element 10 , a heat dissipater 20 , such as a blower, and a circuit board 30 to power the heat dissipater 20 .
- the supporting element 10 includes a bracket 40 and a cover 50 .
- the bracket 40 includes an outside wall 42 , an inside wall 44 in parallel to the outside wall 42 , a pair of sidewalls 46 extending substantially perpendicularly from opposite ends of the outside wall 42 and opposite ends of the inside wall 44 , and a rectangular bottom wall 48 substantially perpendicularly positioned between the sidewalls 46 and connected to the inside wall 44 .
- the outside wall 42 , the inside wall 44 , and the sidewalls 46 cooperatively define a hollow chamber 43 .
- the inside wall 44 , the sidewalls 46 , and the bottom wall 48 cooperatively define a receiving cavity (not shown) to receive the heat dissipater 20 .
- a plurality of air inlets 424 is defined in the outside wall 42 to communicate the receiving cavity with the outside.
- An air intake 442 is defined in the inside wall 44 , to communicate with the air inlets 424 via the hollow chamber 43 .
- Two slots 462 are defined in an end portion of each of the sidewalls 46 .
- Four latches 482 extend from corners of the bottom wall 48 .
- the cover 50 includes a top plate 52 , a pair of side plates 54 extending substantially perpendicularly from opposite sides of the top plate 52 , and an end plate 58 extending substantially perpendicularly from an end edge of the top plate 52 .
- a pair of latching blocks 522 extends from a lower portion of each side plates 54 , corresponding to the plurality of latches 482 .
- An air outlet 582 is defined in the end plate 58 .
- a through hole 584 is defined in the end plate 58 , for allowing a power line 22 of the heat dissipater 20 to extend therethrough.
- the circuit board 30 includes a first power connector 32 positioned on the circuit board 30 , a second power connector 34 positioned on the circuit board 30 , and two pairs of protrusions 36 having different sizes. Each pair of protrusions 36 extends from opposite ends of the circuit board 30 .
- the first connector 32 is electrically communicating with the second connector 34 .
- the second connector 34 is connected to the heat dissipater 20 via the power line 22 of the heat dissipater 20 .
- the heat dissipater 20 is received in the receiving cavity of the bracket 40 .
- the cover 50 is attached to the bracket 40 to shield the heat dissipater 20 , by engaging the plurality of latching blocks 522 with the plurality of latches 482 .
- the circuit board 30 is attached to the sidewalls 46 of the bracket 40 by engaging the protrusions 36 in the slots 462 .
- the heat dissipating device 100 is inserted into a hard disk drive (HDD) receiving spaces of an electrical device such as a server enclosure.
- the first connector 32 is connected to an HDD power interface (not shown) of the server enclosure to power the heat dissipater 20 .
- the heat dissipater 20 is configured to bring in outside air into the cover 50 via the air inlet 424 and the intake 442 . The air is then guided into the enclosure body via the air outlet 582 to cool the server enclosure.
- a second embodiment of a heat dissipating device 200 includes a supporting element 60 , the heat dissipater 20 , and the circuit board 30 .
- the supporting element 60 includes a bracket 70 and a cover 80 .
- the bracket 70 of the second embodiment is similar to the bracket 40 of the first embodiment except that the bracket 70 of the second embodiment includes a pair of sidewalls 46 , in which two slots 762 , instead of the plurality of latches 482 , are defined in a lower portion of each of the sidewalls 76 near the inside wall 74 , corresponding to the four latching blocks 822 .
- the cover 80 is attached to the bracket 70 to shield the heat dissipater 20 , with the four latching blocks 822 of the cover 80 engaging in the four slots 762 of the sidewalls 74 .
Abstract
Description
- The present application is related to a copending U.S. patent application, titled “SERVER ENCLOSURE”, with the application Ser. No. (not yet assigned) assigned to the same assignee as the present application, the disclosure of which is incorporated herein by reference, filed concurrently herewith.
- 1. Field of the Invention
- The present invention relates to a heat dissipating device and a supporting element thereof.
- 2. Description of Related Art
- The number of electronic components in a server continually increases to meet demands for high performance while at the same time efforts are made to reduce or at least maintain the same amount of space occupied by the components. Thus, the density of the components in servers increases, leading to heat dissipation problems. The servers usually have a plurality of receiving spaces to receive hard disk drives. However, if the receiving spaces are not occupied, dummy blocks are used to keep air flow in the server enclosure uniform thereby limiting the flowrate of air into the enclosure.
- Therefore, it is desired to provide a convenient detachable heat dissipating device to overcome the above-described shortcoming.
-
FIG. 1 is an exploded view of a first embodiment of a heat dissipating device. -
FIG. 2 is an assembled view of the heat dissipating device ofFIG. 1 . -
FIG. 3 is an exploded view of a second embodiment of a heat dissipating device. - Referring to
FIG. 1 , a first embodiment of aheat dissipating device 100 includes a supportingelement 10, aheat dissipater 20, such as a blower, and acircuit board 30 to power theheat dissipater 20. The supportingelement 10 includes abracket 40 and acover 50. - The
bracket 40 includes anoutside wall 42, aninside wall 44 in parallel to theoutside wall 42, a pair ofsidewalls 46 extending substantially perpendicularly from opposite ends of theoutside wall 42 and opposite ends of theinside wall 44, and arectangular bottom wall 48 substantially perpendicularly positioned between thesidewalls 46 and connected to theinside wall 44. Theoutside wall 42, theinside wall 44, and thesidewalls 46 cooperatively define ahollow chamber 43. Theinside wall 44, thesidewalls 46, and thebottom wall 48 cooperatively define a receiving cavity (not shown) to receive theheat dissipater 20. A plurality ofair inlets 424 is defined in theoutside wall 42 to communicate the receiving cavity with the outside. Anair intake 442 is defined in theinside wall 44, to communicate with theair inlets 424 via thehollow chamber 43. Twoslots 462 are defined in an end portion of each of thesidewalls 46. Fourlatches 482 extend from corners of thebottom wall 48. - The
cover 50 includes atop plate 52, a pair ofside plates 54 extending substantially perpendicularly from opposite sides of thetop plate 52, and anend plate 58 extending substantially perpendicularly from an end edge of thetop plate 52. A pair oflatching blocks 522 extends from a lower portion of eachside plates 54, corresponding to the plurality oflatches 482. Anair outlet 582 is defined in theend plate 58. A throughhole 584 is defined in theend plate 58, for allowing apower line 22 of theheat dissipater 20 to extend therethrough. - The
circuit board 30 includes afirst power connector 32 positioned on thecircuit board 30, asecond power connector 34 positioned on thecircuit board 30, and two pairs ofprotrusions 36 having different sizes. Each pair ofprotrusions 36 extends from opposite ends of thecircuit board 30. Thefirst connector 32 is electrically communicating with thesecond connector 34. Thesecond connector 34 is connected to theheat dissipater 20 via thepower line 22 of theheat dissipater 20. - Referring to
FIG. 2 , theheat dissipater 20 is received in the receiving cavity of thebracket 40. In one embodiment, thecover 50 is attached to thebracket 40 to shield theheat dissipater 20, by engaging the plurality oflatching blocks 522 with the plurality oflatches 482. Thecircuit board 30 is attached to thesidewalls 46 of thebracket 40 by engaging theprotrusions 36 in theslots 462. - In use, the
heat dissipating device 100 is inserted into a hard disk drive (HDD) receiving spaces of an electrical device such as a server enclosure. Thefirst connector 32 is connected to an HDD power interface (not shown) of the server enclosure to power theheat dissipater 20. Theheat dissipater 20 is configured to bring in outside air into thecover 50 via theair inlet 424 and theintake 442. The air is then guided into the enclosure body via theair outlet 582 to cool the server enclosure. - Referring to
FIG. 3 , a second embodiment of aheat dissipating device 200 includes a supportingelement 60, theheat dissipater 20, and thecircuit board 30. The supportingelement 60 includes abracket 70 and acover 80. Thebracket 70 of the second embodiment is similar to thebracket 40 of the first embodiment except that thebracket 70 of the second embodiment includes a pair ofsidewalls 46, in which twoslots 762, instead of the plurality oflatches 482, are defined in a lower portion of each of the sidewalls 76near theinside wall 74, corresponding to the fourlatching blocks 822. In assembly, thecover 80 is attached to thebracket 70 to shield theheat dissipater 20, with the fourlatching blocks 822 of thecover 80 engaging in the fourslots 762 of thesidewalls 74. - It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiment, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the embodiment to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (13)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810302524.0 | 2008-07-04 | ||
CN200810302524 | 2008-07-04 | ||
CN2008103025240A CN101621915B (en) | 2008-07-04 | 2008-07-04 | Heat dissipating device and bracket thereof |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/313,473 Continuation US8652270B2 (en) | 2007-09-28 | 2011-12-07 | Methods for treating a ferrous metal substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
US20100002384A1 true US20100002384A1 (en) | 2010-01-07 |
US7652881B1 US7652881B1 (en) | 2010-01-26 |
Family
ID=41464201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/237,710 Expired - Fee Related US7652881B1 (en) | 2008-07-04 | 2008-09-25 | Heat dissipating device and supporting element thereof |
Country Status (2)
Country | Link |
---|---|
US (1) | US7652881B1 (en) |
CN (1) | CN101621915B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102231085A (en) * | 2009-10-22 | 2011-11-02 | 鸿富锦精密工业(深圳)有限公司 | External radiating device for laptop |
JP6057715B2 (en) | 2010-10-29 | 2017-01-11 | オリンパス株式会社 | Optical measuring device and probe device |
EP2641526A4 (en) | 2011-04-18 | 2014-09-17 | Olympus Medical Systems Corp | Optical measurement device, endoscopic system and optical measurement program |
EP2653854B1 (en) | 2011-04-21 | 2014-12-31 | Olympus Medical Systems Corp. | Optical measuring system and calibration method |
EP2604173A4 (en) | 2011-04-26 | 2014-12-10 | Olympus Medical Systems Corp | Optical measuring device |
TWI424122B (en) * | 2011-06-15 | 2014-01-21 | Adlink Technology Inc | Electronic system Replaceable USB fan module |
US8503177B2 (en) * | 2011-08-04 | 2013-08-06 | Adlink Technology Inc. | Detachable USB fan module mounting structure |
CN102958322A (en) * | 2011-08-25 | 2013-03-06 | 鸿富锦精密工业(深圳)有限公司 | Air director |
US8857204B2 (en) | 2011-09-23 | 2014-10-14 | R4 Ventures Llc | Real time individual electronic enclosure cooling system |
US8899061B2 (en) | 2011-09-23 | 2014-12-02 | R4 Ventures, Llc | Advanced multi-purpose, multi-stage evaporative cold water/cold air generating and supply system |
US9600044B2 (en) * | 2015-05-12 | 2017-03-21 | Cooler Master Co., Ltd. | Portable electronic device and detachable auxiliary heat-dissipating module thereof |
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US5862037A (en) * | 1997-03-03 | 1999-01-19 | Inclose Design, Inc. | PC card for cooling a portable computer |
US5898568A (en) * | 1997-07-25 | 1999-04-27 | Cheng; Chun-Cheng | External heat dissipator accessory for a notebook computer |
US6058009A (en) * | 1998-07-14 | 2000-05-02 | Dell Usa, L.P. | Computer with improved internal cooling system |
US6071082A (en) * | 1999-05-26 | 2000-06-06 | 3Com Corporation | Method of orientating an apparatus for housing fans |
US6239971B1 (en) * | 2000-07-27 | 2001-05-29 | Ming-Chuan Yu | Cooling rack for notebook computer |
US6459575B1 (en) * | 2001-05-15 | 2002-10-01 | Hewlett-Packard Company | Cooling module for portable computer |
US6549406B1 (en) * | 2002-05-09 | 2003-04-15 | Sun Microsystems, Inc. | Fan tray assembly for an electronics enclosure |
US20080124234A1 (en) * | 2006-11-02 | 2008-05-29 | Jaime Echazarreta | Fan tray assembly shaped Venturi |
US7532470B2 (en) * | 2005-11-30 | 2009-05-12 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US7564681B2 (en) * | 2006-06-21 | 2009-07-21 | Chien-Chang Chen | External heat dissipator detachably adapted to a heat source to force away heat generated by the heat source |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN2522919Y (en) * | 2001-12-06 | 2002-11-27 | 豪达工业股份有限公司 | Rapid-radiating-assembling radiator for computer |
CN2583936Y (en) * | 2002-11-21 | 2003-10-29 | 陞技电脑股份有限公司 | Radiator for circuit board |
CN2886654Y (en) * | 2005-11-08 | 2007-04-04 | 徐学琳 | Heat radiating device for display card |
CN100544568C (en) * | 2006-07-12 | 2009-09-23 | 富准精密工业(深圳)有限公司 | Heat abstractor |
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2008
- 2008-07-04 CN CN2008103025240A patent/CN101621915B/en not_active Expired - Fee Related
- 2008-09-25 US US12/237,710 patent/US7652881B1/en not_active Expired - Fee Related
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5862037A (en) * | 1997-03-03 | 1999-01-19 | Inclose Design, Inc. | PC card for cooling a portable computer |
US6104607A (en) * | 1997-03-03 | 2000-08-15 | Inclose Design, Inc. | Cooling fan for PC card slot |
US5898568A (en) * | 1997-07-25 | 1999-04-27 | Cheng; Chun-Cheng | External heat dissipator accessory for a notebook computer |
US6058009A (en) * | 1998-07-14 | 2000-05-02 | Dell Usa, L.P. | Computer with improved internal cooling system |
US6071082A (en) * | 1999-05-26 | 2000-06-06 | 3Com Corporation | Method of orientating an apparatus for housing fans |
US6239971B1 (en) * | 2000-07-27 | 2001-05-29 | Ming-Chuan Yu | Cooling rack for notebook computer |
US6459575B1 (en) * | 2001-05-15 | 2002-10-01 | Hewlett-Packard Company | Cooling module for portable computer |
US6549406B1 (en) * | 2002-05-09 | 2003-04-15 | Sun Microsystems, Inc. | Fan tray assembly for an electronics enclosure |
US7532470B2 (en) * | 2005-11-30 | 2009-05-12 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US7564681B2 (en) * | 2006-06-21 | 2009-07-21 | Chien-Chang Chen | External heat dissipator detachably adapted to a heat source to force away heat generated by the heat source |
US20080124234A1 (en) * | 2006-11-02 | 2008-05-29 | Jaime Echazarreta | Fan tray assembly shaped Venturi |
Also Published As
Publication number | Publication date |
---|---|
US7652881B1 (en) | 2010-01-26 |
CN101621915B (en) | 2011-07-27 |
CN101621915A (en) | 2010-01-06 |
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Legal Events
Date | Code | Title | Description |
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AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SUN, ZHENG-HENG;REEL/FRAME:021587/0249 Effective date: 20080811 |
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FPAY | Fee payment |
Year of fee payment: 4 |
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FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.) |
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LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.) |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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FP | Expired due to failure to pay maintenance fee |
Effective date: 20180126 |