US20070141289A1 - Peel ply masking device for an adhesive bonded attachment - Google Patents
Peel ply masking device for an adhesive bonded attachment Download PDFInfo
- Publication number
- US20070141289A1 US20070141289A1 US11/608,886 US60888606A US2007141289A1 US 20070141289 A1 US20070141289 A1 US 20070141289A1 US 60888606 A US60888606 A US 60888606A US 2007141289 A1 US2007141289 A1 US 2007141289A1
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- United States
- Prior art keywords
- peel
- adhesive
- attachment
- bonding surface
- ply
- Prior art date
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- Abandoned
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 86
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 86
- 230000000873 masking effect Effects 0.000 title claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 239000007767 bonding agent Substances 0.000 claims abstract description 26
- 238000011109 contamination Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 46
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 229920006267 polyester film Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 3
- 239000013464 silicone adhesive Substances 0.000 claims 2
- 238000000926 separation method Methods 0.000 abstract description 8
- 238000005530 etching Methods 0.000 abstract description 3
- 238000005488 sandblasting Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000002411 adverse Effects 0.000 description 4
- 230000002452 interceptive effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B37/00—Nuts or like thread-engaging members
- F16B37/04—Devices for fastening nuts to surfaces, e.g. sheets, plates
- F16B37/048—Non-releasable devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24777—Edge feature
- Y10T428/24793—Comprising discontinuous or differential impregnation or bond
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A peel ply conformable masking device for protectively overlying a pre-cleaned bonding surface of an adhesive attachment adapted for bonded affixation to a selected substrate, such as an adhesive attachment of the type disclosed in U.S. Pat. Nos. 5,013,391 and 6,773,780 having a bonding surface circumscribing a temporary attachment member for holding the attachment against the substrate for the duration of a bonding agent cure time. The bonding surface of the adhesive attachment is pre-cleaned as by sand blasting and/or etching, and the masking device comprising a peel-off film carrying a thin layer of a peel-off adhesive is placed thereover to prevent contamination thereof. The masking device includes at least one aperture surrounding the temporary attachment member, and further includes at least one outwardly protruding and easily grasped pull tab for facilitated peel-off separation from bonding surface immediately prior to bonded affixation to the selected substrate.
Description
- This invention relates generally to improvements in and to adhesive attachments of the type designed for bonded affixation to a selected substrate, such as an adhesive attachment of the type disclosed in U.S. Pat. Nos. 5,013,391 and 6,773,780 having a bonding surface circumscribing a temporary attachment member which holds the attachment bonding surface against the substrate for the duration of a bonding agent cure time. More specifically, this invention relates to a protective peel-off masking device for overlying a pre-cleaned attachment bonding surface to safeguard the bonding surface against undesired contamination prior to installation onto the selected substrate.
- Adhesive bonded attachments are generally known in the art for connecting a selected component such as a threaded nutplate or a threaded bolt onto a selected substrate such as a panel or other frame component in an aerospace or automotive application or the like. Such adhesive attachments typically define a bonding surface adapted to receive a selected curable bonding agent, whereupon the bonding surface is pressed against the selected substrate for the duration of bonding agent cure time. In preferred attachment designs, a temporary attachment member is provided for temporary connection to or engagement with the substrate in a manner functioning to urge or draw the bonding surface firmly against the substrate until the bonding agent is substantially completely cured. As a result, the adhesive bonded attachment is affixed to the substrate with a substantially optimized adhesive attachment force.
- In one such adhesive attachment design, as disclosed in U.S. Pat. No. 5,013,391 which is incorporated by reference herein, a nutplate assembly includes a threaded nut carried by a nutplate base which defines the bonding surface for adhesive bonded attachment to the substrate. The threaded nut additionally carries a resilient fixture pin having a size and shape to be pulled into and bindingly engage an opening formed in the substrate. This fixture pin thus comprises the temporary attachment member circumscribed by the bonding surface on the nutplate base. The fixture pin functions to draw the bonding surface of the nutplate base firmly against the substrate for the duration of a bonding agent cure time, resulting in strong adhesive attachment of the nutplate base to the substrate. After the bonding agent cures, the resilient fixture pin can be pulled through the substrate opening and separated from the threaded nut. Subsequently, the threaded nut is exposed through the substrate opening for appropriate assembly with a suitable threaded fastener or the like.
- In another adhesive attachment design, as disclosed in U.S. Pat. No. 6,773,780 which is also incorporated by reference herein, a threaded fastener such as a headed bolt or screw is carried by a generally annular mounting base defining the bonding surface for adhesive affixation to a selected substrate. In this design, the fastener head comprises the temporary attachment member circumscribed by the bonding surface on the mounting base. The fastener head carries a pressure sensitive adhesive or the like suitable for temporary or impermanent connection to the substrate. The thus-adhered fastener head cooperates with one or more resilient spring-like structures to apply a positive force to the mounting base in a direction pressing the bonding surface thereon against the substrate for the duration of a bonding agent cure time. Once again, this produces a strong adhesive bonded attachment of the mounting base to the substrate, which in turn supports and retains the fastener relative to the substrate.
- While such adhesive bonded attachments of the above-described types beneficially secure the nutplate or fastener or other attachment component to the substrate with a strong adhesive bonding force, the actual or empirical bonding force can be adversely impacted by the condition and/or cleanliness of the bonding surface at the time of installation onto the substrate. In this regard, the bonding surface is normally pre-cleaned during product manufacture as by sand blasting and/or surface etching, to remove any particulate debris and further to passivate the bonding surface for optimum subsequent bond strength attachment with the selected bonding agent. However, despite such surface pre-cleaning, some bonding surface materials such as certain metals may exhibit varying degrees of oxidation contamination depending upon the time delay between product manufacture and subsequent installation of the adhesive attachment onto a substrate. Alternately, or in addition, post-production contamination of the bonding surface can be attributable to other factors, such as exposure of the bonding surface to dirt and dust, and/or the course of human handling prior to installation. Any or all of these factors can contribute to a reduced bond strength attachment force between the adhesive attachment and the substrate. To avoid this problem, it has sometimes been necessary to re-clean the bonding surface immediately prior to installation of the adhesive attachment onto the substrate.
- There exists, therefore, a need for improvements in and to adhesive bonded attachments particularly with respect to an improved device or method for safeguarding a pre-cleaned attachment bonding surface against undesired post-production contamination in the course of pre-installation shipment, handling and/or storage. The present invention fulfills these needs and provides further related advantages.
- In accordance with the invention, a relatively simple yet highly effective masking device is provided for mounting onto an adhesive bonded attachment, preferably in the course of attachment production, wherein the masking device effectively overlies and safeguards a pre-cleaned attachment bonding surface against undesired post-production contamination which could otherwise interfere with adhesive bonded affixation of the attachment onto a selected substrate. The masking device comprises a relatively thin and somewhat resilient film ply constructed from a substantially fluid-impervious material. The film ply overlies the attachment bonding surface in substantially hermetically sealed and intimate conformal relation therewith, as by means of a selected peel-off pressure sensitive adhesive or the like. Immediately prior to installation onto the selected substrate, the film ply and adhesive means are peeled away to expose the pre-cleaned attachment bonding surface to receive a selected curable bonding agent preparatory to installation onto the substrate.
- In a preferred form, the adhesive attachment includes the pre-cleaned bonding surface in a configuration substantially circumscribing or surrounding a temporary attachment member, of the general type disclosed in U.S. Pat. Nos. 5,013,391 and 6,773,780. The masking device comprising the film ply and associated peel-off adhesive means is constructed in a shape for substantially matingly overlying the bonding surface, whereby the masking device also circumscribes the temporary attachment member, i.e., the masking device has at least one aperture formed therein to accommodate pass-through reception of the temporary attachment member. In addition, the film ply defines at least one pull tab which projects outwardly beyond a periphery of the bonding surface for facilitated peel-off separation of the masking device immediately prior to attachment installation onto the substrate. The pull tab, in the preferred form, also projects outwardly beyond the associated peel-off adhesive means for sealably securing the film ply over the bonding surface.
- Preferred materials for the film ply comprise relatively thin polyimide or polyester film material having suitable substantially fluid-impervious or gas-impervious properties, and preferably having a thickness on the order of about 0.001 inch to provide sufficient hermetically sealed conformance with non-planar bonding surface configurations, and also to provide sufficient stretch capacity for facilitated peel-off separation in otherwise relatively close-fit relation with other attachment components such as the temporary attachment member. Preferred peel-off adhesive materials for use with the film ply include acrylic and silicone-based adhesives, preferably having a highly cross-linked and substantially cured construction to avoid deposit of any significant residual adhesive material on the associated attachment bonding surface following peel-off separation of the masking device. In the most preferred form, the peel-off adhesive material used with the film ply is compatible with the bonding agent applied subsequently to the exposed bonding surface, so that any residual adhesive material remaining on the bonding surface after masking device separation will not adversely impact attachment bond strength affixation to the substrate.
- Other features and advantages of the present invention will become apparent from the following more detailed description, taken in connection with the accompanying drawing which illustrate, by way of example, the principals of the present invention.
- The accompanying drawings illustrate the invention. In such drawings:
-
FIG. 1 is a perspective view of an exemplary adhesive bonded attachment in the form of a nutplate assembly for adhesive bonding onto a substrate, wherein a nutplate base carries a peel ply masking device embodying the novel features of the invention; -
FIG. 2 is a side elevation view of the nutplate assembly ofFIG. 1 , and illustrating peel-off removal of the masking device to expose a bonding surface on the nutplate base; -
FIG. 3 is a fragmented perspective view showing placement of an adhesive bonding agent onto the exposed bonding surface of the nutplate base; -
FIG. 4 is a fragmented perspective view depicting bond-on placement of the nutplate assembly ofFIG. 3 onto a selected substrate; -
FIG. 5 is an enlarged and fragmented sectional view taken generally on the line 5-5 ofFIG. 4 ; -
FIG. 6 is an enlarged and fragmented plan view showing a succession of peel ply masking devices of the present invention carried on a liner tape; -
FIG. 7 is a cross sectional view taken generally on the line 7-7 ofFIG. 6 ; -
FIG. 8 is an underside perspective view showing an alternative adhesive bonded attachment in the form of a threaded stud carried by a mounting base defining an attachment bonding surface, and further illustrating a peel ply masking device in accordance with one alternative preferred form of the invention for normally covering and masking the attachment bonding surface; -
FIG. 9 is an underside perspective view of the threaded stud and mounting base-type attachment shown inFIG. 8 , and further depicting placement of an adhesive bonding agent onto the bonding surface of the mounting base, following peel-off removal of the masking device; -
FIG. 10 is a fragmented vertical sectional view showing initial placement of the attachment ofFIG. 9 onto a selected substrate; and -
FIG. 11 is a fragmented vertical sectional view similar toFIG. 10 , but illustrating secure bonded affixation of the attachment to the substrate. - As shown in the exemplary drawings, a peel ply masking device referred to generally in
FIGS. 1-2 and 6-7 by thereference numeral 10 is provided for protectively overlying a pre-cleaned bonding surface 12 (FIG. 5 ) of an adhesive attachment 1 4, such as the illustrative nutplate assembly shown inFIGS. 1-5 . Theadhesive attachment 14 is designed for relatively high strength adhesive bonded affixation onto a selected substrate 1 6. The peelply masking device 10 of the present invention effectively safeguards theattachment bonding surface 12 against undesired post-production contamination which could otherwise adversely affect the bond-on affixation strength. - The illustrative adhesive attachment 1 4 shown in
FIGS. 1-5 comprises a nutplate assembly of the type disclosed in U.S. Pat. No. 5,013,391, which is incorporated by reference herein. As shown, this nutplate assembly comprises a threadednut 18 or the like carried preferably with at least some floating or freedom of movement by anutplate base 20 having an underside surface defining thebonding surface 12. Aresilient fixture pin 22 is carried by the threadednut 18 to include atail segment 23 protruding through thenutplate base 20 and projecting outwardly or downwardy therefrom. Thisfixture pin 22 comprises a temporary attachment member for short-term retention of thenutplate assembly 14 on thesubstrate 16 for the cure time of the selectedbonding agent 24. - In use, again as described in the above-referenced U.S. Pat. No. 5,013,391, a
curable bonding agent 24 is applied directly onto the nutplatebase bonding surface 12, as by means of asuitable agent applicator 26 as viewed inFIG. 3 . Thenutplate assembly 14 is then seated upon the selectedsubstrate 16, such as a panel or frame component of an aircraft or automotive structure or the like, with thetail 23 of thefixture pin 22 extending through an opening 28 (FIG. 5 ) formed in thesubstrate 16. In this regard, thefixture pin 22 is sized for pull-through reception through thesubstrate opening 28, with a radiallyenlarged shoulder segment 30 on thefixture pin 22 bindingly engaging within thesubstrate opening 28. This binding engagement between the fixture pin and the substrate enables the fixture pin to apply a pulling or drawing force to thenutplate assembly 14, resulting in a positive force urging thebonding surface 12 toward thesubstrate 16. This arrangement effectively draws thebonding surface 12 toward intimate seated relation with the substrate, as thebonding agent 24 therebetween is extruded outwardly to achieve a minimum bond line thickness with a maximum bond strength attachment. Thefixture pin 22 remains engaged with thesubstrate 16 for the duration of a bonding agent cure time, after which thefixture pin 22 can be separated from the adhesively bonded components by pulling outwardly on the tail segment 23 (FIG. 4 ). - The peel
ply masking device 10 of the present invention effectively overlies and seals thebonding surface 12 of thenutplate assembly 14 to prevent undesired post-production contamination thereof. The maskingdevice 10 is quickly and easily removable from thebonding surface 12 by simple peel-off separation therefrom, immediately prior to installation onto thesubstrate 16. - More particularly, as shown best in
FIGS. 6-7 , the peelply masking device 10 comprises afilm ply 32 formed from a selected material which is substantially impervious to fluids including but not limited to air. This film ply 32 may be constructed, in accordance with preferred forms, from a selected polymer-based material such as a polyimide or polyester film material having a relatively thin structure and sufficient inherent flexibility and/or resiliency to accommodate close-fit and substantially sealed overlying conformance with an associatedbonding surface 12 which may exhibit deviations from a true planar shape. In this regard, a preferred thickness for the film ply 32 is on the order of about 0.001 inch. - The film ply 32 is pre-cut to define a
main body segment 34 having a size and shape for substantially mated overlying fit with the associatedbonding surface 12. In this regard, as viewed best inFIG. 6 , thebody segment 34 of each film ply 32 is shown with a generally rectangular geometry having suitable length and width dimensions for conformably overlying the generally rectangular shape of thebonding surface 12 on the underside of the associated nutplate base 20 (FIGS.1 -5 ). In addition, since thebonding surface 12 circumscribes or surrounds a central port 36 (FIG. 5 ) formed in thenutplate base 20 to accommodate passage of thefixture pin 22, thebody segment 34 of the film ply 32 additionally includes at least oneaperture 38 for alignment therewith. - A peel-off
adhesive material 40 is provided in a thin layer underlying thepeel ply 32, wherein this peel-offadhesive material 40 is designed for quickly and easily mounting themasking device 10 onto thebonding surface 12 in a conformably fit, substantially hermetically sealed manner. The peel-offadhesive material 40 comprises, in one preferred form, a pressure sensitive adhesive preferably such as an acrylic or silicone-based adhesive material that is highly cross-linked and substantially cured to avoid deposit of any significant residual adhesive material on the associatedbonding surface 12 following peel-off separation from thebonding surface 12 substantially as a unit with the film ply. In the most preferred form, the peel-offadhesive material 40 used with the film ply 32 is compatible with thebonding agent 24 applied subsequently to the exposed bonding surface, so that any residual adhesive material remaining on the bonding surface after masking device separation will not adversely impact attachment bond strength affixation to the substrate. - The film ply 32 is additional formed to include at least one
pull tab 42 protruding outwardly from themain body segment 34, with the illustrative drawings shown a pair ofsuch pull tabs 42 projecting outwardly from opposite sides of themain body segment 34. Thesepull tabs 42 are, in the preferred form, associated with an underlying paper liner 43 (FIG. 7 ) to prevent adherence to theattachment 14 or other structure. - The masking
device 10, as described, may be produced in tape form as by producing a succession of maskingdevices 10 adhered by means of the peel-offadhesive material 40 to one side of an elongated flexibletape carrier strip 44 as viewed inFIG. 6 . In this form, themasking devices 10 may be subjected to a suitable punch-cut step for producing thecentral apertures 38 respectively therein (and also through the carrier strip 44). In addition, in this form, themasking devices 10 can be peel-away separated from thetape carrier strip 44 manually or by means of automated production equipment for individual mounting onto a nutplatebase bonding surface 12 as viewed inFIGS. 1-2 . - In such mounted position, each masking
device 10 effectively overlies and seals thebonding surface 12, which has been pre-cleaned and passivated as by appropriate sand blasting and/or surface etching steps. Thecentral aperture 38 in each maskingdevice 10 is aligned with theport 36 in thebonding surface 12 to accommodate close-fit passage of thefixture pin 22 in a non-interfering manner. The paper-linedpull tabs 42 project outwardly from opposite ends of thebonding surface 12 for easy manual grasping and peel-off removal of the masking device 10 (FIG. 2 ), including the film ply 32 and associated peel-offadhesive material 40, with the film ply 32 having sufficient flexibility or resilience to pull away from thefixture pin 22 despite close-fit tolerance therewith. As a result, the pre-cleaned and mask-protectedbonding surface 12 is now exposed for application of the bonding agent 24 (FIG. 3 ) and mounting onto the substrate 16 (FIGS. 4-5 ) as previously described. -
FIGS. 8-11 depict the masking device of the present invention in one alternative preferred form, wherein components corresponding in structure or function with those previously shown and described herein are identified by common reference numerals increase by 100. As shown, the modifiedmasking device 110 is configured for use with an alternativeadhesive attachment 114, such as a threadedfastener 118 carried by a mountingbase 120 defining abonding surface 112 for adhesive bonded affixation onto a selectedsubstrate 116. Such alternativeadhesive attachment 114 is shown and described in further detail in U.S. Pat. No. 6,773,780, which is also incorporated by reference herein. - More particularly, the
adhesive attachment 114 comprises the threadedfastener 118 such as a bolt or screw having anenlarged head 122 forming the temporary attachment member for short-term securement to thesubstrate 116. As shown, thefastener head 122 carries a pressuresensitive adhesive 60 of the like, in a position disposed generally centrally within and substantially surrounded or circumscribed by thebonding surface 112 of generally annular shape formed on the underside of the mountingbase 120. In use, a selectedbonding agent 124 is applied as by means of an applicator 126 (FIG. 9 ) to thebonding surface 112, followed by pressed seating of the mountingbase 120 firmly against thesubstrate 116. Thefastener 118 is then pressed firmly against thesubstrate 116, as indicated byarrow 62 inFIG. 10 , to advance the adhesive-coatedhead 122 of the fastener into temporary adhesive connection with thesubstrate 116. Thefastener head 118 thus applies a pulling or drawing force to aspring member 64 coupled between the fastener head and the mountingbase 120, for purposes of drawing the mountingbase 120 and thebonding surface 112 thereon firmly toward thesubstrate 116 for the duration of a bonding agent cure time. Once again, as in the prior-discussed embodiment, this drawing force beneficially causes thebonding agent 124 to be extruded outwardly to achieve a minimum bond line thickness with a maximum bond strength attachment. - The modified
masking device 110 is constructed in generally the same manner as previously shown and described herein, to include afilm ply 132 shaped for conformal overlying placement to protectively cover thebonding surface 112. In this regard, thefilm ply 132 includes acentral body segment 134 having a peel-offadhesive material 140 lining one side thereof for sealed overlying placement covering thebonding surface 112, with at least oneaperture 138 formed therein for accommodating thefastener head 122 and associatedadhesive material 60 andspring member 64 in a non-interfering manner. The film ply 132 further includes at least one outwardly protrudingpull tab 142, such as the pair of oppositely projectingpull tabs 142 shown inFIG. 8 , wherein thesepull tabs 142 are not associated with or lined by the peel-offadhesive material 140. - The modified
masking device 110 thus also seals and protects thebonding surface 112 against post-production contamination. Themasking device 110 is quickly and easily separated from thebonding surface 112 immediately prior to installation of theattachment 114 onto thesubstrate 116. - Although various embodiments and alternatives have been described in detail for purposes of illustration, various further modifications may be made without departing from the scope and spirit of the invention. Accordingly, no limitation on the invention is intended by way of the foregoing description and accompanying drawings, except as set forth in the appended claims.
Claims (20)
1. In an adhesive attachment having a bonding surface for adhesive attachment to a substrate, a peel ply masking device, comprising:
a conformable film ply formed from a substantially fluid impervious material, and having a body segment with a size and shape for substantially overlying the attachment bonding surface; and
a peel-off adhesive material carried by said film ply body segment for removably mounting said body segment onto the attachment bonding surface in intimate, substantially overlying fit relation therewith to prevent contamination thereof;
said film ply and said peel-off adhesive material being removable substantially as a unit from the attachment bonding surface.
2. The peel ply masking device of claim 1 wherein said film ply further includes at least one pull tab projecting outwardly from said body segment.
3. The peel ply masking device of claim 2 wherein said at least one pull tab projects outwardly beyond said peel-off adhesive material.
4. The peel ply masking device of claim 1 wherein said film ply comprises a material selected from the group consisting essentially of polyimide and polyester film material.
5. The peel ply masking device of claim 4 wherein said film ply has a thickness of about 0.001 inch.
6. The peel ply masking device of claim 1 wherein said peel-off adhesive material comprises a highly cross-linked pressure sensitive adhesive material.
7. The peel ply masking device of claim 1 wherein said peel-off adhesive material is selected from the group consisting essentially of acrylic and silicone adhesives.
8. The peel ply masking device of claim 1 further including a curable bonding agent for adhesively bonding the attachment bonding surface to a substrate, and further wherein said peel-off adhesive material comprises an adhesive material compatible with the curable bonding agent.
9. The peel ply masking device of claim 1 wherein the adhesive bonding surface substantially circumscribes a temporary attachment device, and further wherein said film ply has a central aperture formed therein.
10. An adhesive attachment assembly, comprising:
an adhesive attachment device defining a bonding surface for adhesive attachment to a substrate; and
a peel ply masking device including a conformable film ply formed from a substantially fluid impervious material, and having a body segment with a size and shape for substantially overlying said bonding surface;
said peel ply masking device further including a peel-off adhesive material carried by said film ply body segment for removably mounting said body segment onto the attachment bonding surface in intimate, substantially overlying fit relation therewith to prevent contamination thereof;
said film ply and said peel-off adhesive material being removable substantially as a unit from the attachment bonding surface.
11. The adhesive attachment assembly of claim 10 wherein said film ply further includes at least one pull tab projecting outwardly from said body segment.
12. The adhesive attachment assembly of claim 11 wherein said at least one pull tab projects outwardly beyond said peel-off adhesive material.
13. The adhesive attachment assembly of claim 10 wherein said film ply comprises a material selected from the group consisting essentially of polyimide and polyester film material.
14. The adhesive attachment assembly of claim 13 wherein said film ply has a thickness of about 0.001 inch.
15. The adhesive attachment assembly of claim 10 wherein said peel-off adhesive material comprises a highly cross-linked pressure sensitive adhesive material.
16. The adhesive attachment assembly of claim 10 wherein said peel-off adhesive material is selected from the group consisting essentially of acrylic and silicone adhesives.
17. The adhesive attachment assembly of claim 10 further including a curable bonding agent for adhesively bonding the attachment bonding surface to a substrate, and further wherein said peel-off adhesive material comprises an adhesive material compatible with the curable bonding agent.
18. The adhesive attachment assembly of claim 10 wherein the adhesive bonding surface substantially circumscribes a temporary attachment device, and further wherein said film ply has a central aperture formed therein.
19. A peel ply masking device assembly, comprising:
an elongated carrier tape; and
a succession of individual peel ply masking devices on said carrier tape, each of said peel ply masking devices comprising a film ply including a body segment, and a peel-off adhesive material interposed between said body segment and said carrier tape;
said peel ply masking devices being individually separable from said carrier tape for removable mounting of said body segment thereof in intimate, substantially overlying fit onto a bonding surface of an adhesive attachment to prevent contamination of said bonding surface.
20. The peel ply masking device assembly of claim 19 wherein said film ply further includes at least one pull tab projecting outwardly from said body segment.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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US11/608,886 US20070141289A1 (en) | 2005-12-19 | 2006-12-11 | Peel ply masking device for an adhesive bonded attachment |
PCT/US2006/062001 WO2007076267A2 (en) | 2005-12-19 | 2006-12-13 | Peel ply masking device for an adhesive bonded attachment |
US12/699,210 US8038823B2 (en) | 2005-12-19 | 2010-02-03 | Peel ply masking device for an adhesive bonded attachment |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US75180605P | 2005-12-19 | 2005-12-19 | |
US11/608,886 US20070141289A1 (en) | 2005-12-19 | 2006-12-11 | Peel ply masking device for an adhesive bonded attachment |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/699,210 Continuation US8038823B2 (en) | 2005-12-19 | 2010-02-03 | Peel ply masking device for an adhesive bonded attachment |
Publications (1)
Publication Number | Publication Date |
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US20070141289A1 true US20070141289A1 (en) | 2007-06-21 |
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/608,886 Abandoned US20070141289A1 (en) | 2005-12-19 | 2006-12-11 | Peel ply masking device for an adhesive bonded attachment |
US12/699,210 Active US8038823B2 (en) | 2005-12-19 | 2010-02-03 | Peel ply masking device for an adhesive bonded attachment |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/699,210 Active US8038823B2 (en) | 2005-12-19 | 2010-02-03 | Peel ply masking device for an adhesive bonded attachment |
Country Status (2)
Country | Link |
---|---|
US (2) | US20070141289A1 (en) |
WO (1) | WO2007076267A2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7389698B2 (en) * | 2005-08-24 | 2008-06-24 | Physical Systems, Inc. | Nutplate bond strength tester unit |
WO2009095673A2 (en) | 2008-01-30 | 2009-08-06 | Gareth Phillips | Fixing |
US20160223103A1 (en) * | 2015-01-30 | 2016-08-04 | Michael E. Osborne | Pipe Dope Applicator Apparatus |
US10899083B1 (en) * | 2018-03-29 | 2021-01-26 | Kineticure, Llc | Bonded nutplate rapid cure system |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8616868B2 (en) * | 2011-02-28 | 2013-12-31 | Physical Systems, Inc. | Sealant mold fixture for a domed cap |
DE102016105794A1 (en) * | 2016-03-30 | 2017-10-05 | Böllhoff Verbindungstechnik GmbH | fastener |
US10378569B2 (en) | 2017-10-25 | 2019-08-13 | Caterpillar Inc. | Adhesive based mounting structure |
Citations (4)
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US4134153A (en) * | 1975-07-18 | 1979-01-16 | Voorhees Donna S | Throw-away ear protector |
US5013391A (en) * | 1989-06-12 | 1991-05-07 | Physical Systems, Inc. | Adhesive nutplate assembly for mounting |
US6001441A (en) * | 1995-11-06 | 1999-12-14 | Polizzano; Ross | Sanitary strip for drinking vessels |
US6773780B2 (en) * | 2001-08-14 | 2004-08-10 | Physical Systems, Inc. | Self fixturing adhesive attachment |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US4842912A (en) * | 1985-09-04 | 1989-06-27 | Physical Systems, Inc. | Adhesive attachment and mounting fixture |
US4822656A (en) * | 1985-09-04 | 1989-04-18 | Physical Systems, Inc. | Fixture for securing an adhesive attachment to a substrate |
US5348791A (en) * | 1988-05-04 | 1994-09-20 | W. R. Grace Limited | Foldable waterproofing structure |
US5888335A (en) * | 1989-10-26 | 1999-03-30 | Minnesota Mining And Manufacturing Company | Multiple releasable contact responsive fasteners |
JPH04198383A (en) * | 1990-11-28 | 1992-07-17 | Sekisui Chem Co Ltd | Surface protecting film |
US5866249A (en) * | 1995-12-18 | 1999-02-02 | Minnesota Mining And Manufacturing Company | Pressure-sensitive adhesive based on partially oriented and partially crystallized elastomer |
WO2003008134A2 (en) * | 2001-07-16 | 2003-01-30 | Denki Kagaku Kogyo Kabushiki Kaisha | Surface protection film |
US6727466B2 (en) * | 2001-12-18 | 2004-04-27 | Physical Systems, Inc. | Adhesive attachment assembly with heat source |
-
2006
- 2006-12-11 US US11/608,886 patent/US20070141289A1/en not_active Abandoned
- 2006-12-13 WO PCT/US2006/062001 patent/WO2007076267A2/en active Application Filing
-
2010
- 2010-02-03 US US12/699,210 patent/US8038823B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4134153A (en) * | 1975-07-18 | 1979-01-16 | Voorhees Donna S | Throw-away ear protector |
US5013391A (en) * | 1989-06-12 | 1991-05-07 | Physical Systems, Inc. | Adhesive nutplate assembly for mounting |
US6001441A (en) * | 1995-11-06 | 1999-12-14 | Polizzano; Ross | Sanitary strip for drinking vessels |
US6773780B2 (en) * | 2001-08-14 | 2004-08-10 | Physical Systems, Inc. | Self fixturing adhesive attachment |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7389698B2 (en) * | 2005-08-24 | 2008-06-24 | Physical Systems, Inc. | Nutplate bond strength tester unit |
WO2009095673A2 (en) | 2008-01-30 | 2009-08-06 | Gareth Phillips | Fixing |
WO2009095673A3 (en) * | 2008-01-30 | 2010-09-02 | Gareth Phillips | Fixing |
US20100320346A1 (en) * | 2008-01-30 | 2010-12-23 | Gareth Phillips | Fixing |
US20160223103A1 (en) * | 2015-01-30 | 2016-08-04 | Michael E. Osborne | Pipe Dope Applicator Apparatus |
US10899083B1 (en) * | 2018-03-29 | 2021-01-26 | Kineticure, Llc | Bonded nutplate rapid cure system |
US11472127B1 (en) | 2018-03-29 | 2022-10-18 | Kineticure, Llc | Bonded nutplate rapid cure system |
US11541611B1 (en) | 2018-03-29 | 2023-01-03 | Kineticure, Llc | Bonded nutplate rapid cure system |
Also Published As
Publication number | Publication date |
---|---|
WO2007076267A2 (en) | 2007-07-05 |
US20100147453A1 (en) | 2010-06-17 |
WO2007076267A3 (en) | 2007-11-29 |
US8038823B2 (en) | 2011-10-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: PHYSICAL SYSTEMS, INC., NEVADA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HUTTER, CHARLES G., III;REEL/FRAME:018609/0694 Effective date: 20061119 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |