DE69130783T2 - Vorrichtung zur Projecktion eines Maskenmusters auf ein Substrat - Google Patents

Vorrichtung zur Projecktion eines Maskenmusters auf ein Substrat

Info

Publication number
DE69130783T2
DE69130783T2 DE69130783T DE69130783T DE69130783T2 DE 69130783 T2 DE69130783 T2 DE 69130783T2 DE 69130783 T DE69130783 T DE 69130783T DE 69130783 T DE69130783 T DE 69130783T DE 69130783 T2 DE69130783 T2 DE 69130783T2
Authority
DE
Germany
Prior art keywords
projecting
substrate
mask pattern
pattern onto
onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69130783T
Other languages
English (en)
Other versions
DE69130783D1 (de
Inventor
Den Brink Marinus Aart Van
Henk Frederik Dirk Linders
Stefan Wittekoek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Application granted granted Critical
Publication of DE69130783D1 publication Critical patent/DE69130783D1/de
Publication of DE69130783T2 publication Critical patent/DE69130783T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
DE69130783T 1990-07-16 1991-07-05 Vorrichtung zur Projecktion eines Maskenmusters auf ein Substrat Expired - Fee Related DE69130783T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9001611A NL9001611A (nl) 1990-07-16 1990-07-16 Apparaat voor het afbeelden van een maskerpatroon op een substraat.

Publications (2)

Publication Number Publication Date
DE69130783D1 DE69130783D1 (de) 1999-03-04
DE69130783T2 true DE69130783T2 (de) 1999-10-21

Family

ID=19857418

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69130783T Expired - Fee Related DE69130783T2 (de) 1990-07-16 1991-07-05 Vorrichtung zur Projecktion eines Maskenmusters auf ein Substrat

Country Status (6)

Country Link
US (1) US5481362A (de)
EP (1) EP0467445B1 (de)
JP (1) JP3081289B2 (de)
KR (1) KR100306471B1 (de)
DE (1) DE69130783T2 (de)
NL (1) NL9001611A (de)

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US6924884B2 (en) 1999-03-08 2005-08-02 Asml Netherlands B.V. Off-axis leveling in lithographic projection apparatus
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US7068833B1 (en) 2000-08-30 2006-06-27 Kla-Tencor Corporation Overlay marks, methods of overlay mark design and methods of overlay measurements
US7541201B2 (en) 2000-08-30 2009-06-02 Kla-Tencor Technologies Corporation Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
US6489627B1 (en) * 2000-09-29 2002-12-03 Taiwan Semiconductor Manufacturing Co., Ltd Method for inspecting a reticle and apparatus for use therein
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US6904201B1 (en) * 2001-05-09 2005-06-07 Intel Corporation Phase-controlled fiber Bragg gratings and manufacturing methods
US7804994B2 (en) * 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
TW594431B (en) * 2002-03-01 2004-06-21 Asml Netherlands Bv Calibration methods, calibration substrates, lithographic apparatus and device manufacturing methods
EP1341046A3 (de) * 2002-03-01 2004-12-15 ASML Netherlands B.V. Kalibrationsverfahren, Kalibrationssubstrate, lithographischer Apparat und Verfahren zur Herstellung von Artikeln
EP1394616A1 (de) * 2002-08-29 2004-03-03 ASML Netherlands BV Ausrichtgerät, lithographischer Apparat, Ausrichtungsverfahren und Verfahren zur Herstellung einer Vorrichtung
TWI229243B (en) 2002-09-20 2005-03-11 Asml Netherlands Bv Lithographic marker structure, lithographic projection apparatus comprising such a lithographic marker structure and method for substrate alignment using such a lithographic marker structure
US7075639B2 (en) 2003-04-25 2006-07-11 Kla-Tencor Technologies Corporation Method and mark for metrology of phase errors on phase shift masks
US7608468B1 (en) * 2003-07-02 2009-10-27 Kla-Tencor Technologies, Corp. Apparatus and methods for determining overlay and uses of same
US7346878B1 (en) 2003-07-02 2008-03-18 Kla-Tencor Technologies Corporation Apparatus and methods for providing in-chip microtargets for metrology or inspection
US7450217B2 (en) 2005-01-12 2008-11-11 Asml Netherlands B.V. Exposure apparatus, coatings for exposure apparatus, lithographic apparatus, device manufacturing method, and device manufactured thereby
US7557921B1 (en) 2005-01-14 2009-07-07 Kla-Tencor Technologies Corporation Apparatus and methods for optically monitoring the fidelity of patterns produced by photolitographic tools
JP5268239B2 (ja) * 2005-10-18 2013-08-21 キヤノン株式会社 パターン形成装置、パターン形成方法
EP2128832A1 (de) * 2008-05-30 2009-12-02 Robert Bosch GmbH Abdecküberwachungssystem und -verfahren für Bewegungsdetektoren
NL2003363A (en) 2008-09-10 2010-03-15 Asml Netherlands Bv Lithographic apparatus, method of manufacturing an article for a lithographic apparatus and device manufacturing method.
US20100105156A1 (en) * 2008-10-27 2010-04-29 Po-Shen Chen Method of manufacturing light-emitting diode package
KR101650370B1 (ko) * 2009-03-26 2016-08-23 호야 가부시키가이샤 반사형 마스크용 다층 반사막 부착 기판 및 반사형 마스크블랭크 그리고 그것들의 제조방법
NL2005414A (en) * 2009-10-28 2011-05-02 Asml Netherlands Bv Lithographic apparatus and patterning device.
US9927718B2 (en) 2010-08-03 2018-03-27 Kla-Tencor Corporation Multi-layer overlay metrology target and complimentary overlay metrology measurement systems
KR101215094B1 (ko) * 2010-10-25 2012-12-24 삼성전자주식회사 피측정체 정렬장치
CN102486621B (zh) * 2010-12-02 2014-02-19 上海微电子装备有限公司 一种对准调整装置及对准调整方法
US10890436B2 (en) 2011-07-19 2021-01-12 Kla Corporation Overlay targets with orthogonal underlayer dummyfill
US8604417B2 (en) * 2011-08-26 2013-12-10 Baker Hughes Incorporated Targetless pulsed neutron generator using beam-beam interaction
TWI448659B (zh) * 2012-12-27 2014-08-11 Metal Ind Res & Dev Ct Optical image capture module, alignment method and observation method
US9304403B2 (en) * 2013-01-02 2016-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for lithography alignment
US9891540B2 (en) 2014-08-25 2018-02-13 Asml Holding N.V. Measuring method, measurement apparatus, lithographic apparatus and device manufacturing method
US10451412B2 (en) 2016-04-22 2019-10-22 Kla-Tencor Corporation Apparatus and methods for detecting overlay errors using scatterometry
JP7038562B2 (ja) * 2018-02-13 2022-03-18 キヤノン株式会社 検出装置、リソグラフィ装置、および物品の製造方法
CN111061064B (zh) * 2019-12-30 2020-12-15 浙江大学 一种双光束光阱光束辅助对准装置和方法

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NL7606548A (nl) * 1976-06-17 1977-12-20 Philips Nv Werkwijze en inrichting voor het uitrichten van een i.c.-patroon ten opzichte van een halfgelei- dend substraat.
NL186353C (nl) * 1979-06-12 1990-11-01 Philips Nv Inrichting voor het afbeelden van een maskerpatroon op een substraat voorzien van een opto-elektronisch detektiestelsel voor het bepalen van een afwijking tussen het beeldvlak van een projektielenzenstelsel en het substraatvlak.
DD144690A1 (de) * 1979-07-02 1980-10-29 Rainer Dastis Einrichtung zur kompensation der chromatischen laengsabweichung eines projektionsobjektives
US4871257A (en) * 1982-12-01 1989-10-03 Canon Kabushiki Kaisha Optical apparatus for observing patterned article
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US4614433A (en) * 1984-07-09 1986-09-30 At&T Bell Laboratories Mask-to-wafer alignment utilizing zone plates
JPS6139021A (ja) * 1984-07-31 1986-02-25 Canon Inc 光学装置
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NL8601547A (nl) * 1986-06-16 1988-01-18 Philips Nv Optisch litografische inrichting met verplaatsbaar lenzenstelsel en werkwijze voor het regelen van de afbeeldingseigenschappen van een lenzenstelsel in een dergelijke inrichting.
JPH0642448B2 (ja) * 1987-09-30 1994-06-01 株式会社東芝 位置合わせ方法
EP0323242A3 (de) * 1987-12-28 1989-10-18 Kabushiki Kaisha Toshiba Verfahren und Vorrichtung zum Ausrichten von zwei Objekten, und Verfahren und Vorrichtung zum Einstellen eines gewünschten Spaltes zwischen zwei Objekten
NL8900991A (nl) * 1989-04-20 1990-11-16 Asm Lithography Bv Apparaat voor het afbeelden van een maskerpatroon op een substraat.

Also Published As

Publication number Publication date
NL9001611A (nl) 1992-02-17
JP3081289B2 (ja) 2000-08-28
EP0467445B1 (de) 1999-01-20
US5481362A (en) 1996-01-02
EP0467445A1 (de) 1992-01-22
KR100306471B1 (ko) 2001-11-30
DE69130783D1 (de) 1999-03-04
JPH04233218A (ja) 1992-08-21
KR920003456A (ko) 1992-02-29

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication related to discontinuation of the patent is to be deleted
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee