DE69401233D1 - Kapillar für ein Drahtschweissgerät und Verfahren zum Formen von elektrischen Verbindungshöckern mittels Kapillares - Google Patents

Kapillar für ein Drahtschweissgerät und Verfahren zum Formen von elektrischen Verbindungshöckern mittels Kapillares

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Publication number
DE69401233D1
DE69401233D1 DE69401233T DE69401233T DE69401233D1 DE 69401233 D1 DE69401233 D1 DE 69401233D1 DE 69401233 T DE69401233 T DE 69401233T DE 69401233 T DE69401233 T DE 69401233T DE 69401233 D1 DE69401233 D1 DE 69401233D1
Authority
DE
Germany
Prior art keywords
capillaries
capillary
welding device
wire welding
forming electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69401233T
Other languages
English (en)
Other versions
DE69401233T2 (de
Inventor
Yoshihiro Tomura
Yoshihiro Bessho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69401233D1 publication Critical patent/DE69401233D1/de
Application granted granted Critical
Publication of DE69401233T2 publication Critical patent/DE69401233T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004Wire welding
    • B23K20/005Capillary welding
    • B23K20/007Ball bonding
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01Chemical elements
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01039Yttrium [Y]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0105Tin [Sn]
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
DE1994601233 1993-04-30 1994-04-27 Kapillar für ein Drahtschweissgerät und Verfahren zum Formen von elektrischen Verbindungshöckern mittels Kapillares Expired - Fee Related DE69401233T2 (de)

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CN1031907C (zh) 1996-05-29
CN1098819A (zh) 1995-02-15
EP0622149A1 (de) 1994-11-02
US5485949A (en) 1996-01-23
KR0137909B1 (ko) 1998-06-01
DE69401233T2 (de) 1997-06-26
EP0622149B1 (de) 1996-12-27

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