DE69803160T2 - Verfahren und vorrichtung zur bestückung von elektronischen bauteilen - Google Patents

Verfahren und vorrichtung zur bestückung von elektronischen bauteilen

Info

Publication number
DE69803160T2
DE69803160T2 DE69803160T DE69803160T DE69803160T2 DE 69803160 T2 DE69803160 T2 DE 69803160T2 DE 69803160 T DE69803160 T DE 69803160T DE 69803160 T DE69803160 T DE 69803160T DE 69803160 T2 DE69803160 T2 DE 69803160T2
Authority
DE
Germany
Prior art keywords
electronic components
fitting electronic
fitting
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69803160T
Other languages
English (en)
Other versions
DE69803160D1 (de
Inventor
Naoyuki Kitamura
Osamu Okuda
A Kabeshita
Takeshi Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP03196597A external-priority patent/JP3545157B2/ja
Priority claimed from JP14896397A external-priority patent/JP3507279B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69803160D1 publication Critical patent/DE69803160D1/de
Application granted granted Critical
Publication of DE69803160T2 publication Critical patent/DE69803160T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/044—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69803160T 1997-02-17 1998-02-16 Verfahren und vorrichtung zur bestückung von elektronischen bauteilen Expired - Fee Related DE69803160T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP03196597A JP3545157B2 (ja) 1997-02-17 1997-02-17 電子部品実装装置
JP14896397A JP3507279B2 (ja) 1997-06-06 1997-06-06 電子部品装着方法および装着装置
PCT/JP1998/000644 WO1998036629A1 (en) 1997-02-17 1998-02-16 Method and apparatus for mounting electronic components

Publications (2)

Publication Number Publication Date
DE69803160D1 DE69803160D1 (de) 2002-02-21
DE69803160T2 true DE69803160T2 (de) 2002-09-05

Family

ID=26370481

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69803160T Expired - Fee Related DE69803160T2 (de) 1997-02-17 1998-02-16 Verfahren und vorrichtung zur bestückung von elektronischen bauteilen

Country Status (6)

Country Link
US (1) US6266873B1 (de)
EP (1) EP0960555B1 (de)
KR (1) KR100496949B1 (de)
CN (1) CN1110992C (de)
DE (1) DE69803160T2 (de)
WO (1) WO1998036629A1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065392A (ja) * 1996-08-19 1998-03-06 Matsushita Electric Ind Co Ltd 電子部品供給装置及び電子部品実装方法
EP1054584B1 (de) * 1997-11-10 2006-08-23 Matsushita Electric Industrial Co., Ltd. Bauteile-bestückungsvorrichtung und bauteile-zufuhrvorrichtung
JP2000252684A (ja) * 1999-02-27 2000-09-14 Mirae Corp トレイフィーダー部が設置された表面実装機
SG83785A1 (en) * 1999-04-30 2001-10-16 Esec Trading Sa Apparatus and method for mounting semiconductor chips on a substrate
US6691405B1 (en) * 1999-06-08 2004-02-17 Sumitomo Wiring Systems, Ltd. Box assembling apparatus and method for mounting a plurality of different electric/electronic parts in a box
JP3719051B2 (ja) 1999-07-02 2005-11-24 松下電器産業株式会社 電子部品の実装装置および実装方法
KR100311747B1 (ko) * 1999-08-20 2001-10-18 정문술 표면실장기의 인쇄회로기판 이송장치
JP2002050896A (ja) * 2000-08-03 2002-02-15 Sony Corp 部品把持位置補正装置および補正方法
JP3588444B2 (ja) * 2000-10-26 2004-11-10 松下電器産業株式会社 電子部品、部品実装装置及び部品実装方法
US6796022B2 (en) * 2001-03-30 2004-09-28 Sanyo Electric Co., Ltd. Electronic component mounting apparatus
US20040197183A1 (en) * 2001-06-22 2004-10-07 Cho Jae Hyuk Exchanger for tray feeder
KR100406059B1 (ko) 2001-06-22 2003-11-17 미래산업 주식회사 트레이 피더용 트랜스퍼
TW200604060A (en) * 2004-06-11 2006-02-01 Assembleon Nv Component placement apparatus, component feeding apparatus and method
TW200606069A (en) * 2004-06-11 2006-02-16 Assembleon Nv Component placement apparatus and method
EP1605743A3 (de) * 2004-06-11 2007-09-26 Assembléon N.V. Vorrichtung und Verfahren für das Bestücken mit Bauelementen
KR20070042156A (ko) * 2004-07-30 2007-04-20 아셈블레온 엔. 브이. 컴포넌트 배치 장치
JP4249120B2 (ja) * 2004-11-30 2009-04-02 富士通株式会社 加圧装置および回路チップ実装装置
KR100651815B1 (ko) * 2005-01-14 2006-12-01 삼성테크윈 주식회사 부품 실장기
DE102007048410B4 (de) * 2007-10-09 2009-07-30 Siemens Ag Zuführvorrichtung für Bauelemente zu einem Bestückautomaten zur Bestückung von Substraten mit den Bauelementen
WO2009060560A1 (ja) * 2007-11-06 2009-05-14 Panasonic Corporation 部品実装機、部品装着ヘッド、および部品装着方法
CN101885420B (zh) * 2010-07-20 2012-05-30 格兰达技术（深圳）有限公司 一种托盘装料方法及振动式托盘装料机
KR101639667B1 (ko) * 2010-08-10 2016-07-14 한화테크윈 주식회사 부품 실장기
KR101690711B1 (ko) * 2011-08-19 2016-12-29 한화테크윈 주식회사 트레이 피더 및 이를 이용한 부품 공급 방법
KR20130079031A (ko) * 2012-01-02 2013-07-10 삼성전자주식회사 반도체 칩 실장 장치
WO2014196002A1 (ja) * 2013-06-03 2014-12-11 富士機械製造株式会社 ノズル管理システム
CN103964190B (zh) * 2014-05-15 2016-04-06 苏州博众精工科技有限公司 一种自动升降的可堆叠料盘机构
CN109693012B (zh) * 2017-10-24 2020-12-18 泰科电子(上海)有限公司 定位装置
CN108792559B (zh) * 2018-07-20 2024-01-26 苏州德机自动化科技有限公司 移印键帽设备自动输送线

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JPS5534461A (en) * 1978-08-31 1980-03-11 Matsushita Electric Ind Co Ltd Device for automatically inserting electric part
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USRE33974E (en) * 1985-01-21 1992-06-30 Fuji Machine Manufacturing Co., Ltd. Method and apparatus for detecting hold-position of electronic component, and apparatus for mounting electronic component
JPS62114289A (ja) * 1985-11-14 1987-05-26 松下電器産業株式会社 電子部品の装着方法および装置
US4738025A (en) * 1986-12-23 1988-04-19 Northern Telecom Limited Automated apparatus and method for positioning multicontact component
JPS63168277A (ja) * 1986-12-29 1988-07-12 Toshiba Corp 電子部品の実装装置
GB2223429B (en) * 1988-08-24 1993-02-17 Tdk Corp Apparatus for and method of automatically mounting electronic component on printed circuit board
JPH07100265B2 (ja) * 1989-04-27 1995-11-01 松下電器産業株式会社 部品装着装置
JPH02303100A (ja) * 1989-05-17 1990-12-17 Matsushita Electric Ind Co Ltd 部品装着方法
US4980971A (en) * 1989-12-14 1991-01-01 At&T Bell Laboratories Method and apparatus for chip placement
US5208975A (en) * 1990-07-06 1993-05-11 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic parts
JP2517178B2 (ja) * 1991-03-04 1996-07-24 松下電器産業株式会社 電子部品の実装方法
JP3261770B2 (ja) * 1992-11-19 2002-03-04 松下電器産業株式会社 部品装着装置
JPH07249898A (ja) * 1994-03-14 1995-09-26 Matsushita Electric Ind Co Ltd 電気部品の取付装置
JP3408638B2 (ja) * 1994-08-30 2003-05-19 松下電器産業株式会社 電子部品移載装置
US6076394A (en) * 1996-09-02 2000-06-20 Fuji Machine Mfg. Co., Ltd. Electric component transferring apparatus having function of testing negative-pressure suction, and apparatus and method for testing negative-pressure suction
JPH10129370A (ja) * 1996-10-25 1998-05-19 Yazaki Corp 天井用電装組立体
JPH10233570A (ja) * 1997-02-19 1998-09-02 Alps Electric Co Ltd 電気部品の実装装置、及びその電気部品の実装方法

Also Published As

Publication number Publication date
EP0960555B1 (de) 2002-01-16
DE69803160D1 (de) 2002-02-21
EP0960555A1 (de) 1999-12-01
CN1110992C (zh) 2003-06-04
KR20000070938A (ko) 2000-11-25
US6266873B1 (en) 2001-07-31
KR100496949B1 (ko) 2005-06-23
WO1998036629A1 (en) 1998-08-20
CN1247690A (zh) 2000-03-15

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee