DE69620945T2 - Skalierte, adaptive Lithographie - Google Patents
Skalierte, adaptive LithographieInfo
- Publication number
- DE69620945T2 DE69620945T2 DE69620945T DE69620945T DE69620945T2 DE 69620945 T2 DE69620945 T2 DE 69620945T2 DE 69620945 T DE69620945 T DE 69620945T DE 69620945 T DE69620945 T DE 69620945T DE 69620945 T2 DE69620945 T2 DE 69620945T2
- Authority
- DE
- Germany
- Prior art keywords
- scaled
- adaptive lithography
- lithography
- adaptive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/453,110 US5844810A (en) | 1995-05-30 | 1995-05-30 | Scaled adaptive lithography |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69620945D1 DE69620945D1 (de) | 2002-06-06 |
DE69620945T2 true DE69620945T2 (de) | 2002-12-12 |
Family
ID=23799247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69620945T Expired - Fee Related DE69620945T2 (de) | 1995-05-30 | 1996-05-20 | Skalierte, adaptive Lithographie |
Country Status (5)
Country | Link |
---|---|
US (1) | US5844810A (de) |
EP (1) | EP0746020B1 (de) |
JP (1) | JP4100728B2 (de) |
CA (1) | CA2176880C (de) |
DE (1) | DE69620945T2 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6003715A (en) * | 1998-09-15 | 1999-12-21 | Harris; Walter H. | Plastic bucket air vent and method |
US6330708B1 (en) * | 1998-09-17 | 2001-12-11 | International Business Machines Corporation | Method for preparing command files for photomask production |
US6622295B1 (en) * | 2000-07-05 | 2003-09-16 | Dupont Photomasks, Inc. | Network-based photomask data entry interface and instruction generator for manufacturing photomasks |
US6760640B2 (en) * | 2002-03-14 | 2004-07-06 | Photronics, Inc. | Automated manufacturing system and method for processing photomasks |
US7669167B2 (en) * | 2002-07-30 | 2010-02-23 | Photronics, Inc. | Rule based system and method for automatically generating photomask orders by conditioning information from a customer's computer system |
US7269813B2 (en) * | 2004-11-19 | 2007-09-11 | Alcatel | Off-width pitch for improved circuit card routing |
US9595485B2 (en) * | 2014-06-26 | 2017-03-14 | Nxp Usa, Inc. | Microelectronic packages having embedded sidewall substrates and methods for the producing thereof |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4933042A (en) * | 1986-09-26 | 1990-06-12 | General Electric Company | Method for packaging integrated circuit chips employing a polymer film overlay layer |
US4783695A (en) * | 1986-09-26 | 1988-11-08 | General Electric Company | Multichip integrated circuit packaging configuration and method |
US4835704A (en) * | 1986-12-29 | 1989-05-30 | General Electric Company | Adaptive lithography system to provide high density interconnect |
GB2202673B (en) * | 1987-03-26 | 1990-11-14 | Haroon Ahmed | The semi-conductor fabrication |
US4972311A (en) * | 1988-08-15 | 1990-11-20 | Kulicke And Soffa Industries Inc. | X-Y table error mapping apparatus and method |
US5019946A (en) * | 1988-09-27 | 1991-05-28 | General Electric Company | High density interconnect with high volumetric efficiency |
US4894115A (en) * | 1989-02-14 | 1990-01-16 | General Electric Company | Laser beam scanning method for forming via holes in polymer materials |
US5019997A (en) * | 1989-06-05 | 1991-05-28 | General Electric Company | Adaptive lithography accommodation of tolerances in chip positioning in high density interconnection structures |
US5161093A (en) * | 1990-07-02 | 1992-11-03 | General Electric Company | Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive |
US5257178A (en) * | 1991-12-19 | 1993-10-26 | General Electric Company | Method of optimally operating a computer numerical control milling machine to mill optimal high density interconnect substrates |
US5285571A (en) * | 1992-10-13 | 1994-02-15 | General Electric Company | Method for extending an electrical conductor over an edge of an HDI substrate |
US5324687A (en) * | 1992-10-16 | 1994-06-28 | General Electric Company | Method for thinning of integrated circuit chips for lightweight packaged electronic systems |
US5355306A (en) * | 1993-09-30 | 1994-10-11 | Motorola, Inc. | Alignment system and method of alignment by symmetrical and asymmetrical analysis |
US5506793A (en) * | 1994-01-14 | 1996-04-09 | Gerber Systems Corporation | Method and apparatus for distortion compensation in an automatic optical inspection system |
-
1995
- 1995-05-30 US US08/453,110 patent/US5844810A/en not_active Expired - Lifetime
-
1996
- 1996-05-17 CA CA002176880A patent/CA2176880C/en not_active Expired - Fee Related
- 1996-05-20 DE DE69620945T patent/DE69620945T2/de not_active Expired - Fee Related
- 1996-05-20 EP EP96303566A patent/EP0746020B1/de not_active Expired - Lifetime
- 1996-05-22 JP JP12617796A patent/JP4100728B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2176880C (en) | 2007-11-13 |
EP0746020A3 (de) | 1997-07-02 |
CA2176880A1 (en) | 1996-12-01 |
JP4100728B2 (ja) | 2008-06-11 |
EP0746020A2 (de) | 1996-12-04 |
DE69620945D1 (de) | 2002-06-06 |
US5844810A (en) | 1998-12-01 |
JPH09102576A (ja) | 1997-04-15 |
EP0746020B1 (de) | 2002-05-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: ROEGER UND KOLLEGEN, 73728 ESSLINGEN |
|
8339 | Ceased/non-payment of the annual fee |