US20060120543A1 - Electro-optical device and electronic apparatus - Google Patents
Electro-optical device and electronic apparatus Download PDFInfo
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- US20060120543A1 US20060120543A1 US11/294,881 US29488105A US2006120543A1 US 20060120543 A1 US20060120543 A1 US 20060120543A1 US 29488105 A US29488105 A US 29488105A US 2006120543 A1 US2006120543 A1 US 2006120543A1
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- sidewall
- metal frame
- electro
- conductive part
- liquid crystal
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R23/00—Transducers other than those covered by groups H04R9/00 - H04R21/00
- H04R23/008—Transducers other than those covered by groups H04R9/00 - H04R21/00 using optical signals for detecting or generating sound
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133334—Electromagnetic shields
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/46—Fixing elements
- G02F2201/465—Snap -fit
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
- 1. Technical Field
- The present invention relates to an electro-optical device that is used in a personal computer, a mobile phone, or the like, and to an electronic apparatus including the electro-optical device.
- 2. Related Art
- Electro-optical devices, such as a liquid crystal display (LCD) device, have been used as display devices for electronic apparatuses, such as personal computers, mobile phones, or the like. However, as high performance personal computers or mobile phones have been recently put on the market, electro-optic devices such as LCD devices with high precision and high performance have been demanded for electronic apparatuses.
- For example, in order to prevent malfunction of the operation or circuit of the electro-optical panel that is caused by electrical noise resulting from a potential difference between a plurality of components of the electro-optical device, there has been proposed a method in which, for example, in a front case and a rear case at a conductive layer holder fixing location, exposed surfaces of conductive layers of both of the front and rear cases are brought into contact with each other to make an earth contact (for example, see JP-A-2000-19491 (Paragraphs [0020] to [0027], FIG. 4)).
- However, there is a problem in the above-mentioned method in that when the component tolerance variation occurs between the contacted surfaces, rattling occurs between a front case and a rear case, causing both of the cases to be insufficiently electrically connected to each other. When the component tolerance is exactly set to avoid the above-mentioned problem, the cost increases.
- For example, in another method of electrically connecting two cases to each other by means of an electrically conductive tape, there is a problem in that the number of components increases as much as the number of pieces of the conductive tape, causing the cost to increase. In another method of electrically connecting two cases to each other by means of a screw, there is a problem in that the number of manufacturing processes increases as much as the number of screw fixing processes, causing the cost to increase.
- Further, since it is not easy to eliminate soldering completely, it is difficult to recycle the soldered parts. Therefore, resources are wasted.
- An advantage of some aspects of the invention is that it provides an electro-optical device capable of reliably electrically connecting components to one another at low cost and preventing malfunction and breakdown of an electro-optical panel or electronic components caused by an electrical noise, and an electronic apparatus that uses the electro-optical device.
- According to a first aspect of the invention, an electro-optical device is provided which includes a first electro-optical panel, an electronic part that is provided to be adjacent to the first electro-optical panel, a receiving part that is interposed between the first electro-optical panel and the electronic part and receives the first electro-optical panel and the electronic part, a first metal frame that fixes the first electro-optical panel to the receiving part, and a second metal frame that fixes the electronic part together with the first metal frame therebetween. In the electro-optic device, any one of the first and second metal frames is extended toward the other one and has an elastic conductive part, and the conductive part is pressed against the other one by the elastic force and comes into contact with the other one such that the first and second metal frames are electrically connected to each other.
- In a case when the “receiving part” has, for example, a rectangular shape, the “receiving part” is not limited to, for example, a frame having four sides, but may include a plate having L-shaped walls at two corners of the plate. In addition, the material of the receiving part is not limited to resin but may metal.
- According to the above aspect of the invention, any one of the first and second metal frames is extended toward the other one and has an elastic conductive part, and the conductive part is pressed against the other one by the elastic force and comes into contact with the other one such that the first and second metal frames are electrically connected to each other. Accordingly, even though a component tolerance variation exists, the conductive part is pressed against the other one by the elastic force and comes into contact with the other one, whereby the first and second metal frames are reliably electrically connected to each other. As a result, since it is not required to exactly set the component tolerance, it is possible to reduce the manufacturing cost.
- In addition, since the electrical connection is made by the elastic force, it is easy to set the first and second metal frames and it is possible to reduce the manufacturing cost.
- According to the first aspect of the invention, the electro-optical device may further include a circuit board that is electrically connected to the first electro-optical panel. Further, the conductive part may be extended from the circuit board side or the opposite side of the circuit board side of the one metal frame toward the other metal frame. Accordingly, for example, when the conductive part is extended from the opposite side of the circuit board side to the other metal frame, there is a margin of space because the circuit board is not connected. Accordingly, it is possible to freely arrange the conductive part or the sidewall of the second metal frame that comes into contact with the conductive part.
- In addition, an edge of the conductive part of the one metal frame, which is located on the opposite side of the circuit board side, comes into contact with the other metal frame, and the one metal frame is moved, for example, over the other metal frame in a parallel direction by the elastic force to be adjacent to the other metal frame. Accordingly, since it is possible to make the conductive part reliably come into contact with the other metal frame, it is very easy to manufacture the electro-optical device.
- In addition, in contrast, when the conductive part is extended from the circuit board side toward the other metal frame, for example, even though a recess for receiving the conductive part is provided in the other metal frame such that the outer surface of the frame is projected, if it is arranged so as not to interfere with the circuit board, since it doesn't interfere with other components, it is possible to further reducing the size of an electro-optical device.
- Further, according to the first aspect of the invention, the conductive part may be a spring. Accordingly, it is possible to easily make the conductive part elastic at low cost, and to make the conductive part come into contact with the other metal frame.
- Furthermore, according to the first aspect of the invention, each of the first and second metal frames may have a sidewall that is extended to each other, and the spring may be extended from the sidewall of the one to overlap and come into contact with the sidewall of the other one such that the first and second metal frames are electrically connected to each other. Accordingly, it is possible to reliably electrically connect the first and second metal to each other frames without increasing the planar size seen from the display surface side of the electro-optical device.
- Furthermore, according to the first aspect of the invention, the sidewall of the other one may have a recess, which receives at least the spring, on an inner surface or an outer surface of the other sidewall, and the spring may be received in the recess to come into contact with a sidewall of the recess. Accordingly, the spring is received in the recess with which the spring comes into contact, and it is possible to combine an end face of the sidewall of the one except for the spring and an end face of the sidewall of the other one, such that it is possible to further reducing the planar size of the LCD device smaller.
- In addition, when it is received in the recess, the spring comes into contact with a larger area of the inner surface of the recess of the sidewall of the other one without being bent, thereby achieving the reliable electrical connection.
- Furthermore, according to the first aspect of the invention, a plurality of the springs may be extended from the sidewall of the one. Accordingly, even if the first and second metal frames severely rattle and one of the springs fails to electrically connect the first and second metal frames to each other, the remaining springs can be used to electrically connect them to each other, thereby achieving a reliable electrical connection.
- Furthermore, according to the first aspect of the invention, the spring may be a plate spring that rises from the sidewall of the other one. Accordingly, for example, since the spring can be manufactured by using the material of the sidewall of the one metal frame, it is possible to reduce the cost. In addition, since the spring is a plate-shaped spring, even though it is not sufficiently projected from the one sidewall, it can press the other sidewall (the sidewall of the recess), thereby achieving a reliable electrical connection.
- Furthermore, according to the first aspect of the invention, the spring may be a portion of the plate spring obtained by extending a part of the sidewall of the one to the other one and by cutting and bending the extended part from the sidewall of the one. Accordingly, since the spring is a plate spring obtained by cutting and bending a part of the sidewall of the one that is extended to the other metal frame, for example, a rectangular extended part of the sidewall of the one, it is physically stronger as compared to a case where the spring is solely projected to the other metal frame. In addition, since the extended part becomes a guide, it is easier to assemble the one metal frame into the other metal frame.
- Furthermore, according to the first aspect of the invention, the electronic part may be a soundgenerating unit. Accordingly, it is possible to prevent an electrical noise due to a potential difference between the one metal frame and the other metal frame, which results from the soundgenerating unit, and to receive the soundgenerating unit in the electro-optical device in a compact manner, thereby saving space.
- Furthermore, according to the first aspect of the invention, the electronic part may be a second electro-optical panel, and the display side of the second electro-optical panel may face the opposite side of the display side of the first electro-optical panel. Accordingly, even when the electro-optical device has the display surfaces of the electro-optical panels on its two sides, it is possible to reliably electrical connect the first and second metal frames, which fix the electro-optical panels, to each other. Further, it is possible to prevent malfunction of the electro-optical panel, the circuit board, or the like.
- According to a second aspect of the invention, an electronic apparatus is provided which includes the above-mentioned electro-optical device.
- According to the above aspect of the invention, since there is provided an electro-optical device capable of electrically connecting components to one another at low cost and preventing malfunction and breakdown of an electro-optical panel or electronic components caused by an electrical noise, it is possible to provide a reliable electronic apparatus with high display quality.
- The invention will be described with reference to the accompanying drawings, wherein like numbers reference like elements.
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FIG. 1 is a perspective view schematically showing an LCD device according to a first embodiment of the invention. -
FIG. 2 is a perspective view schematically showing the LCD device that is viewed from the opposite side ofFIG. 1 . -
FIG. 3 is an exploded perspective view schematically showing the LCD device according to the first embodiment. -
FIG. 4 is a cross-sectional view taken along the line IV-IV ofFIG. 1 (a light source and a soundgenerating unit are not cut away). -
FIG. 5 is a partially enlarged view ofFIG. 4 . -
FIG. 6 is a view for schematically explaining a conductive part that is extended from a metal frame according to the first embodiment. -
FIG. 7 is a cross-sectional view taken along the line VII-VII ofFIG. 6 (the light source and the soundgenerating unit are not cut away). -
FIG. 8 is a view for schematically explaining the conductive part as seen from the opposite side of a flexible substrate. -
FIG. 9 is a view for schematically explaining earth of the LCD device according to the first embodiment. -
FIGS. 10A and 10B are views for explaining the assembly of a first metal frame according to the first embodiment. -
FIG. 11 is a perspective view schematically showing an LCD device according to modified example 1. -
FIG. 12 is a cross-sectional view taken along the line XII-XII ofFIG. 11 . -
FIG. 13 is an enlarged explanatory view of a conductive part according to the modified example 1. -
FIG. 14 is a perspective view schematically showing an LCD device according to modified example 2. -
FIG. 15 is an enlarged explanatory view of a conductive part according to the modified example 2. -
FIG. 16 is a perspective view of an LCD device according to modified example 3. -
FIG. 17 is a perspective view seen from the opposite direction ofFIG. 16 . -
FIG. 18 is a cross-sectional view taken along the line XVIII-XVIII ofFIG. 16 (a soundgenerating unit being not cut away). -
FIG. 19 is an explanatory view showing the protruded state of a conductive part according to the modified example 3. -
FIG. 20 is a cross-sectional view schematically showing an LCD device according to a second embodiment. -
FIG. 21 is a block diagram schematically showing a display control system of an electronic apparatus according to a third embodiment of the invention. -
FIG. 22 is an explanatory view for showing a case where a receiving part of an LCD device does not have a circumference at its four sides. - Embodiments of the invention will now be described with reference to the accompanying drawings. While the embodiments describe a liquid crystal display (LCD) device, e.g., a transflective passive matrix type LCD device, as an example of an electro-optical device, and an electronic apparatus equipped with the LCD device, it should be understood that the invention is not limited thereto. Scales or dimensions of respective components in the respective drawings are made different from each other so that the respective components have sizes capable of being recognized in the drawings.
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FIG. 1 is a perspective view schematically showing an LCD device according to a first embodiment of the invention.FIG. 2 is a perspective view schematically showing the LCD device that is viewed from the opposite side of a flexible substrate.FIG. 3 is an exploded perspective view schematically showing the LCD device.FIG. 4 is a cross-sectional view taken along the line IV-IV ofFIG. 1 (a light source and a soundgenerating unit are not cut away).FIG. 5 is a partially enlarged view ofFIG. 4 .FIG. 6 is an explanatory view schematically showing a conductive part that is extended from a metal frame.FIG. 7 is a partially sectional view taken along the line VII-VII ofFIG. 6 (the light source and the soundgenerating unit are not cut away).FIG. 8 is an explanatory view schematically showing the conductive part that is viewed from the opposite side of a flexible substrate.FIG. 9 is an explanatory view for showing the earth of the LCD device. - Configuration of LCD Device
- For example, as shown in
FIGS. 1 and 3 , anLCD device 1 includes aliquid crystal panel 2, which acts as a first electro-optical panel; an illuminatingunit 3, which emits light on theliquid crystal panel 2; asoundgenerating unit 4, which is an electronic part provided to be adjacent to theliquid crystal panel 2; aflexible substrate 5, which is a circuit board electrically connected to theliquid crystal panel 2; aplastic frame 6, which receives theliquid crystal panel 2 or thesoundgenerating unit 4; and afirst metal frame 7 and asecond metal frame 8, between which theplastic frame 6 receiving theliquid crystal panel 2 and thesoundgenerating unit 4 is interposed. TheLCD device 1 further includes additional elements (not shown), if necessary, in addition to the first andsecond metal frames - As shown in
FIGS. 3 and 5 , theliquid crystal panel 2 includes a pair of substrates, i.e., afirst substrate 10 and asecond substrate 11, which are joined with a sealingmaterial 9, and an electro-optical material, e.g., a STN (Super Twisted Nematic)liquid crystal 12, which is enclosed between the substrates. In addition, a base layer, a reflective layer, a colored layer, a light-shielding layer and the like, which are not shown, are provided on any one of the first andsecond substrates - As shown in
FIGS. 3 and 5 , for example, on thefirst substrate 10, a plurality ofcommon electrodes 13 is formed in a predetermined pattern on the liquid crystal side. In addition, an overcoat layer 14 is formed on the liquid crystal side of thecommon electrodes 13, and analignment layer 15 is further formed on the liquid crystal side of the overcoat layer. Further, apolarizer 16 is formed on the outside (the opposite side of the liquid crystal) of the first substrate. - On the other hand, for example, as shown in
FIGS. 3 and 5 , on the liquid crystal side of thesecond substrate 11, a plurality ofsegment electrodes 17 is formed in a predetermined pattern. Anovercoat layer 18 is formed on thesegment electrode 17. Analignment layer 19 is further formed on the liquid crystal side of the overcoat layer. Also, apolarizer 20 is formed on the outside (the opposite side of the liquid crystal) of thesecond substrate 11. - The
common electrodes 13 are made of a transparent conductive material, for example, ITO (Indium Tin Oxide), in a stripe shape so that they are parallel to one another in one direction (X-axis direction ofFIG. 3 ), as shown inFIGS. 3 and 5 . - The plurality of
segment electrodes 17 are made of a transparent conductive material, for example, ITO, in a stripe shape, similarly to thecommon electrodes 13, such that they intersect with thecommon electrodes 13 in the Y-axis direction ofFIG. 3 , as shown inFIGS. 3 and 5 . Sub-pixels for displaying images are formed at portions at which thecommon electrodes 13 and thesegment electrodes 17 intersect one another. - As shown in
FIGS. 3 and 5 , the first andsecond substrates second substrate 11 has aprotrusion 21 that is projected outward (in the Y-axis direction inFIGS. 3 and 5 ) with respect to thefirst substrate 10. - The overcoat layers 14 and 18 are made of, for example, silicon oxide, titanium oxide, or a combination thereof. The alignment layers 15 and 19 are made of, for example, polyimide resin. The
polarizers - As shown in
FIGS. 3 and 5 , for example, on theprotrusion 21, a plurality ofexternal terminals 22 is extended from an area, in which thesegment electrodes 17 and thecommon electrodes 13 are surrounded by the sealingmaterial 9, to theprotrusion 21, and is electrically connected to each electrode. - As shown in
FIGS. 3, 4 , and 5, for example, the illuminatingunit 3 is a backlight unit that emits light on thesecond substrate 11. The illuminatingunit 3 includes alight source 23, alight guide plate 24, twoprism sheets sheet 27, and areflective sheet 28. Theprism sheet 25 adheres to thepolarizer 20 of thesecond substrate 11. - A LED (Light Emitting Diode) is used as an example of the
light source 23. As shown inFIG. 3 , thelight source 23 is provided on the opposite side of a protrusion of thelight guide plate 24. It should be understand that thelight source 23 may be provided, for example, on the protrusion side. - The
light guide plate 24 allows light emitted from thelight source 23 to be irradiated, for example, on theentire diffusing sheet 27. Theprism sheets light guide plate 24. - As shown in
FIGS. 3 and 4 , for example, thesoundgenerating unit 4 is provided below the illuminatingunit 3 through theplastic frame 6 to be described below, and includes amain body 29 of a soundgenerating unit, which is composed of a unimorph-type piezoelectric vibrator and the like, and a soundgeneratingunit terminal part 31, which has twosoundgenerating unit terminals 30 electrically connected to a piezoelectric film (not shown) of the unimorph-type piezoelectric vibrator. With such a configuration, as described below, theliquid crystal panel 2, the illuminatingunit 3, and thesoundgenerating unit 4 can be reduced to a small size so as to be received in theplastic frame 6. Accordingly, it is possible to form a smallersized LCD device 1 and to design the device to have an optimum sound quality in advance with regard to the relation between the liquid crystal panel and thesoundgenerating unit 4. - As shown in
FIGS. 1, 3 , and 4, awiring pattern 33 is formed on abase member 32 of theflexible substrate 5, and a liquidcrystal driving IC 34 is mounted on theflexible substrate 5. Thebase member 32 is formed of a flexible film-shaped member. Thewiring pattern 33 is made of, for example, copper or the like. - In addition, the
flexible substrate 5 includes amain body 35, which is connected to theprotrusion 21 of theliquid crystal panel 2, and abranch part 36, which is connected to the soundgeneratingunit terminal part 31. The liquidcrystal driving IC 34 is mounted on themain body 35. - The
main body 35 has a plurality of mainbody connecting terminals 37 at the end portion on the liquid crystal panel side, and is electrically connected to theexternal terminal 22 of theprotrusion 21 of theliquid crystal panel 2 through an external ACF 38 (anisotropic conductive film). - As shown in
FIG. 3 , for example, the mainbody connecting terminals 37 are electrically connected to thewiring pattern 33, and are electrically connected to the liquidcrystal driving IC 34 through a connecting terminal (not shown), the ACF, or the like on the opposite side of the liquid crystal panel of thewiring pattern 33. - As shown in
FIG. 3 , for example, when receiving various signals related to display images through an electrically connected wiring pattern, the liquidcrystal driving IC 34 generates a driving signal according to the signals. The driving signal is applied to thecommon electrodes 13 and thesegment electrodes 17 through the mainbody connecting terminal 37, theexternal ACF 38, theexternal terminal 22 or the like. - As shown in
FIG. 3 , for example, thebranch part 36 has two branchpart connecting terminals 39, and is electrically connected to thesoundgenerating unit terminal 30 of the soundgeneratingunit terminal part 31 through theexternal ACF 38. Also, the branchpart connecting terminal 39 is electrically connected to thewiring pattern 33 of thebranch part 36. With such a configuration, speech current is supplied to thesoundgenerating unit terminal 30 through the flexible substrate of thebranch part 36, such that it is possible to generate sound by means of the vibration of a piezoelectric vibrator in themain body 29 of the soundgenerating unit. - As shown in
FIGS. 3 and 4 , for example, theplastic frame 6 has a rectangular shape. Theplastic frame 6 has an illuminatingunit recess 40 formed on the liquid crystal panel side, asoundgenerating unit recess 41 formed on an opposite side thereof, and aframe guide groove 42 for passing through thebranch part 36 of theflexible substrate 5 on a lateral side. Theplastic frame 6 is formed to be received between the first andsecond metal frames - As shown in
FIG. 3 , for example, the illuminatingunit recess 40 is formed such that a bottom surface of the box-shaped illuminating unit recess has almost the same size as that of the illuminatingunit 3 which is formed in a planar direction (in the XY-axis direction ofFIG. 3 ). Thereflective sheet 28 of the illuminating unit is attached to the bottom surface, for example, with a double-faced adhesive tape or the like. As shown inFIGS. 4 and 6 , the illuminatingunit recess 40 is formed to be deep enough to receive a part of theliquid crystal panel 2 attached to theprism sheet 25 of the illuminating unit. In addition, a part of theliquid crystal panel 2 attached to the illuminatingunit 3, together with the illuminatingunit 3, is received in the illuminatingunit recess 40. - The
soundgenerating unit recess 41 has a hollow for receiving thesoundgenerating unit 4 or the like. Thesoundgenerating unit 4 is received in thesoundgenerating unit recess 41 such that the soundgeneratingunit terminal part 31 faces theframe guide groove 42 in the Y-axis direction, as shown inFIGS. 3 and 4 . - As shown in
FIGS. 3 and 4 , theframe guide groove 42 is formed so that the branch part connecting terminal of thebranch part 36 of theflexible substrate 5 can be inserted into the lateral surface disposed on the flexible substrate side of theplastic frame 6. Thebranch part 36 of theflexible substrate 5 having the branchpart connecting terminal 39 electrically connected to thesoundgenerating unit terminal 30 through theexternal ACF 38 is inserted into theframe guide groove 42. - As shown in
FIGS. 1, 3 , and 4, for example, thefirst metal frame 7 covers and presses theliquid crystal panel 2 received in each of the plastic frames 6 from the upper side of the drawings such that theliquid crystal panel 2 is fixed. Thefirst metal frame 7 has a rectangularplanar portion 43 as a display surface, and a sidewall 44 that is formed to be orthogonal to the four sides of theplanar portion 43 toward thesecond metal frame 8 to be described. - As shown in
FIG. 3 , for example, anopening 45 and twopush spring parts 46 are provided on theplanar portion 43. Theopening 45 provided in the middle of theplanar portion 43 acts as a liquid crystal display surface. The twopush spring parts 46 are provided between theopening 45 and edges of one side on the opposite side of the flexible substrate of theplanar portion 43. - The
push spring part 46 has a U-shaped hole that is formed, for example, by punching. In addition, there is provided apush spring 47 formed by elastically protruding a tongue-shaped portion that is part of thefirst metal frame 7 formed at the hole. The twopush spring parts 46 are formed such that the push springs 47 face each other in the vicinity of corners of theplanar portion 43. - As shown in
FIGS. 1, 2 , and 3, for example, the sidewall 44 has asidewall 44 a formed on the flexible substrate side, asidewall 44 b formed on the opposite side of thesidewall 44 a, and twosidewalls 44 c which are formed between the sidewalls 44 a, 44 b and face each other. - As shown in
FIG. 3 , for example, thesidewall 44 a has a firstmetal frame recess 48 in its central portion so that a main body connecting terminal of themain body 35 of theflexible substrate 5 can be inserted. Accordingly, themain body 35 of theflexible substrate 5 is inserted from the outside of thefirst metal frame 7, such that the mainbody connecting terminal 37 is electrically connected to theexternal terminal 22 through theexternal ACF 38. - As shown in
FIGS. 6 and 7 , for example, thesidewall 44 b has two separatedconductive parts 49 each of which is extended from its central portion toward thesecond metal frame 8 and is an elastic plate spring. - As shown in
FIG. 7 , theconductive part 49 is formed to be outwardly inclined by θ degree starting from the origin, at which theconductive part 49 is extended, toward thesecond metal frame 8 of thesidewall 44 b. The outer surface of anedge 50 of theconductive part 49 is projected from an inner sidewall of a recess of thesecond metal frame 8 by the gap C indicated inFIG. 7 . - With such a configuration, when the
conductive part 49 is inserted into the recess of thesecond metal frame 8 as described below, theconductive part 49 is pressed back to a direction opposite to the projected direction by the gap C. Accordingly, the stress due to the elastic force reacting against the push back always presses theconductive part 49 to the inner sidewall of the recess of thesecond metal frame 8 such that theconductive part 49 reliably comes into contact with the inner sidewall of the recess of thesecond metal frame 8. - For example, even when a component tolerance variation exists, at least the
edge 50 of theconductive part 49 can come into contact with thesecond metal frame 8 within the projected portion of theconductive part 49, for example, within the range of C ofFIG. 7 . Accordingly, thefirst metal frame 7 can reliably come into contact with thesecond metal frame 8. - As shown in
FIGS. 4 and 8 , for example, when the first andsecond metal frames plastic frame 6, the length of theconductive part 49 is formed such that theedge 50 of theconductive part 49 is located a little higher than the inner bottom surface of thesecond metal frame 8. Accordingly, even when a component tolerance variation exists, it is possible to prevent theedge 50 from coming into contact with the inner bottom surface of thesecond metal frame 8, such that thefirst metal frame 7 is not raised from theplastic frame 6. In contrast, even when theconductive part 49 is too short, it is possible to prevent theconductive part 49 from deviating from the recess of thesecond metal frame 8 due to the component tolerance variation or vibration. - As shown in
FIG. 8 , for example, the twoconductive parts 49 are separated from each other by the gap D of the drawing. Accordingly, even when any one of the twoconductive parts 49 does not come into contact with thesecond metal frame 8 due to vibrating or the like, the first andsecond metal frames conductive parts 49. In addition, since the twoconductive parts 49 are separated from each other by the gap D ofFIG. 8 , it is possible to reliably electrically connect the first andsecond metal frames - In addition, while the above-mentioned embodiment describes that two
conductive parts 49 are provided, the invention is not limited thereto, but, for example, one or at least three conductive parts may be provided. - As shown in
FIGS. 2, 3 and 4, for example, thesecond metal frame 8 covers thesoundgenerating unit 4 and a supportingbody 51 for supporting thesoundgenerating unit 4, which are received in eachplastic frame 6, from the bottom side of the drawings, such that thesoundgenerating unit 4 and the supportingbody 51 are fixed. Thesecond metal frame 8 has a rectangularplanar portion 52, and a sidewall 53 that is formed to be orthogonal to the four sides of theplanar portion 52 toward thefirst metal frame 7. - As shown in
FIG. 4 , in theplanar portion 52, asoundproofing hole 54 for discharging sound generated by thesoundgenerating unit 4 is formed in an area surrounded by a portion at which theplanar portion 52 comes into contact with the supportingbody 51 of thesoundgenerating unit 4. The supportingbody 51 is provided inside theplanar portion 52 of thesecond metal frame 8. As shown inFIG. 4 , for example, the supportingbody 51 is formed in a ring shape having a diameter as much as it is not projected from the external circumference of themain body 29 of the soundgenerating unit. While only asingle soundproofing hole 54 is shown in the drawing, a plurality of soundproofing holes may be provided. - As shown in
FIG. 3 , for example, the sidewall 53 has asidewall 53 a formed on the flexible substrate side, asidewall 53 b formed on the opposite side of thesidewall 53 a, and twosidewalls 53 c which are formed between the sidewalls 53 a and 53 b and face each other. - As shown in
FIG. 3 , for example, thesidewall 53 a has a secondmetal frame recess 55 in its central portion so that a branch part connecting terminal of thebranch part 36 of theflexible substrate 5 can be inserted. Accordingly, thebranch part 36 of theflexible substrate 5 is inserted from the outside of thesecond metal frame 8, such that the branchpart connecting terminal 39 is electrically connected to thesoundgenerating unit terminal 30 through theexternal ACF 38. - As shown in
FIGS. 6 and 7 , for example, thesidewall 53 b has asidewall recess 56 for receiving theconductive part 49 in the central portion. - As shown in
FIG. 6 , for example, thesidewall recess 56 is indented in a box shape from the inside of thesidewall 53 b toward the outside. Thesidewall recess 56 is formed to be a little larger than the thickness of theconductive part 49 extended from thefirst metal frame 7, as shown inFIG. 7 . Accordingly, it is possible to easily insert theconductive part 49 into thesidewall recess 56, and to cope with some component tolerance variation. - As shown in
FIG. 8 , for example, thesidewall recess 56 is formed such that its inner length in the X-axis direction of the drawing is approximately equal to a total of the widths of twoconductive parts 49 and the gap D (ofFIG. 8 ) between them when seen from thesidewall 53 b. Therefore, it is possible to make the protrusion from thesecond metal frame 8 as small as possible, thereby reducing the size of theLCD device 1. - As shown in
FIG. 9 , for example, theLCD device 1 is configured such that thesecond metal frame 8 is electrically connected to a middle frame of an electronic apparatus, such as a mobile phone, by means of a connectingpart 57. Accordingly, the first andsecond metal frames conductive part 49, are put to earth. - The first and
second metal frames conductive part 49 of thefirst metal frame 7 and an inner surface of thesidewall recess 56 of thesecond metal frame 8. Accordingly, it is possible to reliably electrically connect the first andsecond metal frames - Method of Manufacturing LCD Device
- A method of manufacturing an LCD device having the above-mentioned configuration will now be described. In this case, a method of assembling the
plastic frame 6 and the first andsecond metal frames -
FIG. 10 is an explanatory view for showing the assembly of thefirst metal frame 7. - First, the
liquid crystal panel 2 is manufactured. - ITO, which is the material for forming the
common electrodes 13, is deposited on thefirst substrate 10 by the sputtering method and then patterned by the photolithographic method, such that thecommon electrodes 13 are formed in a stripe shape in the X-axis direction as shown inFIGS. 3 and 4 . In addition, the overcoat layer 14 and thealignment layer 15 are sequentially formed thereon and are then subjected to a rubbing process, thereby forming the first substrate side. - As shown in
FIGS. 3 and 4 , thesegment electrodes 17 are formed on thesecond substrate 11 in a stripe shape in the Y-axis direction. Theovercoat layer 18 and thealignment layer 19 are further formed thereon, thereby forming the second substrate side. In addition, when thesegment electrodes 17 are formed, theexternal terminal 22 of theprotrusion 21 or the like may be formed at the same time. - Gap members 58 are scattered on the
first substrate 10 by a dry scattering method, and the first andsecond substrates liquid crystal 12 is injected through an injection hole (not shown) of the sealingmaterial 9. The injection hole of the sealingmaterial 9 is sealed with a sealing material, such as an ultraviolet curing resin or the like. - Next, the flexible substrate is manufactured.
- A
predetermined wiring pattern 33, the mainbody connecting terminal 37, the branch part connecting terminal, and other connecting terminals are formed on thebase member 32 formed by the mold of themain body 35 and thebranch part 36. Next, the liquidcrystal driving IC 34 is mounted on a connecting terminal of themain body 35 through ACF. - Other ICs or capacitors are mounted, and the main
body connecting terminal 37 of theflexible substrate 5 is electrically connected to theexternal terminal 22 of theliquid crystal panel 2 through theexternal ACF 38. Similarly, the branchpart connecting terminal 39 is electrically connected to thesoundgenerating unit terminal 30 of thesoundgenerating unit 4 through theexternal ACF 38. - Subsequently, the supporting
body 51 is set on the inner side of theplanar portion 52 of thesecond metal frame 8 such that thesoundproofing hole 54 of thesecond metal frame 8 is located at the central portion of the inner side of the supportingbody 51. Themain body 29 of the soundgenerating unit is provided thereon. Themain body 29 of the soundgenerating unit, the soundgeneratingunit terminal part 31, and the electrically connectedbranch part 36 are received in thesoundgenerating unit recess 41 of theplastic frame 6 so as to retained therein, and theplastic frame 6 is set in thesecond metal frame 8. When thesoundgenerating unit 4 is set in theplastic frame 6 and thesecond metal frame 8, thebranch parts 36 of theflexible substrate 5 are inserted into theframe guide groove 42 and the secondmetal frame recess 55, respectively. - As shown in
FIGS. 3 and 4 , for example, thereflective sheet 28, thelight guide plate 24 to which thelight source 23 is attached, the diffusingsheet 27, and theprism sheets unit recess 40 of theplastic frame 6. Theliquid crystal panel 2 to which themain body 35 of theflexible substrate 5 is connected is provided thereon. - As shown in
FIGS. 4 and 6 , for example, thefirst metal frame 7 is set to cover theliquid crystal panel 2 and theplastic frame 6 that receives theliquid crystal panel 2. - At this time, as shown in
FIG. 10A , theedge 50 of theconductive part 49 that is extended to be inclined outward is inserted into the gap between thesidewall recess 56 of thesecond metal frame 8 and theplastic frame 6. In this state, thefirst metal frame 7 is moved to a direction of the arrow E of the drawing such that the angle θ between theconductive part 49 and thesidewall 44 b is approximately equal to zero. - As a result, as shown in
FIG. 10B , since, in thesecond metal frame 8, the inner surface of thesidewall 44 b and the outer surface of theplastic frame 6 match each other in the Z-axis direction of the drawing, thefirst metal frame 7 is moved to a direction of the arrow F of the drawing such that theconductive part 49 is inserted into the gap between thesidewall recess 56 of thesecond metal frame 8 and theplastic frame 6. Accordingly, for example, as shown inFIG. 9 , thefirst metal frame 7 is set to cover theliquid crystal panel 2 and theplastic frame 6 that receives theliquid crystal panel 2, and theconductive part 49 reliably comes into contact with the inner wall of thesidewall recess 56 of thesecond metal frame 8, thereby electrically connecting the first andsecond metal frames - As shown in
FIG. 10B , when thefirst metal frame 7 is moved to the second metal frame 8 (in the direction of the arrow F of the drawing), the circumference of theopening 45 of thefirst metal frame 7 presses the non-displaying area of thefirst substrate 10 from the upper side as shown inFIG. 9 , and theliquid crystal panel 2 is fixed to the illuminatingunit recess 40 of theplastic frame 6 in each illuminatingunit 3. - Similarly, as shown in
FIG. 10B , when thefirst metal frame 7 is moved to the second metal frame 8 (to the direction of the arrow F of the drawing), the push springs 47 of twopush spring parts 46 provided in thefirst metal frame 7 come into contact with theplastic frame 6 as shown inFIG. 9 , and it is possible to prevent rattling between theplastic frame 6 and thefirst metal frame 7 by the elastic force of the spring. - As described above, the first and
second metal frames plastic frame 6 and other required components are fixed, thereby completing theLCD device 1. - As shown in
FIG. 9 , for example, theLCD device 1 is configured such that thesecond metal frame 8 is electrically connected to a middle frame of an electronic apparatus, such as a mobile phone, by means of a connectingpart 57. Accordingly, the first andsecond metal frames conductive part 49, are put to earth. - According to the present embodiment, the
first metal frame 7 has the elasticconductive part 49 that is extended toward thesecond metal frame 8, and theconductive part 49 is pressed to the inner wall of thesidewall recess 56 of thesecond metal frame 8 by the elastic force and comes into contact with the inner wall such that the first andsecond metal frames conductive part 49 of thefirst metal frame 7 is pressed to, for example, the second metal frame by the elastic force, such that the first and second metal frames are reliably electrically connected to each other. As a result, since it is not required to exactly set the component tolerance, it is possible to reduce the manufacturing cost. - In addition, the first and
second metal frames conductive part 49, a spring, is extended from thesidewall 44 b of thefirst metal frame 7 and overlaps thesidewall 53 b of thesecond metal frame 8 so as to come into contact with the sidewall 53. In this way, the first andsecond metal frames second metal frames LCD device 1 as an electro-optical device. - In addition, the
other sidewall 53 b has thesidewall recess 56, which can receive theconductive part 49, in an inner side of thesidewall 53 b, and theconductive part 49 is received in thesidewall recess 56 and comes into contact with an inner wall of thesidewall recess 56. Accordingly, theconductive part 49, a spring, is received in thesidewall recess 56 with which theconductive part 49 comes into contact, and it is possible to combine an end face of thesidewall 44 a except for theconductive part 49 and an end face of thesidewall 53 b except for thesidewall recess 56, such that it is possible to make the planar size of theLCD device 1 smaller. - In addition, since the
sidewall recess 56 is provided, the conductive part does not get bent and comes into contact with a more area of the inner wall of thesidewall recess 56 of thesidewall 53 b, such that a reliable electrical connection is secured. - In addition, since, for example, two
conductive parts 49 are extended from thesidewall 44 b, even though the first andsecond metal frames conductive parts 49 fails to electrically connect the first andsecond metal frames conductive part 49 can be used to electrically connect them to each other, such that a reliable electrical connection is secured. - In addition, since the
soundgenerating unit 4, an electronic part, is fixed to, for example, thesecond metal frame 8, it is possible to reliably prevent an electrical noise due to a potential difference between thesecond metal frame 8 and thefirst metal frame 7, which results from thesoundgenerating unit 4, and to receive thesoundgenerating unit 4 in theLCD device 1 more in a compact manner, thereby saving space. - In addition, since the
conductive part 49 is extended from thesidewall 44 b, which is located at the opposite side of the flexible substrate, toward thesidewall 53 b of thesecond metal frame 8, for example, theflexible substrate 5 is not connected, there is a margin of space. Accordingly, it is possible to freely arrange theconductive part 49 or thesidewall recess 56 of thesecond metal frame 8 that comes into contact with theconductive part 49. - In addition, after the
edge 50 of theconductive part 49 comes into contact with the inner wall of thesidewall recess 56, the first metal frame is moved in parallel directly above the second metal frame by the elastic force, and the first metal frame is set to be adjacent to the second metal frame. Accordingly, since it is possible to reliably bring theconductive part 49 into contact with thesecond metal frame 8, it is easy to manufacture theLCD device 1. - An LCD device according to modified example 1 of the first embodiment of the invention will now be described. The modified example 1 is different from the first embodiment in that a sidewall recess of the second metal frame is formed outside the sidewall of the second metal frame. In the modified example 1, the same components as those in first embodiment are denoted by the same reference numerals and a detailed description thereof will be omitted.
-
FIG. 11 is a perspective view schematically showing an LCD device according to the modified example 1.FIG. 12 is a cross-sectional view taken along the line XII-XII ofFIG. 11 .FIG. 13 is an enlarged view for explaining a conductive part. - Configuration of LCD Device
- As shown in
FIGS. 11 and 12 , for example, theLCD device 101 includes aliquid crystal panel 2 that is a first electro-optical panel, an illuminatingunit 3 that emits light on theliquid crystal panel 2, asoundgenerating unit 4 that is provided as an electronic part to be adjacent to theliquid crystal panel 2, aflexible substrate 5 that is a circuit board electrically connected to theliquid crystal panel 2, aplastic frame 106 that receives theliquid crystal panel 2 or thesoundgenerating unit 4, and first and second metal frames 107 and 108 between which theplastic frame 106 receiving theliquid crystal panel 2, thesoundgenerating unit 4, and the like is interposed. - The
plastic frame 106 has, for example, a rectangular shape, and includes an illuminatingunit recess 40 formed on the liquid crystal panel side, asoundgenerating unit recess 41 formed on an opposite side thereof, and aframe guide groove 42 formed in the side surface on the flexible substrate side so as to pass through thebranch part 36 of theflexible substrate 5. Theplastic frame 106 is formed to be interposed between the first and second metal frames 107 and 108. - As shown in
FIG. 12 , for example, theplastic frame 106 has aframe recess 159 that is formed to be indented at the middle of a sidewall on the flexible substrate side and the opposite side. Theframe recess 159 is formed so that thesecond metal frame 108 can receive the portion that protrudes in a box shape on the side of theplastic frame 106. - As shown in
FIGS. 11 and 12 , for example, thefirst metal frame 107 covers and presses theliquid crystal panel 2 received in theplastic frame 106 from the upper side of the drawing such that the liquid crystal panel is fixed. Thefirst metal frame 107 has aplanar portion 43 that has a rectangular shape and serves as the display surface, and a sidewall 144 that is formed to be orthogonal to four sides of theplanar portion 43 toward thesecond metal frame 108 to be described below. - The sidewall 144 has, for example, a
sidewall 44 a formed on the flexible substrate side, asidewall 144 b formed to face thesidewall 44 a, and twosidewalls 44 c that face each other and are interposed between the sidewalls 44 a, 144 b. - As shown in
FIGS. 11 and 12 , for example, thesidewall 144 b has two separatedconductive parts 149 each of which is extended from its central portion toward thesecond metal frame 108 and is an elastic plate spring. - As shown in
FIG. 13 , theconductive part 149 is formed to be inwardly inclined by θ degree starting from the origin, at which theconductive part 149 is extended, toward thesecond metal frame 108 of thesidewall 144 b. The inner surface of anedge 150 of theconductive part 149 is inwardly projected from an outer sidewall of a recess of thesecond metal frame 108 to be described below by the gap H indicated inFIG. 13 . - With such a configuration, when the
conductive part 149 is inserted into the recess of thesecond metal frame 108 as described below, theconductive part 149 is pressed back to a direction opposite to the projected direction by the projected portion, for example, the gap H. Accordingly, the stress due to the elastic force reacting against the push back always presses theconductive part 149 to the inner sidewall of the recess of thesecond metal frame 108 such that theconductive part 149 reliably comes into contact with the inner sidewall of the recess of thesecond metal frame 108. - For example, even when a component tolerance variation exists, at least the
edge 150 of theconductive part 149 can come into contact with thesecond metal frame 108 within the projected portion of theconductive part 149, for example, within the range of H ofFIG. 13 . Accordingly, thefirst metal frame 107 can be reliably electrically connected with thesecond metal frame 108. - As shown in
FIG. 12 , for example, when the first and second metal frames 107 and 108 are set in theplastic frame 106, the length of theconductive part 149 is formed such that theedge 150 of theconductive part 149 is located a little higher than the outer bottom surface of thesecond metal frame 108. Accordingly, even when a component tolerance variation exists, it is possible to prevent theedge 150 from deviating from the outer wall surface of thesecond metal frame 108. In contrast, even when theconductive part 149 is too short, it is possible to prevent theconductive part 149 from deviating from the outer wall of thesecond metal frame 108 due to the component tolerance variation or vibration. - As shown in
FIG. 11 , for example, the twoconductive parts 149 are separated from each other. Accordingly, even when any one of the twoconductive parts 149 does not come into contact with thesecond metal frame 108 due to vibrating or the like, the first and second metal frames 107 and 108 can be electrically connected with each other by means of the remaining one of theconductive parts 149. In addition, since the twoconductive parts 149 are separated from each other, it is possible to reliably electrically connect the first and second metal frames 107 and 108 to each other even though the sidewall is partly distorted. - In addition, while the above-mentioned embodiment describes that two
conductive parts 149 are provided, the invention is not limited thereto, but, for example, one or at least three conductive parts may be provided. - As shown in
FIGS. 11 and 12 , for example, thesecond metal frame 108 covers thesoundgenerating unit 4 and a supportingbody 51 for supporting thesoundgenerating unit 4, which are received in eachplastic frame 106, from the bottom side of the drawings such that thesoundgenerating unit 4 and the supportingbody 51 are fixed. Thesecond metal frame 108 has a rectangularplanar portion 52, and a sidewall 153 that is formed to be orthogonal to the four sides of theplanar portion 52 toward thefirst metal frame 107. - As shown in
FIG. 11 , for example, the sidewall 153 has asidewall 53 a formed on the flexible substrate side, asidewall 153 b formed on the opposite side of thesidewall 53 a, and twosidewalls 53 c which are formed between the sidewalls 53 a, 153 b and face each other. - As shown in
FIGS. 11 and 12 , for example, thesidewall 153 b has asidewall recess 156 for receiving theconductive part 149 in the central portion. - For example, the
sidewall recess 156 is indented in a box shape from the outside of thesidewall 153 b toward the inside. Thesidewall recess 156 is formed to be a little larger than the thickness of theconductive part 149 extended from thefirst metal frame 107. - As shown in
FIG. 11 , for example, thesidewall recess 156 is formed such that its inner length in the X-axis direction of the drawing is approximately equal to a total of the widths of twoconductive parts 149 and the distance between them when seen from thesidewall 153 b. Accordingly, it is possible to make the protrusion to theplastic frame 106 as small as possible, thereby reducing the size of theLCD device 101. - Method of Manufacturing LCD Device
- A method of manufacturing the LCD device having the above-mentioned configuration is the same as that of the first embodiment, except that the conductive part is inclined inward, which will now be described.
- For example, when the
first metal frame 107 is set to cover theliquid crystal panel 2 and theplastic frame 106 that receives theliquid crystal panel 2, theedge 150 of theconductive part 149 that is extended to be inclined inward comes into contact with thesidewall recess 156 of thesecond metal frame 108, and thefirst metal frame 107 is horizontally moved such that the angle θ between theconductive part 149 and thesidewall 144 b is approximately equal to zero. - As a result, as shown in
FIG. 12 , since the inner surface of theconductive part 149 and the outer wall surface of thesidewall recess 156 of thesecond metal frame 108 match each other in the Z-axis direction of the drawing, in this state, thefirst metal frame 107 is moved to thesecond metal frame 108. Accordingly, for example, as shown inFIG. 12 , thefirst metal frame 107 is set to cover theliquid crystal panel 2 and theplastic frame 106 that receives theliquid crystal panel 2, and theconductive part 149 reliably comes into contact with the outer wall of thesidewall recess 156 of thesecond metal frame 108, thereby electrically connecting the first and second metal frames 107 and 108 to each other. - The subsequent manufacturing method is the same as that of the first embodiment and a detailed description thereof will thus be omitted.
- According to the present modified example, since the
conductive part 149 is composed of a plate spring and is deformably configured to be inwardly inclined, it is possible to reliably electrically connect the first and second metal frames 107 and 108 to each other by means of theconductive part 149. Further, since theconductive part 149 does not protrude to the outside, it is possible to reduce the size of theLCD device 101. - In addition, since the
conductive part 149 comes into contact with thesidewall recess 156 of thesecond metal frame 108 from the outer side of the sidewall recess, it is possible to easily set thefirst metal frame 107 to theplastic frame 106 and thesecond metal frame 108, and to reduce the manufacturing cost of theLCD device 101. - An LCD device according to modified example 2 of the first embodiment of the invention will now be described. The modified example 2 is different from the first embodiment in the shape of a conductive part of the second metal frame. In the modified example 2, the same components as those in first embodiment are denoted by the same reference numerals and a detailed description thereof will be omitted.
-
FIG. 14 is a perspective view schematically showing an LCD device according to the modified example 2.FIG. 15 is an enlarged view for explaining a conductive part according to the modified example 2. - Configuration of LCD Device
- As shown in
FIGS. 14 and 15 , for example, anLCD device 201 includes aliquid crystal panel 2 that is a first electro-optical panel, an illuminatingunit 3 that emits light on the liquid crystal panel, asoundgenerating unit 4 that is provided as an electronic part to be adjacent to theliquid crystal panel 2, aflexible substrate 5 that is a circuit board electrically connected to theliquid crystal panel 2, aplastic frame 206 that receives theliquid crystal panel 2 or thesoundgenerating unit 4, and first and second metal frames 207 and 208 between which theplastic frame 206 receiving theliquid crystal panel 2, thesoundgenerating unit 4, and the like is inserted. - The
plastic frame 206 has, for example, a rectangular shape, and includes an illuminatingunit recess 40 formed on the liquid crystal panel side, asoundgenerating unit recess 41 formed on an opposite side thereof, and aframe guide groove 42 formed in the side surface on the flexible substrate side so as to pass through thebranch part 36 of theflexible substrate 5. Theplastic frame 206 is formed to be received between the first and second metal frames 207 and 208. - As shown in
FIG. 15 , for example, theplastic frame 206 has aframe recess 259 that is formed to be indented at the middle of a sidewall on the flexible substrate side and the opposite side. Theframe recess 259 is formed so that thesecond metal frame 208 can receive a portion protruded in a box shape on theplastic frame 206 side. - As shown in
FIGS. 14 and 15 , for example, thefirst metal frame 207 covers and presses theliquid crystal panel 2 received in theplastic frame 206 from the upper side of the drawing, such that the liquid crystal panel is fixed. Thefirst metal frame 207 has aplanar portion 43 that has a rectangular shape and serves as the display surface, and a sidewall 244 that is formed to be orthogonal to theplanar portion 43 toward thesecond metal frame 208. - The sidewall 244 has, for example, a
sidewall 44 a formed on the flexible substrate side, asidewall 244 b formed to face thesidewall 44 a, and two sidewalls 244 c that face each other and are interposed between the sidewalls 44 a, 244 b. - As shown in
FIGS. 14 and 15 , for example, thesidewall 244 b has a sidewallextended part 260, which is part of thesidewall 244 b extended from its central portion in a rectangular shape, and theconductive part 249, which is a plate spring obtained by cutting and bending the sidewall extendedpart 260. - As shown in
FIG. 15 , theconductive part 249 is formed to be inwardly inclined by θ degree starting from the origin, at which theconductive part 249 is extended, toward thesecond metal frame 208 of thesidewall 244 b. The inner surface of anedge 250 of theconductive part 249 is inwardly projected from an outer sidewall of a recess of thesecond metal frame 208 to be described below by the gap K indicated inFIG. 15 . - With such a configuration, when the sidewall extended
part 260 is inserted into the recess of thesecond metal frame 208 as described below, theconductive part 249 is pressed back to a direction opposite to the projected direction by the projected portion, for example, the gap K. Accordingly, the stress due to the elastic force reacting against the push back always presses theconductive part 249 to the inner sidewall of the recess of thesecond metal frame 208 such that theconductive part 249 reliably comes into contact with the inner sidewall of the recess of thesecond metal frame 208. - For example, even when a component tolerance variation exists, at least the
edge 250 of theconductive part 249 can come into contact with thesecond metal frame 208 within the projected portion of theconductive part 249, for example, within the range of K ofFIG. 15 . Accordingly, thefirst metal frame 207 can be reliably electrically connected with thesecond metal frame 208. - For example, when the first and second metal frames 207 and 208 are set in the
plastic frame 206, the length of theconductive part 249 is formed such that theedge 250 of theconductive part 249 is located a little higher than the outer bottom surface of thesecond metal frame 208. Accordingly, even when a component tolerance variation exists, it is possible to prevent theedge 250 from deviating from the outer wall surface of thesecond metal frame 208. In contrast, even when theconductive part 249 is too short, it is possible to prevent theconductive part 249 from deviating from the recess of thesecond metal frame 208 due to the component tolerance variation or vibration. - In addition, while the above-mentioned embodiment describes that a single
conductive part 249 are extended, the invention is not limited thereto, but, for example, two or more conductive parts may be provided. - As shown in
FIGS. 11 and 12 , for example, thesecond metal frame 208 covers and presses thesoundgenerating unit 4 and a supportingbody 51 for supporting thesoundgenerating unit 4, which are received in eachplastic frame 206, from the bottom side of the drawings such that thesoundgenerating unit 4 and the supportingbody 51 are fixed. Thesecond metal frame 208 has a rectangularplanar portion 52, and a sidewall 253 that is formed to be orthogonal to the four sides of theplanar portion 52 toward thefirst metal frame 207. - As shown in
FIG. 14 , for example, the sidewall 253 has asidewall 53 a formed on the flexible substrate side, asidewall 253 b formed on the opposite side of thesidewall 53 a, and twosidewalls 53 c which are formed between the sidewalls 53 a, 253 b and face each other. - As shown in
FIGS. 14 and 15 , for example, thesidewall 253 b has asidewall recess 256 for receiving the sidewall extendedpart 260 in its central portion. - For example, the
sidewall recess 256 is indented in a box shape from the outside of thesidewall 253 b toward the inside. Thesidewall recess 256 is formed to be a little larger than the thickness of the sidewall extendedpart 260 extended from thefirst metal frame 207. - As shown in
FIG. 14 , for example, thesidewall recess 256 is formed such that its inner length in the X-axis direction of the drawing is approximately equal to the horizontal width of the sidewall extendedpart 260 when seen from thesidewall 253 b. Accordingly, it is possible to make the protrusion to theplastic frame 206 as small as possible, thereby reducing the size of theLCD device 201. - Method of Manufacturing LCD Device
- A method of manufacturing the LCD device having the above-mentioned configuration is the same as that of the modified example 1, and a detail description thereof will thus be omitted.
- According to the modified example, since the
conductive part 249 is a bent portion of a plate spring obtained by extending the sidewall extendedpart 260, which is a part of thesidewall 244 b of thefirst metal frame 207, to thesecond metal frame 208 and by cutting and bending the plate spring inwardly from the sidewall extendedpart 260, it is stronger in intensity compared to a case where theconductive part 249 is solely projected to thesecond metal frame 208. In addition, since the sidewall extendedpart 260 other than theconductive part 249 becomes a guide of theconductive part 249, it is easier to assemble thefirst metal frame 207 into thesecond metal frame 208. - According to the present modified example, since the
conductive part 249 is cut and bent and is deformably configured to be inwardly inclined, it is possible to cope with some component tolerance variation and to reliably electrically connect the first and second metal frames 207 and 208 to each other. - In addition, since the
conductive part 249 is formed by cutting and bending the sidewall extendedpart 260 that is part of thesidewall 244 b, it is easy to manufacture theconductive part 249 and the waste of resources is reduced. - Next, an LCD device according to modified example 3 of the first embodiment of the invention will now be described. The modified example 3 is different from the first embodiment in that a conductive part is provided on a flexible substrate side, which will be described in detail. In the modified example 3, the same components as those in first embodiment are denoted by the same reference numerals and a detailed description thereof will thus be omitted.
-
FIG. 16 is a perspective view of an LCD device according to the modified example 3.FIG. 17 is a perspective view seen from the opposite side ofFIG. 16 .FIG. 18 is a cross-sectional view taken along the line XVIII-XVIII ofFIG. 16 (soundgenerating unit being not cut away).FIG. 19 is an explanatory view for showing a projected conductive part. - Configuration of LCD Device
- As shown in
FIGS. 16 and 18 , for example, anLCD device 401 includes aliquid crystal panel 2 that is a first electro-optical panel, an illuminatingunit 3 that emits light on theliquid crystal panel 2, asoundgenerating unit 4 that is provided as an electronic part to be adjacent to theliquid crystal panel 2, aflexible substrate 5 that is a circuit board electrically connected to theliquid crystal panel 2, aplastic frame 6 that receives theliquid crystal panel 2 or thesoundgenerating unit 4, and first and second metal frames 407 and 408 between which theplastic frame 6 receiving theliquid crystal panel 2, thesoundgenerating unit 4, or the like is inserted. - As shown in
FIGS. 16 and 18 , for example, thefirst metal frame 407 covers and presses theliquid crystal panel 2 received in theplastic frame 6 from the upper side of the drawing, such that the liquid crystal panel is fixed. Thefirst metal frame 407 has aplanar portion 43 having a rectangular shape, and a sidewall 444 that is formed to be orthogonal to theplanar portion 43 toward thesecond metal frame 408. - The sidewall 444 has, for example, a
sidewall 444 a formed on the flexible substrate side, asidewall 444 b formed to face thesidewall 444 a, and twosidewalls 44 c that face each other and are interposed between thesidewalls - As shown in
FIGS. 16 and 18 , for example, thesidewall 444 a hasconductive parts 449 on the left and right sides of the firstmetal frame recess 48, so as to separate from the firstmetal frame recess 48 provided on the central portion. Eachconductive part 449 is an elastic plate spring having a rectangular shape that is extended toward thesecond metal frame 408. - As shown in
FIG. 19 , theconductive part 449 is formed to be outwardly inclined by θ degree starting from the origin, at which theconductive part 449 is extended, toward thesecond metal frame 408 of thesidewall 444 a. The outer surface of anedge 450 of theconductive part 449 is projected from an inner wall of a recess of thesecond metal frame 408 by the gap M indicated inFIG. 19 . - With such a configuration, when the
conductive part 449 is inserted into the recess of thesecond metal frame 408 as described below, theconductive part 449 is pressed back to a direction opposite to the projected direction by the projected portion, for example, the gap M. Accordingly, by the elastic force of the pressedconductive part 449, theconductive part 449 reliably comes into contact with the inner wall of the recess of thesecond metal frame 408. - For example, even when a component tolerance variation exists, at least the
edge 450 of theconductive part 449 can come into contact with thesecond metal frame 408 within the projected portion of theconductive part 449, for example, within the range of M ofFIG. 19 . Accordingly, thefirst metal frame 407 can be reliably electrically connected with thesecond metal frame 408. - For example, when the first and second metal frames 407 and 408 are set in the
plastic frame 6, the length of theconductive part 449 is formed such that theedge 450 of theconductive part 449 is located a little higher than the inner bottom surface of thesecond metal frame 408. Accordingly, even when a component tolerance variation exists, it is possible to prevent theedge 450 from coming into contact with the inner bottom surface of thesecond metal frame 408, such that thefirst metal frame 407 is not raised from theplastic frame 6. In contrast, even when theconductive part 449 is too short, it is possible to prevent theconductive part 449 from deviating from the recess of thesecond metal frame 408 due to the component tolerance variation or vibration. - As shown in
FIG. 16 , for example, the twoconductive parts 449 are separated from each other. Accordingly, even when any one of the twoconductive parts 449 does not come into contact with thesecond metal frame 408 due to vibrating or the like, the first and second metal frames 407 and 408 can be electrically connected with each other by means of the remaining one of theconductive parts 449. In addition, since the twoconductive parts 449 are separated from each other, it is possible to reliably electrically connect the first and second metal frames 407 and 408 to each other even though the sidewall is partly distorted. - In addition, while the above-mentioned embodiment describes that two
conductive parts 449 are provided, the invention is not limited thereto, but, for example, one or at least three conductive parts may be provided. - As shown in
FIG. 17 , for example, thesidewall 444 b does not have an extended conductive part, unlike thesidewall 44 b of the first embodiment. Thesidewall 444 b may have an extended conductive part, like thesidewall 44 b of the first embodiment. With such a configuration, it is possible to reliably electrically connect the first and second metal frames 407 and 408 to each other. - As shown in
FIGS. 16, 17 and 18, for example, thesecond metal frame 408 covers and presses thesoundgenerating unit 4 and a supportingbody 51 for supporting thesoundgenerating unit 4, which are received in eachplastic frame 6, from the bottom side of the drawings such that thesoundgenerating unit 4 and the supportingbody 51 are fixed. Thesecond metal frame 408 has a rectangularplanar portion 52, and a sidewall 453 that is formed to be orthogonal to the four sides of theplanar portion 52 toward thefirst metal frame 7. - As shown in
FIGS. 16 and 18 , for example, the sidewall 453 has asidewall 453 a formed on the flexible substrate side, asidewall 453 b formed on the opposite side of thesidewall 453 a, and twosidewalls 53 c which are formed between thesidewalls - As shown in
FIGS. 16 and 18 , for example, thesidewall 453 a has sidewall recesses 456 for receiving theconductive parts 449 on the left and right sides of the secondmetal frame recess 55, so as to separate from the secondmetal frame recess 55 provided on the central portion. - As shown in
FIG. 16 , for example, thesidewall recess 456 is indented in a box shape from the inside of thesidewall 453 a toward the outside. Thesidewall recess 456 is formed to be a little larger than the thickness of theconductive part 449 extended from thefirst metal frame 407. Accordingly, it is easy to insert theconductive part 449 into thesidewall recess 456, and to cope with some component tolerance variation. - As shown in
FIG. 16 , for example, thesidewall recess 456 is formed such that its inner length of the X-axis direction is approximately equal to the width of theconductive parts 449 when seen from thesidewall 453 a. Accordingly, it is possible to make the protrusion from thesecond metal frame 408 as small as possible, thereby reducing the size of theLCD device 401. - On the other hand, as shown in
FIG. 17 , for example, thesidewall 453 b does not have a sidewall recess for receiving a conductive part, unlike thesidewall 53 b of the first embodiment. When a conductive part is extended to thesidewall 444 b, thesidewall 453 b may have a sidewall recess for receiving the conductive part, like thesidewall 53 b of the first embodiment. With such a configuration, it is possible to reliably electrically connect the first and second metal frames 407 and 408 to each other. - Method of Manufacturing LCD Device
- A method of manufacturing the LCD device having the above-mentioned configuration is the same as that of the first embodiment, except that a conductive part is extended to a flexible substrate side, which will be described.
- For example, when the
first metal frame 407 is set to cover theliquid crystal panel 2 and theplastic frame 6 that receives theliquid crystal panel 2, theedge 450 of theconductive part 449 that is extended to be inclined outward is inserted between thesidewall recess 456 of thesecond metal frame 408 and theplastic frame 6, and thefirst metal frame 407 is horizontally moved (in the Y-axis direction ofFIG. 19 ) such that the angle θ between theconductive part 449 and thesidewall 444 a is approximately equal to zero. - As a result, since the inner surface of the
sidewall 444 a and the outer surface of theplastic frame 6 match each other in the Z-axis direction ofFIG. 19 , in this state, thefirst metal frame 407 is moved to the second metal frame 408 (in the Z-axis direction ofFIG. 19 ) such that theconductive part 449 is inserted into the gap between thesidewall recess 456 and theplastic frame 6. Accordingly, for example, as shown inFIG. 18 , thefirst metal frame 407 is set to cover theliquid crystal panel 2 and theplastic frame 6 that receives theliquid crystal panel 2, and theconductive part 449 reliably comes into contact with the inner wall of thesidewall recess 456 of thesecond metal frame 408, thereby electrically connecting the first and second metal frames 407 and 408 to each other. - The subsequent manufacturing method is the same as that of the first embodiment and a detailed description thereof will thus be omitted.
- According to the present modified example, the
conductive part 449 is extended from the flexible substrate side toward thesecond metal frame 408. Accordingly, for example, even though thesidewall recess 456 for receiving theconductive part 449 is provided in thesecond metal frame 408 such that the outer surface of thesidewall recess 456 is projected, if it is arranged so as not to interfere with theflexible substrate 5, since space is reserved for the flexible substrate and thus the substrate does not disturb other components, it is possible to further reduce the size of the electro-optical device. - The
conductive part 449 is pressed to the inner surface of thesidewall recess 456 of thesecond metal frame 408 by the elastic force so as to come into contact with the inner surface, such that the first and second metal frames 407 and 408 are electrically connected with each other. Accordingly, even when a component tolerance variation exists, theconductive part 449 of thefirst metal frame 407 is pressed to, for example, thesecond metal frame 408 by the elastic force, such that the first and second metal frames are reliably electrically connected with each other. As a result, since it is not required to exactly set the component tolerance, it is possible to reduce the manufacturing cost. - An LCD device according to a second embodiment of the invention will now be described. In the present embodiment, a liquid crystal panel, which is a second electro-optical panel, is additionally provided instead of a soundgenerating unit, which is an electronic part. Also, in this embodiment, among all the components containing the added liquid crystal panel, the same components as those of the first embodiment are denoted by the same reference numerals, and a detailed description thereof will be omitted.
-
FIG. 20 is a cross-sectional view of an LCD device according to the second embodiment of the invention. - Configuration of LCD Device
- For example, as shown in
FIG. 20 , anLCD device 501 includes a firstliquid crystal panel 502, which acts as a first electro-optical panel, a first illuminatingunit 503, which emits light on the firstliquid crystal panel 502, a secondliquid crystal panel 570, which is an electronic part provided to be adjacent to the firstliquid crystal panel 502 and whose display surface is provided in a direction opposite to a display surface of the firstliquid crystal panel 502, a second illuminatingunit 571, which emits light on the secondliquid crystal panel 570, a firstflexible substrate 505, which is a circuit board electrically connected to the firstliquid crystal panel 502, a secondflexible substrate 572, which is a circuit board electrically connected to the secondflexible substrate 570, aplastic frame 506, which receives the first and secondliquid crystal panels first metal frame 507 and asecond metal frame 508, between which theplastic frame 506 receiving the first and secondliquid crystal panels LCD device 501 further includes additional elements (not shown), if necessary, in addition to the first and second metal frames 507 and 508. - As shown in
FIGS. 5 and 20 , the first and secondliquid crystal panels first substrate 10 and asecond substrate 11, which are joined with a sealingmaterial 9, and an electro-optical material, e.g., a STN (Super Twisted Nematic)liquid crystal 12, which is injected between the substrates. In addition, a base layer, a reflective layer, a colored layer, a light-shielding layer and the like, which are not shown, are provided on any one of the first andsecond substrates - As shown in
FIG. 5 , for example, on thefirst substrate 10, a plurality ofcommon electrodes 13 is formed in a predetermined pattern on the liquid crystal side. In addition, an overcoat layer 14 is formed on thecommon electrode 13 disposed on the liquid crystal side, and analignment layer 15 is further formed on the liquid crystal side. Further, apolarizer 16 and so on are formed on the outside (the opposite side of the liquid crystal) of the first substrate. - On the other hand, for example, as shown in
FIG. 5 , on thesecond substrate 11, a plurality ofsegment electrodes 17 is formed in a predetermined pattern on the liquid crystal side. Anovercoat layer 18 is formed on thesegment electrode 17. Analignment layer 19 is further formed on the liquid crystal side. Also, apolarizer 20 is formed on the outside (the opposite side of the liquid crystal) of thesecond substrate 11. - As shown in
FIG. 5 , the first andsecond substrates second substrate 11 has aprotrusion 21 that is projected outward (Y-axis direction inFIG. 5 ) with respect to thefirst substrate 10. - As shown in
FIG. 5 , for example, on theprotrusion 21, a plurality ofexternal terminals 22 is extended from an area, in which thesegment electrode 17 and thecommon electrode 13 are surrounded by the sealingmaterial 9, to theprotrusion 21, and is electrically connected to each electrode. - As shown in
FIGS. 5 and 20 , for example, the first and second illuminatingunits second substrate 11. Each of the first and second illuminatingunits light source 23, alight guide plate 24, twoprism sheets sheet 27, and areflective sheet 28, which are not shown. Theprism sheet 25 adheres to thepolarizer 20 of thesecond substrate 11. - As shown in
FIG. 20 , awiring pattern 33 is formed on abase member 32 of each of the first and secondflexible substrates flexible substrates - Each of the first and second
flexible substrates panel connecting terminals 537 at its end portion on the liquid crystal panel side, and is electrically connected to theexternal terminal 22 of theprotrusion 21 of each of the first and secondliquid crystal panels - As shown in
FIG. 20 , for example, the liquid crystalpanel connecting terminals 537 are electrically connected to thewiring pattern 33, and are electrically connected to the liquidcrystal driving IC 34 through a connecting terminal (not shown), the ACF, or the like on the opposite side of the liquid crystal panel of thewiring pattern 33. - As shown in
FIG. 20 , for example, theplastic frame 506 has a rectangular shape. Theplastic frame 506 has a first illuminatingunit recess 540 formed on the first liquid crystal panel side, and a second illuminatingunit recess 541 formed on an opposite side thereof. Theplastic frame 506 is formed to be received between the first and second metal frames 507 and 508. - As shown in
FIG. 20 , for example, the first and second illuminating unit recesses 540 and 541 are formed such that a bottom surface of each of the box-shaped illuminating unit recesses has almost the same size as that of each of the first and second illuminatingunits FIG. 20 ). Thereflective sheet 28 of the illuminating unit is attached to the bottom surface, for example, with a double-faced adhesive tape or the like. As shown inFIG. 20 , the first and second illuminating unit recesses 540 and 541 are formed to be deep enough to receive a part of the liquid crystal panel attached to theprism sheet 25 of the illuminating unit. In addition, a part of the liquid crystal panel attached to the illuminating unit, together with the illuminating unit, is received in the first and second illuminating unit recesses 540 and 541. - As shown in
FIG. 20 , for example, thefirst metal frame 507 covers and presses the firstliquid crystal panel 502 received in each of the plastic frames 506 from the outside of the drawings such that the firstliquid crystal panel 502 is fixed. Thefirst metal frame 507 has a rectangularplanar portion 543, and a sidewall 544 that is formed to be orthogonal to the four sides of theplanar portion 543 toward thesecond metal frame 508. - As shown in
FIG. 20 , for example, afirst opening 545 and twopush spring parts 46 are provided on theplanar portion 543. Thefirst opening 545 provided in the middle of theplanar portion 543 acts as a liquid crystal display surface. The twopush spring parts 46 are provided between thefirst opening 545 and edges of one side on the opposite side of the flexible substrate of theplanar portion 543. - As shown in
FIG. 20 , for example, the sidewall 544 has asidewall 544 a formed on the flexible substrate side, asidewall 544 b formed on the opposite side of thesidewall 544 a, and two sidewalls 544 c (not shown) which are formed between thesidewalls - As shown in
FIG. 20 , for example, thesidewall 544 a has a firstmetal frame recess 548 in its central portion so that a connecting terminal of the firstflexible substrate 505 can be inserted. - As shown in
FIG. 20 , for example, thesidewall 544 b has two separatedconductive parts 49 each of which is extended from the central portion toward thesecond metal frame 508 and is an elastic plate spring. - The
conductive part 49 is formed to be outwardly inclined by θ degree starting from the origin, at which theconductive part 49 is extended, toward thesecond metal frame 508 of thesidewall 544 b. The outer surface of anedge 50 of theconductive part 49 is slightly projected from an inner sidewall of a recess of thesecond metal frame 508 to be described below. - With such a configuration, when the
conductive part 49 is inserted into the recess of thesecond metal frame 508 as described below, theconductive part 49 is pressed back to a direction opposite to the projected direction by the projected distance. Accordingly, the stress due to the elastic force reacting against the push back always presses theconductive part 49 to the inner sidewall of the recess of thesecond metal frame 508 such that theconductive part 49 reliably comes into contact with the inner sidewall of the recess of thesecond metal frame 508. - As shown in
FIG. 20 , for example, thesecond metal frame 508 covers and presses the secondliquid crystal panel 570, which are received in eachplastic frame 506, from the outside of the drawing, such that the secondliquid crystal panel 570 is fixed. Thesecond metal frame 508 has a rectangularplanar portion 552 serving as the display surface, and a sidewall 553 that is formed to be orthogonal to the four sides of theplanar portion 552 toward thefirst metal frame 507. - As shown in
FIG. 20 , in theplanar portion 552, asecond opening 573, which is a liquid crystal display surface, is provided at the central portion of theplanar portion 552. Twopush spring parts 46 are provided between thesecond opening 573 and edges of one side of theplanar portion 552 on the opposite side of the flexible substrate. - As shown in
FIG. 20 , for example, the sidewall 553 has asidewall 553 a formed on the flexible substrate side, a sidewall 553 b formed on the opposite side of thesidewall 553 a, and two sidewalls 553 c (not shown) which are formed between thesidewalls 553 a, 553 b and face each other. - As shown in
FIG. 20 , for example, thesidewall 553 a has a secondmetal frame recess 555 in the central portion so that a connecting terminal of the secondflexible substrate 572 can be inserted. - As shown in
FIG. 20 , for example, the sidewall 553 b has asidewall recess 56 for receiving theconductive part 49 in the central portion. - As shown in
FIG. 20 , for example, thesidewall recess 56 is indented in a box shape from the inside of the sidewall 553 b toward the outside. Thesidewall recess 56 is formed to be a little larger than the thickness of theconductive part 49 extended from thefirst metal frame 507. Accordingly, it is possible to easily insert theconductive part 49 into thesidewall recess 56, and to cope with some component tolerance variation. - Similarly to the first embodiment, for example, the
LCD device 501 is configured such that thesecond metal frame 508 is electrically connected to a middle frame of an electronic apparatus, such as a mobile phone, by means of a connecting part (not shown). Accordingly, the first and second metal frames 507 and 508, which have the same potential by theconductive part 49, are put to earth. - Method of Manufacturing LCD Device
- A method of manufacturing an LCD device having the above-mentioned configuration is the same as that of the first embodiment, except that the second liquid crystal panel is provided instead of the soundgenerating unit, which will be described.
- First, the first and second
liquid crystal panels - Next, the first and second flexible substrates are manufactured.
- For example, a
predetermined wiring pattern 33, the liquid crystalpanel connecting terminals 537, and other connecting terminals are formed on thebase member 32 formed by a mold. Next, the liquidcrystal driving IC 34 is mounted on the connecting terminals through ACF. - Other ICs or capacitors are mounted, and the liquid crystal
panel connecting terminals 537 of the first and secondflexible substrates external terminal 22 of the liquid crystal panel through theexternal ACF 38. - Next, for example, the
reflective sheet 28, thelight guide plate 24 to which thelight source 23 is attached, the diffusingsheet 27, and theprism sheets unit recess 540 of theplastic frame 506. The firstliquid crystal panel 502 to which the firstflexible substrate 505 is connected is provided thereon. - In addition, the reflective sheet and the like are mounted on a bottom surface of the second illuminating
unit recess 54 of theplastic frame 506. The secondliquid crystal panel 570 to which the secondflexible substrate 572 is connected is provided thereon. - Next, as shown in
FIG. 20 , for example, thesecond metal frame 508 is set to cover the secondliquid crystal panel 570 and theplastic frame 506 that receives the liquid crystal panel. On the opposite side, thefirst metal frame 507 is set to cover the firstliquid crystal panel 502 and theplastic frame 506 that receives the liquid crystal panel. - At this time, the
edge 50 of theconductive part 49 that is extended to be inclined outward is inserted into the gap between thesidewall recess 56 of thesecond metal frame 508 and theplastic frame 506, and in this state, thefirst metal frame 507 is moved such that the angle θ between theconductive part 49 and thesidewall 544 b is approximately equal to zero. - As a result, since, in the
second metal frame 508, the inner surface of thesidewall 544 b and the outer surface of theplastic frame 506 match each other in the Z-axis direction ofFIG. 20 , in this state, thefirst metal frame 507 is moved in the Z-axis direction of the drawing such that theconductive part 49 is inserted into the gap between thesidewall recess 56 of thesecond metal frame 508 and theplastic frame 506. Accordingly, for example, as shown inFIG. 20 , thefirst metal frame 507 is set to cover theliquid crystal panel 502 and theplastic frame 506 that receives theliquid crystal panel 502, and theconductive part 49 reliably comes into contact with the inner wall of thesidewall recess 56 of thesecond metal frame 508, thereby electrically connecting the first and second metal frames 507 and 508 to each other. - As shown in
FIG. 20 , when thefirst metal frame 507 is moved to thesecond metal frame 508, the circumference of thefirst opening 545 of thefirst metal frame 507 presses the non-displaying area of thefirst substrate 10 from the outside as shown inFIG. 20 , and the firstliquid crystal panel 502 is fixed to the first illuminatingunit recess 540 of theplastic frame 506 in each first illuminatingunit 503. At this time, similarly, the circumference of thesecond opening 573 of thesecond metal frame 508 presses the non-displaying area of thefirst substrate 10 from the outside as shown inFIG. 20 , and the secondliquid crystal panel 570 is fixed to the second illuminatingunit recess 541 of theplastic frame 506 in each second illuminatingunit 571. - On the other hand, when the
first metal frame 507 is moved to thesecond metal frame 508, the push springs 47 of twopush spring parts 46 provided in the first and second metal frames 507 and 508 come into contact with theplastic frame 506 as shown inFIG. 20 , and it is possible to prevent rattling between theplastic frame 506 and the first and second metal frames 507 and 508 by the elastic force of the springs. - As described above, the first and second metal frames 507 and 508 are set in the
plastic frame 506 and other required components are fixed, thereby completing theLCD device 501. - For example, the
LCD device 501 is configured such that thesecond metal frame 508 is electrically connected to a middle frame of an electronic apparatus, such as a mobile phone, by means of a connecting part (not shown). Accordingly, the first and second metal frames 507 and 508, which have the same potential by theconductive part 49, are put to earth. - According to the present embodiment, the first and second
liquid crystal panels plastic frame 506, which is provided between the first and secondliquid crystal panels conductive part 49 is extended from thefirst metal frame 507 to thesecond metal frame 508 to reliably electrically connect the first and second metal frames 507 and 508 to each other. Accordingly, even when some component tolerance variation exists, the first and second metal frames 507 and 508 can be reliably electrically connected to each other. As a result, it is possible to prevent the liquid crystal panel or the circuit board from malfunctioning. - An electronic apparatus, which includes any one of the above-mentioned
LCD devices -
FIG. 21 schematically shows a display control system of an electronic apparatus according to the third embodiment of the invention. - The
electronic apparatus 300 includes aliquid crystal panel 2 and adisplay control circuit 390 as a display control system, for example, as shown inFIG. 21 . Thedisplay control circuit 390 includes a displayinformation output source 391, a displayinformation processing circuit 392, apower supply circuit 393, and atiming generator 394. - The
liquid crystal panel 2 includes adriving circuit 361 that drives a display region I. - The display
information output source 391 includes a memory, which is composed of ROM (Read Only Memory), RAM (Random Access Memory), or the like, a storage unit, which is composed of a magnetic recording disk, an optical recording disk, or the like, and a tuning circuit, which tunes and outputs a digital image signal. On the basis of various clock signals generated by thetiming generator 394, the displayinformation output source 391 is configured to supply display information to the displayinformation processing circuit 392 in the form of an image signal having a predetermined format. - The display
information processing circuit 392 includes various known circuits such as a serial/parallel conversion circuit, an amplification•inversion circuit, a rotation circuit, a gamma correction circuit, a clamp circuit, and the like. The displayinformation processing circuit 392 processes input display information, and applies image information to thedriving circuit 361 together with a clock signal CLK. Thepower supply circuit 393 supplies a predetermined voltage to each of the above-mentioned components. - According to the present embodiment, the
first metal frame 7 of theLCD device 1 used in theelectronic apparatus 300 has the elasticconductive part 49 which is extended toward thesecond metal frame 8, and theconductive part 49 is pressed against and comes into contact with the inner surface of thesidewall recess 56 of thesecond metal frame 8 by the elastic force such that the first andsecond metal frames conductive part 49 of thefirst metal frame 7 is pressed against, for example, thesecond metal frame 8 by the elastic force. Accordingly, it is possible to reliably electrically connect the first andsecond metal frames electronic apparatus 300. - Since the
conductive part 49 is extended from thesidewall 44 b, which is formed on the opposite side of the flexible substrate, toward thesidewall 53 b of thesecond metal frame 8, for example, there is a margin of space because theflexible substrate 5 is not connected. Accordingly, it is possible to freely arrange theconductive part 49 or thesidewall recess 56 of thesecond metal frame 8 that comes into contact with theconductive part 49. - In particular, since an electronic apparatus is recently required to be compact and high-quality, the invention that provides such an electronic apparatus is valuable.
- Examples of the electronic apparatus include a mobile phone, a personal computer, a touch panel equipped with an LCD device, a projector, a liquid crystal television, a view-finder-type or monitor-direct-view-type videotape recorder, a car navigation, a pager, an electronic organizer, a calculator, a word processor, a workstation, a television telephone, a POS terminal, and the like. The above-mentioned
LCD devices - In addition, the electro-optical device and the electronic apparatus according to the invention is not limited to the above-mentioned examples and may be variously changed without departing from the scope of the invention. Further, a combination of the embodiments and the modified examples may be employed without departing from the scope of the invention.
- While the invention has been described with reference to the exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention.
- For example, while the above-mentioned embodiments or modified examples have described a passive matrix type LCD device, the invention is not limited thereto. For example, a thin film transistor or diode active matrix type LCD device may be employed. Further, the invention is not limited to a transflective type LCD device, but may include a reflective or a transmissive LCD device. Accordingly, with respect to various kinds of LCD devices, it is possible to reliably electrically connect components to each other at low cost, and to prevent malfunction and breakdown of electro-optical panels or electronic components due to electrical noise.
- While the above-mentioned embodiments or modified examples have described the liquid crystal panel or the soundgenerating unit serving as an electronic part that is received in the
plastic frame 6, and the second liquid crystal panel, the invention is not limited thereto but, for example, components such as a circuit board or the like may be employed. Accordingly, with respect to various kinds of LCD devices, it is possible to reliably electrically connect components to each other at low cost, and to prevent malfunction and breakdown of electro-optical panels or electronic components due to electrical noise. - While the above-mentioned embodiments or modified examples have described the plastic frame for receiving the liquid crystal panel or the soundgenerating unit of the LCD device, the invention is not limited thereto. That is, the invention may include, for example, a metallic frame. As a result, it is possible to achieve a reliable electrical connection through the first metal frame, a receiving part, and the second metal frame.
- While the above-mentioned embodiments or modified examples have described the plastic frame as a receiving part, the invention is not limited thereto. For example, as shown in
FIG. 22 , the receiving part may have a rectangular plate that is provided with L-shaped walls at opposite corners to guide and hold a liquid crystal panel or the like. Examples of the receiving part will now be described in detail. The same components as those of the first embodiment are denoted by the same reference numerals and a detailed description thereof will be omitted. - As shown in
FIG. 22 , for example, anLCD device 601 includes aliquid crystal panel 2 that is a first electro-optical panel, an illuminatingunit 3 that emits light on theliquid crystal panel 2, asoundgenerating unit 4 that is provided as an electronic part to be adjacent to theliquid crystal panel 2, aflexible substrate 5 that is a circuit board electrically connected to theliquid crystal panel 2, a holdingplate 606 that receives theliquid crystal panel 2 or thesoundgenerating unit 4, and first and second metal frames 607 and 8 between which the holdingplate 606 receiving theliquid crystal panel 2, thesoundgenerating unit 4, or the like is interposed. In theLCD device 601, other components (not shown) are provided, if necessary, in addition to the first and second metal frames 607 and 8. - As shown in
FIG. 22 , for example, the holdingplate 606 has arectangular plate 680 that is provided with L-shapedwalls liquid crystal panel 2, the illuminatingunit 3, or the like. - The
wall 681 is provided to be orthogonal to theplate 680 from the edges of the two sides of theplate 680 over the front and rear surfaces of the plate at the left end of theplate 680 when seen from the flexible substrate side inFIG. 22 . The horizontal width of thewall 681 is shorter than the length of each of the sides. For example, thewall 681 on the flexible substrate side is formed to have the length in the X-axis direction ofFIG. 22 such that the mainbody connecting terminal 37 of theflexible substrate 5 is electrically connected to theexternal terminal 22 of theliquid crystal panel 2 arranged on theplate 680 through theexternal ACF 38. Also, similarly to thewall 681, thewall 682 is provided at the corner (the opposite side of the flexible substrate of the drawing) of theplate 680. Thewalls - The holding
plate 606 is formed such that the illuminatingunit 3 and part of the liquid crystal panel can be accurately received inside thewalls soundgenerating unit 4 is received inside thewalls - Accordingly, it is possible to easily receive the
liquid crystal panel 2, the illuminatingunit 3, thesoundgenerating unit 4 and the like, and to simplify the construction of the receiving part. In addition, since the walls do not cover four sides of theplanar plate 680, it is possible to freely connect theflexible substrate 5 to theliquid crystal panel 2. - The
first metal frame 607 is the same as that of the first embodiment. However, unlike in the first embodiment, for example, as shown inFIG. 22 , in thefirst metal frame 607, thepush spring parts opening 45 and edges of one side on the opposite side of the flexible substrate side of theplanar portion 43. - The entire disclosure of Japanese Patent Application No. 2004-353657, filed Dec. 7, 2004 is expressly incorporated by reference herein.
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004353657A JP4428220B2 (en) | 2004-12-07 | 2004-12-07 | Electro-optical device and electronic apparatus |
JP2004-353657 | 2004-12-07 |
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Publication Number | Publication Date |
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US20060120543A1 true US20060120543A1 (en) | 2006-06-08 |
US7397520B2 US7397520B2 (en) | 2008-07-08 |
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Application Number | Title | Priority Date | Filing Date |
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US11/294,881 Active 2027-01-12 US7397520B2 (en) | 2004-12-07 | 2005-12-06 | Electro-optical device and electronic apparatus |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
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US20080123015A1 (en) * | 2006-11-27 | 2008-05-29 | Funai Electric Co., Ltd. | Liquid crystal module |
US20080150851A1 (en) * | 2006-12-25 | 2008-06-26 | Mitsubishi Electric Corporation | Display apparatus |
US20090051845A1 (en) * | 2007-08-23 | 2009-02-26 | Mitsubishi Electric Corporation | Display apparatus |
US20090135329A1 (en) * | 2007-11-26 | 2009-05-28 | Kim Jung-Ki | Liquid crystal display and method of assembling the same |
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4237748B2 (en) * | 2005-12-09 | 2009-03-11 | カシオ計算機株式会社 | Display module |
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TW200820719A (en) * | 2006-10-31 | 2008-05-01 | Asustek Comp Inc | Handheld electronic apparatus |
JP2008139483A (en) * | 2006-11-30 | 2008-06-19 | Sharp Corp | Display device |
JP5107109B2 (en) * | 2008-03-24 | 2012-12-26 | 株式会社ジャパンディスプレイウェスト | Electro-optical device and electronic apparatus |
JP5141962B2 (en) * | 2008-03-27 | 2013-02-13 | 日本精機株式会社 | Display device |
JP5183522B2 (en) * | 2009-02-12 | 2013-04-17 | キヤノン株式会社 | Electronics |
JP2011099993A (en) * | 2009-11-06 | 2011-05-19 | Sony Ericsson Mobile Communications Ab | Electronic device and flat display module |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6144216A (en) * | 1995-04-01 | 2000-11-07 | Enplas Corporation | Electric contact apparatus for inspecting a liquid crystal display panel |
US20040047149A1 (en) * | 2002-08-30 | 2004-03-11 | Harison Toshiba Lighting Corporation | Lighting device |
US6729888B2 (en) * | 1999-12-10 | 2004-05-04 | Seiko Epson Corporation | Connecting structure, electro-optical device, and electronic apparatus |
US7282852B2 (en) * | 2000-07-24 | 2007-10-16 | Canon Kabushiki Kaisha | Electron-emitting device and image forming apparatus |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0587597A (en) | 1991-09-25 | 1993-04-06 | Koyo Seiko Co Ltd | Key lock control method for measurement device |
JP2639255B2 (en) | 1991-11-11 | 1997-08-06 | 松下電器産業株式会社 | Unwanted radiation shield device |
JP2623196B2 (en) | 1992-08-21 | 1997-06-25 | 株式会社奥村組 | Tunnel lining equipment |
JP2000019491A (en) | 1998-06-29 | 2000-01-21 | Sanyo Electric Co Ltd | Liquid crystal display device |
-
2004
- 2004-12-07 JP JP2004353657A patent/JP4428220B2/en active Active
-
2005
- 2005-12-06 US US11/294,881 patent/US7397520B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6144216A (en) * | 1995-04-01 | 2000-11-07 | Enplas Corporation | Electric contact apparatus for inspecting a liquid crystal display panel |
US6729888B2 (en) * | 1999-12-10 | 2004-05-04 | Seiko Epson Corporation | Connecting structure, electro-optical device, and electronic apparatus |
US7282852B2 (en) * | 2000-07-24 | 2007-10-16 | Canon Kabushiki Kaisha | Electron-emitting device and image forming apparatus |
US20040047149A1 (en) * | 2002-08-30 | 2004-03-11 | Harison Toshiba Lighting Corporation | Lighting device |
Cited By (16)
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---|---|---|---|---|
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US7626672B2 (en) * | 2005-11-23 | 2009-12-01 | Samsung Mobile Display Co., Ltd. | Portable display device |
US7728919B2 (en) * | 2006-11-27 | 2010-06-01 | Funai Electric Co., Ltd. | Liquid crystal module having flexible printed wiring boards and a housing comprising multiple recesses to accommodate them |
US20080123015A1 (en) * | 2006-11-27 | 2008-05-29 | Funai Electric Co., Ltd. | Liquid crystal module |
US20080150851A1 (en) * | 2006-12-25 | 2008-06-26 | Mitsubishi Electric Corporation | Display apparatus |
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US8223291B2 (en) * | 2007-11-26 | 2012-07-17 | Samsung Electronics Co., Ltd. | Liquid crystal display and method of assembling the same |
US20090135329A1 (en) * | 2007-11-26 | 2009-05-28 | Kim Jung-Ki | Liquid crystal display and method of assembling the same |
KR101406978B1 (en) | 2007-11-26 | 2014-06-13 | 삼성디스플레이 주식회사 | Liquid crystal display and method for assembling of the same |
US11422399B2 (en) * | 2008-07-31 | 2022-08-23 | Japan Display Inc. | Portable device and method of manufacturing a display device |
US20100053852A1 (en) * | 2008-09-02 | 2010-03-04 | Cheng Uei Precision Industry Co., Ltd. | Display Device |
US20170127166A1 (en) * | 2014-06-20 | 2017-05-04 | Sharp Kabushiki Kaisha | Lighting device and display device |
US20200019267A1 (en) * | 2017-03-07 | 2020-01-16 | Sharp Kabushiki Kaisha | Touch panel and electronic device |
US10795482B2 (en) * | 2017-03-07 | 2020-10-06 | Sharp Kabushiki Kaisha | Touch panel and electronic device |
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US11906831B2 (en) * | 2021-07-27 | 2024-02-20 | Seiko Epson Corporation | Electro-optical device and electronic apparatus |
Also Published As
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JP2006162923A (en) | 2006-06-22 |
US7397520B2 (en) | 2008-07-08 |
JP4428220B2 (en) | 2010-03-10 |
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