DE69618416T2 - Zusammengesetzte Weichlotpaste für Löthöcker für Flip-Chip-Montage - Google Patents
Zusammengesetzte Weichlotpaste für Löthöcker für Flip-Chip-MontageInfo
- Publication number
- DE69618416T2 DE69618416T2 DE69618416T DE69618416T DE69618416T2 DE 69618416 T2 DE69618416 T2 DE 69618416T2 DE 69618416 T DE69618416 T DE 69618416T DE 69618416 T DE69618416 T DE 69618416T DE 69618416 T2 DE69618416 T2 DE 69618416T2
- Authority
- DE
- Germany
- Prior art keywords
- flip chip
- chip assembly
- compound soft
- solder paste
- solder bumps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0568—Resist used for applying paste, ink or powder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/536,592 US5803340A (en) | 1995-09-29 | 1995-09-29 | Composite solder paste for flip chip bumping |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69618416D1 DE69618416D1 (de) | 2002-02-14 |
DE69618416T2 true DE69618416T2 (de) | 2002-11-07 |
Family
ID=24139142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69618416T Expired - Lifetime DE69618416T2 (de) | 1995-09-29 | 1996-08-26 | Zusammengesetzte Weichlotpaste für Löthöcker für Flip-Chip-Montage |
Country Status (4)
Country | Link |
---|---|
US (1) | US5803340A (de) |
EP (1) | EP0769346B1 (de) |
JP (1) | JP2960017B2 (de) |
DE (1) | DE69618416T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013102742A1 (de) * | 2013-03-18 | 2014-09-18 | Dbk David + Baader Gmbh | Dehnstoffelement und Verfahren |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3446798B2 (ja) * | 1996-11-29 | 2003-09-16 | 日本特殊陶業株式会社 | 接合バンプ付き配線基板 |
US5928404A (en) * | 1997-03-28 | 1999-07-27 | Ford Motor Company | Electrical solder and method of manufacturing |
KR100244965B1 (ko) * | 1997-08-12 | 2000-02-15 | 윤종용 | 인쇄회로기판과 볼 그리드 어레이 패키지의 제조 방법 |
US6156408A (en) * | 1997-08-29 | 2000-12-05 | Motorola, Inc. | Device for reworkable direct chip attachment |
US6329605B1 (en) * | 1998-03-26 | 2001-12-11 | Tessera, Inc. | Components with conductive solder mask layers |
US6153505A (en) * | 1998-04-27 | 2000-11-28 | International Business Machines Corporation | Plastic solder array using injection molded solder |
SG75841A1 (en) | 1998-05-02 | 2000-10-24 | Eriston Invest Pte Ltd | Flip chip assembly with via interconnection |
US6406939B1 (en) | 1998-05-02 | 2002-06-18 | Charles W. C. Lin | Flip chip assembly with via interconnection |
US6509645B2 (en) * | 1998-07-09 | 2003-01-21 | Nippon Steel Corporation | Spherical semiconductor device and method for fabricating the same |
US6461953B1 (en) | 1998-08-10 | 2002-10-08 | Fujitsu Limited | Solder bump forming method, electronic component mounting method, and electronic component mounting structure |
TW522536B (en) | 1998-12-17 | 2003-03-01 | Wen-Chiang Lin | Bumpless flip chip assembly with strips-in-via and plating |
SG82590A1 (en) | 1998-12-17 | 2001-08-21 | Eriston Technologies Pte Ltd | Bumpless flip chip assembly with strips and via-fill |
SG82591A1 (en) | 1998-12-17 | 2001-08-21 | Eriston Technologies Pte Ltd | Bumpless flip chip assembly with solder via |
US6085968A (en) * | 1999-01-22 | 2000-07-11 | Hewlett-Packard Company | Solder retention ring for improved solder bump formation |
US6251501B1 (en) * | 1999-03-29 | 2001-06-26 | Delphi Technologies, Inc. | Surface mount circuit device and solder bumping method therefor |
CA2410636A1 (en) | 2000-05-24 | 2001-11-29 | Stephen F. Corbin | Variable melting point solders and brazes |
US6436734B1 (en) | 2000-08-22 | 2002-08-20 | Charles W. C. Lin | Method of making a support circuit for a semiconductor chip assembly |
US6660626B1 (en) | 2000-08-22 | 2003-12-09 | Charles W. C. Lin | Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint |
US6562709B1 (en) | 2000-08-22 | 2003-05-13 | Charles W. C. Lin | Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint |
US6402970B1 (en) | 2000-08-22 | 2002-06-11 | Charles W. C. Lin | Method of making a support circuit for a semiconductor chip assembly |
US6562657B1 (en) | 2000-08-22 | 2003-05-13 | Charles W. C. Lin | Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint |
US6350633B1 (en) | 2000-08-22 | 2002-02-26 | Charles W. C. Lin | Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint |
US6551861B1 (en) | 2000-08-22 | 2003-04-22 | Charles W. C. Lin | Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive |
US6403460B1 (en) | 2000-08-22 | 2002-06-11 | Charles W. C. Lin | Method of making a semiconductor chip assembly |
US6350386B1 (en) | 2000-09-20 | 2002-02-26 | Charles W. C. Lin | Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly |
US6511865B1 (en) | 2000-09-20 | 2003-01-28 | Charles W. C. Lin | Method for forming a ball bond connection joint on a conductive trace and conductive pad in a semiconductor chip assembly |
US6350632B1 (en) | 2000-09-20 | 2002-02-26 | Charles W. C. Lin | Semiconductor chip assembly with ball bond connection joint |
US6544813B1 (en) | 2000-10-02 | 2003-04-08 | Charles W. C. Lin | Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment |
US6448108B1 (en) | 2000-10-02 | 2002-09-10 | Charles W. C. Lin | Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment |
US6740576B1 (en) | 2000-10-13 | 2004-05-25 | Bridge Semiconductor Corporation | Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly |
US6667229B1 (en) | 2000-10-13 | 2003-12-23 | Bridge Semiconductor Corporation | Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip |
US6440835B1 (en) | 2000-10-13 | 2002-08-27 | Charles W. C. Lin | Method of connecting a conductive trace to a semiconductor chip |
US6548393B1 (en) | 2000-10-13 | 2003-04-15 | Charles W. C. Lin | Semiconductor chip assembly with hardened connection joint |
US6576493B1 (en) | 2000-10-13 | 2003-06-10 | Bridge Semiconductor Corporation | Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps |
US6492252B1 (en) | 2000-10-13 | 2002-12-10 | Bridge Semiconductor Corporation | Method of connecting a bumped conductive trace to a semiconductor chip |
US6699780B1 (en) | 2000-10-13 | 2004-03-02 | Bridge Semiconductor Corporation | Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching |
US6576539B1 (en) | 2000-10-13 | 2003-06-10 | Charles W.C. Lin | Semiconductor chip assembly with interlocked conductive trace |
US6537851B1 (en) | 2000-10-13 | 2003-03-25 | Bridge Semiconductor Corporation | Method of connecting a bumped compliant conductive trace to a semiconductor chip |
US6673710B1 (en) | 2000-10-13 | 2004-01-06 | Bridge Semiconductor Corporation | Method of connecting a conductive trace and an insulative base to a semiconductor chip |
US6609651B1 (en) * | 2000-11-20 | 2003-08-26 | Delphi Technologies, Inc | Method of soldering a leaded circuit component |
US6444489B1 (en) | 2000-12-15 | 2002-09-03 | Charles W. C. Lin | Semiconductor chip assembly with bumped molded substrate |
US6653170B1 (en) | 2001-02-06 | 2003-11-25 | Charles W. C. Lin | Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit |
JP3556922B2 (ja) * | 2001-05-07 | 2004-08-25 | 富士通株式会社 | バンプ形成方法 |
US6767411B2 (en) * | 2002-03-15 | 2004-07-27 | Delphi Technologies, Inc. | Lead-free solder alloy and solder reflow process |
US6811892B2 (en) * | 2002-08-22 | 2004-11-02 | Delphi Technologies, Inc. | Lead-based solder alloys containing copper |
US6630251B1 (en) * | 2002-09-23 | 2003-10-07 | Delphi Technologies, Inc. | Leach-resistant solder alloys for silver-based thick-film conductors |
US20040134976A1 (en) * | 2003-01-14 | 2004-07-15 | Frank Keyser | Method and system for solder connecting electrical devices |
US7017795B2 (en) * | 2003-11-03 | 2006-03-28 | Indium Corporation Of America | Solder pastes for providing high elasticity, low rigidity solder joints |
US7993983B1 (en) | 2003-11-17 | 2011-08-09 | Bridge Semiconductor Corporation | Method of making a semiconductor chip assembly with chip and encapsulant grinding |
US7425759B1 (en) | 2003-11-20 | 2008-09-16 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bumped terminal and filler |
US7538415B1 (en) | 2003-11-20 | 2009-05-26 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bumped terminal, filler and insulative base |
US7422141B2 (en) * | 2004-01-22 | 2008-09-09 | Hrl Laboratories, Llc | Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale |
US7287685B2 (en) * | 2004-09-20 | 2007-10-30 | International Business Machines Corporation | Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders |
US7331503B2 (en) * | 2004-10-29 | 2008-02-19 | Intel Corporation | Solder printing process to reduce void formation in a microvia |
US7750483B1 (en) | 2004-11-10 | 2010-07-06 | Bridge Semiconductor Corporation | Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal |
US7781140B2 (en) * | 2006-08-17 | 2010-08-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of fine pitch bump stripping |
US7811863B1 (en) | 2006-10-26 | 2010-10-12 | Bridge Semiconductor Corporation | Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment |
US7767586B2 (en) * | 2007-10-29 | 2010-08-03 | Applied Materials, Inc. | Methods for forming connective elements on integrated circuits for packaging applications |
JP4685081B2 (ja) * | 2007-11-08 | 2011-05-18 | 富士通株式会社 | 電子部品製造方法 |
TW201210733A (en) | 2010-08-26 | 2012-03-16 | Dynajoin Corp | Variable melting point solders |
KR102087004B1 (ko) * | 2012-03-20 | 2020-03-10 | 알파 어셈블리 솔루션스 인크. | 솔더 프리폼과 솔더 합금 조립 방법 |
TWI484610B (zh) * | 2012-07-09 | 2015-05-11 | 矽品精密工業股份有限公司 | 半導體結構之製法與導電凸塊 |
JP6350967B2 (ja) * | 2014-07-09 | 2018-07-04 | 三菱マテリアル株式会社 | 半導体装置及びその製造方法 |
US11581239B2 (en) | 2019-01-18 | 2023-02-14 | Indium Corporation | Lead-free solder paste as thermal interface material |
CN113878260B (zh) * | 2021-09-29 | 2022-10-18 | 江西小山新材料科技有限公司 | 一种水洗高铅焊锡膏及其制备方法 |
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US2623273A (en) * | 1945-05-05 | 1952-12-30 | Indium Corp America | Soldered joint and method of making same |
US4705205A (en) * | 1983-06-30 | 1987-11-10 | Raychem Corporation | Chip carrier mounting device |
ATE48103T1 (de) * | 1984-05-14 | 1989-12-15 | Raychem Corp | Weichlotzusammensetzung. |
US5024372A (en) * | 1989-01-03 | 1991-06-18 | Motorola, Inc. | Method of making high density solder bumps and a substrate socket for high density solder bumps |
US5154341A (en) * | 1990-12-06 | 1992-10-13 | Motorola Inc. | Noncollapsing multisolder interconnection |
JPH0547812A (ja) * | 1991-08-19 | 1993-02-26 | Mitsubishi Electric Corp | 半導体装置 |
US5229070A (en) * | 1992-07-02 | 1993-07-20 | Motorola, Inc. | Low temperature-wetting tin-base solder paste |
US5328521A (en) * | 1993-03-08 | 1994-07-12 | E. I. Du Pont De Nemours And Company | Kinetic solder paste composition |
US5477086A (en) * | 1993-04-30 | 1995-12-19 | Lsi Logic Corporation | Shaped, self-aligning micro-bump structures |
US5382300A (en) * | 1994-03-22 | 1995-01-17 | At&T Corp. | Solder paste mixture |
US5540379A (en) * | 1994-05-02 | 1996-07-30 | Motorola, Inc. | Soldering process |
US5415944A (en) * | 1994-05-02 | 1995-05-16 | Motorola, Inc. | Solder clad substrate |
US5429293A (en) * | 1994-12-19 | 1995-07-04 | Motorola, Inc. | Soldering process |
-
1995
- 1995-09-29 US US08/536,592 patent/US5803340A/en not_active Expired - Lifetime
-
1996
- 1996-08-26 EP EP96202374A patent/EP0769346B1/de not_active Expired - Lifetime
- 1996-08-26 DE DE69618416T patent/DE69618416T2/de not_active Expired - Lifetime
- 1996-09-30 JP JP8259430A patent/JP2960017B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013102742A1 (de) * | 2013-03-18 | 2014-09-18 | Dbk David + Baader Gmbh | Dehnstoffelement und Verfahren |
Also Published As
Publication number | Publication date |
---|---|
DE69618416D1 (de) | 2002-02-14 |
JP2960017B2 (ja) | 1999-10-06 |
EP0769346B1 (de) | 2002-01-09 |
JPH09108884A (ja) | 1997-04-28 |
US5803340A (en) | 1998-09-08 |
EP0769346A1 (de) | 1997-04-23 |
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