DE60334275D1 - Methode und System zur Einteilung eines Schaltkreises für optische Näherungseffektkorrekturen - Google Patents
Methode und System zur Einteilung eines Schaltkreises für optische NäherungseffektkorrekturenInfo
- Publication number
- DE60334275D1 DE60334275D1 DE60334275T DE60334275T DE60334275D1 DE 60334275 D1 DE60334275 D1 DE 60334275D1 DE 60334275 T DE60334275 T DE 60334275T DE 60334275 T DE60334275 T DE 60334275T DE 60334275 D1 DE60334275 D1 DE 60334275D1
- Authority
- DE
- Germany
- Prior art keywords
- classifying
- circuit
- optical proximity
- proximity effect
- effect corrections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
- G03F7/70441—Optical proximity correction [OPC]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/327,304 US7093228B2 (en) | 2002-12-20 | 2002-12-20 | Method and system for classifying an integrated circuit for optical proximity correction |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60334275D1 true DE60334275D1 (de) | 2010-11-04 |
Family
ID=32393140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60334275T Expired - Lifetime DE60334275D1 (de) | 2002-12-20 | 2003-11-14 | Methode und System zur Einteilung eines Schaltkreises für optische Näherungseffektkorrekturen |
Country Status (4)
Country | Link |
---|---|
US (1) | US7093228B2 (de) |
EP (1) | EP1431820B1 (de) |
JP (1) | JP2004226965A (de) |
DE (1) | DE60334275D1 (de) |
Families Citing this family (53)
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US7069535B2 (en) * | 2003-06-03 | 2006-06-27 | Lsi Logic Corporation | Optical proximity correction method using weighted priorities |
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JP4728676B2 (ja) * | 2005-03-30 | 2011-07-20 | 富士通セミコンダクター株式会社 | フォトマスクの製造方法、及びそのフォトマスクを用いた半導体装置の製造方法 |
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US7604909B2 (en) * | 2005-12-29 | 2009-10-20 | Asml Masktools B.V. | Method for improved manufacturability and patterning of sub-wavelength contact hole mask |
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US7590968B1 (en) | 2006-03-01 | 2009-09-15 | Tela Innovations, Inc. | Methods for risk-informed chip layout generation |
US8658542B2 (en) | 2006-03-09 | 2014-02-25 | Tela Innovations, Inc. | Coarse grid design methods and structures |
US9230910B2 (en) | 2006-03-09 | 2016-01-05 | Tela Innovations, Inc. | Oversized contacts and vias in layout defined by linearly constrained topology |
US7763534B2 (en) | 2007-10-26 | 2010-07-27 | Tela Innovations, Inc. | Methods, structures and designs for self-aligning local interconnects used in integrated circuits |
US7943967B2 (en) | 2006-03-09 | 2011-05-17 | Tela Innovations, Inc. | Semiconductor device and associated layouts including diffusion contact placement restriction based on relation to linear conductive segments |
US8541879B2 (en) | 2007-12-13 | 2013-09-24 | Tela Innovations, Inc. | Super-self-aligned contacts and method for making the same |
US8225239B2 (en) | 2006-03-09 | 2012-07-17 | Tela Innovations, Inc. | Methods for defining and utilizing sub-resolution features in linear topology |
US7446352B2 (en) | 2006-03-09 | 2008-11-04 | Tela Innovations, Inc. | Dynamic array architecture |
US8448102B2 (en) | 2006-03-09 | 2013-05-21 | Tela Innovations, Inc. | Optimizing layout of irregular structures in regular layout context |
US9563733B2 (en) | 2009-05-06 | 2017-02-07 | Tela Innovations, Inc. | Cell circuit and layout with linear finfet structures |
US8653857B2 (en) | 2006-03-09 | 2014-02-18 | Tela Innovations, Inc. | Circuitry and layouts for XOR and XNOR logic |
US7956421B2 (en) | 2008-03-13 | 2011-06-07 | Tela Innovations, Inc. | Cross-coupled transistor layouts in restricted gate level layout architecture |
US7932545B2 (en) | 2006-03-09 | 2011-04-26 | Tela Innovations, Inc. | Semiconductor device and associated layouts including gate electrode level region having arrangement of six linear conductive segments with side-to-side spacing less than 360 nanometers |
US8225261B2 (en) | 2006-03-09 | 2012-07-17 | Tela Innovations, Inc. | Methods for defining contact grid in dynamic array architecture |
US8839175B2 (en) | 2006-03-09 | 2014-09-16 | Tela Innovations, Inc. | Scalable meta-data objects |
US8247846B2 (en) | 2006-03-09 | 2012-08-21 | Tela Innovations, Inc. | Oversized contacts and vias in semiconductor chip defined by linearly constrained topology |
US9009641B2 (en) | 2006-03-09 | 2015-04-14 | Tela Innovations, Inc. | Circuits with linear finfet structures |
US8245180B2 (en) | 2006-03-09 | 2012-08-14 | Tela Innovations, Inc. | Methods for defining and using co-optimized nanopatterns for integrated circuit design and apparatus implementing same |
US9035359B2 (en) | 2006-03-09 | 2015-05-19 | Tela Innovations, Inc. | Semiconductor chip including region including linear-shaped conductive structures forming gate electrodes and having electrical connection areas arranged relative to inner region between transistors of different types and associated methods |
US20070283306A1 (en) * | 2006-05-30 | 2007-12-06 | Matthias Koefferlein | Layout cells, layout cell arrangement, method of generating a layout cell, method of generating a layout cell arrangement, computer program products |
US7586800B1 (en) | 2006-08-08 | 2009-09-08 | Tela Innovations, Inc. | Memory timing apparatus and associated methods |
US8286107B2 (en) | 2007-02-20 | 2012-10-09 | Tela Innovations, Inc. | Methods and systems for process compensation technique acceleration |
US7979829B2 (en) * | 2007-02-20 | 2011-07-12 | Tela Innovations, Inc. | Integrated circuit cell library with cell-level process compensation technique (PCT) application and associated methods |
US8667443B2 (en) | 2007-03-05 | 2014-03-04 | Tela Innovations, Inc. | Integrated circuit cell library for multiple patterning |
US7888705B2 (en) | 2007-08-02 | 2011-02-15 | Tela Innovations, Inc. | Methods for defining dynamic array section with manufacturing assurance halo and apparatus implementing the same |
US7669175B2 (en) * | 2007-05-11 | 2010-02-23 | International Business Machines Corporation | Methodology to improve turnaround for integrated circuit design using geometrical hierarchy |
US8453094B2 (en) | 2008-01-31 | 2013-05-28 | Tela Innovations, Inc. | Enforcement of semiconductor structure regularity for localized transistors and interconnect |
JP5309623B2 (ja) * | 2008-03-10 | 2013-10-09 | 富士通セミコンダクター株式会社 | 階層構造を用いたフォトマスクデータの処理方法、フォトマスクデータ処理システム、および、製造方法 |
JP5024141B2 (ja) * | 2008-03-21 | 2012-09-12 | 富士通セミコンダクター株式会社 | パターンデータの作成方法、そのパターンデータを作成するプログラム、及び、そのプログラムを含む媒体 |
US7939443B2 (en) | 2008-03-27 | 2011-05-10 | Tela Innovations, Inc. | Methods for multi-wire routing and apparatus implementing same |
US8381152B2 (en) | 2008-06-05 | 2013-02-19 | Cadence Design Systems, Inc. | Method and system for model-based design and layout of an integrated circuit |
SG10201608214SA (en) | 2008-07-16 | 2016-11-29 | Tela Innovations Inc | Methods for cell phasing and placement in dynamic array architecture and implementation of the same |
US9122832B2 (en) | 2008-08-01 | 2015-09-01 | Tela Innovations, Inc. | Methods for controlling microloading variation in semiconductor wafer layout and fabrication |
KR101068321B1 (ko) | 2008-12-19 | 2011-09-28 | 주식회사 하이닉스반도체 | 취약 지점 검출 방법 |
US8661392B2 (en) | 2009-10-13 | 2014-02-25 | Tela Innovations, Inc. | Methods for cell boundary encroachment and layouts implementing the Same |
US9159627B2 (en) | 2010-11-12 | 2015-10-13 | Tela Innovations, Inc. | Methods for linewidth modification and apparatus implementing the same |
US8832621B1 (en) | 2011-11-28 | 2014-09-09 | Cadence Design Systems, Inc. | Topology design using squish patterns |
US9244857B2 (en) * | 2013-10-31 | 2016-01-26 | Oracle International Corporation | Systems and methods for implementing low-latency lookup circuits using multiple hash functions |
US9262578B2 (en) * | 2014-04-25 | 2016-02-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for integrated circuit manufacturing |
KR102343850B1 (ko) * | 2015-05-06 | 2021-12-28 | 삼성전자주식회사 | 광 근접 보정에서 공통의 바이어스 값을 이용하여 마스크를 제작하는 방법 |
US10162928B2 (en) | 2015-12-02 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of designing a semiconductor device, system for implementing the method and standard cell |
KR102632559B1 (ko) * | 2018-08-23 | 2024-02-02 | 삼성전자주식회사 | 반도체 소자의 제조 방법, 극 자외선 노광 방법 및 광 근접 보정 방법 |
CN111948915B (zh) * | 2020-08-18 | 2022-12-02 | 上海华力微电子有限公司 | 提高opc修正效率的方法 |
US11886788B2 (en) | 2021-03-25 | 2024-01-30 | Siemens Industry Software Inc. | Duplicate circuit section identification and processing for optical proximity correction (OPC) processes in electronic design automation (EDA) applications |
Family Cites Families (33)
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JPH07191199A (ja) * | 1993-12-27 | 1995-07-28 | Fujitsu Ltd | 荷電粒子ビーム露光システム及び露光方法 |
JPH08297692A (ja) * | 1994-09-16 | 1996-11-12 | Mitsubishi Electric Corp | 光近接補正装置及び方法並びにパタン形成方法 |
JP3328724B2 (ja) * | 1995-08-11 | 2002-09-30 | 日本電信電話株式会社 | 図形データの圧縮方法 |
JP3934719B2 (ja) * | 1995-12-22 | 2007-06-20 | 株式会社東芝 | 光近接効果補正方法 |
US5885734A (en) * | 1996-08-15 | 1999-03-23 | Micron Technology, Inc. | Process for modifying a hierarchical mask layout |
JPH10149378A (ja) * | 1996-11-19 | 1998-06-02 | Sony Corp | データ処理方法,マスクパターンのデータ処理方法,データ処理装置及びマスクパターンのデータ処理装置 |
JPH10153851A (ja) * | 1996-11-22 | 1998-06-09 | Sony Corp | 露光データの補正方法,露光方法,フォトマスク,半導体装置,露光データの補正装置,露光装置及び半導体装置の製造装置 |
JPH10319572A (ja) * | 1997-05-22 | 1998-12-04 | Sony Corp | ハーフトーン位相シフトマスクの製造方法 |
JP4131880B2 (ja) * | 1997-07-31 | 2008-08-13 | 株式会社東芝 | マスクデータ作成方法及びマスクデータ作成装置 |
US6370679B1 (en) * | 1997-09-17 | 2002-04-09 | Numerical Technologies, Inc. | Data hierarchy layout correction and verification method and apparatus |
JP3954216B2 (ja) * | 1997-09-30 | 2007-08-08 | 株式会社東芝 | マスクデータ設計方法 |
KR100313851B1 (ko) * | 1998-04-10 | 2001-12-12 | 윤종용 | 화상표시장치용마이크로미러디바이스 |
JP2000162758A (ja) * | 1998-11-30 | 2000-06-16 | Matsushita Electric Ind Co Ltd | 光学的近接効果補正方法 |
US6467076B1 (en) * | 1999-04-30 | 2002-10-15 | Nicolas Bailey Cobb | Method and apparatus for submicron IC design |
US6301697B1 (en) * | 1999-04-30 | 2001-10-09 | Nicolas B. Cobb | Streamlined IC mask layout optical and process correction through correction reuse |
JP3461305B2 (ja) * | 1999-06-30 | 2003-10-27 | 株式会社東芝 | マスク描画データ作成方法、作成装置および記録媒体 |
US6373568B1 (en) * | 1999-08-06 | 2002-04-16 | Cambridge Research & Instrumentation, Inc. | Spectral imaging system |
US6194104B1 (en) * | 1999-10-12 | 2001-02-27 | Taiwan Semiconductor Manufacturing Company | Optical proximity correction (OPC) method for improving lithography process window |
US6505323B1 (en) * | 2000-02-17 | 2003-01-07 | Avant! Corporation | Methods, apparatus and computer program products that perform layout versus schematic comparison of integrated circuit memory devices using bit cell detection and depth first searching techniques |
JP2001281836A (ja) * | 2000-03-30 | 2001-10-10 | Sony Corp | フォトマスクパターンの補正方法、フォトマスクの製造方法および記録媒体 |
DE10017767A1 (de) | 2000-04-10 | 2001-10-18 | Infineon Technologies Ag | Verfahren zur Herstellung von Masken für die Fertigung von Halbleiterstrukturen |
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JP2002229179A (ja) | 2001-02-07 | 2002-08-14 | Nec Microsystems Ltd | 光近接効果補正方法 |
JP2002329658A (ja) * | 2001-05-01 | 2002-11-15 | Fujitsu Ltd | 光近接効果補正方法 |
JP2003016463A (ja) * | 2001-07-05 | 2003-01-17 | Toshiba Corp | 図形の輪郭の抽出方法、パターン検査方法、パターン検査装置、プログラムおよびこれを格納したコンピュータ読み取り可能な記録媒体 |
US6560766B2 (en) * | 2001-07-26 | 2003-05-06 | Numerical Technologies, Inc. | Method and apparatus for analyzing a layout using an instance-based representation |
JP3871949B2 (ja) * | 2002-03-27 | 2007-01-24 | 株式会社東芝 | マスクデータ作成装置及びマスクデータ作成方法 |
JP2005533283A (ja) * | 2002-07-12 | 2005-11-04 | ケイデンス デザイン システムズ インコーポレイテッド | コンテクスト特定のマスク書込のための方法及びシステム |
EP1579274A4 (de) * | 2002-07-12 | 2006-06-07 | Cadence Design Systems Inc | Verfahren und system zur kontextspezifischen maskenuntersuchung |
US7000208B2 (en) * | 2002-07-29 | 2006-02-14 | Synopsys,Inc. | Repetition recognition using segments |
-
2002
- 2002-12-20 US US10/327,304 patent/US7093228B2/en not_active Expired - Fee Related
-
2003
- 2003-11-14 DE DE60334275T patent/DE60334275D1/de not_active Expired - Lifetime
- 2003-11-14 EP EP03026209A patent/EP1431820B1/de not_active Expired - Fee Related
- 2003-12-22 JP JP2003425354A patent/JP2004226965A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP1431820A3 (de) | 2004-12-29 |
EP1431820B1 (de) | 2010-09-22 |
US20040123265A1 (en) | 2004-06-24 |
US7093228B2 (en) | 2006-08-15 |
JP2004226965A (ja) | 2004-08-12 |
EP1431820A2 (de) | 2004-06-23 |
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