US20050103635A1 - Method of producing micro component - Google Patents

Method of producing micro component Download PDF

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Publication number
US20050103635A1
US20050103635A1 US10/506,015 US50601504A US2005103635A1 US 20050103635 A1 US20050103635 A1 US 20050103635A1 US 50601504 A US50601504 A US 50601504A US 2005103635 A1 US2005103635 A1 US 2005103635A1
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Prior art keywords
metal
micro component
concave
resin
production method
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Pending
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US10/506,015
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Kazuhisa Arai
Kazunori Ishikawa
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Disco Corp
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Individual
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Assigned to DISCO CORPORATION reassignment DISCO CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ARAI, KAZUHISA, ISHIKAWA, KAZUNORI
Publication of US20050103635A1 publication Critical patent/US20050103635A1/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00Subject matter not provided for in other groups of this subclass
    • B81C99/0075Manufacture of substrate-free structures
    • B81C99/0085Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00Subject matter not provided for in other groups of this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/03Microengines and actuators
    • B81B2201/035Microgears

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

To produce a micro component, a resin base (1) capable of being dissolved by a solvent is formed, physical external force is allowed to act on the resin base (1) to form a concave (3) and after a metal is filled into the concave (3), an excessive metal is removed by grinding and the resin base (1) is dissolved by the solvent. Consequently, the necessity for lithography apparatuses such as a stepper and an etching apparatus can be eliminated, economy can be improved and production of components having complicated shapes that the lithographic technology cannot easily produce can also be produced.

Description

    TECHNICAL FIELD
  • This invention relates to a production method of micro components to constitute a micro machine.
  • BACKGROUND ART
  • Micro components constituting a micro-machine are generally produced by an LIGA (Lithographie Galvanoformung Abformung) process that utilizes a semiconductor production technology.
  • The LIGA process is a technology comprising the combination of X-ray lithography, electroplating and molding. Those products that are produced is by a method based on an ordinary semiconductor production process have their height limited to several to dozens of microns (μm) whereas the LIGA process can produce three-dimensional products that have height of hundreds of microns (elm) and an aspect ratio of dozens or more.
  • In the LIGA process, a resist 21 is first applied to an entire surface of a flat substrate 20 as shown in FIG. 7. X-rays are then irradiated from above a mask 22 and are projected to the resist 21 through a lens 23 to sensitize the resist 21. Then, a mask pattern formed on the mask 22 is transferred.
  • Next, when the resist 21 so sensitized is developed, denatured portions due to sensitization are removed. Nickel, for example, is filled by plating into the portions thus removed and the remaining resist 21 and substrate 20 are etched away, providing a component having the transferred shape by nickel is formed. When a mold is formed by the same method, micro components can be produced by using the mold.
  • According to the LIGA process, however, masks corresponding to the shapes of micro components to be produced must be individually prepared and a variety of lithography apparatuses such as a stepper, an etching apparatus, and so forth are necessary. Therefore, the installation cost becomes high and economically inefficient. In addition, because the side surfaces of the masking pattern transferred by X-ray lithography are constituted by vertical surfaces, there is also a problem that processing into complicated shapes is difficult.
  • As described above, the production of micro components involves the problems in that economy must be improved and components having complicated shapes can be formed.
  • DISCLOSURE OF INVENTION
  • The invention provides a production method of a micro component comprising a resin base forming step of forming a resin base capable of being dissolved by use of a solvent; a concave forming step of allowing physical external force to act on the resin base and forming a concave having a shape corresponding to a shape of a micro component to be produced; a metal filling step of filling a metal into the concave; a metal removing step of grinding and removing an excessive metal; and a base dissolving step of dissolving the resin base by use of a solvent.
  • The production method of a micro component described above includes the additional requirements in that the physical external force includes any of a laser beam, an ultrasonic wave, a cutting blade and a grinding wheel; the metal filling step scatters the metal in the concave by sputtering and fills the concave by electroplating; the micro component is a component constituting a micro machine or a molding flask used for producing the component; and the metal is nickel, the resin is an ABS resin and the solvent is acetone.
  • According to the production method of a micro component constituted as described above, the concave having the shape of a micro component to be produced is formed in the base by the physical external force and after the metal is filled into the concave, the base is removed. Therefore, production of masks and transfer of mask patterns by lithographic technology that have been necessary in the past become unnecessary.
  • When a laser beam is used as the physical external force, a micro component having a shape in which the side surfaces are not vertical surfaces can be easily produced.
  • BRIEF DESCRIPTION OF DRAWINGS
  • FIG. 1 is a perspective view showing a base formed by a base forming step.
  • FIG. 2 is a perspective view showing a state where a concave is formed in the base by a concave forming step.
  • FIG. 3 is a perspective view showing a state where a metal is filled into the concave by a metal filling step.
  • FIG. 4 is a perspective view showing a state where an excessive metal is removed by a metal removing step.
  • FIG. 5 is a perspective view showing a micro component formed by a base dissolving step.
  • FIG. 6 is a sectional view showing a mode of forming a concave the side surfaces of which are tapered surfaces.
  • FIG. 7 is a perspective view showing a lithographic technology according to a conventional method. BEST MODE FOR CARRYING OUT THE INVENTION
  • A case where a gear to be used as a micro component is produced will be explained as a mode for carrying out the invention by way of example.
  • To begin with, a resin base 1 having a thickness greater than that of the gear to be formed from a resin is molded (resin base molding step) as shown in FIG. 1. The resin used for molding the resin base 1 must be those which can be later dissolved through a chemical reaction by use of a solvent, and an ABS resin can be used, for example.
  • Unlike a conventional method that applies a resist and conducts development by X-ray lithography, the invention applies physical external force such as irradiation of a laser beam 2 to the resin base 1 without applying a resist and forms a concave 3 as a cavity having the same shape as that of the gear to be produced as shown in FIG. 2 (concave forming step). Besides the laser beam, ultrasonic waves, cutting blades, etc, can be used as the physical external force. A grinding wheel can also be used depending on the shape of the micro component to be produced.
  • When the laser beam 2 is used as in the example shown in FIG. 2, the laser beam is irradiated while an irradiation portion 4 or the resin base 1 is being moved in match with the shape of the gear to be produced, and the concave 3 having the gear shape can be formed.
  • After the concave 3 having a desired shape is formed in the manner described above, a metal 5 as a material of the micro component is filled into the concave 3 as shown in FIG. 3 (metal filling step). Filling of the metal can be performed by a method that scatters the metal by sputtering, for example, and thereafter applies electroplating. Nickel, copper, etc, are used as the metal.
  • After the metal is filled into the concave 3, an excessive metal is deposited onto the resin base 1 and is therefore removed by grinding (metal removing step). Grinding can be carried out by use of a grinding wheel or a CMP technology. After the excessive metal is removed by grinding, the concave 3 is filled, and the metal 6 having the shape of the concave 3 is exposed as shown in FIG. 4. The exposed surface of the metal 6 is planarized.
  • Finally, the resin constituting the resin base 1 is dissolved by using a solvent and the gear 7 as the micro component shown in FIG. 5 is formed (base dissolving step). Here, acetone is used as the solvent when the resin base 1 is formed of an ABS resin.
  • When the micro component is formed in this way, expensive lithography apparatuses such as a stepper are not necessary and masks need not be produced for respective components of different shapes, either. Therefore, the production cost can be drastically reduced.
  • The example shown in FIGS. 1 to 5 explains the case of the production of the gear the side surfaces of which are vertical surfaces. However, components having complicated shapes can be produced, too, such as in the case where the side surfaces are not the vertical surfaces but are inclined, by adjusting the irradiation angle of the laser beam.
  • In the case of a micro component the side surfaces of which are tapered as shown in FIG. 6, for example, the laser beam 8 is obliquely irradiated and a concave 10 having taper surfaces 9 can be formed. When the metal is filled into this concave 10, a micro component having the side surfaces corresponding to the taper surface 9 can be formed. In this way, the micro component having the shape that the conventional method using the lithography technology cannot produce can be produced.
  • The invention can produce not only the micro component itself constituting the micro machine but also a molding flask such as a mold for molding the micro component.
  • Industrial Applicability
  • As explained above, the production method of the micro component according to the invention forms the concave having the shape of the micro component to be produced in the base by using the physical external force, fills the metal into the concave and then removes the base. Therefore, the invention eliminates the necessity for the production of masks and the transfer of the mask pattern by the lithographic technology that have been necessary in the past. In other words, the invention can drastically reduce the installation cost and can reduce the production cost.
  • When the laser beam is used as the physical external force, the micro components the side surfaces of which are not the vertical surfaces can be easily produced. Therefore, those micro components having complicated shapes the production of which has been difficult in the past can be produced easily and economically.

Claims (8)

1. A production method of a micro component comprising the steps of:
a resin base forming step of forming a resin base capable of being dissolved by use of a solvent;
a concave forming step of allowing physical external force to act on said resin base and forming a concave having a shape corresponding to a shape of a micro component to be produced;
a metal filling step of filling a metal into said concave;
a metal removing step of grinding and removing an excessive metal; and
a base dissolving step of dissolving said resin base by use of a solvent.
2. A production method of a micro component according to claim 1, wherein said physical external force includes any of a laser beam, an ultrasonic wave, a cutting blade and a grinding wheel.
3. A production method of a micro component according to claim 1, wherein said metal filling step scatters a metal in said concave by sputtering and then fills said concave by electroplating.
4. A production method of a micro component according to claim 1, wherein said micro component is a component constituting a micro machine or a molding flask used for producing said component.
5. A production method of a micro component according to claim 1, wherein said metal is nickel, said resin is an ABS resin and said solvent is acetone.
6. A production method of a micro component according to claim 2, wherein said metal is nickel, said resin is an ABS resin and said solvent is acetone.
7. A production method of a micro component according to claim 3, wherein said metal is nickel, said resin is an ABS resin and said solvent is acetone.
8. A production method of a micro component according to claim 4, wherein said metal is nickel, said resin is an ABS resin and said solvent is acetone.
US10/506,015 2002-06-03 2003-05-23 Method of producing micro component Pending US20050103635A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-161389 2002-06-03
JP2002161389A JP2004009144A (en) 2002-06-03 2002-06-03 Method of manufacturing micro parts
PCT/JP2003/006475 WO2003101889A1 (en) 2002-06-03 2003-05-23 Mthod of producing micro component

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US20050103635A1 true US20050103635A1 (en) 2005-05-19

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JP (1) JP2004009144A (en)
KR (1) KR20040111494A (en)
AU (1) AU2003242436A1 (en)
DE (1) DE10392431T5 (en)
WO (1) WO2003101889A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050014594A1 (en) * 2001-12-14 2005-01-20 Reinhard Degen Micro gear system operating according to the voltage ripple principle with hollow shafts
US20070227893A1 (en) * 2006-03-15 2007-10-04 Doniar S.A. Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4526556B2 (en) * 2007-09-18 2010-08-18 株式会社木村鋳造所 Manufacturing method of micro parts
US8216697B2 (en) 2009-02-13 2012-07-10 Global Oled Technology Llc OLED with fluoranthene-macrocyclic materials

Citations (5)

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Publication number Priority date Publication date Assignee Title
US6159681A (en) * 1997-05-28 2000-12-12 Syntrix Biochip, Inc. Light-mediated method and apparatus for the regional analysis of biologic material
US20010008309A1 (en) * 2000-01-13 2001-07-19 Takahiro Iijima Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof
US20020117599A1 (en) * 2001-01-17 2002-08-29 Domeier Linda A. Sacrificial plastic mold with electroplatable base
US20020119079A1 (en) * 1999-12-10 2002-08-29 Norbert Breuer Chemical microreactor and microreactor made by process
US20040014317A1 (en) * 2000-09-25 2004-01-22 Hajime Sakamoto Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10168591A (en) * 1996-12-11 1998-06-23 Yaskawa Electric Corp Manufacture of very small machine part
JPH10202757A (en) * 1997-01-24 1998-08-04 Fuji Xerox Co Ltd Microstructure, and manufacture and device therefor
JP2002307398A (en) * 2001-04-18 2002-10-23 Mitsui Chemicals Inc Method for manufacturing micro structure
JP3750646B2 (en) * 2001-10-29 2006-03-01 住友電気工業株式会社 Method for producing metal microstructure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6159681A (en) * 1997-05-28 2000-12-12 Syntrix Biochip, Inc. Light-mediated method and apparatus for the regional analysis of biologic material
US20020119079A1 (en) * 1999-12-10 2002-08-29 Norbert Breuer Chemical microreactor and microreactor made by process
US20010008309A1 (en) * 2000-01-13 2001-07-19 Takahiro Iijima Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof
US20040014317A1 (en) * 2000-09-25 2004-01-22 Hajime Sakamoto Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
US20020117599A1 (en) * 2001-01-17 2002-08-29 Domeier Linda A. Sacrificial plastic mold with electroplatable base

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050014594A1 (en) * 2001-12-14 2005-01-20 Reinhard Degen Micro gear system operating according to the voltage ripple principle with hollow shafts
US7297087B2 (en) * 2001-12-14 2007-11-20 Micromotion Gmbh Micro gear system operating according to the strain wave gear principle with hollow shafts
US20070227893A1 (en) * 2006-03-15 2007-10-04 Doniar S.A. Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained
US20110062112A1 (en) * 2006-03-15 2011-03-17 Doniar S.A. Process for fabricating a monolayer or multilayer metal structure in liga technology, and structure obtained
US8025782B2 (en) * 2006-03-15 2011-09-27 Doniar Sa Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained
US9284654B2 (en) * 2006-03-15 2016-03-15 Rolex Sa Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained
US9365941B2 (en) 2006-03-15 2016-06-14 Rolex S.A. Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained

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WO2003101889A1 (en) 2003-12-11
JP2004009144A (en) 2004-01-15
AU2003242436A1 (en) 2003-12-19
KR20040111494A (en) 2004-12-31
DE10392431T5 (en) 2005-06-30

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