US20050103635A1 - Method of producing micro component - Google Patents
Method of producing micro component Download PDFInfo
- Publication number
- US20050103635A1 US20050103635A1 US10/506,015 US50601504A US2005103635A1 US 20050103635 A1 US20050103635 A1 US 20050103635A1 US 50601504 A US50601504 A US 50601504A US 2005103635 A1 US2005103635 A1 US 2005103635A1
- Authority
- US
- United States
- Prior art keywords
- metal
- micro component
- concave
- resin
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 9
- 239000002184 metal Substances 0.000 claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 claims abstract description 23
- 239000002904 solvent Substances 0.000 claims abstract description 14
- 238000000227 grinding Methods 0.000 claims abstract description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical group CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 8
- 238000001459 lithography Methods 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 2
- 238000001015 X-ray lithography Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0075—Manufacture of substrate-free structures
- B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/03—Microengines and actuators
- B81B2201/035—Microgears
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
To produce a micro component, a resin base (1) capable of being dissolved by a solvent is formed, physical external force is allowed to act on the resin base (1) to form a concave (3) and after a metal is filled into the concave (3), an excessive metal is removed by grinding and the resin base (1) is dissolved by the solvent. Consequently, the necessity for lithography apparatuses such as a stepper and an etching apparatus can be eliminated, economy can be improved and production of components having complicated shapes that the lithographic technology cannot easily produce can also be produced.
Description
- This invention relates to a production method of micro components to constitute a micro machine.
- Micro components constituting a micro-machine are generally produced by an LIGA (Lithographie Galvanoformung Abformung) process that utilizes a semiconductor production technology.
- The LIGA process is a technology comprising the combination of X-ray lithography, electroplating and molding. Those products that are produced is by a method based on an ordinary semiconductor production process have their height limited to several to dozens of microns (μm) whereas the LIGA process can produce three-dimensional products that have height of hundreds of microns (elm) and an aspect ratio of dozens or more.
- In the LIGA process, a
resist 21 is first applied to an entire surface of aflat substrate 20 as shown inFIG. 7 . X-rays are then irradiated from above amask 22 and are projected to theresist 21 through alens 23 to sensitize theresist 21. Then, a mask pattern formed on themask 22 is transferred. - Next, when the
resist 21 so sensitized is developed, denatured portions due to sensitization are removed. Nickel, for example, is filled by plating into the portions thus removed and theremaining resist 21 andsubstrate 20 are etched away, providing a component having the transferred shape by nickel is formed. When a mold is formed by the same method, micro components can be produced by using the mold. - According to the LIGA process, however, masks corresponding to the shapes of micro components to be produced must be individually prepared and a variety of lithography apparatuses such as a stepper, an etching apparatus, and so forth are necessary. Therefore, the installation cost becomes high and economically inefficient. In addition, because the side surfaces of the masking pattern transferred by X-ray lithography are constituted by vertical surfaces, there is also a problem that processing into complicated shapes is difficult.
- As described above, the production of micro components involves the problems in that economy must be improved and components having complicated shapes can be formed.
- The invention provides a production method of a micro component comprising a resin base forming step of forming a resin base capable of being dissolved by use of a solvent; a concave forming step of allowing physical external force to act on the resin base and forming a concave having a shape corresponding to a shape of a micro component to be produced; a metal filling step of filling a metal into the concave; a metal removing step of grinding and removing an excessive metal; and a base dissolving step of dissolving the resin base by use of a solvent.
- The production method of a micro component described above includes the additional requirements in that the physical external force includes any of a laser beam, an ultrasonic wave, a cutting blade and a grinding wheel; the metal filling step scatters the metal in the concave by sputtering and fills the concave by electroplating; the micro component is a component constituting a micro machine or a molding flask used for producing the component; and the metal is nickel, the resin is an ABS resin and the solvent is acetone.
- According to the production method of a micro component constituted as described above, the concave having the shape of a micro component to be produced is formed in the base by the physical external force and after the metal is filled into the concave, the base is removed. Therefore, production of masks and transfer of mask patterns by lithographic technology that have been necessary in the past become unnecessary.
- When a laser beam is used as the physical external force, a micro component having a shape in which the side surfaces are not vertical surfaces can be easily produced.
-
FIG. 1 is a perspective view showing a base formed by a base forming step. -
FIG. 2 is a perspective view showing a state where a concave is formed in the base by a concave forming step. -
FIG. 3 is a perspective view showing a state where a metal is filled into the concave by a metal filling step. -
FIG. 4 is a perspective view showing a state where an excessive metal is removed by a metal removing step. -
FIG. 5 is a perspective view showing a micro component formed by a base dissolving step. -
FIG. 6 is a sectional view showing a mode of forming a concave the side surfaces of which are tapered surfaces. -
FIG. 7 is a perspective view showing a lithographic technology according to a conventional method. BEST MODE FOR CARRYING OUT THE INVENTION - To begin with, a
resin base 1 having a thickness greater than that of the gear to be formed from a resin is molded (resin base molding step) as shown inFIG. 1 . The resin used for molding theresin base 1 must be those which can be later dissolved through a chemical reaction by use of a solvent, and an ABS resin can be used, for example. - Unlike a conventional method that applies a resist and conducts development by X-ray lithography, the invention applies physical external force such as irradiation of a
laser beam 2 to theresin base 1 without applying a resist and forms a concave 3 as a cavity having the same shape as that of the gear to be produced as shown inFIG. 2 (concave forming step). Besides the laser beam, ultrasonic waves, cutting blades, etc, can be used as the physical external force. A grinding wheel can also be used depending on the shape of the micro component to be produced. - When the
laser beam 2 is used as in the example shown inFIG. 2 , the laser beam is irradiated while anirradiation portion 4 or theresin base 1 is being moved in match with the shape of the gear to be produced, and the concave 3 having the gear shape can be formed. - After the concave 3 having a desired shape is formed in the manner described above, a
metal 5 as a material of the micro component is filled into the concave 3 as shown inFIG. 3 (metal filling step). Filling of the metal can be performed by a method that scatters the metal by sputtering, for example, and thereafter applies electroplating. Nickel, copper, etc, are used as the metal. - After the metal is filled into the concave 3, an excessive metal is deposited onto the
resin base 1 and is therefore removed by grinding (metal removing step). Grinding can be carried out by use of a grinding wheel or a CMP technology. After the excessive metal is removed by grinding, the concave 3 is filled, and themetal 6 having the shape of the concave 3 is exposed as shown inFIG. 4 . The exposed surface of themetal 6 is planarized. - Finally, the resin constituting the
resin base 1 is dissolved by using a solvent and thegear 7 as the micro component shown inFIG. 5 is formed (base dissolving step). Here, acetone is used as the solvent when theresin base 1 is formed of an ABS resin. - When the micro component is formed in this way, expensive lithography apparatuses such as a stepper are not necessary and masks need not be produced for respective components of different shapes, either. Therefore, the production cost can be drastically reduced.
- The example shown in FIGS. 1 to 5 explains the case of the production of the gear the side surfaces of which are vertical surfaces. However, components having complicated shapes can be produced, too, such as in the case where the side surfaces are not the vertical surfaces but are inclined, by adjusting the irradiation angle of the laser beam.
- In the case of a micro component the side surfaces of which are tapered as shown in
FIG. 6 , for example, thelaser beam 8 is obliquely irradiated and a concave 10 havingtaper surfaces 9 can be formed. When the metal is filled into this concave 10, a micro component having the side surfaces corresponding to thetaper surface 9 can be formed. In this way, the micro component having the shape that the conventional method using the lithography technology cannot produce can be produced. - The invention can produce not only the micro component itself constituting the micro machine but also a molding flask such as a mold for molding the micro component.
- Industrial Applicability
- As explained above, the production method of the micro component according to the invention forms the concave having the shape of the micro component to be produced in the base by using the physical external force, fills the metal into the concave and then removes the base. Therefore, the invention eliminates the necessity for the production of masks and the transfer of the mask pattern by the lithographic technology that have been necessary in the past. In other words, the invention can drastically reduce the installation cost and can reduce the production cost.
- When the laser beam is used as the physical external force, the micro components the side surfaces of which are not the vertical surfaces can be easily produced. Therefore, those micro components having complicated shapes the production of which has been difficult in the past can be produced easily and economically.
Claims (8)
1. A production method of a micro component comprising the steps of:
a resin base forming step of forming a resin base capable of being dissolved by use of a solvent;
a concave forming step of allowing physical external force to act on said resin base and forming a concave having a shape corresponding to a shape of a micro component to be produced;
a metal filling step of filling a metal into said concave;
a metal removing step of grinding and removing an excessive metal; and
a base dissolving step of dissolving said resin base by use of a solvent.
2. A production method of a micro component according to claim 1 , wherein said physical external force includes any of a laser beam, an ultrasonic wave, a cutting blade and a grinding wheel.
3. A production method of a micro component according to claim 1 , wherein said metal filling step scatters a metal in said concave by sputtering and then fills said concave by electroplating.
4. A production method of a micro component according to claim 1 , wherein said micro component is a component constituting a micro machine or a molding flask used for producing said component.
5. A production method of a micro component according to claim 1 , wherein said metal is nickel, said resin is an ABS resin and said solvent is acetone.
6. A production method of a micro component according to claim 2 , wherein said metal is nickel, said resin is an ABS resin and said solvent is acetone.
7. A production method of a micro component according to claim 3 , wherein said metal is nickel, said resin is an ABS resin and said solvent is acetone.
8. A production method of a micro component according to claim 4 , wherein said metal is nickel, said resin is an ABS resin and said solvent is acetone.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-161389 | 2002-06-03 | ||
JP2002161389A JP2004009144A (en) | 2002-06-03 | 2002-06-03 | Method of manufacturing micro parts |
PCT/JP2003/006475 WO2003101889A1 (en) | 2002-06-03 | 2003-05-23 | Mthod of producing micro component |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050103635A1 true US20050103635A1 (en) | 2005-05-19 |
Family
ID=29706576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/506,015 Pending US20050103635A1 (en) | 2002-06-03 | 2003-05-23 | Method of producing micro component |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050103635A1 (en) |
JP (1) | JP2004009144A (en) |
KR (1) | KR20040111494A (en) |
AU (1) | AU2003242436A1 (en) |
DE (1) | DE10392431T5 (en) |
WO (1) | WO2003101889A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050014594A1 (en) * | 2001-12-14 | 2005-01-20 | Reinhard Degen | Micro gear system operating according to the voltage ripple principle with hollow shafts |
US20070227893A1 (en) * | 2006-03-15 | 2007-10-04 | Doniar S.A. | Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4526556B2 (en) * | 2007-09-18 | 2010-08-18 | 株式会社木村鋳造所 | Manufacturing method of micro parts |
US8216697B2 (en) | 2009-02-13 | 2012-07-10 | Global Oled Technology Llc | OLED with fluoranthene-macrocyclic materials |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6159681A (en) * | 1997-05-28 | 2000-12-12 | Syntrix Biochip, Inc. | Light-mediated method and apparatus for the regional analysis of biologic material |
US20010008309A1 (en) * | 2000-01-13 | 2001-07-19 | Takahiro Iijima | Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof |
US20020117599A1 (en) * | 2001-01-17 | 2002-08-29 | Domeier Linda A. | Sacrificial plastic mold with electroplatable base |
US20020119079A1 (en) * | 1999-12-10 | 2002-08-29 | Norbert Breuer | Chemical microreactor and microreactor made by process |
US20040014317A1 (en) * | 2000-09-25 | 2004-01-22 | Hajime Sakamoto | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10168591A (en) * | 1996-12-11 | 1998-06-23 | Yaskawa Electric Corp | Manufacture of very small machine part |
JPH10202757A (en) * | 1997-01-24 | 1998-08-04 | Fuji Xerox Co Ltd | Microstructure, and manufacture and device therefor |
JP2002307398A (en) * | 2001-04-18 | 2002-10-23 | Mitsui Chemicals Inc | Method for manufacturing micro structure |
JP3750646B2 (en) * | 2001-10-29 | 2006-03-01 | 住友電気工業株式会社 | Method for producing metal microstructure |
-
2002
- 2002-06-03 JP JP2002161389A patent/JP2004009144A/en not_active Withdrawn
-
2003
- 2003-05-23 AU AU2003242436A patent/AU2003242436A1/en not_active Abandoned
- 2003-05-23 DE DE10392431T patent/DE10392431T5/en not_active Withdrawn
- 2003-05-23 KR KR10-2004-7015921A patent/KR20040111494A/en not_active Application Discontinuation
- 2003-05-23 US US10/506,015 patent/US20050103635A1/en active Pending
- 2003-05-23 WO PCT/JP2003/006475 patent/WO2003101889A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6159681A (en) * | 1997-05-28 | 2000-12-12 | Syntrix Biochip, Inc. | Light-mediated method and apparatus for the regional analysis of biologic material |
US20020119079A1 (en) * | 1999-12-10 | 2002-08-29 | Norbert Breuer | Chemical microreactor and microreactor made by process |
US20010008309A1 (en) * | 2000-01-13 | 2001-07-19 | Takahiro Iijima | Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof |
US20040014317A1 (en) * | 2000-09-25 | 2004-01-22 | Hajime Sakamoto | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
US20020117599A1 (en) * | 2001-01-17 | 2002-08-29 | Domeier Linda A. | Sacrificial plastic mold with electroplatable base |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050014594A1 (en) * | 2001-12-14 | 2005-01-20 | Reinhard Degen | Micro gear system operating according to the voltage ripple principle with hollow shafts |
US7297087B2 (en) * | 2001-12-14 | 2007-11-20 | Micromotion Gmbh | Micro gear system operating according to the strain wave gear principle with hollow shafts |
US20070227893A1 (en) * | 2006-03-15 | 2007-10-04 | Doniar S.A. | Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained |
US20110062112A1 (en) * | 2006-03-15 | 2011-03-17 | Doniar S.A. | Process for fabricating a monolayer or multilayer metal structure in liga technology, and structure obtained |
US8025782B2 (en) * | 2006-03-15 | 2011-09-27 | Doniar Sa | Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained |
US9284654B2 (en) * | 2006-03-15 | 2016-03-15 | Rolex Sa | Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained |
US9365941B2 (en) | 2006-03-15 | 2016-06-14 | Rolex S.A. | Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained |
Also Published As
Publication number | Publication date |
---|---|
WO2003101889A1 (en) | 2003-12-11 |
JP2004009144A (en) | 2004-01-15 |
AU2003242436A1 (en) | 2003-12-19 |
KR20040111494A (en) | 2004-12-31 |
DE10392431T5 (en) | 2005-06-30 |
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AS | Assignment |
Owner name: DISCO CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ARAI, KAZUHISA;ISHIKAWA, KAZUNORI;REEL/FRAME:016179/0922 Effective date: 20040823 |
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STPP | Information on status: patent application and granting procedure in general |
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