EP1684336A4 - Heat treatment apparatus and heat treatment method - Google Patents
Heat treatment apparatus and heat treatment methodInfo
- Publication number
- EP1684336A4 EP1684336A4 EP04799419A EP04799419A EP1684336A4 EP 1684336 A4 EP1684336 A4 EP 1684336A4 EP 04799419 A EP04799419 A EP 04799419A EP 04799419 A EP04799419 A EP 04799419A EP 1684336 A4 EP1684336 A4 EP 1684336A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat treatment
- treatment apparatus
- treatment method
- heat
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003371291 | 2003-10-30 | ||
| JP2004306040A JP4712343B2 (en) | 2003-10-30 | 2004-10-20 | Heat treatment apparatus, heat treatment method, program, and recording medium |
| PCT/JP2004/016213 WO2005043609A1 (en) | 2003-10-30 | 2004-11-01 | Heat treatment apparatus and heat treatment method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1684336A1 EP1684336A1 (en) | 2006-07-26 |
| EP1684336A4 true EP1684336A4 (en) | 2008-01-09 |
Family
ID=34554755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP04799419A Withdrawn EP1684336A4 (en) | 2003-10-30 | 2004-11-01 | Heat treatment apparatus and heat treatment method |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20070074660A1 (en) |
| EP (1) | EP1684336A4 (en) |
| JP (1) | JP4712343B2 (en) |
| KR (1) | KR100882633B1 (en) |
| TW (1) | TW200520036A (en) |
| WO (1) | WO2005043609A1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8211235B2 (en) * | 2005-03-04 | 2012-07-03 | Picosun Oy | Apparatuses and methods for deposition of material on surfaces |
| KR100684902B1 (en) * | 2005-05-30 | 2007-02-20 | 삼성전자주식회사 | Temperature adjusting unit, apparatus for treating substrate having the adjusting unit, and method for controlling temperature of the apparatus |
| JP4658818B2 (en) * | 2006-01-19 | 2011-03-23 | 株式会社山武 | Temperature estimation method and apparatus |
| US7869888B2 (en) | 2006-05-31 | 2011-01-11 | Tokyo Electron Limited | Information processing apparatus, semiconductor manufacturing system, information processing method, and storage medium |
| JP5040213B2 (en) | 2006-08-15 | 2012-10-03 | 東京エレクトロン株式会社 | Heat treatment apparatus, heat treatment method and storage medium |
| JP5005388B2 (en) * | 2007-03-01 | 2012-08-22 | 東京エレクトロン株式会社 | Heat treatment system, heat treatment method, and program |
| JP5106932B2 (en) * | 2007-06-28 | 2012-12-26 | 日本エア・リキード株式会社 | Fluid supply system |
| JP5028352B2 (en) * | 2007-10-19 | 2012-09-19 | 株式会社日立国際電気 | Temperature control method, temperature correction value acquisition method, semiconductor manufacturing method, substrate processing apparatus |
| JP5101243B2 (en) * | 2007-10-29 | 2012-12-19 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing apparatus control method, and program |
| US8354135B2 (en) * | 2008-03-17 | 2013-01-15 | Tokyo Electron Limited | Thermal processing apparatus, method for regulating temperature of thermal processing apparatus, and program |
| JP5766647B2 (en) * | 2012-03-28 | 2015-08-19 | 東京エレクトロン株式会社 | Heat treatment system, heat treatment method, and program |
| JP6280407B2 (en) * | 2014-03-19 | 2018-02-14 | 東京エレクトロン株式会社 | Substrate processing method, program, control device, substrate processing apparatus, and substrate processing system |
| US10254179B2 (en) | 2014-12-25 | 2019-04-09 | Fujitsu Limited | Enclosure surface temperature estimation method and electronic apparatus |
| KR101830124B1 (en) * | 2017-04-06 | 2018-02-20 | (주)앤피에스 | Substrate treating apparatus |
| CN112530826A (en) * | 2020-11-27 | 2021-03-19 | 北京北方华创微电子装备有限公司 | Bearing device of semiconductor heat treatment equipment and semiconductor heat treatment equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1189261A2 (en) * | 2000-09-13 | 2002-03-20 | Tokyo Electron Limited | Batch-type heat treatment apparatus and method for controlling it |
| WO2002071459A1 (en) * | 2001-03-05 | 2002-09-12 | Tokyo Electron Limited | Heat treatment method and heat treatment system |
| US20030061989A1 (en) * | 2001-08-31 | 2003-04-03 | Kabushiki Kaisha Toshiba | Semiconductor manufacturing system |
| WO2003041139A1 (en) * | 2001-11-08 | 2003-05-15 | Tokyo Electron Limited | Thermal treating apparatus |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5517594A (en) * | 1994-10-17 | 1996-05-14 | Relman, Inc. | Thermal reactor optimization |
| JP3423671B2 (en) | 2000-06-19 | 2003-07-07 | 上商株式会社 | Connecting structure between vertical roofing metal shingles |
| JP3497450B2 (en) | 2000-07-06 | 2004-02-16 | 東京エレクトロン株式会社 | Batch heat treatment apparatus and control method thereof |
| JP4468555B2 (en) * | 2000-07-24 | 2010-05-26 | 東京エレクトロン株式会社 | Heat treatment apparatus and heat treatment method |
| JP2003031647A (en) * | 2001-07-19 | 2003-01-31 | Hitachi Kokusai Electric Inc | Substrate processor and method for manufacturing semiconductor device |
| JP4276813B2 (en) * | 2002-03-26 | 2009-06-10 | 株式会社日立国際電気 | Heat treatment apparatus and semiconductor manufacturing method |
| JP3802889B2 (en) * | 2003-07-01 | 2006-07-26 | 東京エレクトロン株式会社 | Heat treatment apparatus and calibration method thereof |
-
2004
- 2004-10-20 JP JP2004306040A patent/JP4712343B2/en active Active
- 2004-10-29 TW TW093133010A patent/TW200520036A/en not_active IP Right Cessation
- 2004-11-01 US US10/577,145 patent/US20070074660A1/en not_active Abandoned
- 2004-11-01 WO PCT/JP2004/016213 patent/WO2005043609A1/en active Application Filing
- 2004-11-01 KR KR1020057011807A patent/KR100882633B1/en active IP Right Grant
- 2004-11-01 EP EP04799419A patent/EP1684336A4/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1189261A2 (en) * | 2000-09-13 | 2002-03-20 | Tokyo Electron Limited | Batch-type heat treatment apparatus and method for controlling it |
| WO2002071459A1 (en) * | 2001-03-05 | 2002-09-12 | Tokyo Electron Limited | Heat treatment method and heat treatment system |
| US20030061989A1 (en) * | 2001-08-31 | 2003-04-03 | Kabushiki Kaisha Toshiba | Semiconductor manufacturing system |
| WO2003041139A1 (en) * | 2001-11-08 | 2003-05-15 | Tokyo Electron Limited | Thermal treating apparatus |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2005043609A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2005043609A1 (en) | 2005-05-12 |
| KR100882633B1 (en) | 2009-02-06 |
| EP1684336A1 (en) | 2006-07-26 |
| JP4712343B2 (en) | 2011-06-29 |
| US20070074660A1 (en) | 2007-04-05 |
| TWI355014B (en) | 2011-12-21 |
| KR20060114284A (en) | 2006-11-06 |
| JP2005159317A (en) | 2005-06-16 |
| TW200520036A (en) | 2005-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| PL374499A1 (en) | Method and apparatus for heat treatment | |
| EP1548809A4 (en) | Heat treatment method and heat treatment apparatus | |
| AU2003259925A8 (en) | Well treatment apparatus and method | |
| EP1487006A4 (en) | Device and method for heat treatment | |
| EP1503685A4 (en) | Implantable thermal treatment method and apparatus | |
| EP1659189A4 (en) | Heat treating device and heat treating method | |
| IL176126A0 (en) | Electromagnetic treatment apparatus and method | |
| EP1811253A4 (en) | Apparatus and method for heating treatment | |
| EP1544900A4 (en) | Heat treatment apparatus | |
| EP1640035A4 (en) | Heart treatment apparatus and heart treatment method | |
| EP1543852A4 (en) | Blood treating apparatus and blood treating method | |
| GB0303422D0 (en) | Apparatus and method | |
| EP1650789A4 (en) | Heat treatment apparatus and method of calibrating the apparatus | |
| EP1610363A4 (en) | Method of heat treatment and heat treatment apparatus | |
| EP1475823A4 (en) | Heat treatment device and heat treatment method | |
| GB2404009B (en) | Cooling method and apparatus | |
| EP1684336A4 (en) | Heat treatment apparatus and heat treatment method | |
| PL378465A1 (en) | Therapeutic treatment apparatus and method | |
| EP1801862A4 (en) | Vertical heat treatment apparatus and method for using the same | |
| GB2396546B (en) | Heat treatment apparatus method and produce | |
| GB0326118D0 (en) | Apparatus and method | |
| GB0327981D0 (en) | De-blistering apparatus and method | |
| GB0305023D0 (en) | Apparatus and method | |
| GB0315475D0 (en) | Apparatus and method | |
| GB0311049D0 (en) | Apparatus and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 20060523 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB IT NL |
|
| DAX | Request for extension of the european patent (deleted) | ||
| RBV | Designated contracting states (corrected) |
Designated state(s): DE FR GB IT NL |
|
| A4 | Supplementary search report drawn up and despatched |
Effective date: 20071210 |
|
| 17Q | First examination report despatched |
Effective date: 20080527 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 20091215 |