DE69127054T2 - Verfahren zur Herstellung eines Musters und Projektionsbelichtungsapparat - Google Patents

Verfahren zur Herstellung eines Musters und Projektionsbelichtungsapparat

Info

Publication number
DE69127054T2
DE69127054T2 DE69127054T DE69127054T DE69127054T2 DE 69127054 T2 DE69127054 T2 DE 69127054T2 DE 69127054 T DE69127054 T DE 69127054T DE 69127054 T DE69127054 T DE 69127054T DE 69127054 T2 DE69127054 T2 DE 69127054T2
Authority
DE
Germany
Prior art keywords
pattern
making
exposure apparatus
projection exposure
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69127054T
Other languages
English (en)
Other versions
DE69127054D1 (de
Inventor
Hiroshi Fukuda
Tsuneo Terasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE69127054D1 publication Critical patent/DE69127054D1/de
Publication of DE69127054T2 publication Critical patent/DE69127054T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/30Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/29Rim PSM or outrigger PSM; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70125Use of illumination settings tailored to particular mask patterns
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70191Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70241Optical aspects of refractive lens systems, i.e. comprising only refractive elements
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70308Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70325Resolution enhancement techniques not otherwise provided for, e.g. darkfield imaging, interfering beams, spatial frequency multiplication, nearfield lenses or solid immersion lenses
    • G03F7/70333Focus drilling, i.e. increase in depth of focus for exposure by modulating focus during exposure [FLEX]
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
DE69127054T 1990-10-24 1991-09-27 Verfahren zur Herstellung eines Musters und Projektionsbelichtungsapparat Expired - Fee Related DE69127054T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP28422990 1990-10-24
JP1634691 1991-02-07
JP11012791A JP3245882B2 (ja) 1990-10-24 1991-05-15 パターン形成方法、および投影露光装置

Publications (2)

Publication Number Publication Date
DE69127054D1 DE69127054D1 (de) 1997-09-04
DE69127054T2 true DE69127054T2 (de) 1998-01-29

Family

ID=27281368

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69127054T Expired - Fee Related DE69127054T2 (de) 1990-10-24 1991-09-27 Verfahren zur Herstellung eines Musters und Projektionsbelichtungsapparat

Country Status (5)

Country Link
US (3) US5316896A (de)
EP (2) EP0777147A1 (de)
JP (1) JP3245882B2 (de)
KR (1) KR100213605B1 (de)
DE (1) DE69127054T2 (de)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5436114A (en) * 1989-12-06 1995-07-25 Hitachi, Ltd. Method of optical lithography with super resolution and projection printing apparatus
US6020950A (en) * 1992-02-24 2000-02-01 Nikon Corporation Exposure method and projection exposure apparatus
US6404482B1 (en) 1992-10-01 2002-06-11 Nikon Corporation Projection exposure method and apparatus
US5415952A (en) * 1992-10-05 1995-05-16 Fujitsu Limited Fine pattern lithography with positive use of interference
US5739898A (en) * 1993-02-03 1998-04-14 Nikon Corporation Exposure method and apparatus
JP3291849B2 (ja) * 1993-07-15 2002-06-17 株式会社ニコン 露光方法、デバイス形成方法、及び露光装置
US5642183A (en) * 1993-08-27 1997-06-24 Sharp Kabushiki Kaisha Spatial filter used in a reduction-type projection printing apparatus
JP3339174B2 (ja) * 1993-11-08 2002-10-28 ソニー株式会社 フォトマスクの製造方法、露光方法及び半導体装置の製造方法
KR950033689A (ko) * 1994-03-02 1995-12-26 오노 시게오 노광장치 및 이를 이용한 회로패턴 형성방법
KR100377206B1 (ko) * 1994-08-26 2003-06-09 소니 가부시끼 가이샤 패턴형성방법및이방법을이용한반도체디바이스제조방법
JP3297791B2 (ja) * 1994-11-16 2002-07-02 ソニー株式会社 露光方法およびレジストパターン算出方法
KR0158904B1 (ko) * 1994-12-02 1999-02-01 김주용 콘택마스크
US5663785A (en) * 1995-05-24 1997-09-02 International Business Machines Corporation Diffraction pupil filler modified illuminator for annular pupil fills
US5621500A (en) * 1995-05-25 1997-04-15 Nikon Corporation Method and apparatus for projection exposure
JPH09199390A (ja) * 1996-01-16 1997-07-31 Hitachi Ltd パターン形成方法、投影露光装置および半導体装置の製造方法
JP3431387B2 (ja) * 1996-03-14 2003-07-28 株式会社東芝 露光強度分布表示方法とマスクパターン編集装置
EP0806707A1 (de) * 1996-05-08 1997-11-12 Texas Instruments Incorporated Mikrolithographisches Abbildungssystem
US5869212A (en) * 1996-05-31 1999-02-09 Kabushiki Kaisha Toshiba Integrated circuit photofabrication masks and methods for making same
JP3918044B2 (ja) * 1996-11-01 2007-05-23 浜松ホトニクス株式会社 画像形成装置
KR100273234B1 (ko) * 1997-09-30 2000-12-15 김영환 포토리소그래피장치
JP3315658B2 (ja) * 1998-12-28 2002-08-19 キヤノン株式会社 投影装置および露光装置
IL133243A0 (en) 1999-03-30 2001-03-19 Univ Ramot A method and system for super resolution
US6421820B1 (en) * 1999-12-13 2002-07-16 Infineon Technologies Ag Semiconductor device fabrication using a photomask with assist features
US6507389B1 (en) * 2000-04-07 2003-01-14 Promos Technologies, Inc. Photolithography system having a frequency domain filtering mask
WO2001084236A2 (en) * 2000-04-27 2001-11-08 Petersen Advanced Lithography, Inc. Method for phase shift mask design, fabrication, and use
DE10027984B4 (de) * 2000-06-06 2008-10-23 Promos Technologies, Inc. Fotolithografiesystem mit einer Frequenzbereichsfiltermaske
US6344893B1 (en) 2000-06-19 2002-02-05 Ramot University Authority For Applied Research And Industrial Development Ltd. Super-resolving imaging system
JP4671473B2 (ja) * 2000-07-14 2011-04-20 ルネサスエレクトロニクス株式会社 マスクデータ補正装置、転写用マスクの製造方法、および、パターン構造を有する装置の製造方法
NL1015748C2 (nl) * 2000-07-19 2002-01-22 Promos Technologies Inc Fotolithografiesysteem met een filtermasker voor het frequentiebereik.
IL159700A0 (en) * 2001-07-06 2004-06-20 Palantyr Res Llc Imaging system and methodology employing reciprocal space optical design
WO2003038518A1 (en) * 2001-10-30 2003-05-08 Pixelligent Technologies Llc Advanced exposure techniques for programmable lithography
CN1602451A (zh) 2001-11-07 2005-03-30 应用材料有限公司 无掩膜光子电子点格栅阵列光刻机
CN1791839A (zh) 2001-11-07 2006-06-21 应用材料有限公司 光点格栅阵列光刻机
US6906305B2 (en) * 2002-01-08 2005-06-14 Brion Technologies, Inc. System and method for aerial image sensing
US6670646B2 (en) 2002-02-11 2003-12-30 Infineon Technologies Ag Mask and method for patterning a semiconductor wafer
DE10218989A1 (de) * 2002-04-24 2003-11-06 Zeiss Carl Smt Ag Projektionsverfahren und Projektionssystem mit optischer Filterung
DE10220324A1 (de) 2002-04-29 2003-11-13 Zeiss Carl Smt Ag Projektionsverfahren mit Pupillenfilterung und Projektionsobjektiv hierfür
KR100866702B1 (ko) * 2002-05-20 2008-11-03 주식회사 하이닉스반도체 반도체 노광장비의 유효광원 형상 추출방법
US6828542B2 (en) 2002-06-07 2004-12-07 Brion Technologies, Inc. System and method for lithography process monitoring and control
US6807503B2 (en) 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication
US6759297B1 (en) 2003-02-28 2004-07-06 Union Semiconductor Technology Corporatin Low temperature deposition of dielectric materials in magnetoresistive random access memory devices
US7053355B2 (en) 2003-03-18 2006-05-30 Brion Technologies, Inc. System and method for lithography process monitoring and control
US7198873B2 (en) * 2003-11-18 2007-04-03 Asml Netherlands B.V. Lithographic processing optimization based on hypersampled correlations
DE102004011733A1 (de) * 2004-03-04 2005-09-22 Carl Zeiss Smt Ag Transmissionsfiltervorrichtung
US20050287483A1 (en) * 2004-06-23 2005-12-29 International Business Machines Corporation Contact hole printing method and apparatus with single mask, multiple exposures, and optimized pupil filtering
US20060183057A1 (en) * 2005-02-11 2006-08-17 Katsuhiko Mitani Patterning method
US7519940B2 (en) * 2005-05-02 2009-04-14 Cadence Design Systems, Inc. Apparatus and method for compensating a lithography projection tool
US7934172B2 (en) * 2005-08-08 2011-04-26 Micronic Laser Systems Ab SLM lithography: printing to below K1=.30 without previous OPC processing
WO2007018464A2 (en) * 2005-08-08 2007-02-15 Micronic Laser Systems Ab Method and apparatus for projection printing
US20070121090A1 (en) * 2005-11-30 2007-05-31 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5299937B2 (ja) 2006-05-18 2013-09-25 カール・ツァイス・エスエムティー・ゲーエムベーハー 光近接効果を補正する方法
US7546573B1 (en) * 2006-06-06 2009-06-09 Kla-Tencor Corporation Semiconductor device pattern generation
DE102008001216A1 (de) * 2007-04-18 2008-10-23 Carl Zeiss Smt Ag Projektionsobjektiv für die Mikrolithographie
JP5365353B2 (ja) * 2009-06-08 2013-12-11 凸版印刷株式会社 濃度分布マスク
KR101603859B1 (ko) * 2011-12-30 2016-03-16 인텔 코포레이션 프로세스 최적화를 위한 위상 조정 기법들
US9261793B2 (en) 2012-09-14 2016-02-16 Globalfoundries Inc. Image optimization using pupil filters in projecting printing systems with fixed or restricted illumination angular distribution
CN108051879B (zh) * 2012-11-21 2020-09-08 3M创新有限公司 光学扩散膜及其制备方法
JP2015007725A (ja) * 2013-06-26 2015-01-15 株式会社フォトニックラティス 光学的結像装置
US9964850B2 (en) * 2014-07-31 2018-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Method to mitigate defect printability for ID pattern
JP2019012280A (ja) * 2018-09-19 2019-01-24 Hoya株式会社 フォトマスク、フォトマスクの製造方法、フォトマスクブランク及び表示装置の製造方法
CN111060431B (zh) * 2020-01-09 2020-12-25 北京航空航天大学 一种机载被动进气特种污染实时快速监测系统
KR20220029480A (ko) 2020-09-01 2022-03-08 캐논 가부시끼가이샤 노광 장치, 노광 방법, 및 반도체 장치의 제조방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4389092A (en) * 1980-07-29 1983-06-21 Honeywell Inc. High speed ambiguity function evaluation by optical processing utilizing a space variant linear phase shifter
US4370405A (en) * 1981-03-30 1983-01-25 Hewlett-Packard Company Multilayer photoresist process utilizing an absorbant dye
US4496216A (en) * 1982-12-30 1985-01-29 Polaroid Corporation Method and apparatus for exposing photosensitive material
JPS6141150A (ja) * 1984-08-02 1986-02-27 Matsushita Electric Ind Co Ltd 露光装置
JPH0614508B2 (ja) * 1985-03-06 1994-02-23 キヤノン株式会社 ステップアンドリピート露光方法
US4750801A (en) * 1985-09-30 1988-06-14 American Telephone And Telegraph Company, At&T Bell Laboratories Optical waveguide resonator filters
GB8602482D0 (en) * 1986-01-31 1986-03-05 Crosfield Electronics Ltd Controlling radiation beam diameters
JPS62212617A (ja) * 1986-03-14 1987-09-18 Olympus Optical Co Ltd 結像光学系
US4902899A (en) * 1987-06-01 1990-02-20 International Business Machines Corporation Lithographic process having improved image quality
JP2702183B2 (ja) * 1988-11-04 1998-01-21 富士通株式会社 半導体製造装置
JP2710967B2 (ja) * 1988-11-22 1998-02-10 株式会社日立製作所 集積回路装置の製造方法
US4997746A (en) * 1988-11-22 1991-03-05 Greco Nancy A Method of forming conductive lines and studs
US5003567A (en) * 1989-02-09 1991-03-26 Hawryluk Andrew M Soft x-ray reduction camera for submicron lithography

Also Published As

Publication number Publication date
JP3245882B2 (ja) 2002-01-15
US5595857A (en) 1997-01-21
KR920008870A (ko) 1992-05-28
EP0485062B1 (de) 1997-07-30
US5316896A (en) 1994-05-31
EP0485062A2 (de) 1992-05-13
EP0485062A3 (en) 1993-04-28
EP0777147A1 (de) 1997-06-04
KR100213605B1 (ko) 1999-08-02
JPH04348017A (ja) 1992-12-03
US5418598A (en) 1995-05-23
DE69127054D1 (de) 1997-09-04

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