DE69922656D1 - Zusammenbau von elektronischen komponenten mittels federpackungen - Google Patents

Zusammenbau von elektronischen komponenten mittels federpackungen

Info

Publication number
DE69922656D1
DE69922656D1 DE69922656T DE69922656T DE69922656D1 DE 69922656 D1 DE69922656 D1 DE 69922656D1 DE 69922656 T DE69922656 T DE 69922656T DE 69922656 T DE69922656 T DE 69922656T DE 69922656 D1 DE69922656 D1 DE 69922656D1
Authority
DE
Germany
Prior art keywords
assembly
electronic components
spring pack
pack
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69922656T
Other languages
English (en)
Other versions
DE69922656T2 (de
Inventor
V Pedersen
N Eldridge
Y Khandros
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/108,163 external-priority patent/US6033935A/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Application granted granted Critical
Publication of DE69922656D1 publication Critical patent/DE69922656D1/de
Publication of DE69922656T2 publication Critical patent/DE69922656T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K2101/36—Electric or electronic devices
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    • C—CHEMISTRY; METALLURGY
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    • C—CHEMISTRY; METALLURGY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10878—Means for retention of a lead in a hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
DE69922656T 1998-06-30 1999-06-30 Zusammenbau von elektronischen komponenten mittels federpackungen Expired - Fee Related DE69922656T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/108,163 US6033935A (en) 1997-06-30 1998-06-30 Sockets for "springed" semiconductor devices
US108163 1998-06-30
US205502 1998-12-04
US09/205,502 US20020004320A1 (en) 1995-05-26 1998-12-04 Attaratus for socketably receiving interconnection elements of an electronic component
PCT/US1999/014924 WO2000001208A1 (en) 1998-06-30 1999-06-30 Assembly of an electronic component with spring packaging

Publications (2)

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DE69922656D1 true DE69922656D1 (de) 2005-01-20
DE69922656T2 DE69922656T2 (de) 2005-11-03

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US (3) US20020004320A1 (de)
EP (1) EP1092338B1 (de)
JP (2) JP3723079B2 (de)
CN (1) CN1197443C (de)
DE (2) DE69937416T2 (de)
TW (1) TW548756B (de)
WO (1) WO2000001208A1 (de)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US6033935A (en) * 1997-06-30 2000-03-07 Formfactor, Inc. Sockets for "springed" semiconductor devices
US20020004320A1 (en) * 1995-05-26 2002-01-10 David V. Pedersen Attaratus for socketably receiving interconnection elements of an electronic component
US6627483B2 (en) * 1998-12-04 2003-09-30 Formfactor, Inc. Method for mounting an electronic component
US6468098B1 (en) * 1999-08-17 2002-10-22 Formfactor, Inc. Electrical contactor especially wafer level contactor using fluid pressure
US7396236B2 (en) * 2001-03-16 2008-07-08 Formfactor, Inc. Wafer level interposer
DE10121969C1 (de) * 2001-05-05 2002-08-29 Semikron Elektronik Gmbh Schaltungsanordnung in Druckkontaktierung und Verfahren zu seiner Herstellung
JP4752157B2 (ja) * 2001-08-27 2011-08-17 株式会社村田製作所 コイル装置
US6764869B2 (en) 2001-09-12 2004-07-20 Formfactor, Inc. Method of assembling and testing an electronics module
US7064953B2 (en) * 2001-12-27 2006-06-20 Formfactor, Inc. Electronic package with direct cooling of active electronic components
US6891385B2 (en) 2001-12-27 2005-05-10 Formfactor, Inc. Probe card cooling assembly with direct cooling of active electronic components
US6650456B2 (en) * 2002-04-11 2003-11-18 Triquint Technology Holding Co. Ultra-high frequency interconnection using micromachined substrates
US7694246B2 (en) * 2002-06-19 2010-04-06 Formfactor, Inc. Test method for yielding a known good die
JP3918708B2 (ja) * 2002-10-08 2007-05-23 セイコーエプソン株式会社 回路基板及びその製造方法、転写チップ、転写元基板、電気光学装置、電子機器
US7135704B2 (en) * 2003-08-14 2006-11-14 Lockhead Martin Corporation VCSEL settling fixture
US20050108875A1 (en) * 2003-11-26 2005-05-26 Mathieu Gaetan L. Methods for making vertical electric feed through structures usable to form removable substrate tiles in a wafer test system
US7024763B2 (en) 2003-11-26 2006-04-11 Formfactor, Inc. Methods for making plated through holes usable as interconnection wire or probe attachments
JP2005311205A (ja) * 2004-04-23 2005-11-04 Nec Corp 半導体装置
CN1304189C (zh) * 2004-08-24 2007-03-14 宇东电浆科技股份有限公司 热塑性固定装置和热塑性固定装置处理方法
JP2006339553A (ja) * 2005-06-06 2006-12-14 Fuji Electric Device Technology Co Ltd 薄膜磁気誘導素子およびその製造方法
JP4581864B2 (ja) * 2005-06-21 2010-11-17 パナソニック電工株式会社 半導体基板への貫通配線の形成方法
KR100731351B1 (ko) * 2006-02-01 2007-06-21 삼성전자주식회사 탄성 표면파 디바이스 웨이퍼 레벨 패키지 및 그 패키징방법
US20080073778A1 (en) * 2006-09-27 2008-03-27 Texas Instruments Incorporated Two-way heat extraction from packaged semiconductor chips
US7479794B2 (en) * 2007-02-28 2009-01-20 Sv Probe Pte Ltd Spring loaded probe pin assembly
US7928582B2 (en) 2007-03-09 2011-04-19 Micron Technology, Inc. Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces
US7688077B2 (en) * 2007-08-23 2010-03-30 Advantest Corporation Test system and daughter unit
CN101316014B (zh) * 2007-10-17 2012-02-01 番禺得意精密电子工业有限公司 电连接装置及其组装方法
JP5351071B2 (ja) * 2009-02-24 2013-11-27 株式会社アドバンテスト テスト部ユニット、テストヘッドおよび電子部品試験装置
DE102009022659B4 (de) 2009-05-26 2012-01-19 Semikron Elektronik Gmbh & Co. Kg Kontakteinrichtung für ein Leistungshalbleitermodul
TWI405375B (zh) * 2009-11-13 2013-08-11 Unimicron Technology Corp 電連接器
JP5798435B2 (ja) * 2011-03-07 2015-10-21 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
JP5777997B2 (ja) * 2011-03-07 2015-09-16 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
KR101149759B1 (ko) * 2011-03-14 2012-06-01 리노공업주식회사 반도체 디바이스의 검사장치
JP5690678B2 (ja) * 2011-07-19 2015-03-25 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
CN102891116B (zh) * 2011-07-20 2015-06-10 讯芯电子科技（中山）有限公司 内埋元件封装结构及制造方法
CN103325773A (zh) * 2012-03-22 2013-09-25 民瑞科技股份有限公司 集成电路的封装结构
JP6341634B2 (ja) * 2013-05-28 2018-06-13 新光電気工業株式会社 プローブガイド板及びその製造方法、半導体検査装置
US9252138B2 (en) * 2014-05-27 2016-02-02 General Electric Company Interconnect devices for electronic packaging assemblies
EP2962799B8 (de) * 2014-07-04 2016-10-12 ABB Schweiz AG Halbleitermodul mit Ultraschall geschweißten Anschlüssen
CN104251923B (zh) * 2014-09-17 2017-06-30 大族激光科技产业集团股份有限公司 二线测试探针装置及其应用方法
US9530749B2 (en) * 2015-04-28 2016-12-27 Invensas Corporation Coupling of side surface contacts to a circuit platform
US10468363B2 (en) * 2015-08-10 2019-11-05 X-Celeprint Limited Chiplets with connection posts
US9958476B2 (en) 2015-11-25 2018-05-01 Formfactor, Inc. Floating nest for a test socket
JP6706076B2 (ja) * 2016-01-14 2020-06-03 新光電気工業株式会社 プローブガイド板及びその製造方法とプローブ装置
CN106983966B (zh) * 2017-03-31 2022-05-20 四川华川工业有限公司 一种钢化玻璃自动破碎装置
RU2657460C1 (ru) * 2017-05-10 2018-06-14 Открытое акционерное общество "ОКБ-Планета" ОАО "ОКБ-Планета" Контактное устройство
US10446729B1 (en) * 2018-03-22 2019-10-15 Innolux Corporation Display device having an electronic device disposed on a first pad and a second pad
CN109300859B (zh) * 2018-09-18 2020-08-28 苏州施密科微电子设备有限公司 一种半导体芯片封装框架
US20230018510A1 (en) * 2019-11-21 2023-01-19 Yokowo Co., Ltd. Socket and tool
TWI799887B (zh) * 2021-06-08 2023-04-21 進聯工業股份有限公司 接合器及可組合該接合器之導線端子座結構
JP7182817B1 (ja) 2022-03-14 2022-12-05 ユニコン株式会社 プローブシート及びその製造方法
EP4261872A1 (de) * 2022-04-11 2023-10-18 Nexperia B.V. Umgegossenes elektronikgehäuse mit zwischen zwei substraten vergossenem elektronischem bauelement mit federelement zwischen dem elektronischen bauelement und einem der substrate und verfahren zu herstellung davon
TWI811005B (zh) * 2022-07-05 2023-08-01 中華精測科技股份有限公司 可拆式測試裝置

Family Cites Families (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US720677A (en) * 1902-12-18 1903-02-17 Seth A Crone Brake-beam.
NL292051A (de) * 1962-04-27
US3939831A (en) * 1974-03-04 1976-02-24 Intreprinderea Flacara Rosie Process for preparing medicinal dressings
US3939381A (en) * 1974-03-22 1976-02-17 Mcm Industries, Inc. Universal burn-in fixture
GB1530786A (en) * 1974-12-30 1978-11-01 Trw Inc Electrical connector
FR2322465A1 (fr) * 1975-08-29 1977-03-25 Doloise Metallurgique Dispositif de raccordement pour composants munis de fiches
DE2936615C2 (de) * 1979-09-11 1985-03-28 Brown, Boveri & Cie Ag, 6800 Mannheim Schutzvorrichtung
US4477134A (en) * 1981-08-14 1984-10-16 Hewlett-Packard Company Electrostatic discharge protected integrated circuit module
CA1186418A (en) * 1981-08-14 1985-04-30 Allen J. Wright Electrostatic discharge protected integrated circuit module
US4711024A (en) * 1981-10-30 1987-12-08 Honeywell Information Systems Inc. Method for making testable electronic assemblies
US4511201A (en) * 1982-11-05 1985-04-16 At&T Bell Laboratories Module mounting assembly
US4553192A (en) 1983-08-25 1985-11-12 International Business Machines Corporation High density planar interconnected integrated circuit package
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPS62229896A (ja) * 1986-03-29 1987-10-08 株式会社東芝 印刷配線基板
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
JPH063820B2 (ja) 1988-07-25 1994-01-12 松下電器産業株式会社 半導体装置の実装方法
US5036431A (en) * 1988-03-03 1991-07-30 Ibiden Co., Ltd. Package for surface mounted components
DE3903060A1 (de) * 1989-02-02 1990-08-09 Minnesota Mining & Mfg Vorrichtung zum pruefen von integrierten schaltungsanordnungen
US4940181A (en) * 1989-04-06 1990-07-10 Motorola, Inc. Pad grid array for receiving a solder bumped chip carrier
US4922376A (en) * 1989-04-10 1990-05-01 Unistructure, Inc. Spring grid array interconnection for active microelectronic elements
US4933808A (en) * 1989-05-11 1990-06-12 Westinghouse Electric Corp. Solderless printed wiring board module and multi-module assembly
US4966556A (en) * 1989-06-13 1990-10-30 General Datacomm, Inc. Electrical connector for direct connection to plated through holes in circuit board
US5366380A (en) * 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
JPH03142847A (ja) 1989-10-30 1991-06-18 Hitachi Ltd 半導体集積回路装置
JPH0711422Y2 (ja) * 1989-12-25 1995-03-15 山一電機工業株式会社 Ｉｃソケット
CA2034703A1 (en) * 1990-01-23 1991-07-24 Masanori Nishiguchi Substrate for packaging a semiconductor device
US5905382A (en) * 1990-08-29 1999-05-18 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US5207585A (en) * 1990-10-31 1993-05-04 International Business Machines Corporation Thin interface pellicle for dense arrays of electrical interconnects
US5578934A (en) * 1991-06-04 1996-11-26 Micron Technology, Inc. Method and apparatus for testing unpackaged semiconductor dice
US5239260A (en) * 1991-06-28 1993-08-24 Digital Equipment Corporation Semiconductor probe and alignment system
US5175491A (en) * 1991-09-18 1992-12-29 Sgs-Thomson Microelectronics, Inc. Integrated circuit testing fixture
JPH0649656A (ja) 1992-08-04 1994-02-22 Vacuum Metallurgical Co Ltd ガス・デポジション法による超微粒子膜の形成法およびその形成装置
US5489854A (en) * 1993-04-01 1996-02-06 Analog Devices, Inc. IC chip test socket with double-ended spring biased contacts
US5329423A (en) * 1993-04-13 1994-07-12 Scholz Kenneth D Compressive bump-and-socket interconnection scheme for integrated circuits
US5811982A (en) * 1995-11-27 1998-09-22 International Business Machines Corporation High density cantilevered probe for electronic devices
JP3053507B2 (ja) 1993-06-11 2000-06-19 裕子 鈴木 ドーム型羽毛ふとん
US5500605A (en) * 1993-09-17 1996-03-19 At&T Corp. Electrical test apparatus and method
US6336269B1 (en) 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6525555B1 (en) * 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
US6064213A (en) * 1993-11-16 2000-05-16 Formfactor, Inc. Wafer-level burn-in and test
US6835898B2 (en) * 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US5772451A (en) 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US5475317A (en) * 1993-12-23 1995-12-12 Epi Technologies, Inc. Singulated bare die tester and method of performing forced temperature electrical tests and burn-in
GB9400384D0 (en) 1994-01-11 1994-03-09 Inmos Ltd Circuit connection in an electrical assembly
US5455390A (en) * 1994-02-01 1995-10-03 Tessera, Inc. Microelectronics unit mounting with multiple lead bonding
US5635832A (en) * 1994-06-15 1997-06-03 Advantest Corporation IC carrier for use with an IC handler
US5476818A (en) * 1994-08-19 1995-12-19 Motorola, Inc. Semiconductor structure and method of manufacture
US5495667A (en) * 1994-11-07 1996-03-05 Micron Technology, Inc. Method for forming contact pins for semiconductor dice and interconnects
AU4237696A (en) 1994-11-15 1996-06-06 Formfactor, Inc. Mounting spring elements on semiconductor devices, and wafer-level testing methodology
AU4283996A (en) * 1994-11-15 1996-06-19 Formfactor, Inc. Electrical contact structures from flexible wire
US6229320B1 (en) * 1994-11-18 2001-05-08 Fujitsu Limited IC socket, a test method using the same and an IC socket mounting mechanism
JPH1069955A (ja) 1996-08-28 1998-03-10 Fujitsu Ltd Ｉｃソケット及びこれを用いた試験方法及びｉｃソケットの実装機構
JPH08263092A (ja) 1995-03-23 1996-10-11 N T T Data Tsushin Kk 応答音声生成方法および音声対話システム
DE59510080D1 (de) * 1995-04-24 2002-04-04 Infineon Technologies Ag Halbleiter-Speichervorrichtung unter Verwendung eines ferroelektrischen Dielektrikums und Verfahren zur Herstellung
EP0742682B1 (de) * 1995-05-12 2005-02-23 STMicroelectronics, Inc. IC-Packungsfassungssystem mit niedrigem Profil
US6002266A (en) * 1995-05-23 1999-12-14 Digital Equipment Corporation Socket including centrally distributed test tips for testing unpackaged singulated die
US6033935A (en) 1997-06-30 2000-03-07 Formfactor, Inc. Sockets for "springed" semiconductor devices
US20020004320A1 (en) * 1995-05-26 2002-01-10 David V. Pedersen Attaratus for socketably receiving interconnection elements of an electronic component
US5578870A (en) * 1995-08-03 1996-11-26 Precision Connector Designs, Inc. Top loading test socket for ball grid arrays
US5874780A (en) * 1995-07-27 1999-02-23 Nec Corporation Method of mounting a semiconductor device to a substrate and a mounted structure
US5714803A (en) * 1995-07-28 1998-02-03 Sgs-Thomson Microelectronics, Inc. Low-profile removable ball-grid-array integrated circuit package
US5686842A (en) * 1995-08-31 1997-11-11 Nat Semiconductor Corp Known good die test apparatus and method
JP2891665B2 (ja) 1996-03-22 1999-05-17 株式会社日立製作所 半導体集積回路装置およびその製造方法
CN1272632C (zh) 1996-05-17 2006-08-30 佛姆法克特股份有限公司 晶片级老化和测试
US5865639A (en) * 1996-06-25 1999-02-02 Texas Instruments Incorporated Burn-in test socket apparatus
DE69734158T2 (de) * 1996-09-13 2006-06-22 International Business Machines Corp. Prüfkopfstruktur mit mehreren getrennten isolierten prüfspitzen
US5764486A (en) * 1996-10-10 1998-06-09 Hewlett Packard Company Cost effective structure and method for interconnecting a flip chip with a substrate
US6060891A (en) * 1997-02-11 2000-05-09 Micron Technology, Inc. Probe card for semiconductor wafers and method and system for testing wafers
US6025730A (en) * 1997-03-17 2000-02-15 Micron Technology, Inc. Direct connect interconnect for testing semiconductor dice and wafers
JPH1172534A (ja) * 1997-08-28 1999-03-16 Mitsubishi Electric Corp テスト端子付き半導体装置およびｉｃソケット
US6018249A (en) * 1997-12-11 2000-01-25 Micron Technolgoy, Inc. Test system with mechanical alignment for semiconductor chip scale packages and dice
US6292003B1 (en) * 1998-07-01 2001-09-18 Xilinx, Inc. Apparatus and method for testing chip scale package integrated circuits
US6031282A (en) * 1998-08-27 2000-02-29 Advantest Corp. High performance integrated circuit chip package
US6627483B2 (en) 1998-12-04 2003-09-30 Formfactor, Inc. Method for mounting an electronic component
US7694246B2 (en) 2002-06-19 2010-04-06 Formfactor, Inc. Test method for yielding a known good die
US6920689B2 (en) 2002-12-06 2005-07-26 Formfactor, Inc. Method for making a socket to perform testing on integrated circuits

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US20020004320A1 (en) 2002-01-10
WO2000001208A1 (en) 2000-01-06
JP2002519872A (ja) 2002-07-02
DE69922656T2 (de) 2005-11-03
CN1197443C (zh) 2005-04-13
EP1092338B1 (de) 2004-12-15
DE69937416T2 (de) 2008-07-24
CN1307793A (zh) 2001-08-08
JP2006013526A (ja) 2006-01-12
US7202677B2 (en) 2007-04-10
EP1092338A1 (de) 2001-04-18
TW548756B (en) 2003-08-21
US20070285114A1 (en) 2007-12-13
DE69937416D1 (de) 2007-12-06
US20040152348A1 (en) 2004-08-05
JP3723079B2 (ja) 2005-12-07
US7534654B2 (en) 2009-05-19

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