US20070018325A1 - Semiconductor device and method for fabricating the same - Google Patents

Semiconductor device and method for fabricating the same Download PDF

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Publication number
US20070018325A1
US20070018325A1 US11/481,199 US48119906A US2007018325A1 US 20070018325 A1 US20070018325 A1 US 20070018325A1 US 48119906 A US48119906 A US 48119906A US 2007018325 A1 US2007018325 A1 US 2007018325A1
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Prior art keywords
electrode line
line structure
lower electrode
semiconductor device
guard contact
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Abandoned
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US11/481,199
Inventor
Young Kim
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SK Hynix Inc
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Hynix Semiconductor Inc
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Assigned to HYNIX SEMICONDUCTOR INC. reassignment HYNIX SEMICONDUCTOR INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, YOUNG SEOK
Publication of US20070018325A1 publication Critical patent/US20070018325A1/en
Priority to US12/271,626 priority Critical patent/US8013447B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
    • H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
    • H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a semiconductor memory device. More particularly, the present invention relates to a method for fabricating a memory device wherein a guard contact formed in a chip guard is strengthened to prevent cracking caused from outside stresses.
  • FIG. 1 is a layout view illustrating a conventional semiconductor device.
  • FIG. 2 is a simplified cross-sectional view taken along line I-I′ of FIG. 1 .
  • a lower electrode line structure 30 and an upper electrode line structure 50 are disposed over a semiconductor substrate (not shown) having a lower structure including a gate, a bit line, and a bit line contact.
  • a guard contact 40 is disposed between the lower electrode line structure 30 and the upper electrode line structure 50 .
  • the guard contact 40 is formed of a whole body-type contact vertical to the lower electrode line structure 30 .
  • the guard contact 40 is formed to prevent impurity particles from passing.
  • FIG. 3 is a simplified cross-sectional view illustrating a conventional semiconductor device. In particular, it shows the failure of a fuse guard structure caused by the outside stresses.
  • a gate 5 and a bit line 20 is formed over a semiconductor substrate (not shown), and a bit line contact 15 is formed to connect the bit line 20 to the gate 5 .
  • a lower electrode line structure 30 is formed over the bit line 20 , and a lower electrode contact 25 is formed to connect the lower electrode line structure 30 to the bit line 20 .
  • An upper electrode line structure 50 is formed over the lower electrode line structure 30 , and a whole body-type guard contact 40 is formed to connect the upper electrode line structure 50 to the lower electrode line structure 30 .
  • the guard contact cannot prevent a crack from occurring when a chip is cut due to shrinkage to a fuse of the device.
  • a “cracking phenomenon” between the electrode line structures shown in FIG. 3 occurs due to the outside stress and pressures in other processes. This allows impurity particles to enter into the lower electrode line structure through the cracks. Accordingly, the yield and reliability of the device may be degraded.
  • the present invention relates to a semiconductor device and a method for fabricating wherein a guard contact formed in a chip guard is designed with two portions with different line widths.
  • the two portions provide a zigzag or criss-cross pattern to increase the strength of the structure, thereby preventing impurity particles from passing and increasing resistance against outside stresses. Accordingly, reliability and yield of the device can be improved.
  • a semiconductor device having an upper electrode line structure and a lower electrode line structure over a semiconductor substrate includes: a guard contact having a first portion and a second portion with different line width, disposed between the upper electrode line structure and the lower electrode line structure, wherein the first portion is disposed parallel to the upper electrode line structure, and the second portion is disposed perpendicular to the upper electrode line structure.
  • a method for fabricating a semiconductor device includes: (a) forming a lower electrode line structure over a semiconductor substrate having a lower structure; (b) forming a guard line having a first portion and a second portion over the lower electrode structure, wherein the line width of the first and second regions are different; and (c) forming an upper electrode line structure over the guard contact.
  • FIG. 1 is a simplified layout of a conventional semiconductor device.
  • FIG. 2 is a simplified cross-sectional view illustrating a conventional semiconductor device.
  • FIG. 3 is a simplified cross-sectional view illustrating a conventional semiconductor device.
  • FIG. 4 is a simplified layout of a semiconductor device according to one embodiment of the present invention.
  • FIG. 5 is a simplified cross-sectional view illustrating a semiconductor device according to one embodiment of the present invention.
  • FIG. 6 is a simplified layout of a semiconductor device according to another embodiment of the present invention.
  • FIG. 4 is a simplified layout of a semiconductor device according to one embodiment of the present invention.
  • a lower electrode line structure 130 and an upper electrode line structure 150 are manufactured parallel to each other over a semiconductor substrate (not shown) having a lower structure (not shown).
  • a guard contact 140 having a first portion 145 and a second portion 143 with different line width are disposed between the lower electrode line structure 130 and the upper electrode line structure 150 .
  • the first portion 145 and the second portion 143 of the guard contact 140 is alternately disposed over the lower electrode line structure 130 in a zigzag pattern, as can be seen in FIG. 4 a .
  • the line width of the second portion 143 (B) is equal to or greater than that of the first portion 145 (A).
  • the line width of the second portion 143 is at least twice that of the first portion 145 , the width being the direction along the longitudinal extension of the lower electrode line structure 130 .
  • FIG. 5 is a simplified cross-sectional view taken along the line II-II′ of FIG. 4 .
  • Reference symbols A and B denote the line width of the first portion 145 and that of the second portion 143 , respectively. Since B is greater than A in the guard contact 140 , the lower electrode line structure 130 can support the outside stress or pressure from other processes, thereby preventing cracking phenomenon for the guard contact. Thereafter, an upper electrode line structure 150 is formed over the guard contact 140 .
  • FIG. 6 is a simplified layout of a semiconductor device according to another embodiment of the present invention.
  • a lower electrode line structure 130 and an upper electrode line structure 150 are manufactured parallel to each other over the semiconductor substrate (not shown).
  • a guard contact 140 having a first portion 145 and a second portion 143 with different line width are disposed between the lower electrode line structure 130 and the upper electrode line structure 150 .
  • the first portion 145 and the second portion 143 of the guard contact 140 is alternately disposed over the lower electrode line structure 130 , where the two portions (or regions) are centered over the lower electrode line structure 130 , as can be seen in FIG. 6 .
  • the second portion 143 has substantially the same line width along a longitudinal direction of the lower electrode line structure 130 .
  • the line width of the second portion 143 (B) is greater than that of the first portion 145 (A).
  • the guard contact plays the role of a structural member for supporting the outside stresses or pressures
  • the electrode line structures are prevented from cracking and allowing impurity particles to enter the electrode line structures. Accordingly, the process yield and reliability of the device can be improved.

Abstract

The semiconductor device includes an upper electrode line structure and a lower electrode line structure provided over a semiconductor substrate. The semiconductor device also includes a guard contact having a first portion and a second portion. The guard contact is disposed between the upper electrode line structure and the lower electrode line structure. The first and second portions of the guard contact have different line widths.

Description

    CROSS-REFERENCES TO RELATED APPLICATIONS
  • The present application claims priority to Korean patent application number 10-2005-0065784, filed on Jul. 20, 2005, which is incorporated by reference in its entirety.
    • BACKGROUND OF THE INVENTION
  • The present invention relates to a semiconductor memory device. More particularly, the present invention relates to a method for fabricating a memory device wherein a guard contact formed in a chip guard is strengthened to prevent cracking caused from outside stresses.
  • FIG. 1 is a layout view illustrating a conventional semiconductor device. FIG. 2 is a simplified cross-sectional view taken along line I-I′ of FIG. 1.
  • Referring to FIGS. 1 and 2, a lower electrode line structure 30 and an upper electrode line structure 50 are disposed over a semiconductor substrate (not shown) having a lower structure including a gate, a bit line, and a bit line contact. A guard contact 40 is disposed between the lower electrode line structure 30 and the upper electrode line structure 50. Here, the guard contact 40 is formed of a whole body-type contact vertical to the lower electrode line structure 30. The guard contact 40 is formed to prevent impurity particles from passing.
  • FIG. 3 is a simplified cross-sectional view illustrating a conventional semiconductor device. In particular, it shows the failure of a fuse guard structure caused by the outside stresses.
  • Referring to FIG. 3, a gate 5 and a bit line 20 is formed over a semiconductor substrate (not shown), and a bit line contact 15 is formed to connect the bit line 20 to the gate 5. A lower electrode line structure 30 is formed over the bit line 20, and a lower electrode contact 25 is formed to connect the lower electrode line structure 30 to the bit line 20. An upper electrode line structure 50 is formed over the lower electrode line structure 30, and a whole body-type guard contact 40 is formed to connect the upper electrode line structure 50 to the lower electrode line structure 30.
  • According to the above conventional semiconductor device, the guard contact cannot prevent a crack from occurring when a chip is cut due to shrinkage to a fuse of the device. As a result, a “cracking phenomenon” between the electrode line structures shown in FIG. 3 occurs due to the outside stress and pressures in other processes. This allows impurity particles to enter into the lower electrode line structure through the cracks. Accordingly, the yield and reliability of the device may be degraded.
    • BRIEF SUMMARY OF THE INVENTION
  • The present invention relates to a semiconductor device and a method for fabricating wherein a guard contact formed in a chip guard is designed with two portions with different line widths. The two portions provide a zigzag or criss-cross pattern to increase the strength of the structure, thereby preventing impurity particles from passing and increasing resistance against outside stresses. Accordingly, reliability and yield of the device can be improved.
  • According to an embodiment of the present invention, a semiconductor device having an upper electrode line structure and a lower electrode line structure over a semiconductor substrate includes: a guard contact having a first portion and a second portion with different line width, disposed between the upper electrode line structure and the lower electrode line structure, wherein the first portion is disposed parallel to the upper electrode line structure, and the second portion is disposed perpendicular to the upper electrode line structure.
  • According to another embodiment of the present invention, a method for fabricating a semiconductor device includes: (a) forming a lower electrode line structure over a semiconductor substrate having a lower structure; (b) forming a guard line having a first portion and a second portion over the lower electrode structure, wherein the line width of the first and second regions are different; and (c) forming an upper electrode line structure over the guard contact.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a simplified layout of a conventional semiconductor device.
  • FIG. 2 is a simplified cross-sectional view illustrating a conventional semiconductor device.
  • FIG. 3 is a simplified cross-sectional view illustrating a conventional semiconductor device.
  • FIG. 4 is a simplified layout of a semiconductor device according to one embodiment of the present invention.
  • FIG. 5 is a simplified cross-sectional view illustrating a semiconductor device according to one embodiment of the present invention.
  • FIG. 6 is a simplified layout of a semiconductor device according to another embodiment of the present invention.
    • DESCRIPTION OF SPECIFIC EMBODIMENTS
  • FIG. 4 is a simplified layout of a semiconductor device according to one embodiment of the present invention. A lower electrode line structure 130 and an upper electrode line structure 150 are manufactured parallel to each other over a semiconductor substrate (not shown) having a lower structure (not shown). A guard contact 140 having a first portion 145 and a second portion 143 with different line width are disposed between the lower electrode line structure 130 and the upper electrode line structure 150.
  • In one embodiment of the present invention, the first portion 145 and the second portion 143 of the guard contact 140 is alternately disposed over the lower electrode line structure 130 in a zigzag pattern, as can be seen in FIG. 4 a. In addition, the line width of the second portion 143 (B) is equal to or greater than that of the first portion 145 (A). In one implementation, the line width of the second portion 143 is at least twice that of the first portion 145, the width being the direction along the longitudinal extension of the lower electrode line structure 130.
  • FIG. 5 is a simplified cross-sectional view taken along the line II-II′ of FIG. 4. Reference symbols A and B denote the line width of the first portion 145 and that of the second portion 143, respectively. Since B is greater than A in the guard contact 140, the lower electrode line structure 130 can support the outside stress or pressure from other processes, thereby preventing cracking phenomenon for the guard contact. Thereafter, an upper electrode line structure 150 is formed over the guard contact 140.
  • FIG. 6 is a simplified layout of a semiconductor device according to another embodiment of the present invention. A lower electrode line structure 130 and an upper electrode line structure 150 are manufactured parallel to each other over the semiconductor substrate (not shown). A guard contact 140 having a first portion 145 and a second portion 143 with different line width are disposed between the lower electrode line structure 130 and the upper electrode line structure 150.
  • In another embodiment of the present invention, the first portion 145 and the second portion 143 of the guard contact 140 is alternately disposed over the lower electrode line structure 130, where the two portions (or regions) are centered over the lower electrode line structure 130, as can be seen in FIG. 6. The second portion 143 has substantially the same line width along a longitudinal direction of the lower electrode line structure 130. In addition, the line width of the second portion 143 (B) is greater than that of the first portion 145 (A).
  • According to one embodiment of the present invention, since the guard contact plays the role of a structural member for supporting the outside stresses or pressures, the electrode line structures are prevented from cracking and allowing impurity particles to enter the electrode line structures. Accordingly, the process yield and reliability of the device can be improved.
  • The description of various embodiments of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed, and modifications and variations are possible in light of the above teachings. The embodiments were chosen and described in order to explain the principles of the invention and its practical application to enable one skilled in the art to utilize the invention in various embodiments and with various modifications as are suited to the particular use.

Claims (10)

1. A semiconductor device, comprising:
an upper electrode line structure and a lower electrode line structure provided over a semiconductor substrate; and
a guard contact having a first portion and a second portion that are disposed between the upper electrode line structure and the lower electrode line structure, the first and second portions of the guard contact having different line widths.
2. The semiconductor device according to claim 1, wherein the first portion and the second portion of the guard contact are disposed in a zigzag pattern.
3. The semiconductor device according to claim 1, wherein the first portion and the second portion of the guard contact are aligned to the middle of a longitudinal extension of the lower electrode line structure.
4. The semiconductor device of claim 1, wherein the guard contact has a plurality of the first portions and a plurality of the second portions that are alternately disposed.
5. The semiconductor device according to claim 1, wherein a width of the first portion is at least twice that of the second portion.
6. A method for fabricating a semiconductor device comprising:
forming a lower electrode line structure over a semiconductor substrate having a lower structure;
forming a guard line having a first portion and a second portion over the lower electrode structure, wherein each line width of the first portion and the second portion is different from each other; and
forming an upper electrode line structure over the guard contact.
7. The method according to claim 6, wherein the first portion and the second portion of the guard contact are alternately disposed in a zigzag pattern.
8. The method according to claim 7, wherein a width of the first portion is at least twice that of the second portion.
9. The method according to claim 6, wherein the first portion and the second portion of the guard contact are aligned to the middle of a longitudinal extension of the lower electrode line structure.
10. The method according to claim 9, wherein a width of the first portion is greater than that of the second portion, the width being a direction corresponding to a longitudinal direction of the lower electrode line structure.
US11/481,199 2005-07-20 2006-07-03 Semiconductor device and method for fabricating the same Abandoned US20070018325A1 (en)

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Application Number Priority Date Filing Date Title
US12/271,626 US8013447B2 (en) 2005-07-20 2008-11-14 Semiconductor device and method for fabricating the same

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KR10-2005-0065784 2005-07-20
KR1020050065784A KR100781850B1 (en) 2005-07-20 2005-07-20 Semiconductor device and method for manufacturing the same

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5674787A (en) * 1996-01-16 1997-10-07 Sematech, Inc. Selective electroless copper deposited interconnect plugs for ULSI applications
US5834829A (en) * 1996-09-05 1998-11-10 International Business Machines Corporation Energy relieving crack stop
US6163065A (en) * 1997-12-31 2000-12-19 Intel Corporation Energy-absorbing stable guard ring
US6495918B1 (en) * 2000-09-05 2002-12-17 Infineon Technologies Ag Chip crack stop design for semiconductor chips

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270256A (en) * 1991-11-27 1993-12-14 Intel Corporation Method of forming a guard wall to reduce delamination effects
JPH07201855A (en) * 1993-12-28 1995-08-04 Fujitsu Ltd Semiconductor device
KR19980055962A (en) * 1996-12-28 1998-09-25 김영환 Guard ring formation method of semiconductor device
US6022791A (en) * 1997-10-15 2000-02-08 International Business Machines Corporation Chip crack stop
US6365958B1 (en) * 1998-02-06 2002-04-02 Texas Instruments Incorporated Sacrificial structures for arresting insulator cracks in semiconductor devices
JP3502288B2 (en) * 1999-03-19 2004-03-02 富士通株式会社 Semiconductor device and manufacturing method thereof
JP3538170B2 (en) * 2001-09-11 2004-06-14 松下電器産業株式会社 Semiconductor device and manufacturing method thereof
US6943063B2 (en) * 2001-11-20 2005-09-13 Taiwan Semiconductor Manufacturing Co., Ltd. RF seal ring structure
US7453128B2 (en) * 2003-11-10 2008-11-18 Panasonic Corporation Semiconductor device and method for fabricating the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5674787A (en) * 1996-01-16 1997-10-07 Sematech, Inc. Selective electroless copper deposited interconnect plugs for ULSI applications
US5834829A (en) * 1996-09-05 1998-11-10 International Business Machines Corporation Energy relieving crack stop
US6163065A (en) * 1997-12-31 2000-12-19 Intel Corporation Energy-absorbing stable guard ring
US6495918B1 (en) * 2000-09-05 2002-12-17 Infineon Technologies Ag Chip crack stop design for semiconductor chips

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US8013447B2 (en) 2011-09-06
US20090072354A1 (en) 2009-03-19
KR20070010840A (en) 2007-01-24
KR100781850B1 (en) 2007-12-03

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