DE69017354D1 - Dampfablagerungsapparat. - Google Patents

Dampfablagerungsapparat.

Info

Publication number
DE69017354D1
DE69017354D1 DE69017354T DE69017354T DE69017354D1 DE 69017354 D1 DE69017354 D1 DE 69017354D1 DE 69017354 T DE69017354 T DE 69017354T DE 69017354 T DE69017354 T DE 69017354T DE 69017354 D1 DE69017354 D1 DE 69017354D1
Authority
DE
Germany
Prior art keywords
vapor deposition
deposition apparatus
vapor
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69017354T
Other languages
English (en)
Other versions
DE69017354T2 (de
Inventor
Akiyoshi Mikami
Takashi Ogura
Kousuke Terada
Masaru Yoshida
Takuo Yamashita
Koichi Tanaka
Katsushi Okibayashi
Shigeo Nakajima
Hiroaki Nakaya
Kouji Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Application granted granted Critical
Publication of DE69017354D1 publication Critical patent/DE69017354D1/de
Publication of DE69017354T2 publication Critical patent/DE69017354T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45587Mechanical means for changing the gas flow
    • C23C16/45591Fixed means, e.g. wings, baffles
DE69017354T 1989-11-02 1990-11-02 Dampfablagerungsapparat. Expired - Fee Related DE69017354T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1286454A JPH0818902B2 (ja) 1989-11-02 1989-11-02 気相成長装置

Publications (2)

Publication Number Publication Date
DE69017354D1 true DE69017354D1 (de) 1995-04-06
DE69017354T2 DE69017354T2 (de) 1995-09-28

Family

ID=17704602

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69017354T Expired - Fee Related DE69017354T2 (de) 1989-11-02 1990-11-02 Dampfablagerungsapparat.

Country Status (5)

Country Link
US (1) US5334250A (de)
EP (1) EP0426494B1 (de)
JP (1) JPH0818902B2 (de)
DE (1) DE69017354T2 (de)
FI (1) FI95150C (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6337102B1 (en) * 1997-11-17 2002-01-08 The Trustees Of Princeton University Low pressure vapor phase deposition of organic thin films
US6656272B2 (en) * 2001-03-30 2003-12-02 Technologies And Devices International, Inc. Method of epitaxially growing submicron group III nitride layers utilizing HVPE
KR20030002070A (ko) * 2001-06-30 2003-01-08 삼성전자 주식회사 원심력을 이용한 비점착 웨이퍼 건조방법 및 장치
US7501023B2 (en) * 2001-07-06 2009-03-10 Technologies And Devices, International, Inc. Method and apparatus for fabricating crack-free Group III nitride semiconductor materials
US20060011135A1 (en) * 2001-07-06 2006-01-19 Dmitriev Vladimir A HVPE apparatus for simultaneously producing multiple wafers during a single epitaxial growth run
US6936357B2 (en) * 2001-07-06 2005-08-30 Technologies And Devices International, Inc. Bulk GaN and ALGaN single crystals
US20070032046A1 (en) * 2001-07-06 2007-02-08 Dmitriev Vladimir A Method for simultaneously producing multiple wafers during a single epitaxial growth run and semiconductor structure grown thereby
US6613143B1 (en) * 2001-07-06 2003-09-02 Technologies And Devices International, Inc. Method for fabricating bulk GaN single crystals
JP4714422B2 (ja) * 2003-04-05 2011-06-29 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. ゲルマニウムを含有するフィルムを堆積させる方法、及び蒸気送達装置
US20060065622A1 (en) * 2004-09-27 2006-03-30 Floyd Philip D Method and system for xenon fluoride etching with enhanced efficiency
KR100792396B1 (ko) * 2005-10-11 2008-01-08 주식회사 유진테크 파티션 구조형 가열유닛과 이를 이용한 히팅장치
US9416464B1 (en) 2006-10-11 2016-08-16 Ostendo Technologies, Inc. Apparatus and methods for controlling gas flows in a HVPE reactor
EP2104948A2 (de) * 2007-02-20 2009-09-30 Qualcomm Mems Technologies, Inc. Ausrüstung und verfahren zur mems-ätzung
US7719752B2 (en) 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US7569488B2 (en) 2007-06-22 2009-08-04 Qualcomm Mems Technologies, Inc. Methods of making a MEMS device by monitoring a process parameter
EP2181355A1 (de) 2007-07-25 2010-05-05 Qualcomm Mems Technologies, Inc. Mems-anzeigevorrichtungen und herstellungsverfahren dafür
US8023191B2 (en) * 2008-05-07 2011-09-20 Qualcomm Mems Technologies, Inc. Printable static interferometric images
US9343273B2 (en) * 2008-09-25 2016-05-17 Seagate Technology Llc Substrate holders for uniform reactive sputtering
WO2011108640A1 (ja) * 2010-03-04 2011-09-09 Jx日鉱日石金属株式会社 結晶成長装置、窒化物系化合物半導体結晶の製造方法及び窒化物系化合物半導体結晶
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
US9909205B2 (en) * 2014-03-11 2018-03-06 Joled Inc. Vapor deposition apparatus, vapor deposition method using vapor deposition apparatus, and device production method
CN106103790B (zh) * 2014-03-11 2018-12-07 株式会社日本有机雷特显示器 蒸镀装置及其控制方法、使用了蒸镀装置的蒸镀方法、以及器件的制造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3098763A (en) * 1961-05-29 1963-07-23 Raytheon Co Chemical reactor
US3310425A (en) * 1963-06-28 1967-03-21 Rca Corp Method of depositing epitaxial layers of gallium arsenide
US3424629A (en) * 1965-12-13 1969-01-28 Ibm High capacity epitaxial apparatus and method
US3858548A (en) * 1972-08-16 1975-01-07 Corning Glass Works Vapor transport film deposition apparatus
JPS544566A (en) * 1977-06-13 1979-01-13 Nec Corp Vapor phase growth method of semiconductor
JPS5931985B2 (ja) * 1977-11-14 1984-08-06 富士通株式会社 マグネスピネルの気相成長法
DD206687A3 (de) * 1981-07-28 1984-02-01 Mikroelektronik Zt Forsch Tech Verfahren und vorrichtung zur gasfuehrung fuer lp cvd prozesse in einem rohrreaktor
US4487640A (en) * 1983-02-22 1984-12-11 The United States Of America As Represented By The Secretary Of The Air Force Method for the preparation of epitaxial films of mercury cadmium telluride
JPS59207622A (ja) * 1983-05-11 1984-11-24 Furukawa Electric Co Ltd:The 半導体薄膜気相成長装置
JPS6065526A (ja) * 1983-09-20 1985-04-15 Nec Corp 多元混晶3−5族化合物半導体成長方法及び装置
JPS60215594A (ja) * 1984-04-06 1985-10-28 Fujitsu Ltd 気相成長装置
JPS60253212A (ja) * 1984-05-30 1985-12-13 Toshiba Mach Co Ltd 気相成長装置
JPS61101021A (ja) * 1984-10-24 1986-05-19 Hitachi Ltd 膜形成装置
JPH07105345B2 (ja) * 1985-08-08 1995-11-13 日電アネルバ株式会社 基体処理装置
JPS6291496A (ja) * 1985-10-15 1987-04-25 Nec Corp 気相成長装置用反応管
JPH0691020B2 (ja) * 1986-02-14 1994-11-14 日本電信電話株式会社 気相成長方法および装置
JPS6335776A (ja) * 1986-07-30 1988-02-16 Matsushita Electronics Corp 気相化学蒸着装置
US4886412A (en) * 1986-10-28 1989-12-12 Tetron, Inc. Method and system for loading wafers
JPH01108744A (ja) * 1987-10-22 1989-04-26 Oki Electric Ind Co Ltd 半導体製造装置
US4854266A (en) * 1987-11-02 1989-08-08 Btu Engineering Corporation Cross-flow diffusion furnace
JPH0760738B2 (ja) * 1988-05-13 1995-06-28 シャープ株式会社 エレクトロルミネッセンス発光膜の製造方法

Also Published As

Publication number Publication date
FI95150B (fi) 1995-09-15
FI95150C (fi) 1995-12-27
JPH0818902B2 (ja) 1996-02-28
DE69017354T2 (de) 1995-09-28
FI905349A0 (fi) 1990-10-30
US5334250A (en) 1994-08-02
EP0426494B1 (de) 1995-03-01
JPH03150293A (ja) 1991-06-26
EP0426494A1 (de) 1991-05-08

Similar Documents

Publication Publication Date Title
NO903190L (no) Fremgangsmaate for klorering av sukrose-b-estere.
DE69017354T2 (de) Dampfablagerungsapparat.
DE69105605T2 (de) Beschichtungsverfahren.
DE69001292D1 (de) Ueberzugsverfahren.
DE3876975T2 (de) Mehrfachbeschichtungsverfahren.
DE69100793D1 (de) Verbessertes Hydrocyanisierungsverfahren.
DE69112222T2 (de) Beschichtungsverfahren.
FI900684A0 (fi) Process foer framstaellning av polyaluminiumfoereningar.
DE69014550D1 (de) Beschichtungsvorrichtung.
DE69014360T2 (de) Beschichtungsvorrichtung.
FI920196A0 (fi) Miljoevaenligare process foer blekning av lignocellulosamaterial.
NO903371D0 (no) Beleggsammensetninger.
DE59009000D1 (de) Beschichtungsvorrichtung.
FI912316A (fi) Laite höyrykerrostamisen suorittamiseksi
DE69112487T2 (de) Beschichtungsapparat.
MX9202702A (es) Proceso de bioblanqueo.
FI902336A0 (fi) Anordning foer framstaellning av en fristaoende kiselkristall.
DE69104850D1 (de) Beschichtungsverfahren.
DE69204206D1 (de) Hydrodeziklierungsverfahren.
DE69002957T2 (de) Vakuum-Destillationsverfahren.
FI903088A0 (fi) Process foer framstaellning av straengsprutade skumkroppar.
DE59006286D1 (de) Streicheinrichtung.
DE69003963T2 (de) Vakuum-Destillationsverfahren.
DE69010835D1 (de) Chemischer Dampfablagerungsapparat.
DE3874896D1 (de) Ablagerungsapparatur.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: PATENTANWAELTE MUELLER & HOFFMANN, 81667 MUENCHEN

8339 Ceased/non-payment of the annual fee