EP2685512A4 - Method for manufacturing light emitting device and mixed phosphor solution - Google Patents
Method for manufacturing light emitting device and mixed phosphor solutionInfo
- Publication number
- EP2685512A4 EP2685512A4 EP12757484.6A EP12757484A EP2685512A4 EP 2685512 A4 EP2685512 A4 EP 2685512A4 EP 12757484 A EP12757484 A EP 12757484A EP 2685512 A4 EP2685512 A4 EP 2685512A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- light emitting
- emitting device
- manufacturing light
- mixed phosphor
- phosphor solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
- C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011053766 | 2011-03-11 | ||
PCT/JP2012/053578 WO2012124426A1 (en) | 2011-03-11 | 2012-02-15 | Method for manufacturing light emitting device and mixed phosphor solution |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2685512A1 EP2685512A1 (en) | 2014-01-15 |
EP2685512A4 true EP2685512A4 (en) | 2014-09-03 |
Family
ID=46830503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12757484.6A Withdrawn EP2685512A4 (en) | 2011-03-11 | 2012-02-15 | Method for manufacturing light emitting device and mixed phosphor solution |
Country Status (5)
Country | Link |
---|---|
US (1) | US9260654B2 (en) |
EP (1) | EP2685512A4 (en) |
JP (2) | JP5761330B2 (en) |
CN (1) | CN103597621A (en) |
WO (1) | WO2012124426A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013051281A1 (en) | 2011-10-07 | 2013-04-11 | コニカミノルタアドバンストレイヤー株式会社 | Led device manufacturing method and fluorescent material-dispersed solution used in same |
KR101538603B1 (en) * | 2012-08-13 | 2015-07-21 | 코니카 미놀타 가부시키가이샤 | Method for producing phosphor dispersion liquid and method for manufacturing led device |
DE102012217776A1 (en) * | 2012-09-28 | 2014-06-12 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic component |
WO2014087629A1 (en) * | 2012-12-03 | 2014-06-12 | コニカミノルタ株式会社 | Translucent ceramic material for application by dispenser, and method for manufacturing led device using same |
DE102013103983B4 (en) * | 2013-04-19 | 2021-09-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Process for the production of a large number of radiation-emitting semiconductor chips |
CN104574726A (en) * | 2014-12-19 | 2015-04-29 | 欧阳秋娜 | Monitoring system and monitoring method of electronic fence |
US10955567B2 (en) * | 2015-11-19 | 2021-03-23 | Koninklijke Philips N.V. | Scintillating nanocomposites |
US11435059B2 (en) * | 2018-09-26 | 2022-09-06 | Panasonic Intellectual Property Management Co., Ltd. | Wavelength conversion member and white light emitting device using same |
KR20220137867A (en) * | 2020-02-13 | 2022-10-12 | 도레이 카부시키가이샤 | Method for manufacturing wavelength conversion substrate, wavelength conversion substrate, and display |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1030339A1 (en) * | 1997-11-06 | 2000-08-23 | Matsushita Electric Industrial Co., Ltd. | Phosphor material, phosphor material powder, plasma display panel, and processes for producing these |
JP2001181614A (en) * | 1999-12-24 | 2001-07-03 | Teikoku Tsushin Kogyo Co Ltd | Fluorescent substance paste for el element and method for producing the same |
EP1367655A1 (en) * | 2001-09-03 | 2003-12-03 | Matsushita Electric Industrial Co., Ltd. | SEMICONDUCTOR LIGHT EMITTING DEVICE, LIGHT EMITTING APPARATUS AND PRODUCTION METHOD FOR SEMICONDUCTOR LIGHT EMITTING DEVICE |
JP2004153109A (en) * | 2002-10-31 | 2004-05-27 | Matsushita Electric Works Ltd | Light emitting device and manufacturing method thereof |
US6756731B1 (en) * | 1999-06-03 | 2004-06-29 | Sanken Electric Co., Ltd. | Semiconductor light emitting device resistible to ultraviolet light |
US20070018137A1 (en) * | 2003-10-21 | 2007-01-25 | Keiji Ono | Fluorescent material and fluorescent material paste |
US20100061077A1 (en) * | 2006-11-17 | 2010-03-11 | Merck Patent Gesellschaft | Phosphor body based on flake form substrates |
EP2608284A1 (en) * | 2010-08-17 | 2013-06-26 | Konica Minolta Opto, Inc. | Method of manufacturing light-emitting device |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06200153A (en) * | 1993-01-06 | 1994-07-19 | Teijin Ltd | Polyamide resin composition and illumination reflector composed of the composition |
JP3412152B2 (en) | 1999-06-08 | 2003-06-03 | サンケン電気株式会社 | Semiconductor light emitting device |
JP4988123B2 (en) * | 2001-02-23 | 2012-08-01 | 株式会社カネカ | Light emitting diode |
CN1323441C (en) * | 2001-10-12 | 2007-06-27 | 日亚化学工业株式会社 | Light-emitting device and its mfg. method |
US7432642B2 (en) * | 2002-04-25 | 2008-10-07 | Nichia Corporation | Semiconductor light emitting device provided with a light conversion element using a haloborate phosphor composition |
US7473729B2 (en) * | 2003-08-29 | 2009-01-06 | Inmat Inc. | Barrier coating mixtures containing non-elastomeric acrylic polymer with silicate filler and coated articles |
WO2005056683A1 (en) * | 2003-12-15 | 2005-06-23 | Sekisui Chemical Co., Ltd. | Thermosetting resin composition, material for substrate and film for substrate |
JP4451178B2 (en) * | 2004-03-25 | 2010-04-14 | スタンレー電気株式会社 | Light emitting device |
US8110622B2 (en) * | 2004-07-20 | 2012-02-07 | Teijin Chemicals Ltd. | Aromatic polycarbonate resin composition and manufacturing process thereof |
JP2006257385A (en) | 2004-09-09 | 2006-09-28 | Showa Denko Kk | Oxynitride phosphor and method for producing the same |
KR100735320B1 (en) * | 2005-12-27 | 2007-07-04 | 삼성전기주식회사 | Formation method of phosphor film and fabrication method of light emitting diode package using the same |
JP2008024774A (en) * | 2006-07-19 | 2008-02-07 | Canon Inc | Fluorescent substance sheet and light-emission element |
JP2008045088A (en) | 2006-08-21 | 2008-02-28 | Sekisui Chem Co Ltd | Thermosetting composition for optical semiconductor, sealant for optical semiconductor element, die bond material for optical semiconductor element, underfill material for optical semiconductor element and optical semiconductor device |
JP4594407B2 (en) * | 2008-03-19 | 2010-12-08 | 国立大学法人 新潟大学 | Phosphor for near-ultraviolet excitation light-emitting element |
JP2010003776A (en) * | 2008-06-19 | 2010-01-07 | Okaya Electric Ind Co Ltd | Method for manufacturing light-emitting diode |
EP3163602A3 (en) * | 2009-01-23 | 2017-08-09 | Nichia Corporation | Method of producing a semiconductor device by bonding silver on a surface of a semiconductor element with silver on a surface of a base in air or in an oxygen environment |
US20110215348A1 (en) * | 2010-02-03 | 2011-09-08 | Soraa, Inc. | Reflection Mode Package for Optical Devices Using Gallium and Nitrogen Containing Materials |
JP5445473B2 (en) * | 2011-01-14 | 2014-03-19 | 信越化学工業株式会社 | Silicone resin composition for optical material formation and optical material |
JP2014078678A (en) * | 2012-09-18 | 2014-05-01 | Toyoda Gosei Co Ltd | Semiconductor light-emitting device manufacturing method |
-
2012
- 2012-02-15 EP EP12757484.6A patent/EP2685512A4/en not_active Withdrawn
- 2012-02-15 WO PCT/JP2012/053578 patent/WO2012124426A1/en active Application Filing
- 2012-02-15 JP JP2013504620A patent/JP5761330B2/en not_active Expired - Fee Related
- 2012-02-15 US US14/003,920 patent/US9260654B2/en not_active Expired - Fee Related
- 2012-02-15 CN CN201280012739.3A patent/CN103597621A/en active Pending
-
2015
- 2015-06-11 JP JP2015117913A patent/JP5999223B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1030339A1 (en) * | 1997-11-06 | 2000-08-23 | Matsushita Electric Industrial Co., Ltd. | Phosphor material, phosphor material powder, plasma display panel, and processes for producing these |
US6756731B1 (en) * | 1999-06-03 | 2004-06-29 | Sanken Electric Co., Ltd. | Semiconductor light emitting device resistible to ultraviolet light |
JP2001181614A (en) * | 1999-12-24 | 2001-07-03 | Teikoku Tsushin Kogyo Co Ltd | Fluorescent substance paste for el element and method for producing the same |
EP1367655A1 (en) * | 2001-09-03 | 2003-12-03 | Matsushita Electric Industrial Co., Ltd. | SEMICONDUCTOR LIGHT EMITTING DEVICE, LIGHT EMITTING APPARATUS AND PRODUCTION METHOD FOR SEMICONDUCTOR LIGHT EMITTING DEVICE |
JP2004153109A (en) * | 2002-10-31 | 2004-05-27 | Matsushita Electric Works Ltd | Light emitting device and manufacturing method thereof |
US20070018137A1 (en) * | 2003-10-21 | 2007-01-25 | Keiji Ono | Fluorescent material and fluorescent material paste |
US20100061077A1 (en) * | 2006-11-17 | 2010-03-11 | Merck Patent Gesellschaft | Phosphor body based on flake form substrates |
EP2608284A1 (en) * | 2010-08-17 | 2013-06-26 | Konica Minolta Opto, Inc. | Method of manufacturing light-emitting device |
Non-Patent Citations (1)
Title |
---|
See also references of WO2012124426A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN103597621A (en) | 2014-02-19 |
US20130344633A1 (en) | 2013-12-26 |
JP2015179875A (en) | 2015-10-08 |
WO2012124426A1 (en) | 2012-09-20 |
JP5999223B2 (en) | 2016-09-28 |
US9260654B2 (en) | 2016-02-16 |
JP5761330B2 (en) | 2015-08-12 |
JPWO2012124426A1 (en) | 2014-07-17 |
EP2685512A1 (en) | 2014-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20130911 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: TAGUCHI, YOSHIHITO Inventor name: HATANO, TAKUJI Inventor name: WASHIZU, TAKASHI |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20140806 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C09K 11/08 20060101ALI20140731BHEP Ipc: H01L 33/50 20100101AFI20140731BHEP Ipc: C09K 11/02 20060101ALI20140731BHEP |
|
17Q | First examination report despatched |
Effective date: 20160412 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20160823 |