US20080142196A1 - Heat Pipe with Advanced Capillary Structure - Google Patents
Heat Pipe with Advanced Capillary Structure Download PDFInfo
- Publication number
- US20080142196A1 US20080142196A1 US11/611,885 US61188506A US2008142196A1 US 20080142196 A1 US20080142196 A1 US 20080142196A1 US 61188506 A US61188506 A US 61188506A US 2008142196 A1 US2008142196 A1 US 2008142196A1
- Authority
- US
- United States
- Prior art keywords
- heat pipe
- capillary
- working fluid
- fluid path
- wick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat pipe has a wick of capillary structure formed on the inner wall of the heat pipe so as to form a working fluid path in the heat pipe, wherein the wick of the capillary structure is un-ringlike or various radially. The cross-section of the working fluid path in the heat pipe is in various shapes, such as in a shape of polygon, poly-petal, poly-serration, arc or semicircle. Thus, the thickness of the capillary wick structure on the inner wall of the heat pipe is various due to the shape of the working fluid path.
Description
- 1. Field of the Invention
- This invention relates to a heat pipe with a capillary structure, and in particular, relates to a heat pipe with a wick of a capillary structure at the inner wall of the pipe, in which the thickness of the wick is un-ringlike or various radially.
- 2. Description of the Related Art
- A conventional method for manufacturing a heat pipe comprises the steps of positioning a mandrel in a tube, filling metal powder into the space between the mandrel and inner wall of the tube, sintering the metal powder and removing out the mandrel. A
heat pipe 10 with a capillary structure is thus formed with a concentric andringlike wick 16, as shown inFIG. 1 . The heat pipe is performed further processes for the specific uses, such as cutting, bending, or pressing processes. The capillary wick structure is unavoidably damaged during the processes and the properties thereof is thus adversely affected, for example, the capillarity of the heat pipe is decreased, which results in a decrease of the performance of the vapor and working fluid in the heat pipe. Thus, the application of the heat pipe is limited. - Therefore, a heat pipe is demanded, in which the damage to the capillary wick of a heat pipe is limited during the manufacturing processes.
- The present invention is to provide a heat pipe with a wick of capillary structure, in which the thickness of the capillary wick structure is various radially. The cross-sectional of working fluid path in the heat pipe is in various shapes, such as in a shape of polygon, poly-petal, poly-serration, arc, or semicircle. Thus, the thickness of the capillary wick structure on the inner wall of the heat pipe is various due to the shape of the working fluid path.
- In one embodiment of the present invention, the capillary wick structure is at part of the axial semicircle or arc of the heat pipe. In another one embodiment of present invention, the working fluid path of the present heat pipe is a combination of sections with different radius, such as two sections respectively with different radius.
- A reinforced layer, such as mesh, fibers, a porous material, is provided to be formed at the inner wall of the heat pipe to incorporate into the capillary wick structure for reinforcing the capillary wick structure and enhancing the capillary transferring function thereof.
- The invention can be more fully understood by reading the subsequent detailed description in conjunction with the examples and references made to the accompanying drawings, wherein:
-
FIG. 1 is a perspective view of a conventional heat pipe with a capillary wick; -
FIG. 2 is a perspective view of an embodiment of a heat pipe with a capillary wick according to the present invention; -
FIG. 3 is a perspective view of another embodiment of a heat pipe with a capillary wick according to the present invention; -
FIG. 4 is a perspective view of another embodiment of a heat pipe with a capillary wick according to the present invention; -
FIG. 5 is a perspective view of another embodiment of a heat pipe with a capillary wick according to the present invention; -
FIG. 6 is a perspective view of another embodiment of a heat pipe with a capillary wick according to the present invention; -
FIG. 7A is a perspective view of an embodiment of a mandrel for using in manufacturing of a capillary wick according to the present invention; -
FIG. 7B is a perspective view of another embodiment of a mandrel for using in manufacturing of a capillary wick according to the present invention; -
FIG. 8 is a perspective view of another embodiment of a heat pipe with a capillary wick according to the present invention; -
FIG. 8A is a perspective view of another embodiment of a heat pipe with a capillary wick according to the present invention; -
FIG. 8B is a perspective view of another embodiment of a heat pipe with a capillary wick according to the present invention; -
FIG. 9 is a perspective view of another embodiment of a heat pipe with a capillary wick according to the present invention; -
FIG. 10 is a perspective view of another embodiment of a heat pipe with a capillary wick according to the present invention; -
FIG. 11 is a perspective view of a continuous U-shape tube made from the heat pipe ofFIG. 8 according to the present invention; - The present invention is to provide a
heat pipe 20 with acapillary wick structure 26. Referring toFIG. 2 , a mandrel of rectangular shape (not shown in the drawings) is inserted into a tube 22 for forming a workingfluid path 24 in the heat pipe. A metal powder is filled into the space between the mandrel and the inner wall of the tube. After sintering process is complete, the metal powder is sintered to form acapillary wick structure 26 on the inner wall of the tube. Thus, aheat pipe 20 with a workingfluid path 24 of rectangular shape in cross section is constructed. Thisheat pipe 20 with rectangular workingfluid path 24 is able to be pressed into a flat tube without damaging the capillary structure during the pressing process because the thickness of thecapillary wick 26 is radially various. - As shown in
FIG. 3 , aheat pipe 30 with a penta-petalousworking fluid path 34 is constructed by the above described method. Acapillary wick 36 is formed on the tube wall with a radially various thickness. When theheat pipe 30 is pressed into a flat tube, the thinner portion of thewick 36 is born with the stress damage. However, the thicker portion of thewick 36 is not damaged and keeps the original axial capillarity for the application of theheat pipe 30, such as used as a heat pipe for vaporization. - A
heat pipe 40 with an octagonalworking fluid path 44, as shown inFIG. 4 , is constructed by the above described method. The thickness of thewick 46 is various according to the shape of the octagonal mandrel. Thus, when theheat pipe 40 is pressed into a flat tube, theworking fluid path 44 is deformed into a poly-serration shape in cross section, as shown inFIG. 5 . Due to the octagonal shape of the working fluid path, the damage to the capillary wick structure is limited during the pressing process. - As described above, the non-circle mandrel is provided to form a capillary wick with different thickness radially. The different thickness of wicks is provided to meet the different requirements in different application of the present heat pipes. However, when a heat pipe is pressed for forming a specific shape, the capillary wick is stressed and thus is damaged. To minimize this possible defect to the capillary wick, the present invention is to provide a reinforced capillary structure, as shown in
FIG. 6 . Areinforce material 67 is applied to the inner wall of thetube 60. The reinforced material is a mesh, fibers, a porous material and the likes, which are well known to the skilled in the art. Optionally, a plurality of slots can be formed on the inner wall for strengthening the capillary wick structure. The reinforced material or the plurality of the slots are able to reinforce thecapillary wicks 66, especially in the case that the workingfluid path 64 is non-circle shape in cross-section. Particularly, when the thickness of thecapillary wick 66 is various radially, the reinforced means is able to compliment the thinner portion of thecapillary wick 66 to be against the pressing stress. - For a various requirements of heat pipes, the mandrel can be in various shapes, such as described above, in rectangular, penta-petalous, octagonal and the likes. Optionally, the mandrel is able to be a combination of sections with different radius, as shown in
FIG. 7 . In one embodiment of theFIG. 7A , oneend 71 a of themandrel 71 is smaller than theother end 71 b, wherein theend 71 a is in a conical shape and gradually extends toward theend 71 b. The other embodiment as shown inFIG. 7B , themandrel 73 is a combination of two sections, or multi-sections with different radius. When the mandrel ofFIGS. 7A and 7B are used to manufacture heat pipes, the thickness of capillary structure on the inner wall of the tube is axially various at the ends thereof. Thus, this heat pipe is able to be used for specific applications. - In general, heat pipes contact a heat source at one side only. Thus, the capillary wick structure can be sintered at one side of the tube for meeting the high heat transfer efficiency request. As shown in
FIG. 8 , thecapillary structure 86 is at the half side of theheat pipe 80 for concentrating the capillary function. The workingfluid path 84 is at the other half side for the vapor of working fluid in theheat pipe 80. A reinforcedlayer 87, such as in mesh, fibers, a porous material, is formed at all over the inner wall of theheat pipe 80. The reinforcedlayer 87 is performed as a secondary capillary structure for enhancing the radial capillary function inheat pipe 80. Theheat pipe 80 can be further conducted to be pressed into a flat tube, as shown inFIGS. 8 a and 8 b. InFIG. 8 a, the pressedcapillary structure 86 a is thus at the horizontal side of theheat pipe 80 a. InFIG. 8 b, the pressed capillary structure 86 b is thus at the longitudinal side. The pressed secondary capillary layers 87 a, 87 b still cover the inner wall theheat pipe - Referring to
FIG. 9 , thecurve heat pipe 90 is shown. Since the capillary structure will be significantly damaged if a tube with capillary sintering layer is bended. In such a situation, the tube is conducted a bending process and then, is sintering a wick ofcapillary structure 96. - In another one embodiment of the present invention, a capillary structure of a heat pipe 100 is manufactured as an axially various thickness. As shown in
FIG. 10 , the thickness of the capillary structure is gradually increased from theend 111 toward theend 112. Due to the space variation between theend 111 to end 112, the workingfluid path 140 and thecapillary wick 160 can effectively transfer the heat via thecapillary wick 160 and the workingfluid path 140. -
FIG. 11 shows a continuousU-shape tube 110 made from aheat pipe 80 of the embodiment ofFIG. 8 according to the present invention. In conventional, when a heat pipe is subjected to a 180° bending process, the capillary structure is damaged and the thermal resistance is very high. Thus, the continuous U-shape tube made from a conventional heat pipe is unable to perform the desired heat transfer function. The present invention is to provide a method to avoid the defeat to the capillary structure of heat pipe. In present invention, a tube is bended to form a continuous 180° U-shape tube and then, is sintered to form a wick of capillary structure, such as mesh, fibers, porous layer, as shown inFIG. 8 , so as to afford the capillary function to the tube. - Accordingly, the present invention provides a novel mandrel for using in the sintering of the capillary structure of a heat pipe. Due to the various shape of the mandrel, the capillary wick sintering thereby is in various thicknesses. Thus, the pressing damage to the capillary structure will be minimized
- As is understood by a person skilled in the art, the foregoing preferred embodiments of the present invention are illustrative of the present invention rather than limiting of the present invention. It is intended that various modifications and similar arrangements be included within the spirit and scope of the appended claims, the scope of which should be accorded the broadest interpretation so as to encompass all such modifications and similar structures.
Claims (13)
1. A heat pipe with a wick of capillary structure, in which a capillary structure is formed on the inner wall of the heat pipe so as to form a working fluid path, wherein of the capillary wick structure is un-ringlike or various radially.
2. The heat pipe as claimed in claim 1 , wherein the cross-sectional of working fluid path in the heat pipe is a shape of polygon.
3. The heat pipe as claimed in claim 1 , wherein the cross-sectional of working fluid path in the heat pipe is a shape of poly-petal.
4. The heat pipe as claimed in claim 1 , wherein the cross-sectional of working fluid path in the heat pipe is a shape of poly-serration.
5. The heat pipe as claimed in claim 1 , wherein the capillary wick structure is formed at the part of the semicircle, or arc of the heat pipe, or gradually increases the thickness of wick, or increases by step.
6. The heat pipe as claimed in claim 1 , wherein the working fluid path of the present heat pipe is a combination of sections with different radius, such as two sections respectively, or multi-sections with different radius.
7. The heat pipe as claimed in claim 1 , wherein a reinforced layer is provided to be formed at the inner wall of the heat pipe to incorporate into the capillary wick structure for reinforcing the capillary wick structure and enhancing the capillary transfer function thereof.
8. The heat pipe as claimed in claim 7 , wherein a reinforced layer is a mesh layer.
9. The heat pipe as claimed in claim 1 , wherein a reinforced layer is fibers.
10. The heat pipe as claimed in claim 1 , wherein a reinforced layer is a porous material.
11. The heat pipe as claimed in claim 1 , wherein a reinforced layer is a plurality of slots on the inner wall of the heat pipe.
12. The heat pipe as claimed in claim 1 , wherein the heat pipe is further pressed in to a flat tube.
13. The heat pipe as claimed in claim 1 , wherein heat pipe is further bended into a continuous U-shape tube.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/611,885 US20080142196A1 (en) | 2006-12-17 | 2006-12-17 | Heat Pipe with Advanced Capillary Structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/611,885 US20080142196A1 (en) | 2006-12-17 | 2006-12-17 | Heat Pipe with Advanced Capillary Structure |
Publications (1)
Publication Number | Publication Date |
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US20080142196A1 true US20080142196A1 (en) | 2008-06-19 |
Family
ID=39525742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/611,885 Abandoned US20080142196A1 (en) | 2006-12-17 | 2006-12-17 | Heat Pipe with Advanced Capillary Structure |
Country Status (1)
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Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090166004A1 (en) * | 2007-12-29 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat pipe |
US20100126701A1 (en) * | 2008-11-25 | 2010-05-27 | Foxconn Technology Co., Ltd. | Plate-type heat pipe and method for manufacturing the same |
US20100181048A1 (en) * | 2009-01-16 | 2010-07-22 | Furui Precise Component (Kunshan) Co., Ltd. | Heat pipe |
US20100266864A1 (en) * | 2009-04-16 | 2010-10-21 | Yeh-Chiang Technology Corp. | Ultra-thin heat pipe |
WO2011010395A1 (en) * | 2009-07-21 | 2011-01-27 | 古河電気工業株式会社 | Flattened heat pipe, and method for manufacturing the heat pipe |
US20110114294A1 (en) * | 2009-11-17 | 2011-05-19 | Apple Inc. | Heat removal in compact computing systems |
US20110214841A1 (en) * | 2010-03-04 | 2011-09-08 | Kunshan Jue-Chung Electronics Co. | Flat heat pipe structure |
JP2013100922A (en) * | 2011-11-07 | 2013-05-23 | Fujikura Ltd | Method of manufacturing sintered heat pipe |
JP2013100923A (en) * | 2011-11-07 | 2013-05-23 | Fujikura Ltd | Method of manufacturing sintered heat pipe |
CN103217038A (en) * | 2012-01-19 | 2013-07-24 | 奇鋐科技股份有限公司 | Improved heat pipe structure |
US20130213610A1 (en) * | 2012-02-22 | 2013-08-22 | Chun-Ming Wu | Heat pipe structure |
US20130213609A1 (en) * | 2012-02-22 | 2013-08-22 | Chun-Ming Wu | Heat pipe structure |
EP2253919A3 (en) * | 2009-05-22 | 2013-11-06 | General Electric Company | High Performance Heat Transfer Device, Methods Of Manufacture Thereof And Articles Comprising The Same |
CN103512414A (en) * | 2012-06-15 | 2014-01-15 | 奇鋐科技股份有限公司 | Heat tube structure, heat dissipation module and electronic device |
US8667684B2 (en) * | 2010-05-14 | 2014-03-11 | Furui Precise Component (Kunshan) Co., Ltd. | Flat heat pipe and method for manufacturing the same |
CN103868384A (en) * | 2012-12-14 | 2014-06-18 | 富瑞精密组件(昆山)有限公司 | Flat heat pipe and manufacturing method thereof |
US20140166246A1 (en) * | 2012-12-14 | 2014-06-19 | Foxconn Technology Co., Ltd. | Heat pipe and method for manufacturing the same |
US20140290914A1 (en) * | 2013-03-26 | 2014-10-02 | Asustek Computer Inc. | Heat pipe structure |
CN104422321A (en) * | 2013-08-22 | 2015-03-18 | 深圳市凯强热传科技有限公司 | Metal pipe, flat heat pipe and manufacturing method thereof |
CN105698579A (en) * | 2014-11-28 | 2016-06-22 | 台达电子工业股份有限公司 | Heat pipe |
US20170318702A1 (en) * | 2016-04-29 | 2017-11-02 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms |
JP2017223435A (en) * | 2016-06-14 | 2017-12-21 | 古河電気工業株式会社 | heat pipe |
CN115351280A (en) * | 2022-08-22 | 2022-11-18 | 西北有色金属研究院 | Integrated preparation method of evaporator for loop heat pipe |
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US4274479A (en) * | 1978-09-21 | 1981-06-23 | Thermacore, Inc. | Sintered grooved wicks |
US5219020A (en) * | 1990-11-22 | 1993-06-15 | Actronics Kabushiki Kaisha | Structure of micro-heat pipe |
US5720339A (en) * | 1995-03-27 | 1998-02-24 | Glass; David E. | Refractory-composite/heat-pipe-cooled leading edge and method for fabrication |
US6293333B1 (en) * | 1999-09-02 | 2001-09-25 | The United States Of America As Represented By The Secretary Of The Air Force | Micro channel heat pipe having wire cloth wick and method of fabrication |
US6619384B2 (en) * | 2001-03-09 | 2003-09-16 | Electronics And Telecommunications Research Institute | Heat pipe having woven-wire wick and straight-wire wick |
US20060162905A1 (en) * | 2005-01-27 | 2006-07-27 | Hul-Chun Hsu | Heat pipe assembly |
US20060213646A1 (en) * | 2005-03-28 | 2006-09-28 | Jaffe Limited | Wick structure of heat pipe |
US20060260786A1 (en) * | 2005-05-23 | 2006-11-23 | Faffe Limited | Composite wick structure of heat pipe |
US7210519B2 (en) * | 2004-09-08 | 2007-05-01 | Hon Hai Precision Industry Co. Ltd | Heat pipe |
-
2006
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Patent Citations (9)
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US4274479A (en) * | 1978-09-21 | 1981-06-23 | Thermacore, Inc. | Sintered grooved wicks |
US5219020A (en) * | 1990-11-22 | 1993-06-15 | Actronics Kabushiki Kaisha | Structure of micro-heat pipe |
US5720339A (en) * | 1995-03-27 | 1998-02-24 | Glass; David E. | Refractory-composite/heat-pipe-cooled leading edge and method for fabrication |
US6293333B1 (en) * | 1999-09-02 | 2001-09-25 | The United States Of America As Represented By The Secretary Of The Air Force | Micro channel heat pipe having wire cloth wick and method of fabrication |
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US20060260786A1 (en) * | 2005-05-23 | 2006-11-23 | Faffe Limited | Composite wick structure of heat pipe |
Cited By (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090166004A1 (en) * | 2007-12-29 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat pipe |
US20100126701A1 (en) * | 2008-11-25 | 2010-05-27 | Foxconn Technology Co., Ltd. | Plate-type heat pipe and method for manufacturing the same |
US20100181048A1 (en) * | 2009-01-16 | 2010-07-22 | Furui Precise Component (Kunshan) Co., Ltd. | Heat pipe |
US20100266864A1 (en) * | 2009-04-16 | 2010-10-21 | Yeh-Chiang Technology Corp. | Ultra-thin heat pipe |
EP2253919A3 (en) * | 2009-05-22 | 2013-11-06 | General Electric Company | High Performance Heat Transfer Device, Methods Of Manufacture Thereof And Articles Comprising The Same |
US20160033206A1 (en) * | 2009-07-21 | 2016-02-04 | Furukawa Electric Co., Ltd. | Flattened heat pipe and manufacturing method thereof |
US20120118537A1 (en) * | 2009-07-21 | 2012-05-17 | Furukawa Electric Co., Ltd. | Flattened heat pipe and manufacturing method thereof |
US9188396B2 (en) * | 2009-07-21 | 2015-11-17 | Furukawa Electric Co., Ltd. | Flattened heat pipe and manufacturing method thereof |
WO2011010395A1 (en) * | 2009-07-21 | 2011-01-27 | 古河電気工業株式会社 | Flattened heat pipe, and method for manufacturing the heat pipe |
US10408547B2 (en) * | 2009-07-21 | 2019-09-10 | Furukawa Electric Co., Ltd. | Flattened heat pipe and manufacturing method thereof |
JP2011043320A (en) * | 2009-07-21 | 2011-03-03 | Furukawa Electric Co Ltd:The | Flattened heat pipe, and method of manufacturing the same |
US8305761B2 (en) * | 2009-11-17 | 2012-11-06 | Apple Inc. | Heat removal in compact computing systems |
US8897016B2 (en) | 2009-11-17 | 2014-11-25 | Apple Inc. | Heat removal in compact computing systems |
US20110114294A1 (en) * | 2009-11-17 | 2011-05-19 | Apple Inc. | Heat removal in compact computing systems |
US20110214841A1 (en) * | 2010-03-04 | 2011-09-08 | Kunshan Jue-Chung Electronics Co. | Flat heat pipe structure |
US8667684B2 (en) * | 2010-05-14 | 2014-03-11 | Furui Precise Component (Kunshan) Co., Ltd. | Flat heat pipe and method for manufacturing the same |
JP2013100922A (en) * | 2011-11-07 | 2013-05-23 | Fujikura Ltd | Method of manufacturing sintered heat pipe |
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US20130213609A1 (en) * | 2012-02-22 | 2013-08-22 | Chun-Ming Wu | Heat pipe structure |
US20130213610A1 (en) * | 2012-02-22 | 2013-08-22 | Chun-Ming Wu | Heat pipe structure |
US9506699B2 (en) * | 2012-02-22 | 2016-11-29 | Asia Vital Components Co., Ltd. | Heat pipe structure |
CN103512414A (en) * | 2012-06-15 | 2014-01-15 | 奇鋐科技股份有限公司 | Heat tube structure, heat dissipation module and electronic device |
US9689625B2 (en) * | 2012-12-14 | 2017-06-27 | Furui Precise Component (Kunshan) Co., Ltd. | Heat pipe |
US20140166246A1 (en) * | 2012-12-14 | 2014-06-19 | Foxconn Technology Co., Ltd. | Heat pipe and method for manufacturing the same |
CN103868384A (en) * | 2012-12-14 | 2014-06-18 | 富瑞精密组件(昆山)有限公司 | Flat heat pipe and manufacturing method thereof |
US20140290914A1 (en) * | 2013-03-26 | 2014-10-02 | Asustek Computer Inc. | Heat pipe structure |
CN104422321A (en) * | 2013-08-22 | 2015-03-18 | 深圳市凯强热传科技有限公司 | Metal pipe, flat heat pipe and manufacturing method thereof |
CN105698579A (en) * | 2014-11-28 | 2016-06-22 | 台达电子工业股份有限公司 | Heat pipe |
US20170318702A1 (en) * | 2016-04-29 | 2017-11-02 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms |
US10694641B2 (en) * | 2016-04-29 | 2020-06-23 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms |
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US11324139B2 (en) | 2016-04-29 | 2022-05-03 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes |
JP2017223435A (en) * | 2016-06-14 | 2017-12-21 | 古河電気工業株式会社 | heat pipe |
CN115351280A (en) * | 2022-08-22 | 2022-11-18 | 西北有色金属研究院 | Integrated preparation method of evaporator for loop heat pipe |
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