US20030218075A1 - Thermal heating board - Google Patents
Thermal heating board Download PDFInfo
- Publication number
- US20030218075A1 US20030218075A1 US10/379,372 US37937203A US2003218075A1 US 20030218075 A1 US20030218075 A1 US 20030218075A1 US 37937203 A US37937203 A US 37937203A US 2003218075 A1 US2003218075 A1 US 2003218075A1
- Authority
- US
- United States
- Prior art keywords
- heating system
- recess
- board
- supporting board
- supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D3/00—Hot-water central heating systems
- F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
- F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D3/00—Hot-water central heating systems
- F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
- F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
- F24D3/148—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor with heat spreading plates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Definitions
- Another object of the present invention is to provide an improved hydronic radiant heating system which is simple and inexpensive to install.
- a further object of the present invention is to provide an improved hydronic radiant heating system comprising a simple board rather than a complex assembly of parts.
- Another object of the present invention is to provide an improved hydronic radiant heating system comprising a board that lends itself to modules which can easily be laid out and installed.
- An additional object of the present invention is to provide an improved hydronic radiant heatiing system that lends itself to mass production with associated cost savings.
- a further object of the present invention is to provide an improved hydronic radiant heating system comprising a board having a thermally conductive coating whose thickness can be varied to compensate for the condutcivity of the board to achieve a desired overall thermal performance.
- Another specific object of the present invention is to provide an improved hydronic radiant heating system comprising a nonstructural board having an undercut recess formed in one surface of said board, a pipe releasably retained [located] within said recess, and a coat of thermally conductive material applied to said surface of said board having a thickness sufficient to compensate for the thermal characteristics of said board to provide desired overall thermal performance for said system.
- FIG. 1 b is a view, similar to that of FIG. 1 a, showing a pipe inserted into the recess of the heating system of FIG. 1;
- FIG. 3 b is a view, similar to that of FIG. 3 a, showing the metal foil having been slit;
- FIG. 4 b is a view, similar to that of FIG. 4 a, showing a pipe installed in the heating system of FIG. 4 a.
- FIG. 3 a shows the board 12 having a layer of metal foil 20 attached to the board 12 by suitable means, such as adhesive 21 , and overlying the recess 14 .
- suitable means such as adhesive 21
- the metal layer 20 could be applied by plating or other well known means.
- the metal layer is slit, as seen at 22 in FIG. 3 b, and the portions of thematel layer 20 are then pressed into the recess 14 , as seen at 23 in FIG. 3 c. This provides a very simple and inexpensive means of manufacturing the board of FIG. 1 a.
Abstract
An improved hydronic radiant heating system comprising a nonstructural board having a recess formed in one surface of said board, a pipe located within said recess, and, if desired, a film of metal covering said surface of said board and having a thickness proportional to the thermal properties of said board to provide desired overall thermal characteristics for said heating system.
Description
- This invention is descnbed in my copending Provisional Patent Application Ser. 60/110,693, filed Dec. 3, 1998 and now expired and Utility Patent Application, Ser. No. 09/451,324, filed Nov. 30, 1999 and now.
- This invention relates to construction material and is particularly directed to improved thermal heating modules for application of hydronic radiant heating in new and existing construction.
- The concept of heating an area by heating the floor surface has been known since Roman times. In more recent times, such systems were formed by metal or plastic pipes embedded in concrete slabs or attached under a subfloor or sandwiched in between layers of flooring thereto by various means and by laying flooring or subflooring on top of these. More recently it has been proposed to have combinations of boards and pipes in various configurations installed either above or below a subfloor as well as integrated structural subfloor svstems with an integral metal plate However, these systems have been found to be relatively inefficient in transferring heat to desired area or have been too expensive to install or have been dimensionally too thick to be usefull in retrofit applications or have had sound transmission problems due to thermal contraction1 and expansion of poorly connected component parts, or use uncommon building practices and sequencing of installation and have been somewhat useful to new construction. Also, inserting the pipe into the grooves of the prior art boards has been unsatisfactory. Frequently, the pipe would come loose and pop out of place, causing problems with laying overflooring and the like. Thus, none of the prior art thermal heating boards have been entirely satisfactory.
- These disadvantages of the prior art are overcome with the present invention and an improved hydronic radiant heating system is provided which is simple and inexpensive to install and which can be applied equally well to new or existing construction and to floors, walls or ceilings, while providing efficient heating to the desired area and ensuring that the pipes are retained within the system.
- These advantages of the present invention are preferably attained by providing an improved hydronic radiant heating system comprising a non-structural board formed of thermally conductive material and having at least one undercut recess formed in the upper surface of said board, a pipe releasably ratained [located] within said undercut recess, and a film of metal covering the upper surface of said board.
- Accordingly, it is an object of the present invention to provide an improved hydronic radiant heating system.
- Another object of the present invention is to provide an improved hydronic radiant heating system which is simple and inexpensive to install.
- An additional object of the present invention is to provide an improved hydronic radiant heating system which can be applied equally well to new or existing construction, while providing efficient heating to the desired area.
- A further object of the present invention is to provide an improved hydronic radiant heating system comprising a simple board rather than a complex assembly of parts.
- An additional object of the present invention is to provide an improved hydronic radiant heating system which can be applied to floors, walls and ceilings.
- Another object of the present invention is to provide an improved hydronic radiant heating system comprising a board that lends itself to modules which can easily be laid out and installed.
- An additional object of the present invention is to provide an improved hydronic radiant heatiing system that lends itself to mass production with associated cost savings.
- A further object of the present invention is to provide an improved hydronic radiant heating system comprising a board having a thermally conductive coating whose thickness can be varied to compensate for the condutcivity of the board to achieve a desired overall thermal performance.
- An additional object of the present invention is to provide an improved hydronic radiant heating system comprising a board having a groove with undercut grooves for releasably retaining a pipe within said groove.
- A specific object of the present invention is to provide an improved hydronic radiant heating system comprising a nonstructural board formed of thermally conductive material having an undercut recess formed in one surface of said board and having a pipe releasably retained [located] within said recess.
- Another specific object of the present invention is to provide an improved hydronic radiant heating system comprising a nonstructural board having an undercut recess formed in one surface of said board, a pipe releasably retained [located] within said recess, and a coat of thermally conductive material applied to said surface of said board having a thickness sufficient to compensate for the thermal characteristics of said board to provide desired overall thermal performance for said system.
- These and other objects and features of the present invention will be apparent from the following detailed description, taken with reference to the figures of the accompanying drawing.
- FIG. 1a is a vertical section through a floor heating system embodying the present invention;
- FIG. 1b is a view, similar to that of FIG. 1a, showing a pipe inserted into the recess of the heating system of FIG. 1;
- FIG. 2a is a view, similar to that of FIG. 1a, showing an alternative form of the floor heating system of FIG. 1;
- FIG. 2b is a view, similar to that of FIG. 2a, showing a pipe inserted into the heating system of FIG. 2a;
- FIG. 3a is a view, similar to that of FIG. 1a, showing a layer of metal foil attached to the surface of a board similar to that of FIG. 1a;
- FIG. 3b is a view, similar to that of FIG. 3a, showing the metal foil having been slit;
- FIG. 3c is a view, similar to that of FIG. 3a, showing the metal foil pressed into the recess of the board of FIG. 3a;
- FIG. 4a is a view, similar to that of FIG. 1, showing an alternative form of the heating system of FIG. 1; and
- FIG. 4b is a view, similar to that of FIG. 4a, showing a pipe installed in the heating system of FIG. 4a.
- In the form of the present invention chosen for purposes of illustration in the drawing, FIG. 1a shows a hydronic radiant heating system, indicated generally at 10, comprising a supporting
board 12 having arecess 14 formed in theupper surface 16 of theboard 12 and having apipe 18 located within therecess 14, with acoat 20 of thermally conductive material, such as metal spray, metal foil or the like deposited on theupper surface 16 of theboard 12. As seen in FIG. 1b, therecess 14 is undercut, providing anopening 15 withflanges 17 which overlie thepipe 18 after thepipe 18 has been inserted into therecess 14. Thepipe 18 sufficiently resilient to allow thepipe 18 to be inserted through theopening 15 and to snap back to overlie thepipe 18, as seen in FIG. 1b. This serves to releasably retain thepipe 18 and ensures that thepipe 18 cannot become dislodged or otherwise displaced. The supportingboard 12 may be a wooden board or, if desired, may be plywood, fiberboard, recycled material or other suitable supporting material. - In use, the hydronic
radiant heatng system 10 is applied over a suitable subfloor. over wall framing, under ceiling framing or over a concrete slab or over an existing floor, then thepipe 18 is forced intorecess 14 so thatflanges 17 overlie and releasably retain thepipe 18 and the finished floor, wall or ceiling goods are installed over the hydronicradiant heating system 10. (In the case of its use for radiant hydronic ceiling heat the finished goods are installed below the board 12) Heated water or the like is circulated through thepipe 18 and transfers heat by conductivity and radiation through the new floor to the desired area. The thermallyconductive coat 20 can be varied to compensate for the varying conductive qualities of the supportingboard 12. Thus, the thickness of the thermallyconductive coat 20 could vary proportionally to the thermal properties of the supportingboaard 12. (More conductive board would have a thinner coating, while less conductive bboard would have a thicker coating.) The thermallyconductive coat 20 may be applied to theupper surface 16 of the supportingboard 12 by spraying or by applying one or more layers of metal foil or the like. Thus, the thickness of thecoat 20 can be extremely thin, yet serves to effectively and efficiently transfer heat from thepipe 18 to thecoat 20 and, hence, to the desired area. - FIGS. 2a and 2 b show an alternative form of the heating system of FIG. 1a wherein two supporting
boards conductive coating 20 is applied between theboards - FIG. 3a shows the
board 12 having a layer ofmetal foil 20 attached to theboard 12 by suitable means, such as adhesive 21, and overlying therecess 14. Obviously, if desired, themetal layer 20 could be applied by plating or other well known means. After themetal layer 20 has been attached to theboard 12, the metal layer is slit, as seen at 22 in FIG. 3b, and the portions ofthematel layer 20 are then pressed into therecess 14, as seen at 23 in FIG. 3c. This provides a very simple and inexpensive means of manufacturing the board of FIG. 1a. - FIG. 4a shows an alternative form of the
board 12 having thesurface 13 of therecess 14 serrated or otherwise prepared to frictionally retain thepipe 18 when thepipe 18 is forcefully inserted into therecess 14. - Obviously, numerous variations and modifications can be made without departing from the spirit of the present invention. Therefore, it should be clearly understood that the form of the present invention described above and shown in the accompanying drawing is illustrative only and is not intended to limit the scope of the present invention.
Claims (39)
1. A hydronic radiant heating system comprising:
a nonstructural supporting board mountable on a subfloor having at least one undercut recess formed in one surface of said supporting board, and
a pipe releasably retained [located] within said recess.
2. The heating system of claim 1 wherein:
said supporting board is formed of thermally conductive material.
3. The heating system of claim 1 wherein:
said supporting board is formed of a wood.
4. The heating system of claim 1 wherein:
said supporting board is formed of plywood.
5. The heating system of claim 1 wherein:
said supporting board is formed of fiberboard.
6. The heating system of claim 1 wherein:
said supporting board is formed of metal.
7. The heating system of claim 1 wherein:
said supporting board is formed of recycled material.
8 The heating system of claim 1 wherein:
said recess is formed in the upper surface of said supporting board.
9. The heating system of claim 1 further comprising:
a coat of thermally conductive material applied to said surface of said supporting board.
10 The heating system of claim 8 wherein:
said thermally conductive coat is formed by spraying molten metal onto said surface.
11. The heating system of claim 1 wherein:
said thermally-conductive coat is formed by applying at least one ply of metal foil to said surface.
12. The heating system of claim 1 wherein:
said member is applied of a subfloor.
13. The heating system of claim 1 wherein:
said member is applied to an existing floor.
14. The heating system of claim 1 wherein:
said member is applied to a wall.
15. The heating system of claim 1 wherein:
said member is applied to a ceiling.
16. The heating system of claim 1 wherein:
the thickness of said thermally-conductive coat is varied in pro-portion to the thermal properties of said supporting board.
16. The heating system of claim 1 wherein:
a pair of supporting members are provided, an upper one formed with a recess and the other having no recess.
17. The heating system of claim 16 further comprising:
a layer of thermally conductive material interposed between said board.
18. The heating system of claim 1 further comprising:
a layer of metal applied to overlie said recess,
said metal layer being subsequently slit loingitudinally of said recess and having the adjacent portions of said metal layer pressed into said recess.
19. The heating system of claim 1 further comprising:
said recess extending completely through said board,
a second board underlying said recessed board, and
a layer of metal foil interposed between said boards.
20. A hydronic radiant heating system comprising:
a nonstructural supporting board mountable on a subfloor having at least one recess formed in one surface of said supporting board, and
a pipe frictionally retained within said recess.
21. The heating system of claim 20 wherein:
said supporting board is formed of thermally conductive material.
22. The heating system of claim 20 wherein:
said supporting board is formed of a wood.
23. The heating system of claim 20 wherein:
said supporting board is formed of plywood.
24. The heating system of claim 20 wherein:
said supporting board is formed of fiberboard.
25. The heating system of claim 20 wherein:
said supporting board is formed of recycled material.
26 The heating system of claim 20 wherein:
said recess is formed in the upper surface of said supporting board.
27. The heating system of claim 20 further comprising:
a coat of thermally conductive material applied to said surface of said supporting board.
28. The heating system of claim 27 wherein:
said thermally conductive coat is formed by spraying molten metal onto said surface.
29. The heating system of claim 20 wherein:
said thermally-conductive coat is formed by applying at least one ply of metal foil to said surface.
30. The heating system of claim 1 wherein:
said member is applied of a subfloor.
31. The heating system of claim 20 wherein:
said member is applied to an existing floor.
32. The heating system of claim 20 wherein:
said member is applied to a wall.
33. The heating system of claim 20 wherein:
said member is applied to a ceiling.
34. The heating system of claim 20 wherein:
the thickness of said thermally-conductive coat is varied in pro-portion to the thermal properties of said supporting board.
34. The heating system of claim 20 wherein:
a pair of supporting members are provided, an upper one formed with a recess and the other having no recess.
35. The heating system of claim 34 further comprising:
a layer of thermally conductive material interposed between said board.
36. The heating system of claim 20 further comprising:
a layer of metal applied to overlie said recess,
said metal layer being subsequently slit loingitudinally of said recess and having the adjacent portions of said metal layer pressed into said recess.
37. The heating system of claim 20 further comprising:
said recess extending completely through said board,
a second board underlying said recessed board, and
a layer of metal foil interposed between said boards.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/379,372 US20030218075A1 (en) | 1998-12-03 | 2003-03-03 | Thermal heating board |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11069398P | 1998-12-03 | 1998-12-03 | |
US45132499A | 1999-11-30 | 1999-11-30 | |
US10/379,372 US20030218075A1 (en) | 1998-12-03 | 2003-03-03 | Thermal heating board |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US45132499A Continuation-In-Part | 1998-12-03 | 1999-11-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20030218075A1 true US20030218075A1 (en) | 2003-11-27 |
Family
ID=26808309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/379,372 Abandoned US20030218075A1 (en) | 1998-12-03 | 2003-03-03 | Thermal heating board |
Country Status (1)
Country | Link |
---|---|
US (1) | US20030218075A1 (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070295827A1 (en) * | 2006-06-23 | 2007-12-27 | Bruce Kriens | Floor with radiant heat and method of construction |
US20080017725A1 (en) * | 2006-07-19 | 2008-01-24 | Backman James J Jr | Radiant mat grid |
US20090101306A1 (en) * | 2007-10-22 | 2009-04-23 | Reis Bradley E | Heat Exchanger System |
US20100083600A1 (en) * | 2008-10-07 | 2010-04-08 | Certuse Jr John | Method and system for insulating piping in an exterior wall |
US7832159B1 (en) | 2006-06-06 | 2010-11-16 | Kayhart Paul H | Radiant in-floor heating system |
US20110180060A1 (en) * | 2010-01-25 | 2011-07-28 | National Yunlin University Of Science & Technology | Pavement element |
US8555574B2 (en) | 2008-10-07 | 2013-10-15 | Insulation Systems, Llc | Pipe insulation system |
US20140367477A1 (en) * | 2013-06-12 | 2014-12-18 | Codi Group, Llc | Impact and/or sound deadening hydronic sub-flooring panel and related system and method |
US20150285568A1 (en) * | 2010-05-14 | 2015-10-08 | Paragon Space Development Corporation | Radiator systems |
US9285125B2 (en) * | 2008-09-22 | 2016-03-15 | Hi Gon Lee | Prefabricated heat-insulation panel with two hot water flow paths |
US9404665B1 (en) | 2010-08-30 | 2016-08-02 | Khart Panels LLC | Radiant panel system having increased efficiency |
DE202015106131U1 (en) | 2015-11-12 | 2017-02-16 | Uponor Innovation Ab | Surface tempering system and heat exchanger arrangement |
WO2018029461A1 (en) * | 2016-08-10 | 2018-02-15 | Timoleon Limited | Heat transfer panel |
DE102017118977A1 (en) * | 2017-08-18 | 2019-02-21 | Ullrich Buff | Heat exchanger element and method for its production |
GB2597258A (en) * | 2020-07-16 | 2022-01-26 | Ridgespear Ltd | Heat transfer panel and method |
Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4205719A (en) * | 1977-06-13 | 1980-06-03 | Norell B | Building module for a ceiling |
US4338994A (en) * | 1980-01-28 | 1982-07-13 | Bernd Hewing | Modular panel heater having improved holder devices |
US4369836A (en) * | 1979-05-16 | 1983-01-25 | Ingo Bleckmann | Heat exchange assembly |
US4501128A (en) * | 1982-05-05 | 1985-02-26 | Gallagher Paul H | Heat reclamation |
US4523519A (en) * | 1983-09-02 | 1985-06-18 | Johnson Wilfred B | Heating and cooling system using ground air |
US4653729A (en) * | 1985-08-30 | 1987-03-31 | Sumitomo Light Metal Industries, Ltd. | Foot warmer for use in car |
US4865120A (en) * | 1988-02-26 | 1989-09-12 | Shigetomo Shiroki | Floor structure for heating |
US4907739A (en) * | 1986-04-22 | 1990-03-13 | Gyp-Crete Corporation | Heating method and apparatus |
US4911353A (en) * | 1986-03-31 | 1990-03-27 | David Deakin | Solar collector having absorber plate formed by spraying molten metal |
US5327737A (en) * | 1989-06-27 | 1994-07-12 | Eggemar Bengt V | Method and apparatus for heat exchange, where channels, e.g. tubes, are secured in recesses in heat-isolating boards |
US5454428A (en) * | 1993-11-22 | 1995-10-03 | Radiant Engineering, Inc. | Hydronic radiant heat distribution panel and system |
US5491942A (en) * | 1991-09-16 | 1996-02-20 | Prokasky; Thomas W. | Multi-story building construction employing prefabricated elements |
US5542603A (en) * | 1994-09-29 | 1996-08-06 | Macduff; Jim | Hydronic heating system |
US5572841A (en) * | 1995-04-10 | 1996-11-12 | Buster; Robert W. | Modular wall panel assembly |
US5577554A (en) * | 1994-07-07 | 1996-11-26 | Umina; John T. | Radiant heating systems which are more efficient to build, and methods and apparatuses for building them |
US5579996A (en) * | 1992-06-30 | 1996-12-03 | Fiedrich; Joachim | Radiant floor and wall hydronic heating systems |
US5788152A (en) * | 1995-03-15 | 1998-08-04 | Alsberg; Terry Wayne W. | Floor heating system |
US5931381A (en) * | 1997-05-23 | 1999-08-03 | Fiedrich; Joachim | For radiant floor, wall and ceiling hydronic heating and/or cooling systems using metal plates that are heated or cooled by attached tubing that is fed hot or cold water, techniques of improving performance and avoiding condensation when cooling |
US6092587A (en) * | 1992-10-05 | 2000-07-25 | Ingram; Rex Anthony | Heating/cooling systems |
US6126081A (en) * | 1998-06-29 | 2000-10-03 | Calvin; Donald R. | Atmospheric liquid heater |
US6152377A (en) * | 1992-06-30 | 2000-11-28 | Fiedrich; Joachim | Radiant floor and wall hydronic heating system tubing attachment to radiant plate |
US6739097B1 (en) * | 1999-09-17 | 2004-05-25 | Rodin Haakan | Floor element for a floor heating or cooling system, and a process for manufacturing the element |
US6776222B2 (en) * | 2000-04-03 | 2004-08-17 | Mitsubishi Chemical Functional Products, Inc. | Foldable floor heating panel |
US6805298B1 (en) * | 2002-06-14 | 2004-10-19 | Warm Brothers, Inc. | Modular cementitous thermal panels for radiant heating |
-
2003
- 2003-03-03 US US10/379,372 patent/US20030218075A1/en not_active Abandoned
Patent Citations (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4205719A (en) * | 1977-06-13 | 1980-06-03 | Norell B | Building module for a ceiling |
US4369836A (en) * | 1979-05-16 | 1983-01-25 | Ingo Bleckmann | Heat exchange assembly |
US4338994A (en) * | 1980-01-28 | 1982-07-13 | Bernd Hewing | Modular panel heater having improved holder devices |
US4501128A (en) * | 1982-05-05 | 1985-02-26 | Gallagher Paul H | Heat reclamation |
US4523519A (en) * | 1983-09-02 | 1985-06-18 | Johnson Wilfred B | Heating and cooling system using ground air |
US4653729A (en) * | 1985-08-30 | 1987-03-31 | Sumitomo Light Metal Industries, Ltd. | Foot warmer for use in car |
US4911353A (en) * | 1986-03-31 | 1990-03-27 | David Deakin | Solar collector having absorber plate formed by spraying molten metal |
US4907739A (en) * | 1986-04-22 | 1990-03-13 | Gyp-Crete Corporation | Heating method and apparatus |
US4865120A (en) * | 1988-02-26 | 1989-09-12 | Shigetomo Shiroki | Floor structure for heating |
US5327737A (en) * | 1989-06-27 | 1994-07-12 | Eggemar Bengt V | Method and apparatus for heat exchange, where channels, e.g. tubes, are secured in recesses in heat-isolating boards |
US5491942A (en) * | 1991-09-16 | 1996-02-20 | Prokasky; Thomas W. | Multi-story building construction employing prefabricated elements |
US6152377A (en) * | 1992-06-30 | 2000-11-28 | Fiedrich; Joachim | Radiant floor and wall hydronic heating system tubing attachment to radiant plate |
US5579996A (en) * | 1992-06-30 | 1996-12-03 | Fiedrich; Joachim | Radiant floor and wall hydronic heating systems |
US6092587A (en) * | 1992-10-05 | 2000-07-25 | Ingram; Rex Anthony | Heating/cooling systems |
US5454428A (en) * | 1993-11-22 | 1995-10-03 | Radiant Engineering, Inc. | Hydronic radiant heat distribution panel and system |
US5577554A (en) * | 1994-07-07 | 1996-11-26 | Umina; John T. | Radiant heating systems which are more efficient to build, and methods and apparatuses for building them |
US5542603A (en) * | 1994-09-29 | 1996-08-06 | Macduff; Jim | Hydronic heating system |
US5788152A (en) * | 1995-03-15 | 1998-08-04 | Alsberg; Terry Wayne W. | Floor heating system |
US5572841A (en) * | 1995-04-10 | 1996-11-12 | Buster; Robert W. | Modular wall panel assembly |
US5931381A (en) * | 1997-05-23 | 1999-08-03 | Fiedrich; Joachim | For radiant floor, wall and ceiling hydronic heating and/or cooling systems using metal plates that are heated or cooled by attached tubing that is fed hot or cold water, techniques of improving performance and avoiding condensation when cooling |
US6220523B1 (en) * | 1997-05-23 | 2001-04-24 | Joachim Fiedrich | For radiant floor, wall and ceiling hydronic heating and/or cooling systems using metal plates that are heated or cooled by attached tubing that is fed hot or cold water, techniques of improving performance and avoiding condensation when cooling |
US6126081A (en) * | 1998-06-29 | 2000-10-03 | Calvin; Donald R. | Atmospheric liquid heater |
US6739097B1 (en) * | 1999-09-17 | 2004-05-25 | Rodin Haakan | Floor element for a floor heating or cooling system, and a process for manufacturing the element |
US6776222B2 (en) * | 2000-04-03 | 2004-08-17 | Mitsubishi Chemical Functional Products, Inc. | Foldable floor heating panel |
US6805298B1 (en) * | 2002-06-14 | 2004-10-19 | Warm Brothers, Inc. | Modular cementitous thermal panels for radiant heating |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7832159B1 (en) | 2006-06-06 | 2010-11-16 | Kayhart Paul H | Radiant in-floor heating system |
US9453647B2 (en) | 2006-06-23 | 2016-09-27 | Bruce Kriens | Floor with radiant heat and method of construction |
US20070295827A1 (en) * | 2006-06-23 | 2007-12-27 | Bruce Kriens | Floor with radiant heat and method of construction |
US20080017725A1 (en) * | 2006-07-19 | 2008-01-24 | Backman James J Jr | Radiant mat grid |
US8020783B2 (en) | 2006-07-19 | 2011-09-20 | Backman Jr James Joseph | Radiant mat grid |
US20090101306A1 (en) * | 2007-10-22 | 2009-04-23 | Reis Bradley E | Heat Exchanger System |
US9285125B2 (en) * | 2008-09-22 | 2016-03-15 | Hi Gon Lee | Prefabricated heat-insulation panel with two hot water flow paths |
US20100083600A1 (en) * | 2008-10-07 | 2010-04-08 | Certuse Jr John | Method and system for insulating piping in an exterior wall |
US8555574B2 (en) | 2008-10-07 | 2013-10-15 | Insulation Systems, Llc | Pipe insulation system |
US8146311B2 (en) * | 2008-10-07 | 2012-04-03 | Insulation Systems, Llc | Method and system for insulating piping in an exterior wall |
US20110180060A1 (en) * | 2010-01-25 | 2011-07-28 | National Yunlin University Of Science & Technology | Pavement element |
US9962798B2 (en) | 2010-05-14 | 2018-05-08 | Paragon Space Development Corporation | Radiator systems |
US20150285568A1 (en) * | 2010-05-14 | 2015-10-08 | Paragon Space Development Corporation | Radiator systems |
US9429371B2 (en) * | 2010-05-14 | 2016-08-30 | Paragon Space Development Corporation | Radiator systems |
US9404665B1 (en) | 2010-08-30 | 2016-08-02 | Khart Panels LLC | Radiant panel system having increased efficiency |
US20160061459A1 (en) * | 2013-06-12 | 2016-03-03 | Codi Group, Llc | Impact and/or sound deadening hydronic sub-flooring panel and related system and method |
US9146038B2 (en) * | 2013-06-12 | 2015-09-29 | Codi Group, Llc | Impact and/or sound deadening hydronic sub-flooring panel and related system and method |
US20140367477A1 (en) * | 2013-06-12 | 2014-12-18 | Codi Group, Llc | Impact and/or sound deadening hydronic sub-flooring panel and related system and method |
DE202015106131U1 (en) | 2015-11-12 | 2017-02-16 | Uponor Innovation Ab | Surface tempering system and heat exchanger arrangement |
WO2018029461A1 (en) * | 2016-08-10 | 2018-02-15 | Timoleon Limited | Heat transfer panel |
DE102017118977A1 (en) * | 2017-08-18 | 2019-02-21 | Ullrich Buff | Heat exchanger element and method for its production |
US11549698B2 (en) | 2017-08-18 | 2023-01-10 | Ullrich Buff | Heat exchanger element and method for its manufacture; building panel and method for dehumidifying air |
GB2597258A (en) * | 2020-07-16 | 2022-01-26 | Ridgespear Ltd | Heat transfer panel and method |
GB2597258B (en) * | 2020-07-16 | 2023-07-19 | Ridgespear Ltd | Heat transfer panel and method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6533185B1 (en) | Thermal heating board | |
US20030218075A1 (en) | Thermal heating board | |
US7793483B2 (en) | Ventilated floor moldings | |
US6188839B1 (en) | Radiant floor heating system with reflective layer and honeycomb panel | |
US4865120A (en) | Floor structure for heating | |
US8795813B2 (en) | Ribbed backed panels | |
US20140069605A1 (en) | Thermal Transfer Panels With Channel Structures and Method of Using Thermal Transfer Panels | |
US20150047807A1 (en) | In-Wall Hydronic Thermal Control System and Installation Method | |
US20070163191A1 (en) | Mold resistant structural drywall track | |
CA2185548C (en) | Floor heating system | |
US8650832B2 (en) | In-wall hydronic thermal control system and installation method | |
JP3093925U (en) | Soundproofing material | |
JP2839230B2 (en) | Roof insulation and roof insulation structure | |
US8898997B2 (en) | In-wall hydronic thermal control system and installation method | |
WO2000032991A2 (en) | Thermal heating board | |
EP0854325A2 (en) | A heat exchanger | |
JP2000345694A (en) | Floor heating structure | |
GB2440204A (en) | Acoustic flooring for underfloor heating | |
EP3502574A1 (en) | Improvements in flooring systems | |
KR101848740B1 (en) | dry type ceramic tile ondol panel | |
JP3062818B1 (en) | Heating flooring | |
JP2002106862A (en) | Heat radiator | |
CN213868715U (en) | Floor block, wall panel, floor system and wall system | |
JP2993491B2 (en) | Floor heating panel | |
CN109340870B (en) | Heating floor slab for duplex apartment and installation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: WARM BROTHERS INC., WASHINGTON Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MUIR, MORGAN;REEL/FRAME:014216/0601 Effective date: 20030520 |
|
STCB | Information on status: application discontinuation |
Free format text: EXPRESSLY ABANDONED -- DURING EXAMINATION |