DE69028274D1 - Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung - Google Patents

Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung

Info

Publication number
DE69028274D1
DE69028274D1 DE69028274T DE69028274T DE69028274D1 DE 69028274 D1 DE69028274 D1 DE 69028274D1 DE 69028274 T DE69028274 T DE 69028274T DE 69028274 T DE69028274 T DE 69028274T DE 69028274 D1 DE69028274 D1 DE 69028274D1
Authority
DE
Germany
Prior art keywords
high speed
inspection device
optical inspection
speed optical
automatic high
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69028274T
Other languages
English (en)
Other versions
DE69028274T2 (de
Inventor
Curt H Chadwick
Robert H Sholes
John D Greene
Francis D Tucker Iii
Michael E Fein
P C Jann
David J Harvey
William Bell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Instruments Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Instruments Corp filed Critical KLA Instruments Corp
Application granted granted Critical
Publication of DE69028274D1 publication Critical patent/DE69028274D1/de
Publication of DE69028274T2 publication Critical patent/DE69028274T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95607Inspecting patterns on the surface of objects using a comparative method
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/89Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901Optical details; Scanning details
    • G01N2021/8905Directional selective optics, e.g. slits, spatial filters
    • G01N2021/8907Cylindrical optics
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/89Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901Optical details; Scanning details
    • G01N2021/8908Strip illuminator, e.g. light tube
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95607Inspecting patterns on the surface of objects using a comparative method
    • G01N2021/95615Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/06Illumination; Optics
    • G01N2201/061Sources
    • G01N2201/06126Large diffuse sources
DE69028274T 1989-10-31 1990-10-31 Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung Expired - Fee Related DE69028274T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/429,859 US5131755A (en) 1988-02-19 1989-10-31 Automatic high speed optical inspection system

Publications (2)

Publication Number Publication Date
DE69028274D1 true DE69028274D1 (de) 1996-10-02
DE69028274T2 DE69028274T2 (de) 1997-04-17

Family

ID=23705015

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69028274T Expired - Fee Related DE69028274T2 (de) 1989-10-31 1990-10-31 Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung

Country Status (5)

Country Link
US (1) US5131755A (de)
EP (1) EP0426166B1 (de)
JP (1) JPH03160348A (de)
DE (1) DE69028274T2 (de)
IL (1) IL96010A (de)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL99823A0 (en) * 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
US5590060A (en) * 1992-03-20 1996-12-31 Metronics, Inc. Apparatus and method for an object measurement system
US5825945A (en) * 1992-05-15 1998-10-20 Unisys Corp Document imaging with illumination from lambertian surfaces
EP0767361B1 (de) * 1993-07-22 2000-02-23 Applied Spectral Imaging Ltd. Verfahren und Vorrichtung zur Spektralen Bilderfassung
US5544256A (en) * 1993-10-22 1996-08-06 International Business Machines Corporation Automated defect classification system
JPH07270119A (ja) * 1994-03-21 1995-10-20 Nikon Corp 集積回路リソグラフィー用の蛍光使用の直接レチクル対ウエハ・アライメントの方法及び装置
DE4434474C2 (de) * 1994-09-27 2000-06-15 Basler Ag Verfahren und Vorrichtung zur vollständigen optischen Qualitätskontrolle von Gegenständen
DE4434473A1 (de) * 1994-09-27 1996-03-28 Basler Gmbh Verfahren und Vorrichtung zur Qualitätskontrolle von Gegenständen mit polarisiertem Licht
US5774222A (en) * 1994-10-07 1998-06-30 Hitachi, Ltd. Manufacturing method of semiconductor substrative and method and apparatus for inspecting defects of patterns on an object to be inspected
JP3570815B2 (ja) * 1996-04-26 2004-09-29 松下電器産業株式会社 部品実装機用画像撮像装置
TW461008B (en) * 1997-01-13 2001-10-21 Schlumberger Technologies Inc Method and apparatus for detecting defects in wafers
EP0930498A3 (de) * 1997-12-26 1999-11-17 Nidek Co., Ltd. Prüfeinrichtung und Verfahren zum Erfassen von Fehlstellen
WO1999041621A2 (en) * 1998-02-13 1999-08-19 Scientific Generics Limited Circuit board assembly inspection
US6137570A (en) * 1998-06-30 2000-10-24 Kla-Tencor Corporation System and method for analyzing topological features on a surface
US6324298B1 (en) 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US6476913B1 (en) * 1998-11-30 2002-11-05 Hitachi, Ltd. Inspection method, apparatus and system for circuit pattern
FR2786499B1 (fr) * 1998-11-30 2002-02-08 Intelligence Artificielle Appl Appareil de lecture automatique d'un antibiogramme a contraste ameliore
JP2000249661A (ja) * 1999-03-01 2000-09-14 Topcon Corp 光学測定装置
DE60031349T2 (de) 1999-11-18 2007-05-24 Fuji Photo Film Co., Ltd., Minami-Ashigara Verfahren und Vorrichtung zur Erzeugung von Fluoreszenzbildern
US6616332B1 (en) 1999-11-18 2003-09-09 Sensarray Corporation Optical techniques for measuring parameters such as temperature across a surface
US6407810B1 (en) * 2000-03-10 2002-06-18 Robotic Vision Systems, Inc. Imaging system
JP2001343336A (ja) * 2000-05-31 2001-12-14 Nidek Co Ltd 欠陥検査方法及び欠陥検査装置
US6760471B1 (en) * 2000-06-23 2004-07-06 Teradyne, Inc. Compensation system and related techniques for use in a printed circuit board inspection system
US6864498B2 (en) * 2001-05-11 2005-03-08 Orbotech Ltd. Optical inspection system employing a staring array scanner
DE60229740D1 (de) 2001-05-15 2008-12-18 Ebara Corp Kontakthülse und durchkoppelgerät
US7009163B2 (en) * 2001-06-22 2006-03-07 Orbotech Ltd. High-sensitivity optical scanning using memory integration
JP2003016463A (ja) * 2001-07-05 2003-01-17 Toshiba Corp 図形の輪郭の抽出方法、パターン検査方法、パターン検査装置、プログラムおよびこれを格納したコンピュータ読み取り可能な記録媒体
GB2384852A (en) * 2001-09-03 2003-08-06 Millennium Venture Holdings Lt Workpiece inspection apparatus
DE10146583A1 (de) * 2001-09-21 2003-04-17 Siemens Ag Vorrichtung und Verfahren zum optischen Abtasten einer Substratscheibe
US6834855B2 (en) * 2001-10-09 2004-12-28 Edward J. Mancuso Dice scanner
US7126681B1 (en) * 2002-04-23 2006-10-24 Kla-Tencor Technologies Corporation Closed region defect detection system
US7009695B2 (en) * 2003-04-01 2006-03-07 Applied Materials, Inc. Full frame thermal pump probe technique for detecting subsurface defects
KR100598096B1 (ko) * 2003-12-01 2006-07-07 삼성전자주식회사 패턴 검사 장치 및 검사 방법
DE102005031647A1 (de) 2005-07-06 2007-01-11 Chromasens Gmbh Beleuchtungsvorrichtung zur Dunkelfeldbeleuchtung für eine optische Testvorrichtung und Verfahren zum optischen Abtasten eines Objektes
EP1744147B1 (de) 2005-07-13 2009-12-09 Audi Ag Verfahren und Vorrichtung zur optischen Prüfung von Carbon-Keramik-Brems- und Kupplungskomponenten
US9121843B2 (en) 2007-05-08 2015-09-01 Trustees Of Boston University Chemical functionalization of solid-state nanopores and nanopore arrays and applications thereof
US20090153814A1 (en) * 2007-12-12 2009-06-18 Langrel Charles B Self-cleaning scan head assembly
EP2403396B1 (de) * 2009-03-04 2019-08-14 Elie Meimoun Vorrichtung und verfahren zur überprüfung von wellenfrontanalysen
WO2011040996A1 (en) 2009-09-30 2011-04-07 Quantapore, Inc. Ultrafast sequencing of biological polymers using a labeled nanopore
US20110090489A1 (en) * 2009-10-21 2011-04-21 Robert Bishop Method and Apparatus for Detecting Small Reflectivity Variations in Electronic Parts at High Speed
US8964088B2 (en) 2011-09-28 2015-02-24 Semiconductor Components Industries, Llc Time-delay-and-integrate image sensors having variable intergration times
JP6289450B2 (ja) * 2012-05-09 2018-03-07 シーゲイト テクノロジー エルエルシーSeagate Technology LLC 表面特徴マッピング
US9212900B2 (en) 2012-08-11 2015-12-15 Seagate Technology Llc Surface features characterization
US9297751B2 (en) 2012-10-05 2016-03-29 Seagate Technology Llc Chemical characterization of surface features
US9297759B2 (en) 2012-10-05 2016-03-29 Seagate Technology Llc Classification of surface features using fluorescence
US9377394B2 (en) 2012-10-16 2016-06-28 Seagate Technology Llc Distinguishing foreign surface features from native surface features
US9651539B2 (en) 2012-10-28 2017-05-16 Quantapore, Inc. Reducing background fluorescence in MEMS materials by low energy ion beam treatment
US9217714B2 (en) 2012-12-06 2015-12-22 Seagate Technology Llc Reflective surfaces for surface features of an article
CN103163155B (zh) * 2013-02-26 2016-01-20 上海大学 一种键盘缺陷检测装置及方法
CN105283560B (zh) 2013-05-24 2018-11-30 昆塔波尔公司 基于纳米孔的通过混合的fret检测的核酸分析
US9513215B2 (en) 2013-05-30 2016-12-06 Seagate Technology Llc Surface features by azimuthal angle
US9217715B2 (en) 2013-05-30 2015-12-22 Seagate Technology Llc Apparatuses and methods for magnetic features of articles
US9274064B2 (en) 2013-05-30 2016-03-01 Seagate Technology Llc Surface feature manager
US9201019B2 (en) 2013-05-30 2015-12-01 Seagate Technology Llc Article edge inspection
JP2015175607A (ja) * 2014-03-13 2015-10-05 株式会社Screenホールディングス 画像取得装置および検査装置
US9870669B2 (en) * 2014-04-24 2018-01-16 Orell Füssli Sicherheitsdruck Ag Security device for security document
CA2963604C (en) 2014-10-10 2023-02-14 Quantapore, Inc. Nanopore-based polymer analysis with mutually-quenching fluorescent labels
CA2964790C (en) 2014-10-24 2023-02-21 Quantapore, Inc. Efficient optical analysis of polymers using arrays of nanostructures
WO2018009346A1 (en) 2016-07-05 2018-01-11 Quantapore, Inc. Optically based nanopore sequencing
JP6568245B2 (ja) * 2018-01-24 2019-08-28 Ckd株式会社 検査装置、ptp包装機、及び、検査装置の較正方法
US10290091B1 (en) 2018-07-06 2019-05-14 Arevo, Inc. Filament inspection system
KR102518783B1 (ko) * 2022-06-23 2023-04-06 큐알티 주식회사 적응적 변형이 가능한 빔 제어기, 이를 이용한 반도체 소자의 테스트 장치, 및 이를 이용한 반도체 소자의 테스트 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909602A (en) * 1973-09-27 1975-09-30 California Inst Of Techn Automatic visual inspection system for microelectronics
US3963354A (en) * 1975-05-05 1976-06-15 Bell Telephone Laboratories, Incorporated Inspection of masks and wafers by image dissection
JPS6017044B2 (ja) * 1979-07-23 1985-04-30 株式会社日立製作所 印刷配線板のパタ−ン検査装置
EP0124113B1 (de) * 1983-04-28 1989-03-01 Hitachi, Ltd. Verfahren und Einrichtung zur Feststellung von Fehlern in Mustern
DE3422395A1 (de) * 1983-06-16 1985-01-17 Hitachi, Ltd., Tokio/Tokyo Verfahren und vorrichtung zum ermitteln von verdrahtungsmustern
JPH0750664B2 (ja) * 1983-06-23 1995-05-31 富士通株式会社 レチクルの検査方法
EP0162120B1 (de) * 1984-05-14 1988-12-07 Ibm Deutschland Gmbh Verfahren und Einrichtung zur Oberflächenprüfung
JPS60263807A (ja) * 1984-06-12 1985-12-27 Dainippon Screen Mfg Co Ltd プリント配線板のパタ−ン欠陥検査装置
JPS61213612A (ja) * 1985-03-19 1986-09-22 Hitachi Ltd プリント基板のパタ−ン検査装置
US4806774A (en) * 1987-06-08 1989-02-21 Insystems, Inc. Inspection system for array of microcircuit dies having redundant circuit patterns
US4877326A (en) * 1988-02-19 1989-10-31 Kla Instruments Corporation Method and apparatus for optical inspection of substrates
US4949172A (en) * 1988-09-26 1990-08-14 Picker International, Inc. Dual-mode TDI/raster-scan television camera system

Also Published As

Publication number Publication date
EP0426166B1 (de) 1996-08-28
IL96010A0 (en) 1991-07-18
EP0426166A2 (de) 1991-05-08
EP0426166A3 (en) 1992-01-08
DE69028274T2 (de) 1997-04-17
US5131755A (en) 1992-07-21
JPH03160348A (ja) 1991-07-10
IL96010A (en) 1993-06-10

Similar Documents

Publication Publication Date Title
DE69028274D1 (de) Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung
DE69029561D1 (de) Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung und Verfahren
DE69128103D1 (de) Optische Vorrichtung
DE69129817D1 (de) Optische Vorrichtung
DE69131485T2 (de) Optische vorrichtung
DE3883683D1 (de) Optische Oberflächen-Inspektionsvorrichtung.
DE69219104T2 (de) Optische vorrichtung
DE69030924D1 (de) Optische sicherheitsvorrichtung
DE69123066D1 (de) Optische Wellenleitervorrichtung
DE69019498T2 (de) Optische Halbleitervorrichtung.
DE69124504T2 (de) Optische vorrichtung
DE69028734T2 (de) Optische Halbleitervorrichtung
DE69131612T2 (de) Optische Vorrichtung mit strukturierten Domänen
DE69030148D1 (de) Optische Halbleitervorrichtung
DE69029207D1 (de) Optische Halbleitervorrichtung
DE69019173T2 (de) Verdrahtungsvorrichtung für optische Fasern.
DE68929527D1 (de) Optische Übertragungsvorrichtung
DE3871371D1 (de) Optische messeinrichtung.
DE69030175D1 (de) Optische Halbleitervorrichtung
DE69032173T2 (de) Optische Speichervorrichtung
DE69025169T2 (de) Optische Vorrichtung mit Gitterstruktur
DE3854989T2 (de) Optische Halbleiteranordnung
DE69122700T2 (de) Optische Empfangsvorrichtung
DE69104411T2 (de) Optische Messvorrichtung.
DE69118768D1 (de) Optische Vorrichtung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee