DE69028274D1 - Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung - Google Patents
Automatische mit hoher Geschwindigkeit arbeitende optische PrüfungsvorrichtungInfo
- Publication number
- DE69028274D1 DE69028274D1 DE69028274T DE69028274T DE69028274D1 DE 69028274 D1 DE69028274 D1 DE 69028274D1 DE 69028274 T DE69028274 T DE 69028274T DE 69028274 T DE69028274 T DE 69028274T DE 69028274 D1 DE69028274 D1 DE 69028274D1
- Authority
- DE
- Germany
- Prior art keywords
- high speed
- inspection device
- optical inspection
- speed optical
- automatic high
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007689 inspection Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/8901—Optical details; Scanning details
- G01N2021/8905—Directional selective optics, e.g. slits, spatial filters
- G01N2021/8907—Cylindrical optics
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/8901—Optical details; Scanning details
- G01N2021/8908—Strip illuminator, e.g. light tube
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
- G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
- G01N2201/06126—Large diffuse sources
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/429,859 US5131755A (en) | 1988-02-19 | 1989-10-31 | Automatic high speed optical inspection system |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69028274D1 true DE69028274D1 (de) | 1996-10-02 |
DE69028274T2 DE69028274T2 (de) | 1997-04-17 |
Family
ID=23705015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69028274T Expired - Fee Related DE69028274T2 (de) | 1989-10-31 | 1990-10-31 | Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung |
Country Status (5)
Country | Link |
---|---|
US (1) | US5131755A (de) |
EP (1) | EP0426166B1 (de) |
JP (1) | JPH03160348A (de) |
DE (1) | DE69028274T2 (de) |
IL (1) | IL96010A (de) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL99823A0 (en) * | 1990-11-16 | 1992-08-18 | Orbot Instr Ltd | Optical inspection method and apparatus |
US5590060A (en) * | 1992-03-20 | 1996-12-31 | Metronics, Inc. | Apparatus and method for an object measurement system |
US5825945A (en) * | 1992-05-15 | 1998-10-20 | Unisys Corp | Document imaging with illumination from lambertian surfaces |
EP0767361B1 (de) * | 1993-07-22 | 2000-02-23 | Applied Spectral Imaging Ltd. | Verfahren und Vorrichtung zur Spektralen Bilderfassung |
US5544256A (en) * | 1993-10-22 | 1996-08-06 | International Business Machines Corporation | Automated defect classification system |
JPH07270119A (ja) * | 1994-03-21 | 1995-10-20 | Nikon Corp | 集積回路リソグラフィー用の蛍光使用の直接レチクル対ウエハ・アライメントの方法及び装置 |
DE4434474C2 (de) * | 1994-09-27 | 2000-06-15 | Basler Ag | Verfahren und Vorrichtung zur vollständigen optischen Qualitätskontrolle von Gegenständen |
DE4434473A1 (de) * | 1994-09-27 | 1996-03-28 | Basler Gmbh | Verfahren und Vorrichtung zur Qualitätskontrolle von Gegenständen mit polarisiertem Licht |
US5774222A (en) * | 1994-10-07 | 1998-06-30 | Hitachi, Ltd. | Manufacturing method of semiconductor substrative and method and apparatus for inspecting defects of patterns on an object to be inspected |
JP3570815B2 (ja) * | 1996-04-26 | 2004-09-29 | 松下電器産業株式会社 | 部品実装機用画像撮像装置 |
TW461008B (en) * | 1997-01-13 | 2001-10-21 | Schlumberger Technologies Inc | Method and apparatus for detecting defects in wafers |
EP0930498A3 (de) * | 1997-12-26 | 1999-11-17 | Nidek Co., Ltd. | Prüfeinrichtung und Verfahren zum Erfassen von Fehlstellen |
WO1999041621A2 (en) * | 1998-02-13 | 1999-08-19 | Scientific Generics Limited | Circuit board assembly inspection |
US6137570A (en) * | 1998-06-30 | 2000-10-24 | Kla-Tencor Corporation | System and method for analyzing topological features on a surface |
US6324298B1 (en) | 1998-07-15 | 2001-11-27 | August Technology Corp. | Automated wafer defect inspection system and a process of performing such inspection |
US6476913B1 (en) * | 1998-11-30 | 2002-11-05 | Hitachi, Ltd. | Inspection method, apparatus and system for circuit pattern |
FR2786499B1 (fr) * | 1998-11-30 | 2002-02-08 | Intelligence Artificielle Appl | Appareil de lecture automatique d'un antibiogramme a contraste ameliore |
JP2000249661A (ja) * | 1999-03-01 | 2000-09-14 | Topcon Corp | 光学測定装置 |
DE60031349T2 (de) | 1999-11-18 | 2007-05-24 | Fuji Photo Film Co., Ltd., Minami-Ashigara | Verfahren und Vorrichtung zur Erzeugung von Fluoreszenzbildern |
US6616332B1 (en) | 1999-11-18 | 2003-09-09 | Sensarray Corporation | Optical techniques for measuring parameters such as temperature across a surface |
US6407810B1 (en) * | 2000-03-10 | 2002-06-18 | Robotic Vision Systems, Inc. | Imaging system |
JP2001343336A (ja) * | 2000-05-31 | 2001-12-14 | Nidek Co Ltd | 欠陥検査方法及び欠陥検査装置 |
US6760471B1 (en) * | 2000-06-23 | 2004-07-06 | Teradyne, Inc. | Compensation system and related techniques for use in a printed circuit board inspection system |
US6864498B2 (en) * | 2001-05-11 | 2005-03-08 | Orbotech Ltd. | Optical inspection system employing a staring array scanner |
DE60229740D1 (de) | 2001-05-15 | 2008-12-18 | Ebara Corp | Kontakthülse und durchkoppelgerät |
US7009163B2 (en) * | 2001-06-22 | 2006-03-07 | Orbotech Ltd. | High-sensitivity optical scanning using memory integration |
JP2003016463A (ja) * | 2001-07-05 | 2003-01-17 | Toshiba Corp | 図形の輪郭の抽出方法、パターン検査方法、パターン検査装置、プログラムおよびこれを格納したコンピュータ読み取り可能な記録媒体 |
GB2384852A (en) * | 2001-09-03 | 2003-08-06 | Millennium Venture Holdings Lt | Workpiece inspection apparatus |
DE10146583A1 (de) * | 2001-09-21 | 2003-04-17 | Siemens Ag | Vorrichtung und Verfahren zum optischen Abtasten einer Substratscheibe |
US6834855B2 (en) * | 2001-10-09 | 2004-12-28 | Edward J. Mancuso | Dice scanner |
US7126681B1 (en) * | 2002-04-23 | 2006-10-24 | Kla-Tencor Technologies Corporation | Closed region defect detection system |
US7009695B2 (en) * | 2003-04-01 | 2006-03-07 | Applied Materials, Inc. | Full frame thermal pump probe technique for detecting subsurface defects |
KR100598096B1 (ko) * | 2003-12-01 | 2006-07-07 | 삼성전자주식회사 | 패턴 검사 장치 및 검사 방법 |
DE102005031647A1 (de) | 2005-07-06 | 2007-01-11 | Chromasens Gmbh | Beleuchtungsvorrichtung zur Dunkelfeldbeleuchtung für eine optische Testvorrichtung und Verfahren zum optischen Abtasten eines Objektes |
EP1744147B1 (de) | 2005-07-13 | 2009-12-09 | Audi Ag | Verfahren und Vorrichtung zur optischen Prüfung von Carbon-Keramik-Brems- und Kupplungskomponenten |
US9121843B2 (en) | 2007-05-08 | 2015-09-01 | Trustees Of Boston University | Chemical functionalization of solid-state nanopores and nanopore arrays and applications thereof |
US20090153814A1 (en) * | 2007-12-12 | 2009-06-18 | Langrel Charles B | Self-cleaning scan head assembly |
EP2403396B1 (de) * | 2009-03-04 | 2019-08-14 | Elie Meimoun | Vorrichtung und verfahren zur überprüfung von wellenfrontanalysen |
WO2011040996A1 (en) | 2009-09-30 | 2011-04-07 | Quantapore, Inc. | Ultrafast sequencing of biological polymers using a labeled nanopore |
US20110090489A1 (en) * | 2009-10-21 | 2011-04-21 | Robert Bishop | Method and Apparatus for Detecting Small Reflectivity Variations in Electronic Parts at High Speed |
US8964088B2 (en) | 2011-09-28 | 2015-02-24 | Semiconductor Components Industries, Llc | Time-delay-and-integrate image sensors having variable intergration times |
JP6289450B2 (ja) * | 2012-05-09 | 2018-03-07 | シーゲイト テクノロジー エルエルシーSeagate Technology LLC | 表面特徴マッピング |
US9212900B2 (en) | 2012-08-11 | 2015-12-15 | Seagate Technology Llc | Surface features characterization |
US9297751B2 (en) | 2012-10-05 | 2016-03-29 | Seagate Technology Llc | Chemical characterization of surface features |
US9297759B2 (en) | 2012-10-05 | 2016-03-29 | Seagate Technology Llc | Classification of surface features using fluorescence |
US9377394B2 (en) | 2012-10-16 | 2016-06-28 | Seagate Technology Llc | Distinguishing foreign surface features from native surface features |
US9651539B2 (en) | 2012-10-28 | 2017-05-16 | Quantapore, Inc. | Reducing background fluorescence in MEMS materials by low energy ion beam treatment |
US9217714B2 (en) | 2012-12-06 | 2015-12-22 | Seagate Technology Llc | Reflective surfaces for surface features of an article |
CN103163155B (zh) * | 2013-02-26 | 2016-01-20 | 上海大学 | 一种键盘缺陷检测装置及方法 |
CN105283560B (zh) | 2013-05-24 | 2018-11-30 | 昆塔波尔公司 | 基于纳米孔的通过混合的fret检测的核酸分析 |
US9513215B2 (en) | 2013-05-30 | 2016-12-06 | Seagate Technology Llc | Surface features by azimuthal angle |
US9217715B2 (en) | 2013-05-30 | 2015-12-22 | Seagate Technology Llc | Apparatuses and methods for magnetic features of articles |
US9274064B2 (en) | 2013-05-30 | 2016-03-01 | Seagate Technology Llc | Surface feature manager |
US9201019B2 (en) | 2013-05-30 | 2015-12-01 | Seagate Technology Llc | Article edge inspection |
JP2015175607A (ja) * | 2014-03-13 | 2015-10-05 | 株式会社Screenホールディングス | 画像取得装置および検査装置 |
US9870669B2 (en) * | 2014-04-24 | 2018-01-16 | Orell Füssli Sicherheitsdruck Ag | Security device for security document |
CA2963604C (en) | 2014-10-10 | 2023-02-14 | Quantapore, Inc. | Nanopore-based polymer analysis with mutually-quenching fluorescent labels |
CA2964790C (en) | 2014-10-24 | 2023-02-21 | Quantapore, Inc. | Efficient optical analysis of polymers using arrays of nanostructures |
WO2018009346A1 (en) | 2016-07-05 | 2018-01-11 | Quantapore, Inc. | Optically based nanopore sequencing |
JP6568245B2 (ja) * | 2018-01-24 | 2019-08-28 | Ckd株式会社 | 検査装置、ptp包装機、及び、検査装置の較正方法 |
US10290091B1 (en) | 2018-07-06 | 2019-05-14 | Arevo, Inc. | Filament inspection system |
KR102518783B1 (ko) * | 2022-06-23 | 2023-04-06 | 큐알티 주식회사 | 적응적 변형이 가능한 빔 제어기, 이를 이용한 반도체 소자의 테스트 장치, 및 이를 이용한 반도체 소자의 테스트 방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3909602A (en) * | 1973-09-27 | 1975-09-30 | California Inst Of Techn | Automatic visual inspection system for microelectronics |
US3963354A (en) * | 1975-05-05 | 1976-06-15 | Bell Telephone Laboratories, Incorporated | Inspection of masks and wafers by image dissection |
JPS6017044B2 (ja) * | 1979-07-23 | 1985-04-30 | 株式会社日立製作所 | 印刷配線板のパタ−ン検査装置 |
EP0124113B1 (de) * | 1983-04-28 | 1989-03-01 | Hitachi, Ltd. | Verfahren und Einrichtung zur Feststellung von Fehlern in Mustern |
DE3422395A1 (de) * | 1983-06-16 | 1985-01-17 | Hitachi, Ltd., Tokio/Tokyo | Verfahren und vorrichtung zum ermitteln von verdrahtungsmustern |
JPH0750664B2 (ja) * | 1983-06-23 | 1995-05-31 | 富士通株式会社 | レチクルの検査方法 |
EP0162120B1 (de) * | 1984-05-14 | 1988-12-07 | Ibm Deutschland Gmbh | Verfahren und Einrichtung zur Oberflächenprüfung |
JPS60263807A (ja) * | 1984-06-12 | 1985-12-27 | Dainippon Screen Mfg Co Ltd | プリント配線板のパタ−ン欠陥検査装置 |
JPS61213612A (ja) * | 1985-03-19 | 1986-09-22 | Hitachi Ltd | プリント基板のパタ−ン検査装置 |
US4806774A (en) * | 1987-06-08 | 1989-02-21 | Insystems, Inc. | Inspection system for array of microcircuit dies having redundant circuit patterns |
US4877326A (en) * | 1988-02-19 | 1989-10-31 | Kla Instruments Corporation | Method and apparatus for optical inspection of substrates |
US4949172A (en) * | 1988-09-26 | 1990-08-14 | Picker International, Inc. | Dual-mode TDI/raster-scan television camera system |
-
1989
- 1989-10-31 US US07/429,859 patent/US5131755A/en not_active Expired - Lifetime
-
1990
- 1990-10-15 IL IL96010A patent/IL96010A/xx active IP Right Review Request
- 1990-10-31 JP JP2297022A patent/JPH03160348A/ja active Pending
- 1990-10-31 EP EP90120932A patent/EP0426166B1/de not_active Expired - Lifetime
- 1990-10-31 DE DE69028274T patent/DE69028274T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0426166B1 (de) | 1996-08-28 |
IL96010A0 (en) | 1991-07-18 |
EP0426166A2 (de) | 1991-05-08 |
EP0426166A3 (en) | 1992-01-08 |
DE69028274T2 (de) | 1997-04-17 |
US5131755A (en) | 1992-07-21 |
JPH03160348A (ja) | 1991-07-10 |
IL96010A (en) | 1993-06-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |