US20080178535A1 - Graded drilling cutter - Google Patents
Graded drilling cutter Download PDFInfo
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- US20080178535A1 US20080178535A1 US12/020,247 US2024708A US2008178535A1 US 20080178535 A1 US20080178535 A1 US 20080178535A1 US 2024708 A US2024708 A US 2024708A US 2008178535 A1 US2008178535 A1 US 2008178535A1
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- gradient
- compact
- abrasive
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- particle size
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
Abstract
In an embodiment, an abrasive compact includes ultra-hard particles which are sintered, bonded, or otherwise consolidated into a solid body. The compact also includes various physical characteristics having a continuous gradient, a multiaxial gradient, or multiple independent gradients.
Description
- This application claims priority to U.S. Provisional Patent Application No. 60/886,711, filed on Jan. 26, 2007.
- Not Applicable
- 1. Technical Field
- This application relates to abrasive compacts with various physical characteristics, such as compacts having a continuous gradient, a multiaxial gradient, or multiple independent gradients.
- 2. Description of the Related Art
- Abrasive compacts are widely used in drilling, boring, cutting, milling, grinding and other material removal operations. Abrasive compacts include ultra-hard particles sintered, bonded, or otherwise consolidated into a solid body. Ultra-hard particles may include natural or synthetic diamond, cubic boron nitride (CBN), carbo-nitride (CN) compounds, boron-carbon-nitrogen-oxygen (BCNO) compounds, or any material with hardness greater than that of boron carbide. The ultra-hard particles may be single crystals, polycrystalline aggregates or both.
- In commerce, abrasive compacts are sometimes referred to as polycrystalline diamond (PCD), or diamond compacts when based on diamond. Abrasive compacts based on CBN are often called polycrystalline cubic boron nitride (PCBN) or CBN compacts. Abrasive compacts from which residual sintering catalysts have been partially or totally removed are sometimes called leached or thermally stable compacts. Abrasive compacts integrated with cemented carbide or other substrates are sometimes called supported compacts.
- Abrasive compacts are useful for demanding applications requiring resistance to abrasion, corrosion, thermal stress, impact resistance, and strength. Design compromises for these abrasive compacts arise from the difficulty of attaching the abrasive compact to supporting substrates, sintering process limitations, or balancing inversely varying properties, such as the need for sintering additives an their effect on corrosion resistance. Prior art abrasive compacts use layered microstructures to overcome some of these design compromises. The prior art's transition between layers with different ultra-hard particle sizes is shown in
FIG. 1 , where a uniformfine particle region 111, withfine particles 114 and uniformlycoarse region 112 and respectively 113, are visible.FIG. 2 shows the abrupt change in particle size of the compact ofFIG. 1 that appears 550 microns from the active cutting surface of the cutter. - Prior art compacts also use abrupt chemical transitions.
FIG. 3 , an electron micrograph, illustrates acatalyst concentration change region 211 is near theactive cutting surface 217. The catalyst metal is visible in the metalrich region 212 as a fine network of light gray lines. The transition also may be shown by electron beam microprobe analysis conducted along the line heading from onesurface 215 to another 216.FIG. 4 graphically illustrates the five-fold reduction in catalyst concentration of the cutter ofFIG. 3 along the line betweensurfaces - The abrupt transitions in physical properties or structure of prior art abrasive compacts are also supported by patent drawings of, for example, U.S. Pat. No. 5,135,061, U.S. Pat. No. 6,187,068, and U.S. Pat. No. 4,604,106, the disclosures of which are incorporated herein by reference in their entirety. The foregoing abrasive compacts all contain discrete layers of essentially uniform physical characteristics with abrupt transitions between the regions. Abrupt transitions in physical, chemical or structural characteristics can reduce performance of abrasive compacts.
- In an embodiment, an abrasive compact includes a plurality of superabrasive particles consolidated into a solid mass. The particles have a characteristic gradient that is continuous, monotonic and uniaxial.
- Optionally, the characteristic gradient is a particle size gradient. Additionally, the maximum rate of change of particle size along an axis may be less than 1 micron of diameter per 1 micron of translation.
- Alternatively, the characteristic gradient may be a pore size gradient. Additionally, the maximum rate of change of pore size along an axis may be less than 1 micron of diameter per 1 micron of translation.
- As another option, the characteristic gradient may be a particle shape gradient. Additionally, the maximum rate of change of particle aspect ratio along an axis may be less than 0.1 per 1 micron of translation.
- In yet another option, the characteristic gradient may be a superabrasive particle concentration.
- In another embodiment, an abrasive compact includes superabrasive material consolidated into a solid mass. This mass has at least two characteristic gradients that are each continuous. The gradients may be (i) monotonic and uniaxial or (ii) oscillating.
- In an embodiment, a method of creating an abrasive compact includes starting with a group of ultra-hard particles, such as a prepared synthetic diamonds, with a range of particle sizes. The particles are combined and mixed with alcohol or another fluid to create a mixed slurry. The slurry is allowed to settle or otherwise separate. The mixed slurry settles into a substantially solid, graded layer, optionally in which more of the coarse particles have first settled and more of the finest particles have settled last. Most, if not all, remaining liquid is removed by drying, centrifugation, or another method. A portion of the graded layer is then removed and processed by sintering, typically under HPHT conditions, to create an abrasive compact. A portion of the graded layer optionally may be placed against a substrate. The layer of ultra-hard particles may be oriented in order to place the surface having more coarse diamond particles near the substrate to create an initial assembly, which is processed by sintering, typically under HPHT conditions, to create a processed assembly. From this processed assembly, a sintered diamond abrasive compact supported on a cobalt cemented tungsten substrate is produced and recovered. The resulting supported sintered compact may be finished into an abrasive tool.
- Optionally, the mixed slurry is allowed to separate in a non-planar fixture. Additionally, the substrate may have an interface surface matching the graded layer, and it may be placed against the portion of the compact having more fine particles.
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FIG. 1 is an electron micrograph of a prior art PCD compact structure, illustrating an abrupt transition and particle size. -
FIG. 2 is a graph showing particle size transition as a function of distance from cutting surface, which is relevant to the cutter ofFIG. 1 . -
FIG. 3 is an electron micrograph illustrating an abrupt catalyst concentration change in a prior art thermally stable supported abrasive composite. -
FIG. 4 is a graph of cobalt catalyst concentration as a function of the distance from the cutter interface, which is relevant to the cutter ofFIG. 3 . -
FIG. 3 is a block diagram from the prior art illustrating various layers of a superabrasive cutter. -
FIG. 4 is a diagram of a prior art cutter having particles of different sizes arranged in circumferential regions. -
FIG. 5 is a diagram illustrating a cross section of an exemplary cylindrical supported abrasive composite. -
FIG. 6 is an electron micrograph illustrating an exemplary microstructure of an embodiment such as that ofFIG. 5 . -
FIG. 7 is a graph comparing grain size as a function of distance from the cutting surface for the embodiments ofFIG. 3 andFIG. 5 . -
FIG. 8 includes electron micrographs of an exemplary cutter having multiple independent gradients, including high magnification insets. -
FIG. 9 is a graph illustrating grain size as a function of the distance from the active cutting surface, based on the embodiment ofFIG. 8 . -
FIG. 10 is a graph showing tungsten content, catalyst metal concentration, and particle size gradients in an exemplary cutter. -
FIG. 11 is a schematic section of a supported abrasive compact with multimodal gradients present on multiple axes. -
FIG. 12 is a micrograph of a gradient from a region of the cutter ofFIG. 11 . -
FIG. 13 is a graph of a particle size gradient, whileFIG. 14 shows catalyst metal concentration, in one direction for the exemplary cutter ofFIG. 12 . -
FIGS. 15 and 16 show catalyst metal concentration and particle size gradients of the exemplary cutter ofFIG. 12 in a direction that is different from that shown inFIGS. 13 and 14 . -
FIG. 17 is a graph showing particle size distribution of the exemplary cutter of Example 3 presented herein. -
FIG. 18 is a graph illustrating particle size distributions of the diamond powder used in Example 4. -
FIG. 19 is a graph illustrating particle size distributions of the tungsten powder used in Example 5. -
FIG. 20 illustrates a compact and an exemplary settling fixture. - Before the present methods, systems and materials are described, it is to be understood that this disclosure is not limited to the particular methodologies, systems and materials described, as these may vary. It is also to be understood that the terminology used in the description is for the purpose of describing the particular versions or embodiments only, and is not intended to limit the scope. For example, as used herein, the singular forms “a,” “an,” and “the” include plural references unless the context clearly dictates otherwise. In addition, the word “comprising” as used herein is intended to mean “including but not limited to.” Unless defined otherwise, all technical and scientific terms used herein have the same meanings as commonly understood by one of ordinary skill in the art.
- This disclosure deals with solid materials in which at least one characteristic, such as structure or another physical characteristics varies with position in the material. As used herein, the following terms have the following definitions:
- Areal Average—an average of a measured characteristic assessed in a section of a compact oriented with respect to the gradient axis. The dimension perpendicular to the gradient axis is large enough give a good estimate of the characteristic, at least 30 coarse particle diameters, and in some
cases 100 or more. The dimension parallel to the gradient should be small enough not to obscure the presence of discontinuities, such as at least 1 to 3 times the diameter of the coarsest particle in the section of interest. - Coarse Grain—The grain of a polycrystalline compact having the 99th (largest) percentile diameter of those grains present in a sample area of a compact.
- Concomitant Gradients—multiple structural or physical characteristics that simultaneously vary as a function of position, or structural or physical characteristics that simultaneously vary along one or multiple axes of an object. A causal relationship exists between the gradients.
- Continuous Gradient—a smooth gradient without abrupt transitions at the microstructural scale of the compact. A continuous gradient, described mathematically, may have a finite first positional derivative.
- Continuous Characteristic Gradient—a characteristic that varies as a function of position at about or below the scale of the microstructure of the compact. A continuous characteristic exhibits a smooth positional dependence of the average of at least 30 randomly selected, different line intercept assessments of the characteristic along the gradient axis. Alternatively, a continuous characteristic gradient exhibits a smooth positional dependence of an areal average of the characteristic when the smaller dimension of the assessment area is oriented parallel to the gradient axis.
- Continuous Variable—a variable in which changes occur in small increments such that large swings do not occur in a relatively small portion of the change.
- Gradient—a change in a structural or physical property based on position within a solid body. The definition encompasses structure and/or physical characteristic changes. A gradient is sometimes referred to herein as a “characteristic gradient,” where the characteristic is the structural or physical property that changes.
- Linear Gradient—a gradient in which particle size, chemical composition, or both change as a linear function of position.
- Monotonic Gradient—a gradient in which a characteristic continually increases or decreases with position and does not oscillate.
- Multiaxial Gradient—a gradient that varies along more than one axis.
- Multimodal Gradient—more than one independent structural or physical characteristic gradients. The gradients may or may not have a casual relationship with each other. As a non-limiting example, a compact in which both ultra-hard particle size and composition simultaneously vary has a multimodal gradient.
- Oscillating Gradient—a continuous gradient in which a characteristic repeatedly varies between limiting values as a function of position.
- Ultra-hard Material—diamond, cubic boron nitride, or another material having a Vickers hardness of greater than about 3000 kg/mm2, and optionally more than about 3200 kg/mm2. Ultra-hard material is sometimes referred to herein as superabrasive material.
- Uniaxial Gradient—a gradient along a single directional axis.
- Unimodal Gradient—a gradient of a single structural or physical characteristic. As a non-limiting example, increasing ultra-hard particle diameter along a direction in an abrasive compact provides a unimodal gradient. Concomitant gradients along multiple axes of an object may be associated with a unimodal gradient.
- In accordance with embodiments disclosed herein, an abrasive compact includes diamond, cubic boron nitride (CBN) or other particles of ultra-hard material consolidated into a solid mass. Any now or hereafter known consolidation method may be used to create the mass, such as sintering at elevated temperatures and pressures known as high pressure/high temperature (HPHT) conditions. For polycrystalline diamond (PCD) or polycrystalline CBN (PCBN), these conditions are typically over 4 gigapascal (Gpa) and temperatures over 1200° C. The abrasive compacts may be free standing, attached to a substrate to form a supported abrasive compact, and/or processed to form a thermally stable, or leached, abrasive compact.
- In one form, an abrasive compact may have at least one continuous uniaxial characteristic gradient of a continuously distributed structural or physical characteristic.
FIG. 5 is a schematic cross section of a cylindrical supported abrasive composite such as the type that may be used as a drilling cutter in an earth-boring bit. The section shown is parallel to thecylindrical axis 850 of the drilling cutter. Such cutters comprise asubstrate 820 made of a supporting material such as cemented tungsten carbide, with a compact 810 of sintered ultra-hard particles coaxially attached to at least one end of the substrate. The freeplanar end 830 of the abrasive compact and a portion of the cylindrical abrasive compact side surface 831 are active cutting surfaces. - In embodiments described herein, the abrasive compact microstructure has a continuous size gradient of ultra-hard materials, typically in the form of particles. The gradient shown in
FIG. 5 is substantially parallel to the cuttercylindrical axis 850. However, other positional gradients are possible, such as a gradient that extends inward from acorner 816 of the compact along a line that is offset at desired angles fromtop surface 830 and side surface 831. The illustrated unimodal, uniaxial gradient in ultra-hard particle size is an independent continuous characteristic gradient. A relatively high concentration of fineultra-hard particles 813 provides high abrasive wear and fracture resistance near the cutting surface, while a relatively high concentration ofcoarser particles 814 will be present near thetungsten carbide substrate 820. The region of fine particles 811 may extend some axial distance toward thesubstrate 820 to encompass the entire active cutting surfaces 830 and 831. The linear or areal average particle size, measured as described above, smoothly and continuously increases axially toward thesubstrate 820. - The micrograph of
FIG. 6 shows one microstructure of an embodiment such as that schematically illustrated inFIG. 5 .Ultra-hard particle sizes 910 are measured and recorded on micrograph. The active cutting surfaces 930 and 931 comprise ultra-hard particles that, in this example, are between about 6 and 8 microns in size for high abrasion resistance. Particles of other sizes may be used. The ultra-hard particle size continuously increases to about 40 microns in the direction toward thesubstrate interface 940. The ultra-hard particle size characteristic changes in a continuous gradient, and thus is distinctly different from prior art layered and discontinuous mixture gradients. In some embodiments, the maximum rate of change of the particle size gradient may be no more than 1 micron of particle size per 1 micron of translation (i.e., physical distance) along the gradient axis. An alternative gradient may be pore size, with a similar maximum rate of change. -
FIG. 7 compares graphical presentations of the ultra-hard particle size transitions in prior art compacts 1001 (such as that shown inFIG. 3 ) and the embodiment ofFIGS. 5 and 6 1002. The ultra-hard particle sizes are measured in a direction parallel to the cylindrical axis of the drilling cutter (axis 850 inFIG. 5 ).FIG. 7 shows acontinuous gradient 1002 in ultra-hard particle size for the embodiment ofFIG. 5 , in clear contrast with the abruptparticle size transition 1001 of the prior art ofFIG. 3 . While the embodiment ofFIG. 5 has a nominallylinear gradient 1002 in particle size, a linear gradient is not required, nor should it limit the scope of the invention. This compact also may have several concomitant gradients: (i) a concomitant continuous, uniaxial gradient in wear resistance, a continuous variable; (ii) a concomitant, continuous, uniaxial composition gradient, a discontinuous variable; and (iii) others, such as catalyst metal pool size, thermal conductivity, and/or thermal expansion. The gradients described herein may encompass a portion of the abrasive compact volume as shown or the entire volume. The abrasive compacts described herein may achieve the objectives of prior art without the stress concentration or contamination of discrete interfaces of a layered structure. The abrasive compacts described herein are the first reduction to practice of a continuous, uniaxial gradient of a continuously distributed compact variable. - Another embodiment is an abrasive compact with multimodal gradients. These independent gradients may be continuous or not, and they may include continuously or discontinuously distributed structural or physical characteristics. The gradients may be monotonic or oscillating. As an example, an abrasive compact may contain independent gradients of continuously distributed sizes of ultra-hard particles and additive particles and discontinuously distributed composition characteristics.
- In such an embodiment, an example of which is shown in
FIG. 8 , a micrograph of a sectioned drilling cutter, illustrates an abrasive composite with multiple independent coaxial gradients, comprising asubstrate 1120 of a tungsten carbide and/or other material with an abrasive compact 1110 of diamond and tungsten carbide and/or other material coaxially attached to the substrate. The freeplanar end 1130 of the abrasive compact and aproximal portion 1135 of the cylindrical abrasive compact surface are active cutting surfaces. As shown in the high magnification inset, 1115, fineultra-hard particles 1113, in this example having a particle size below about 3 microns, comprise the active cutting surfaces, providing high abrasive wear and fracture resistance while coarser particles, shown in high magnification inset 1116, in this example having a particle size above about 20microns 1114 improve HPHT sintering near thetungsten carbide substrate 1120. The region of fine ultra-hard particles extends some axial distance toward thetungsten carbide substrate 1120 to encompass an extended portion of active cutting surfaces 1135. The characteristic particle size gradient begins at about 3 microns average particle size and continuously increases axially from the freeplanar end 1130 toward the direction of thesubstrate 1120, achieving a final particle diameter of about 20 microns.FIG. 9 presents a graph illustrating thediamond size gradient 1220 as a function of distance from the free planar end and/or active cutting surface. - The second gradient set of this embodiment, independent from and coaxial with the previously described ultra hard particle size gradient comprises gradients in the characteristics of an additive, tungsten carbide. The tungsten carbide additive has both a particle size and mixture compositional gradient. As shown in the insets A and B of
FIG. 8 and in the graph ofFIG. 9 , the average tungsten carbideparticle size gradient 1210 continuously decreases from about 15microns 1114 near thetungsten carbide substrate 1120 to nearly 0microns 1113, meaning very little tungsten carbide is present, at theactive cutting surface 1130. The continuous tungsten carbide composition gradient, coaxial with ultra-hard particle size gradient, decreases from about 50 weight percent near thetungsten carbide substrate 1120 to approximately 0% at the planar end and/oractive cutting surface 1130. -
FIG. 10 , an elemental concentration microanalysis, shows the independent nature of these gradients in arbitrary composition units. The tungsten carbide, measured as elemental tungsten,content 1310 of the abrasive compact decreases in an axial direction moving away from the tungsten carbide substrate. An independent ultra-hardparticle size gradient 1320 also may show a decrease with distance from the substrate, while the cobaltcatalyst metal concentration 1320 may increase in the same direction. As in the prior embodiment, other concomitant gradients, such as cobalt particle size or diamond concentration, may be present. The independent gradients may encompass a portion or the complete volume of the abrasive compact. The multimodal gradients may provide additional compact design flexibility while reducing the contamination and stress concentration of the prior art. - Yet another embodiment comprises independent continuous gradients on multiple axes within the abrasive compact. These gradients may be of any type previously mentioned.
FIG. 11 is a schematic section of a supported abrasive compact 1400 with multimodal gradients present on multiple axes. The schematic section intersects thecylindrical axis 1450 of the compact. A radial direction is also shown 1460. The exterior of the abrasive compact comprises a planaractive cutting surface 1410 and acircumferential surface 1411, a portion of which may be an active cutting surface. Ultra-hard particles, which may in embodiments range from fine 1431 to coarse 1432 are present in the abrasive compact. A second gradient, such as a composition gradient, a property, orother gradient 1440 is present in the abrasive compact. This second gradient characteristic is illustrated by changing shade. Non-planar features 1470 may be present at the interface of the supportingsubstrate 1420 and the abrasive compact 1400. In this non-limiting example it is seen that particles of essentially one size are present at the exterior surface of the abrasive compact. Note that the particles need not be exactly the same size hut merely need to be closely similar in size, such as by a 10 percent or less variation, a 5 percent or less variation, or a one percent or less variation. Particles of a different size may be present at the interior. The particles may change average or mean size on more than one axis and the rate of particle size change may vary on different axes, such as axial 1450, radial 1460 or other directions. Other characteristic gradients may include concomitant gradients in catalyst metal concentration; catalyst metal distribution; ultra-hard particle concentration the amount or fraction of the compact that is porous, known as pore fraction; the size of the pores present in the compact, known as pore size; and shape distributions and derivative gradients in other physical characteristics. Thesecond gradient 1440 may be a gradient of any of the types mentioned above, for example a gradient in the concentration or particle size of an additional phase. The multiple gradients may be oscillating, monotonic, linear or of other types. -
FIG. 12 is a micrograph of an actual multiaxial, multimodal gradient from theregion 1470 ofFIG. 11 . The direction parallel to the cuttercylindrical axis 1550 and theradial direction 1560 are indicated. The supportingsubstrate 1520, coarse ultra-hardabrasive grains 1532 and fine ultra-hardabrasive grains 1531 are shown. Radial and axial ultra-hard particle size gradients are present. The rate of change of the particle size also varies with the axis chosen. -
FIG. 13 shows the smoothaxial gradient 1570 in ultra-hard particle size from about 5 microns near the exterior of the compact to about 35 microns near thecarbide substrate 1520.FIG. 14 shows the catalystmetal concentration gradient 1580 in the same direction as assessed by a single line scan. The variability in the catalyst concentration, due much lower level of catalyst present in the abrasive particles, does not obscure the presence of the gradient. The variability may be reduced by averaging a statistically significant number of line scans parallel to the gradient or areal assessment as described previously.FIGS. 15 and 16 show the same physical characteristic gradients in the radial direction. A lower rate of change is present in the radial direction. Multiaxial gradients further enhance design flexibility. - One form of multiaxial gradients may be found in an abrasive compact where an entire surface or volume, for example the entire exterior surface, has at least one substantially uniform physical characteristic, while having gradients in other regions. As an example, this embodiment may include a supported abrasive composite for an earth boring bit cutter having a uniform ultra-hard particle size on all exterior surfaces with interior gradients to improve sintering or manage stresses. In such an embodiment, concomitant gradients may be present. This embodiment may further improve design flexibility while eliminating undesirable preferential wear during cutter service.
- In another embodiment, the several structural or physical characteristics may vary in some, but not all directions. For example, a continuous axial composition gradient may coexist with a radial ultra-hard particle size gradient. In such an embodiment, concomitant gradients may be present.
- In still another form, the compacts described herein may exhibit a discontinuous gradient of other phases mixed with ultra-hard particles. In one example, cutting tools for machining reactive metals require supported abrasive compacts with active cutting surfaces unreactive toward the workpiece and simultaneous high reactivity toward the substrate. Additions of aluminum oxide in the abrasive composite can advantageously reduce the cutting surface reactivity, but may also disadvantageously reduce the interfacial bond strength between the abrasive composite and a tungsten carbide substrate. The abrasive compacts of various embodiments may have an aluminum oxide rich active cutting surface that continuously changes to a lower aluminum oxide concentration composition at the substrate interface. In this way, a cutting tool may have improved life, little or no undesirable abrupt transitions, and strong attachment to a tungsten carbide substrate.
- One other embodiment incorporates particle shape gradients. Particles in an abrasive compact may have various shapes. Aspect ratio, the numeric ratio between the major and minor axes or diameter of a particle, may be used to quantify particle shape. An abrasive compact with a particle shape gradient may have a volume or region of the compact comprised of particles that have a spherical or blocky, shape that changes to a more oblate, planar, whiskery shaped in another volume or region. An abrasive compact may have a region with low aspect ratio particles that, through a continuous gradient, becomes a region with high aspect ratio particles such as platelets or whiskers. The higher aspect ratio regions may offer different fracture, strength, or tribological, chemical, or electrical characteristics. In some embodiments, the maximum rate of change of the aspect ratio may be no more than 0.1 per one micron of translation (i.e. distance) along an axis.
- In another embodiment, electrical conductivity and wear resistance gradients provide ultra-hard particle abrasive compacts for machining manufactured wood products. For these applications, a diamond based abrasive compact with a high level of bulk electrical conductivity is desirable to facilitate electronic spark machining of diamond cutters. Also for this application, high wear resistance is derived from a structure with a maximum content of coarse diamond particles. When such coarse diamond particles are incorporated in a monolithic, homogenous abrasive compact, electronic spark machining becomes more difficult. This embodiment solves this problem with coarse ultra-hard particles at active cutting surfaces with a gradient to finer ultra-hard particles and concomitant higher electrical conductivity. The continuous uniform gradient of particle size may provide a high bulk electrical conductivity with highly abrasion resistant wear surfaces.
- Another embodiment applies the invented continuous gradients to other shapes. Annular abrasive compact geometries are suited to wire drawing dies. In these abrasive compacts structural or physical characteristics will be varied to produce an annular surface with the desired properties. In annular shapes, some of the gradients will be approximately perpendicular (radial) to tapered cylindrical or toroidal wear surfaces.
- While compositional and ultra-hard particle size gradients have been described, other gradients will have utility. Unimodal, multimodal, uni- and/or multi-axial gradients of potential use are: phase composition, particle shape, electrical conductivity, thermal conductivity or expansion, acoustic and elastic properties, incorporation of other than ultra hard particle materials, density, porosity size and shape, strength, fracture toughness, optical properties.
- In an embodiment, a method of creating an abrasive compact includes starting with a group of ultra-hard particles, such as a prepared synthetic diamonds, with a range of particle sizes. The particles are combined and mixed with alcohol or another fluid to create a mixed slurry. The mixed slurry is allowed to segregate as influenced by gravity, centrifugal force, an electrical field, a magnetic field or another method. The mixed slurry settles into a substantially solid, graded layer, optionally in which more of the coarse particles have first settled and more of the finest particles have settled last. Some, if not all, remaining liquid is removed by drying, centrifugation, or another method. A portion of the graded layer is then removed and optionally placed on a substrate. The layer of ultra-hard particles may be oriented in order to place the surface having more coarse diamond particles near the substrate to create an initial assembly, which is processed by sintering, typically under HPHT conditions, to create a processed assembly. From this processed assembly, a sintered diamond abrasive compact supported on a cobalt cemented tungsten substrate is produced and recovered. The resulting supported sintered compact may be finished into an abrasive tool.
- Optionally, the mixed slurry is allowed to separate in a non-planar fixture. An example of the non-planar elements of a
fixture 2000 is shown inFIG. 20 . As shown inFIG. 20 , thefixture 2000 may include aplanar portion 2010 andnon-planar portion 2020. The non-planar portion may be of any non-planar shape, such as that of two ramps meeting at a peak, a conical shape, a hemispherical shape, a pyramidal shape, or another non-planar shape. A larger concentration ofcoarse particles 2030 will settle near the non-planar structure, while a larger concentration offine particles 2040 will settle at higher points away from the non-planar structure. Also optionally, the carbide or other substrate may have an interface surface size and shape matching the size and shape of the settled diamond layer against which it is placed. - Following the procedures of U.S. Pat. Nos. 3,831,428; 3,745,623; and 4,311,490. MBM® grade, 3 micron diameter synthetic diamond from Diamond Innovations, Inc. was placed in a 16 millimeter (mm) diameter high purity tantalum foil cup to a uniform depth of approximately 1.5 mm. On top of this fine layer a second 1.5 mm uniformly thick layer of 40 micron MBM powder was added. A 16 mm cylindrical 13 weight-percent (wt %) cobalt cemented tungsten carbide substrate was also placed into the tantalum foil cup. This assembly was processed following the cell structure and teachings of cited patents at a pressure of 55-65 Kbar at about 1500° C. for about 15-45 minutes. The recovered supported abrasive compact had a sintered diamond layer structure supported on the cemented carbide substrate. The structure of this cutter is shown in
FIGS. 1 and 2 . - A drilling cutter may be boiled in 3HCl:1HNO3 acid using methods such as those described in U.S. Pat. No. 4,224,380 with its carbide substrate covered by a protective layer to yield a cobalt depleted region. The structure such a cutter is shown in
FIGS. 2 and 3 . - 45 grams of synthetic diamond with a particle size distribution shown in
FIG. 17 may be prepared and combined with 450 cc of 99.9% pure isopropyl alcohol. These materials may be mixed in a TURBULA® mixer for 2 minutes. The mixed slurry may be poured into a 100 mm diameter plastic container and allowed to settle for 8 hours. The remaining liquid may be carefully removed by decanting and evaporation. Once the settled diamond layer is solid, a 16 mm disc may be cut out of the settled layer. The diamond layer may be oriented in a tantalum (Ta) foil cup to place the coarse particles near the tungsten carbide substrate. A cylindrical cobalt cemented tungsten carbide substrate may be placed on top of the coarse diamond particles. This assembly may be processed using HPHT processing at a pressure of 55 to 65 Kbar at about 1500° C. for about 15 to 45 minutes. The exact conditions depend on many variables, these are provided as guidelines. The recovered assembly will produce a sintered diamond abrasive compact supported on a cemented tungsten carbide substrate, which may be finished into an abrasive tool. A sample of such a structure was cut axially in half and polished for structure evaluation, the structure of this example is shown inFIG. 6 . - To demonstrate the utility of this example's uniaxial continuously graded structure, several cutters were prepared and tested for impact and abrasion resistance. These results were compared to Diamond Innovations, Inc. TITAN commercial drilling cutters. Impact testing was performed on an INSTRON 9250 drop tester. Abrasion resistance (volumetric efficiency or G-ratio) was measured by turning a granite cylinder with a sharp, unchamfered cutter. The cutter of this example outperformed commercial abrasion cutters by over 100% in impact performance and 500% in abrasion. Detailed test results are shown in Table 1.
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TABLE 1 Graded cutter Commercial cutter Average Abrasion G-Ratio 85 15 (10{circumflex over ( )}5) Average diamond table 6.3% 13.0% Impact damage after 10 drops at 20 J - 45 grams of synthetic diamond powder with the particle size distributions shown in
FIG. 19 were combined with 12 grams of (99% purity and source) tungsten powder with the particle size distribution shown inFIG. 19 as in Example 3. The fabrication and sintering processes were according to those of Example 3. The recovered composite compact had a sintered diamond layer structure supported on the cemented carbide substrate and could be finished for an abrasive tool. One sintered tool was cut and polished for structure evaluation. The microstructure of this example is shown inFIG. 8 . - The settled diamond layer process of Example 3 was duplicated with the exception that the slurry was allowed to separate in a non-planar fixture as shown in
FIG. 20 for 8 hours. As shown inFIG. 20 ,coarse particles 2030 settled primarily near the non-planar structure, whilefine particles 2040 primarily separated above the non-planar structure. The drying and assembly process of Example 3 was performed except that a cylindrical cobalt cementedtungsten carbide substrate 2050 with an interface surface matching the size and shape of an interface surface of the settled diamond layer surface was placed on top of the diamond particles. Sintering of Example 3 was duplicated. The recovered composite compact had a sintered diamond layer structure supported on the cemented carbide substrate and could be finished for an abrasive tool. One sintered tool was cut and polished for structure evaluation. The microstructure of this example is shown inFIG. 12 . - The examples described above are not limiting. While sedimentation is described, other methods may be employed, such as centrifugation, percolation, vibration, magnetic, electrostatic, electrophoretic, vacuum, and other methods. It will be appreciated that various of the above-disclosed and other features and functions, or alternatives thereof, may be desirably combined into many other different systems or applications. Also, various presently unforeseen or unanticipated alternatives, modifications, variations or improvements therein may be subsequently made by those skilled in the art which are also intended to be encompassed by the following claims.
Claims (16)
1. An abrasive compact comprising:
a plurality of superabrasive particles consolidated into a solid mass, the particles having a characteristic gradient that is continuous, monotonic and uniaxial.
2. The abrasive compact of claim 1 wherein the characteristic gradient comprises a particle size gradient.
3. The compact of claim 2 in which a maximum rate of change of particle size is less than 1 micron of particle size per 1 micron of translation.
4. The abrasive compact of claim 1 , wherein the characteristic gradient comprises a pore size gradient.
5. The compact of claim 4 in which a maximum rate of change of pore size is less than 1 micron of diameter per 1 micron of translation.
6. The abrasive compact of claim 1 , wherein the characteristic gradient comprises a particle shape gradient.
7. The compact of claim 6 in which a maximum rate of change of particle aspect ratio is less than 0.1 per 1 micron of translation.
8. The abrasive compact of claim 1 , wherein the characteristic gradient comprises a concentration of the superabrasive particles.
9. An abrasive compact comprising:
a plurality of superabrasive particles consolidated into a solid mass, the mass having a first continuous gradient along a first axis of the mass and a second continuous gradient along a second axis of the mass.
10. The compact of claim 9 , wherein each of the gradients comprises a particle size gradient.
11. The compact of claim 9 , wherein the first continuous gradient comprises a particle size gradient and the second continuous gradient comprises one of a pore size gradient, a particle shape gradient, or a superabrasive particle concentration gradient.
12. The compact of claim 11 , wherein the first continuous gradient is monotonic and uniaxial.
13. The compact of claim 11 , wherein the first continuous gradient is oscillating.
14. A method of creating an abrasive compact, comprising:
combining ultra-hard particles with a fluid to create a mixed slurry;
allowing the mixed slurry to separate and form a graded layer;
removing remaining liquid from the graded layer;
selecting a portion of the graded layer;
placing a substrate against the selected portion of the graded layer to create an initial assembly;
processing the initial assembly to produce a sintered abrasive compact supported on the substrate to form a recovered assembly; and
finishing the supported sintered compact into an abrasive tool.
15. The method of claim 14 :
wherein the allowing comprises allowing the mixed slurry to settle in a non-planar fixture; and
wherein the placing comprises placing an interface surface of the substrate so that the interface surface matches a surface of the graded layer.
16. The method of claim 14 , wherein the placing comprises orienting the graded layer and the substrate so that a surface of the substrate having more coarse particles is near the substrate.
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US12/020,247 US20080178535A1 (en) | 2007-01-26 | 2008-01-25 | Graded drilling cutter |
US13/360,909 US8679206B2 (en) | 2007-01-26 | 2012-01-30 | Graded drilling cutters |
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Application Number | Priority Date | Filing Date | Title |
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US88671107P | 2007-01-26 | 2007-01-26 | |
US12/020,247 US20080178535A1 (en) | 2007-01-26 | 2008-01-25 | Graded drilling cutter |
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US13/360,909 Division US8679206B2 (en) | 2007-01-26 | 2012-01-30 | Graded drilling cutters |
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US20080178535A1 true US20080178535A1 (en) | 2008-07-31 |
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Family Applications (2)
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US13/360,909 Active 2028-05-15 US8679206B2 (en) | 2007-01-26 | 2012-01-30 | Graded drilling cutters |
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US13/360,909 Active 2028-05-15 US8679206B2 (en) | 2007-01-26 | 2012-01-30 | Graded drilling cutters |
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EP (1) | EP2114620B1 (en) |
JP (2) | JP2010516488A (en) |
KR (2) | KR101663316B1 (en) |
CN (1) | CN101646527B (en) |
WO (1) | WO2008092093A2 (en) |
ZA (1) | ZA200903696B (en) |
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US20060191723A1 (en) * | 2005-02-23 | 2006-08-31 | Keshavan Madapusi K | Thermally stable polycrystalline diamond materials, cutting elements incorporating the same and bits incorporating such cutting elements |
US20100159806A1 (en) * | 2008-12-15 | 2010-06-24 | Saint-Gobain Abrasives Inc. | Bonded abrasive article and method of use |
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US8309050B2 (en) | 2005-05-26 | 2012-11-13 | Smith International, Inc. | Polycrystalline diamond materials having improved abrasion resistance, thermal stability and impact resistance |
US8590130B2 (en) | 2009-05-06 | 2013-11-26 | Smith International, Inc. | Cutting elements with re-processed thermally stable polycrystalline diamond cutting layers, bits incorporating the same, and methods of making the same |
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US8727046B2 (en) | 2011-04-15 | 2014-05-20 | Us Synthetic Corporation | Polycrystalline diamond compacts including at least one transition layer and methods for stress management in polycrsystalline diamond compacts |
US8771389B2 (en) | 2009-05-06 | 2014-07-08 | Smith International, Inc. | Methods of making and attaching TSP material for forming cutting elements, cutting elements having such TSP material and bits incorporating such cutting elements |
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US8936659B2 (en) | 2010-04-14 | 2015-01-20 | Baker Hughes Incorporated | Methods of forming diamond particles having organic compounds attached thereto and compositions thereof |
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US11065863B2 (en) | 2017-02-20 | 2021-07-20 | Kennametal Inc. | Cemented carbide powders for additive manufacturing |
Citations (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4311490A (en) * | 1980-12-22 | 1982-01-19 | General Electric Company | Diamond and cubic boron nitride abrasive compacts using size selective abrasive particle layers |
US4604106A (en) * | 1984-04-16 | 1986-08-05 | Smith International Inc. | Composite polycrystalline diamond compact |
US4694918A (en) * | 1985-04-29 | 1987-09-22 | Smith International, Inc. | Rock bit with diamond tip inserts |
US5037704A (en) * | 1985-11-19 | 1991-08-06 | Sumitomo Electric Industries, Ltd. | Hard sintered compact for a tool |
US5135061A (en) * | 1989-08-04 | 1992-08-04 | Newton Jr Thomas A | Cutting elements for rotary drill bits |
US5510193A (en) * | 1994-10-13 | 1996-04-23 | General Electric Company | Supported polycrystalline diamond compact having a cubic boron nitride interlayer for improved physical properties |
US5547767A (en) * | 1991-10-14 | 1996-08-20 | Commissariat A L'energie Atomique | Multilayer material, anti-erosion and anti-abrasion coating incorporating said multilayer material and process for producing said multilayer material |
US5645617A (en) * | 1995-09-06 | 1997-07-08 | Frushour; Robert H. | Composite polycrystalline diamond compact with improved impact and thermal stability |
US5723177A (en) * | 1990-12-21 | 1998-03-03 | Sandvik Ab | Diamond-impregnated hard material |
US6187068B1 (en) * | 1998-10-06 | 2001-02-13 | Phoenix Crystal Corporation | Composite polycrystalline diamond compact with discrete particle size areas |
US6202770B1 (en) * | 1996-02-15 | 2001-03-20 | Baker Hughes Incorporated | Superabrasive cutting element with enhanced durability and increased wear life and apparatus so equipped |
US6220375B1 (en) * | 1999-01-13 | 2001-04-24 | Baker Hughes Incorporated | Polycrystalline diamond cutters having modified residual stresses |
US6290008B1 (en) * | 1998-12-07 | 2001-09-18 | Smith International, Inc. | Inserts for earth-boring bits |
US6326090B1 (en) * | 1994-10-18 | 2001-12-04 | Symyx Technologies | Combinatorial synthesis of novel materials |
US6346689B1 (en) * | 1997-11-14 | 2002-02-12 | The Australian National University | Cell and method for forming a composite hard material and composite hard materials formed thereby |
US20020029909A1 (en) * | 2000-05-01 | 2002-03-14 | Anthony Griffo | Rotary cone bit with functionally-engineered composite inserts |
US6443248B2 (en) * | 1999-04-16 | 2002-09-03 | Smith International, Inc. | Drill bit inserts with interruption in gradient of properties |
US6533831B2 (en) * | 1995-02-24 | 2003-03-18 | Sp3, Inc. | Graded grain size diamond layer |
US6601662B2 (en) * | 2000-09-20 | 2003-08-05 | Grant Prideco, L.P. | Polycrystalline diamond cutters with working surfaces having varied wear resistance while maintaining impact strength |
US20030191533A1 (en) * | 2000-01-30 | 2003-10-09 | Diamicron, Inc. | Articulating diamond-surfaced spinal implants |
US6641893B1 (en) * | 1997-03-14 | 2003-11-04 | Massachusetts Institute Of Technology | Functionally-graded materials and the engineering of tribological resistance at surfaces |
US6655882B2 (en) * | 1999-02-23 | 2003-12-02 | Kennametal Inc. | Twist drill having a sintered cemented carbide body, and like tools, and use thereof |
US6696137B2 (en) * | 1997-07-31 | 2004-02-24 | Smith International, Inc. | Woven and packed composite constructions |
US20040137834A1 (en) * | 2003-01-15 | 2004-07-15 | General Electric Company | Multi-resinous molded articles having integrally bonded graded interfaces |
US6793681B1 (en) * | 1994-08-12 | 2004-09-21 | Diamicron, Inc. | Prosthetic hip joint having a polycrystalline diamond articulation surface and a plurality of substrate layers |
US20040223676A1 (en) * | 2001-04-22 | 2004-11-11 | Pope Bill J. | Bearings, races and components thereof having diamond and other superhard surfaces |
US6817550B2 (en) * | 2001-07-06 | 2004-11-16 | Diamicron, Inc. | Nozzles, and components thereof and methods for making the same |
US6892836B1 (en) * | 1998-03-25 | 2005-05-17 | Smith International, Inc. | Cutting element having a substrate, a transition layer and an ultra hard material layer |
US6908688B1 (en) * | 2000-08-04 | 2005-06-21 | Kennametal Inc. | Graded composite hardmetals |
US20050133277A1 (en) * | 2003-08-28 | 2005-06-23 | Diamicron, Inc. | Superhard mill cutters and related methods |
US20050146086A1 (en) * | 1994-08-12 | 2005-07-07 | Diamicron, Inc. | Use of gradient layers and stress modifiers to fabricate superhard constructs |
US6951578B1 (en) * | 2000-08-10 | 2005-10-04 | Smith International, Inc. | Polycrystalline diamond materials formed from coarse-sized diamond grains |
US6987318B2 (en) * | 2002-10-11 | 2006-01-17 | Chien-Min Sung | Diamond composite heat spreader having thermal conductivity gradients and associated methods |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57175775A (en) * | 1981-04-20 | 1982-10-28 | Showa Denko Kk | Diamond sintered body |
ZA862903B (en) * | 1985-04-29 | 1987-11-25 | Smith International | Composite polycrystalline diamond compact |
AU605995B2 (en) * | 1988-08-31 | 1991-01-24 | De Beers Industrial Diamond Division (Proprietary) Limited | Manufacture of abrasive products |
JPH0437650A (en) * | 1990-06-04 | 1992-02-07 | Exxon Res & Eng Co | Fracture resisting diamond and processing of diamond-combined article |
JP3309897B2 (en) * | 1995-11-15 | 2002-07-29 | 住友電気工業株式会社 | Ultra-hard composite member and method of manufacturing the same |
JP2000054007A (en) * | 1998-07-31 | 2000-02-22 | Sumitomo Electric Ind Ltd | Diamond-sintered body and its production |
US20070175103A1 (en) | 2003-05-22 | 2007-08-02 | Iakovos Sigalas | Method of making a tool component |
-
2008
- 2008-01-25 CN CN200880003089XA patent/CN101646527B/en active Active
- 2008-01-25 WO PCT/US2008/052076 patent/WO2008092093A2/en active Application Filing
- 2008-01-25 EP EP08728300.8A patent/EP2114620B1/en active Active
- 2008-01-25 KR KR1020097014166A patent/KR101663316B1/en active IP Right Grant
- 2008-01-25 JP JP2009547442A patent/JP2010516488A/en active Pending
- 2008-01-25 US US12/020,247 patent/US20080178535A1/en not_active Abandoned
- 2008-01-25 KR KR1020157029947A patent/KR20150121728A/en not_active Application Discontinuation
-
2009
- 2009-05-27 ZA ZA2009/03696A patent/ZA200903696B/en unknown
-
2012
- 2012-01-30 US US13/360,909 patent/US8679206B2/en active Active
-
2013
- 2013-10-15 JP JP2013214798A patent/JP5739502B2/en active Active
Patent Citations (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4311490A (en) * | 1980-12-22 | 1982-01-19 | General Electric Company | Diamond and cubic boron nitride abrasive compacts using size selective abrasive particle layers |
US4604106A (en) * | 1984-04-16 | 1986-08-05 | Smith International Inc. | Composite polycrystalline diamond compact |
US4694918A (en) * | 1985-04-29 | 1987-09-22 | Smith International, Inc. | Rock bit with diamond tip inserts |
US5037704A (en) * | 1985-11-19 | 1991-08-06 | Sumitomo Electric Industries, Ltd. | Hard sintered compact for a tool |
US5135061A (en) * | 1989-08-04 | 1992-08-04 | Newton Jr Thomas A | Cutting elements for rotary drill bits |
US5723177A (en) * | 1990-12-21 | 1998-03-03 | Sandvik Ab | Diamond-impregnated hard material |
US5547767A (en) * | 1991-10-14 | 1996-08-20 | Commissariat A L'energie Atomique | Multilayer material, anti-erosion and anti-abrasion coating incorporating said multilayer material and process for producing said multilayer material |
US20050146086A1 (en) * | 1994-08-12 | 2005-07-07 | Diamicron, Inc. | Use of gradient layers and stress modifiers to fabricate superhard constructs |
US6793681B1 (en) * | 1994-08-12 | 2004-09-21 | Diamicron, Inc. | Prosthetic hip joint having a polycrystalline diamond articulation surface and a plurality of substrate layers |
US6800095B1 (en) * | 1994-08-12 | 2004-10-05 | Diamicron, Inc. | Diamond-surfaced femoral head for use in a prosthetic joint |
US5510193A (en) * | 1994-10-13 | 1996-04-23 | General Electric Company | Supported polycrystalline diamond compact having a cubic boron nitride interlayer for improved physical properties |
US6326090B1 (en) * | 1994-10-18 | 2001-12-04 | Symyx Technologies | Combinatorial synthesis of novel materials |
US6533831B2 (en) * | 1995-02-24 | 2003-03-18 | Sp3, Inc. | Graded grain size diamond layer |
US5645617A (en) * | 1995-09-06 | 1997-07-08 | Frushour; Robert H. | Composite polycrystalline diamond compact with improved impact and thermal stability |
US6202770B1 (en) * | 1996-02-15 | 2001-03-20 | Baker Hughes Incorporated | Superabrasive cutting element with enhanced durability and increased wear life and apparatus so equipped |
US6641893B1 (en) * | 1997-03-14 | 2003-11-04 | Massachusetts Institute Of Technology | Functionally-graded materials and the engineering of tribological resistance at surfaces |
US6696137B2 (en) * | 1997-07-31 | 2004-02-24 | Smith International, Inc. | Woven and packed composite constructions |
US6346689B1 (en) * | 1997-11-14 | 2002-02-12 | The Australian National University | Cell and method for forming a composite hard material and composite hard materials formed thereby |
US6892836B1 (en) * | 1998-03-25 | 2005-05-17 | Smith International, Inc. | Cutting element having a substrate, a transition layer and an ultra hard material layer |
US6187068B1 (en) * | 1998-10-06 | 2001-02-13 | Phoenix Crystal Corporation | Composite polycrystalline diamond compact with discrete particle size areas |
US6290008B1 (en) * | 1998-12-07 | 2001-09-18 | Smith International, Inc. | Inserts for earth-boring bits |
US6220375B1 (en) * | 1999-01-13 | 2001-04-24 | Baker Hughes Incorporated | Polycrystalline diamond cutters having modified residual stresses |
US6655882B2 (en) * | 1999-02-23 | 2003-12-02 | Kennametal Inc. | Twist drill having a sintered cemented carbide body, and like tools, and use thereof |
US6443248B2 (en) * | 1999-04-16 | 2002-09-03 | Smith International, Inc. | Drill bit inserts with interruption in gradient of properties |
US20030191533A1 (en) * | 2000-01-30 | 2003-10-09 | Diamicron, Inc. | Articulating diamond-surfaced spinal implants |
US6571889B2 (en) * | 2000-05-01 | 2003-06-03 | Smith International, Inc. | Rotary cone bit with functionally-engineered composite inserts |
US20040040750A1 (en) * | 2000-05-01 | 2004-03-04 | Smith International, Inc. | Rotary cone bit with functionally-engineered composite inserts |
US20020029909A1 (en) * | 2000-05-01 | 2002-03-14 | Anthony Griffo | Rotary cone bit with functionally-engineered composite inserts |
US6908688B1 (en) * | 2000-08-04 | 2005-06-21 | Kennametal Inc. | Graded composite hardmetals |
US6951578B1 (en) * | 2000-08-10 | 2005-10-04 | Smith International, Inc. | Polycrystalline diamond materials formed from coarse-sized diamond grains |
US6601662B2 (en) * | 2000-09-20 | 2003-08-05 | Grant Prideco, L.P. | Polycrystalline diamond cutters with working surfaces having varied wear resistance while maintaining impact strength |
US20040223676A1 (en) * | 2001-04-22 | 2004-11-11 | Pope Bill J. | Bearings, races and components thereof having diamond and other superhard surfaces |
US6817550B2 (en) * | 2001-07-06 | 2004-11-16 | Diamicron, Inc. | Nozzles, and components thereof and methods for making the same |
US6987318B2 (en) * | 2002-10-11 | 2006-01-17 | Chien-Min Sung | Diamond composite heat spreader having thermal conductivity gradients and associated methods |
US20040137834A1 (en) * | 2003-01-15 | 2004-07-15 | General Electric Company | Multi-resinous molded articles having integrally bonded graded interfaces |
US20050133277A1 (en) * | 2003-08-28 | 2005-06-23 | Diamicron, Inc. | Superhard mill cutters and related methods |
Cited By (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8020644B2 (en) | 2005-02-23 | 2011-09-20 | Smith International Inc. | Thermally stable polycrystalline diamond materials, cutting elements incorporating the same and bits incorporating such cutting elements |
US7694757B2 (en) * | 2005-02-23 | 2010-04-13 | Smith International, Inc. | Thermally stable polycrystalline diamond materials, cutting elements incorporating the same and bits incorporating such cutting elements |
US20100192473A1 (en) * | 2005-02-23 | 2010-08-05 | Keshavan Madapusi K | Thermally stable polycrystalline diamond materials, cutting elements incorporating the same and bits incorporating such cutting elements |
US20060191723A1 (en) * | 2005-02-23 | 2006-08-31 | Keshavan Madapusi K | Thermally stable polycrystalline diamond materials, cutting elements incorporating the same and bits incorporating such cutting elements |
US8852546B2 (en) | 2005-05-26 | 2014-10-07 | Smith International, Inc. | Polycrystalline diamond materials having improved abrasion resistance, thermal stability and impact resistance |
US8309050B2 (en) | 2005-05-26 | 2012-11-13 | Smith International, Inc. | Polycrystalline diamond materials having improved abrasion resistance, thermal stability and impact resistance |
US9097074B2 (en) | 2006-09-21 | 2015-08-04 | Smith International, Inc. | Polycrystalline diamond composites |
US10124468B2 (en) | 2007-02-06 | 2018-11-13 | Smith International, Inc. | Polycrystalline diamond constructions having improved thermal stability |
US9387571B2 (en) | 2007-02-06 | 2016-07-12 | Smith International, Inc. | Manufacture of thermally stable cutting elements |
US10132121B2 (en) | 2007-03-21 | 2018-11-20 | Smith International, Inc. | Polycrystalline diamond constructions having improved thermal stability |
US10076824B2 (en) | 2007-12-17 | 2018-09-18 | Smith International, Inc. | Polycrystalline diamond construction with controlled gradient metal content |
US9297211B2 (en) | 2007-12-17 | 2016-03-29 | Smith International, Inc. | Polycrystalline diamond construction with controlled gradient metal content |
US8297382B2 (en) | 2008-10-03 | 2012-10-30 | Us Synthetic Corporation | Polycrystalline diamond compacts, method of fabricating same, and various applications |
US8461832B2 (en) | 2008-10-03 | 2013-06-11 | Us Synthetic Corporation | Method of characterizing a polycrystalline diamond element by at least one magnetic measurement |
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US10507565B2 (en) | 2008-10-03 | 2019-12-17 | Us Synthetic Corporation | Polycrystalline diamond, polycrystalline diamond compacts, methods of making same, and applications |
US10508502B2 (en) | 2008-10-03 | 2019-12-17 | Us Synthetic Corporation | Polycrystalline diamond compact |
US10287822B2 (en) | 2008-10-03 | 2019-05-14 | Us Synthetic Corporation | Methods of fabricating a polycrystalline diamond compact |
US20100225311A1 (en) * | 2008-10-03 | 2010-09-09 | Us Synthetic Corporation | Method of characterizing a polycrystalline diamond element by at least one magnetic measurement |
US9134275B2 (en) | 2008-10-03 | 2015-09-15 | Us Synthetic Corporation | Polycrystalline diamond compact and method of fabricating same |
US20100307069A1 (en) * | 2008-10-03 | 2010-12-09 | Us Synthetic Corporation | Polycrystalline diamond compact |
US8616306B2 (en) | 2008-10-03 | 2013-12-31 | Us Synthetic Corporation | Polycrystalline diamond compacts, method of fabricating same, and various applications |
US9315881B2 (en) | 2008-10-03 | 2016-04-19 | Us Synthetic Corporation | Polycrystalline diamond, polycrystalline diamond compacts, methods of making same, and applications |
US9932274B2 (en) | 2008-10-03 | 2018-04-03 | Us Synthetic Corporation | Polycrystalline diamond compacts |
US9459236B2 (en) | 2008-10-03 | 2016-10-04 | Us Synthetic Corporation | Polycrystalline diamond compact |
US8766628B2 (en) | 2008-10-03 | 2014-07-01 | Us Synthetic Corporation | Methods of characterizing a component of a polycrystalline diamond compact by at least one magnetic measurement |
US20110017519A1 (en) * | 2008-10-03 | 2011-01-27 | Us Synthetic Corporation | Polycrystalline diamond compacts, method of fabricating same, and various applications |
US20110206470A1 (en) * | 2008-10-28 | 2011-08-25 | Kyocera Corporation | Surface-Coated Tool |
US8846217B2 (en) * | 2008-10-28 | 2014-09-30 | Kyocera Corporation | Surface-coated tool |
US8628385B2 (en) * | 2008-12-15 | 2014-01-14 | Saint-Gobain Abrasives, Inc. | Bonded abrasive article and method of use |
US20100159806A1 (en) * | 2008-12-15 | 2010-06-24 | Saint-Gobain Abrasives Inc. | Bonded abrasive article and method of use |
US9115553B2 (en) | 2009-05-06 | 2015-08-25 | Smith International, Inc. | Cutting elements with re-processed thermally stable polycrystalline diamond cutting layers, bits incorporating the same, and methods of making the same |
US8590130B2 (en) | 2009-05-06 | 2013-11-26 | Smith International, Inc. | Cutting elements with re-processed thermally stable polycrystalline diamond cutting layers, bits incorporating the same, and methods of making the same |
US8771389B2 (en) | 2009-05-06 | 2014-07-08 | Smith International, Inc. | Methods of making and attaching TSP material for forming cutting elements, cutting elements having such TSP material and bits incorporating such cutting elements |
US20140290146A1 (en) * | 2009-06-18 | 2014-10-02 | Smith International, Inc. | Polycrystalline diamond cutting elements with engineered porosity and method for manufacturing such cutting elements |
US8783389B2 (en) | 2009-06-18 | 2014-07-22 | Smith International, Inc. | Polycrystalline diamond cutting elements with engineered porosity and method for manufacturing such cutting elements |
US8434348B2 (en) * | 2009-12-18 | 2013-05-07 | Varel Europe S.A.S. | Synthetic materials for PDC cutter testing or for testing other superhard materials |
US20110146372A1 (en) * | 2009-12-18 | 2011-06-23 | Varel Europe S.A.S. | Synthetic Materials for PDC Cutter Testing or for Testing Other Superhard Materials |
US20110146374A1 (en) * | 2009-12-18 | 2011-06-23 | Varel Europe S.A.S. | Synthetic Materials for PDC Cutter Testing or for Testing Other Superhard Materials |
US8434347B2 (en) * | 2009-12-18 | 2013-05-07 | Varel Europe S.A.S. | Synthetic materials for PDC cutter testing or for testing other superhard materials |
US8434346B2 (en) * | 2009-12-18 | 2013-05-07 | Varel Europe S.A.S. | Synthetic materials for PDC cutter testing or for testing other superhard materials |
US20110146373A1 (en) * | 2009-12-18 | 2011-06-23 | Varel Europe S.A.S. | Synthetic Materials for PDC Cutter Testing or for Testing Other Superhard Materials |
US8784890B2 (en) | 2009-12-22 | 2014-07-22 | Cook Medical Technologies Llc | Methods for producing ECM-based biomaterials |
US20110150998A1 (en) * | 2009-12-22 | 2011-06-23 | Laura-Lee Farrell | Methods For Producing ECM-Based Biomaterials |
US8329219B2 (en) | 2009-12-22 | 2012-12-11 | Cook Biotech Incorporated | Methods for producing ECM-based biomaterials |
US8936659B2 (en) | 2010-04-14 | 2015-01-20 | Baker Hughes Incorporated | Methods of forming diamond particles having organic compounds attached thereto and compositions thereof |
US8936116B2 (en) | 2010-06-24 | 2015-01-20 | Baker Hughes Incorporated | Cutting elements for earth-boring tools, earth-boring tools including such cutting elements, and methods of forming cutting elements for earth-boring tools |
US9931736B2 (en) | 2010-06-24 | 2018-04-03 | Baker Hughes Incorporated | Cutting elements for earth-boring tools, earth-boring tools including such cutting elements, and methods of forming cutting elements for earth-boring tools |
WO2012061563A1 (en) | 2010-11-03 | 2012-05-10 | Diamond Innovations, Inc. | Cutting element structure with sloped superabrasive layer |
US9097075B2 (en) | 2010-11-03 | 2015-08-04 | Diamond Innovations, Inc. | Cutting element structure with sloped superabrasive layer |
JP2014505162A (en) * | 2010-11-24 | 2014-02-27 | スミス インターナショナル,インコーポレイティド | Polycrystalline diamond structure with optimal material composition |
US8727046B2 (en) | 2011-04-15 | 2014-05-20 | Us Synthetic Corporation | Polycrystalline diamond compacts including at least one transition layer and methods for stress management in polycrsystalline diamond compacts |
US10350730B2 (en) | 2011-04-15 | 2019-07-16 | Us Synthetic Corporation | Polycrystalline diamond compacts including at least one transition layer and methods for stress management in polycrystalline diamond compacts |
US9140072B2 (en) | 2013-02-28 | 2015-09-22 | Baker Hughes Incorporated | Cutting elements including non-planar interfaces, earth-boring tools including such cutting elements, and methods of forming cutting elements |
US10920303B2 (en) * | 2015-05-28 | 2021-02-16 | Halliburton Energy Services, Inc. | Induced material segregation methods of manufacturing a polycrystalline diamond tool |
US20180119254A1 (en) * | 2015-05-28 | 2018-05-03 | Halliburton Energy Services, Inc. | Induced material segregation methods of manufacturing a polycrystalline diamond tool |
CN109789538A (en) * | 2016-11-02 | 2019-05-21 | 哈利伯顿能源服务公司 | Leach the increased polycrystalline diamond compact of surface area and polycrystalline diamond compact leaching method |
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KR101663316B1 (en) | 2016-10-06 |
WO2008092093A2 (en) | 2008-07-31 |
EP2114620A2 (en) | 2009-11-11 |
US8679206B2 (en) | 2014-03-25 |
KR20150121728A (en) | 2015-10-29 |
US20120151846A1 (en) | 2012-06-21 |
EP2114620B1 (en) | 2015-11-18 |
ZA200903696B (en) | 2013-08-28 |
CN101646527B (en) | 2012-08-08 |
CN101646527A (en) | 2010-02-10 |
JP5739502B2 (en) | 2015-06-24 |
WO2008092093B1 (en) | 2008-11-06 |
JP2014037054A (en) | 2014-02-27 |
KR20090113259A (en) | 2009-10-29 |
JP2010516488A (en) | 2010-05-20 |
WO2008092093A3 (en) | 2008-09-12 |
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