DE69131266D1 - Universal Mehrfach-Kontakt-Verbindung zwischen einer EWS-Probekarte und eine Testkarte oder einer Siliciumscheiben-Teststation - Google Patents

Universal Mehrfach-Kontakt-Verbindung zwischen einer EWS-Probekarte und eine Testkarte oder einer Siliciumscheiben-Teststation

Info

Publication number
DE69131266D1
DE69131266D1 DE69131266T DE69131266T DE69131266D1 DE 69131266 D1 DE69131266 D1 DE 69131266D1 DE 69131266 T DE69131266 T DE 69131266T DE 69131266 T DE69131266 T DE 69131266T DE 69131266 D1 DE69131266 D1 DE 69131266D1
Authority
DE
Germany
Prior art keywords
card
ews
silicon wafer
test
contact connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69131266T
Other languages
English (en)
Other versions
DE69131266T2 (de
Inventor
Giuseppe Libretti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
STMicroelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL filed Critical STMicroelectronics SRL
Publication of DE69131266D1 publication Critical patent/DE69131266D1/de
Application granted granted Critical
Publication of DE69131266T2 publication Critical patent/DE69131266T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE69131266T 1990-06-19 1991-06-12 Universal Mehrfach-Kontakt-Verbindung zwischen einer EWS-Probekarte und eine Testkarte oder einer Siliciumscheiben-Teststation Expired - Fee Related DE69131266T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT08362390A IT1243302B (it) 1990-06-19 1990-06-19 Connessione universale multicontatto tra scheda portasonde ews e scheda di prova per una stazione di collaudo su fetta di dispositivi a semiconduttore.

Publications (2)

Publication Number Publication Date
DE69131266D1 true DE69131266D1 (de) 1999-07-01
DE69131266T2 DE69131266T2 (de) 1999-09-23

Family

ID=11323294

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69131266T Expired - Fee Related DE69131266T2 (de) 1990-06-19 1991-06-12 Universal Mehrfach-Kontakt-Verbindung zwischen einer EWS-Probekarte und eine Testkarte oder einer Siliciumscheiben-Teststation

Country Status (6)

Country Link
US (1) US5187431A (de)
EP (1) EP0462944B1 (de)
JP (1) JP3160314B2 (de)
KR (1) KR920001665A (de)
DE (1) DE69131266T2 (de)
IT (1) IT1243302B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5457344A (en) * 1994-03-25 1995-10-10 Bartelink; Dirk J. Test fixtures for C4 solder-bump technology
US5656942A (en) * 1995-07-21 1997-08-12 Electroglas, Inc. Prober and tester with contact interface for integrated circuits-containing wafer held docked in a vertical plane
US6281692B1 (en) * 1998-10-05 2001-08-28 International Business Machines Corporation Interposer for maintaining temporary contact between a substrate and a test bed
JP3486841B2 (ja) * 2000-08-09 2004-01-13 日本電子材料株式会社 垂直型プローブカード
US6667631B2 (en) 2001-12-27 2003-12-23 Stmicroelectronics, Inc. High temperature probe card
US7554347B2 (en) * 2002-03-19 2009-06-30 Georgia Tech Research Corporation High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use
ATE493559T1 (de) * 2002-10-30 2011-01-15 Element Six Pty Ltd Werkzeugeinsatz
US6812720B1 (en) * 2003-04-17 2004-11-02 Chipmos Technologies (Bermuda) Ltd. Modularized probe card with coaxial transmitters
JP5258590B2 (ja) * 2009-01-16 2013-08-07 株式会社日本マイクロニクス 集積回路の試験装置
JP5235163B2 (ja) * 2009-05-18 2013-07-10 株式会社日本マイクロニクス 検査装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3028573A (en) * 1959-05-01 1962-04-03 Automatic Elect Lab Cross-connecting board
US3866119A (en) * 1973-09-10 1975-02-11 Probe Rite Inc Probe head-probing machine coupling adaptor
US4357062A (en) * 1979-12-10 1982-11-02 John Fluke Mfg. Co., Inc. Universal circuit board test fixture
JPS5929151B2 (ja) * 1981-08-03 1984-07-18 日本電子材料株式会社 半導体ウエハ−試験装置
DE8500168U1 (de) * 1985-01-05 1985-05-23 Riba-Prüftechnik GmbH, 7801 Schallstadt Tastnadel für eine Leiterplatten-Prüfeinrichtung
JPS61278768A (ja) * 1985-06-04 1986-12-09 Meiko Denshi Kogyo Kk プリント配線板検査機のインタ−フエ−ス
US4667154A (en) * 1985-06-26 1987-05-19 Lehighton Electronics, Inc. Electrical contact assembly
JPS62105379A (ja) * 1985-11-01 1987-05-15 株式会社日立製作所 コネクタ装置
JPS62113069A (ja) * 1985-11-12 1987-05-23 Hitachi Electronics Eng Co Ltd 取付用部品
US4884024A (en) * 1985-11-19 1989-11-28 Teradyne, Inc. Test pin assembly for circuit board tester
DE3630548A1 (de) * 1986-09-08 1988-03-10 Mania Gmbh Vorrichtung zum elektronischen pruefen von leiterplatten mit kontaktpunkten im 1/20 zoll-raster
DE3721312A1 (de) * 1987-06-27 1989-01-05 List Ingo Verstellbarer universalfederkontaktstift zum kontaktieren von testpunkten mit beliebigen koordinaten von einem vorgegebenen rasterfeld aus
US4859806A (en) * 1988-05-17 1989-08-22 Microelectronics And Computer Technology Corporation Discretionary interconnect

Also Published As

Publication number Publication date
JP3160314B2 (ja) 2001-04-25
DE69131266T2 (de) 1999-09-23
EP0462944B1 (de) 1999-05-26
KR920001665A (ko) 1992-01-30
IT9083623A0 (it) 1990-06-19
US5187431A (en) 1993-02-16
JPH0621167A (ja) 1994-01-28
EP0462944A1 (de) 1991-12-27
IT1243302B (it) 1994-05-26
IT9083623A1 (it) 1991-12-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee