DE69132685D1 - Halbleiteranordnung bestehend aus einem TAB-Band und deren Herstellungsverfahren - Google Patents

Halbleiteranordnung bestehend aus einem TAB-Band und deren Herstellungsverfahren

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Publication number
DE69132685D1
DE69132685D1 DE69132685T DE69132685T DE69132685D1 DE 69132685 D1 DE69132685 D1 DE 69132685D1 DE 69132685 T DE69132685 T DE 69132685T DE 69132685 T DE69132685 T DE 69132685T DE 69132685 D1 DE69132685 D1 DE 69132685D1
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Germany
Prior art keywords
manufacturing process
tab tape
semiconductor arrangement
arrangement consisting
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69132685T
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English (en)
Other versions
DE69132685T2 (de
Inventor
Takao Fujitsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
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Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69132685D1 publication Critical patent/DE69132685D1/de
Publication of DE69132685T2 publication Critical patent/DE69132685T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
DE69132685T 1990-06-01 1991-05-31 Halbleiteranordnung bestehend aus einem TAB-Band und deren Herstellungsverfahren Expired - Fee Related DE69132685T2 (de)

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JPH02208957A (ja) * 1989-02-09 1990-08-20 Toshiba Corp 電子機器用封着材料
US4948645A (en) * 1989-08-01 1990-08-14 Rogers Corporation Tape automated bonding and method of making the same

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JP2540652B2 (ja) 1996-10-09
KR970000972B1 (ko) 1997-01-21
EP1020903A1 (de) 2000-07-19
DE69133497D1 (de) 2006-01-19
EP1020903B1 (de) 2005-12-14
EP0459493A2 (de) 1991-12-04
KR920001701A (ko) 1992-01-30
US5654584A (en) 1997-08-05
EP0459493B1 (de) 2001-08-16
DE69132685T2 (de) 2002-06-13
JPH0437149A (ja) 1992-02-07
DE69133497T2 (de) 2006-08-24
EP0459493A3 (de) 1994-02-23

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