DE69838638D1 - Ic-modul, sein herstellungsverfahren und damit versehene ic-karte - Google Patents

Ic-modul, sein herstellungsverfahren und damit versehene ic-karte

Info

Publication number
DE69838638D1
DE69838638D1 DE69838638T DE69838638T DE69838638D1 DE 69838638 D1 DE69838638 D1 DE 69838638D1 DE 69838638 T DE69838638 T DE 69838638T DE 69838638 T DE69838638 T DE 69838638T DE 69838638 D1 DE69838638 D1 DE 69838638D1
Authority
DE
Germany
Prior art keywords
card
module
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69838638T
Other languages
English (en)
Other versions
DE69838638T2 (de
Inventor
Minoru Hirai
Shigeyuki Ueda
Osamu Miyata
Tomoharu Horio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Application granted granted Critical
Publication of DE69838638D1 publication Critical patent/DE69838638D1/de
Publication of DE69838638T2 publication Critical patent/DE69838638T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3456—Antennas, e.g. radomes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
DE69838638T 1997-07-18 1998-07-13 Ic-modul, sein herstellungsverfahren und damit versehene ic-karte Expired - Fee Related DE69838638T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP19384297A JPH1134553A (ja) 1997-07-18 1997-07-18 Ｉｃモジュール、およびその製造方法、ならびにこれを備えたｉｃカード
JP19384297 1997-07-18
PCT/JP1998/003141 WO1999004365A1 (fr) 1997-07-18 1998-07-13 Module a circuit integre, procede de fabrication dudit module et carte a circuit integre dotee dudit module

Publications (2)

Publication Number Publication Date
DE69838638D1 true DE69838638D1 (de) 2007-12-13
DE69838638T2 DE69838638T2 (de) 2008-08-28

Family

ID=16314656

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69838638T Expired - Fee Related DE69838638T2 (de) 1997-07-18 1998-07-13 Ic-modul, sein herstellungsverfahren und damit versehene ic-karte

Country Status (9)

Country Link
US (1) US6308894B1 (de)
EP (1) EP0923047B1 (de)
JP (1) JPH1134553A (de)
KR (1) KR100300253B1 (de)
CN (1) CN1167039C (de)
AU (2) AU761860B2 (de)
CA (1) CA2265918A1 (de)
DE (1) DE69838638T2 (de)
WO (1) WO1999004365A1 (de)

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US6441741B1 (en) 1999-05-17 2002-08-27 Avid Identification Systems, Inc. Overmolded transponder
DE19935441A1 (de) * 1999-07-28 2001-03-01 Siemens Ag Verfahren und Moldwerkzeug zum Umhüllen von elektronischen Bauelementen
JP3521325B2 (ja) * 1999-07-30 2004-04-19 シャープ株式会社 樹脂封止型半導体装置の製造方法
DE60144452D1 (de) 2000-02-22 2011-05-26 Toray Eng Co Ltd Verfahren zur Herstellung einer kontaktlosen ID Karte
JP2002092575A (ja) * 2000-09-19 2002-03-29 Mitsubishi Electric Corp 小型カードとその製造方法
DE60120894T2 (de) * 2000-12-26 2007-01-11 The Furukawa Electric Co., Ltd. Herstellungsverfahren einer Antenne
WO2002075646A1 (en) * 2001-03-19 2002-09-26 Hitachi Maxell, Ltd. Core piece and non-contact communication type information carrier using the core piece
JP4706117B2 (ja) * 2001-03-26 2011-06-22 凸版印刷株式会社 Ｉｃカードの製造方法
US6604686B1 (en) * 2001-10-09 2003-08-12 Vahid Taban High speed system for embedding wire antennas in an array of smart cards
US20030078618A1 (en) * 2001-10-19 2003-04-24 Fey Kate E. System and method for removing implanted devices
US20030085288A1 (en) * 2001-11-06 2003-05-08 Luu Deniel V.H. Contactless SIM card carrier with detachable antenna and carrier therefore
FR2834103B1 (fr) * 2001-12-20 2004-04-02 Gemplus Card Int Carte a puce a module de surface etendue
US6774470B2 (en) * 2001-12-28 2004-08-10 Dai Nippon Printing Co., Ltd. Non-contact data carrier and method of fabricating the same
DE10207000C2 (de) * 2002-02-19 2003-12-11 Orga Kartensysteme Gmbh Chipkarte
JP4523223B2 (ja) * 2002-04-26 2010-08-11 株式会社日立製作所 レーダセンサ
JP2003331242A (ja) * 2002-05-10 2003-11-21 Konica Minolta Holdings Inc Ｉｃカード
FR2851988B1 (fr) * 2003-03-03 2005-07-01 Dispositif de bouchage pour recipients, tels que bonbonnes, munis d'un col du type fontaine a eau
EP1623367A1 (de) * 2003-05-05 2006-02-08 Axalto SA Verfahren zur herstellung eines vorlaminierten inlets
JP4792560B2 (ja) * 2004-03-31 2011-10-12 株式会社サトーゴーセー 情報記録体樹脂封入タグ
DE102004028218B4 (de) * 2004-06-09 2006-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines tragbaren Datenträgers
EP1780662A1 (de) * 2005-10-27 2007-05-02 Axalto SA Verstärktes Chipkartenmodul und Herstellungsverfahren dafür
US20080094225A1 (en) * 2006-10-20 2008-04-24 Radio Systems Corporation RFID Collar
JP5027481B2 (ja) * 2006-11-06 2012-09-19 株式会社日立製作所 Ｉｃタグ
JP2008299465A (ja) * 2007-05-30 2008-12-11 Dainippon Printing Co Ltd 非接触型ｉｃタグ及び非接触型ｉｃタグの製造方法
JP4861303B2 (ja) * 2007-12-27 2012-01-25 株式会社日立製作所 レーダセンサ
JP5123107B2 (ja) * 2008-08-25 2013-01-16 小島プレス工業株式会社 車載用防水型アンテナ装置及びその防水モールディング方法
JP5556072B2 (ja) * 2009-01-07 2014-07-23 ソニー株式会社 半導体装置、その製造方法、ミリ波誘電体内伝送装置
JP5718720B2 (ja) * 2011-02-22 2015-05-13 アピックヤマダ株式会社 Ｒｆｉｄタグ、非接触給電アンテナ部品、それらの製造方法、及び金型
US9812782B2 (en) 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
US9489613B2 (en) 2011-08-08 2016-11-08 Féinics Amatech Teoranta RFID transponder chip modules with a band of the antenna extending inward
US9622359B2 (en) 2011-08-08 2017-04-11 Féinics Amatech Teoranta RFID transponder chip modules
US9634391B2 (en) 2011-08-08 2017-04-25 Féinics Amatech Teoranta RFID transponder chip modules
JP2014010473A (ja) * 2012-06-27 2014-01-20 Lintec Corp アンテナ回路部材、ｉｃインレット、ｉｃチップの保護方法、およびアンテナ回路部材の製造方法
JP6098124B2 (ja) * 2012-11-13 2017-03-22 凸版印刷株式会社 Ｉｃタグ及びｉｃタグの製造方法
US10248902B1 (en) 2017-11-06 2019-04-02 Féinics Amatech Teoranta Coupling frames for RFID devices
US8763912B1 (en) * 2013-03-29 2014-07-01 Identive Group, Inc. Dual interface module and dual interface card having a dual interface module
US10839282B2 (en) 2014-03-08 2020-11-17 Féinics Amatech Teoranta RFID transponder chip modules, elements thereof, and methods
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US9590699B1 (en) * 2015-09-11 2017-03-07 Texas Instuments Incorporated Guided near field communication for short range data communication
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DK3491584T3 (da) * 2016-07-27 2022-10-17 Composecure Llc Omstøbte elektroniske komponenter til transaktionskort og fremgangsmåder til fremstilling deraf
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Also Published As

Publication number Publication date
US6308894B1 (en) 2001-10-30
DE69838638T2 (de) 2008-08-28
CN1167039C (zh) 2004-09-15
AU2003246072A1 (en) 2003-10-09
WO1999004365A1 (fr) 1999-01-28
JPH1134553A (ja) 1999-02-09
KR100300253B1 (ko) 2001-09-22
CN1234886A (zh) 1999-11-10
EP0923047B1 (de) 2007-10-31
AU2003246072B2 (en) 2005-09-08
CA2265918A1 (en) 1999-01-28
EP0923047A4 (de) 2001-08-29
KR20000068556A (ko) 2000-11-25
AU761860B2 (en) 2003-06-12
EP0923047A1 (de) 1999-06-16
AU8129898A (en) 1999-02-10

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee