DE60312087D1 - Flexible MEMS Wandler und Verfahren zu ihrer Herstellung, und flexible MEMS Mikrophone - Google Patents

Flexible MEMS Wandler und Verfahren zu ihrer Herstellung, und flexible MEMS Mikrophone

Info

Publication number
DE60312087D1
DE60312087D1 DE60312087T DE60312087T DE60312087D1 DE 60312087 D1 DE60312087 D1 DE 60312087D1 DE 60312087 T DE60312087 T DE 60312087T DE 60312087 T DE60312087 T DE 60312087T DE 60312087 D1 DE60312087 D1 DE 60312087D1
Authority
DE
Germany
Prior art keywords
flexible mems
manufacturing processes
converters
microphones
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60312087T
Other languages
English (en)
Other versions
DE60312087T2 (de
Inventor
Yun-Woo Nam
Suk-Han Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of DE60312087D1 publication Critical patent/DE60312087D1/de
Application granted granted Critical
Publication of DE60312087T2 publication Critical patent/DE60312087T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/098—Forming organic materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2041—Beam type
    • H10N30/2042—Cantilevers, i.e. having one fixed end
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/032—Bimorph and unimorph actuators, e.g. piezo and thermo
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/40—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
    • H04R1/406—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/02—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2420/00—Details of connection covered by H04R, not provided for in its groups
    • H04R2420/07—Applications of wireless loudspeakers or wireless microphones

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Micromachines (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Pressure Sensors (AREA)
  • Details Of Aerials (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
DE60312087T 2002-09-26 2003-09-25 Flexible MEMS Wandler und Verfahren zu ihrer Herstellung, und flexible MEMS Mikrophone Expired - Lifetime DE60312087T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2002-0058313A KR100512960B1 (ko) 2002-09-26 2002-09-26 플렉서블 ｍｅｍｓ 트랜스듀서와 그 제조방법 및 이를채용한 플렉서블 ｍｅｍｓ 무선 마이크로폰
KR2002058313 2002-09-26

Publications (2)

Publication Number Publication Date
DE60312087D1 true DE60312087D1 (de) 2007-04-12
DE60312087T2 DE60312087T2 (de) 2007-11-29

Family

ID=36598028

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60312087T Expired - Lifetime DE60312087T2 (de) 2002-09-26 2003-09-25 Flexible MEMS Wandler und Verfahren zu ihrer Herstellung, und flexible MEMS Mikrophone

Country Status (7)

Country Link
US (1) US6967362B2 (de)
EP (1) EP1403212B1 (de)
JP (1) JP4126003B2 (de)
KR (1) KR100512960B1 (de)
CN (1) CN100411968C (de)
DE (1) DE60312087T2 (de)
TW (1) TWI235011B (de)

Families Citing this family (149)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7781850B2 (en) 2002-09-20 2010-08-24 Qualcomm Mems Technologies, Inc. Controlling electromechanical behavior of structures within a microelectromechanical systems device
KR100512988B1 (ko) * 2002-09-26 2005-09-07 삼성전자주식회사 플렉서블 ｍｅｍｓ 트랜스듀서 제조방법
US7045246B2 (en) * 2003-04-22 2006-05-16 The Aerospace Corporation Integrated thin film battery and circuit module
US7434476B2 (en) * 2003-05-07 2008-10-14 Califronia Institute Of Technology Metallic thin film piezoresistive transduction in micromechanical and nanomechanical devices and its application in self-sensing SPM probes
TW570896B (en) 2003-05-26 2004-01-11 Prime View Int Co Ltd A method for fabricating an interference display cell
US7221495B2 (en) * 2003-06-24 2007-05-22 Idc Llc Thin film precursor stack for MEMS manufacturing
DE102004030748A1 (de) * 2004-06-25 2006-01-12 Sennheiser Electronic Gmbh & Co. Kg Elektro-akustischer Backelektret-Wandler
WO2006034377A2 (en) * 2004-09-22 2006-03-30 The Board Of Trustees Of The University Of Illinois Light powered microactuator, microfluidic dispenser and retinal prosthesis
US7372613B2 (en) 2004-09-27 2008-05-13 Idc, Llc Method and device for multistate interferometric light modulation
US7369296B2 (en) * 2004-09-27 2008-05-06 Idc, Llc Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator
US7289259B2 (en) 2004-09-27 2007-10-30 Idc, Llc Conductive bus structure for interferometric modulator array
US7420725B2 (en) 2004-09-27 2008-09-02 Idc, Llc Device having a conductive light absorbing mask and method for fabricating same
US7304784B2 (en) 2004-09-27 2007-12-04 Idc, Llc Reflective display device having viewable display on both sides
US7564612B2 (en) 2004-09-27 2009-07-21 Idc, Llc Photonic MEMS and structures
US7936497B2 (en) 2004-09-27 2011-05-03 Qualcomm Mems Technologies, Inc. MEMS device having deformable membrane characterized by mechanical persistence
US7527995B2 (en) 2004-09-27 2009-05-05 Qualcomm Mems Technologies, Inc. Method of making prestructure for MEMS systems
US7630119B2 (en) 2004-09-27 2009-12-08 Qualcomm Mems Technologies, Inc. Apparatus and method for reducing slippage between structures in an interferometric modulator
US7684104B2 (en) 2004-09-27 2010-03-23 Idc, Llc MEMS using filler material and method
US7373026B2 (en) * 2004-09-27 2008-05-13 Idc, Llc MEMS device fabricated on a pre-patterned substrate
US7405861B2 (en) 2004-09-27 2008-07-29 Idc, Llc Method and device for protecting interferometric modulators from electrostatic discharge
US7327510B2 (en) * 2004-09-27 2008-02-05 Idc, Llc Process for modifying offset voltage characteristics of an interferometric modulator
US8008736B2 (en) 2004-09-27 2011-08-30 Qualcomm Mems Technologies, Inc. Analog interferometric modulator device
US7944599B2 (en) 2004-09-27 2011-05-17 Qualcomm Mems Technologies, Inc. Electromechanical device with optical function separated from mechanical and electrical function
US7642612B2 (en) * 2005-06-17 2010-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
EP2495212A3 (de) * 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. MEMS-Vorrichtungen mit Stützstrukturen und Herstellungsverfahren dafür
WO2007015593A1 (en) * 2005-08-02 2007-02-08 Bse Co., Ltd Silicon based condenser microphone and packaging method for the same
KR100675027B1 (ko) * 2005-08-10 2007-01-30 주식회사 비에스이 실리콘 콘덴서 마이크로폰 및 이를 위한 실장 방법
KR100644730B1 (ko) * 2005-08-20 2006-11-10 주식회사 비에스이 실리콘 콘덴서 마이크로폰
KR100675025B1 (ko) * 2005-08-20 2007-01-29 주식회사 비에스이 실리콘 콘덴서 마이크로폰
US20080247572A1 (en) * 2005-09-09 2008-10-09 Nxp B.V. Micro-Electro-Mechanical System (Mems) Capacitor Microphone and Method of Manufacturing Thereof
US7418281B2 (en) 2005-09-13 2008-08-26 International Business Machines Corporation Centralized voice recognition unit for wireless control of personal mobile electronic devices
US7362035B2 (en) * 2005-09-22 2008-04-22 The Penn State Research Foundation Polymer bulk acoustic resonator
KR100670946B1 (ko) * 2005-10-27 2007-01-17 학교법인 포항공과대학교 나노 크기의 미세홀을 갖는 멀티스케일 캔티레버 구조물 및그 제조 방법
US7808253B2 (en) * 2005-12-02 2010-10-05 Semiconductor Energy Laboratory Co., Ltd. Test method of microstructure body and micromachine
US7795061B2 (en) 2005-12-29 2010-09-14 Qualcomm Mems Technologies, Inc. Method of creating MEMS device cavities by a non-etching process
US7916980B2 (en) 2006-01-13 2011-03-29 Qualcomm Mems Technologies, Inc. Interconnect structure for MEMS device
US7652814B2 (en) 2006-01-27 2010-01-26 Qualcomm Mems Technologies, Inc. MEMS device with integrated optical element
US7450295B2 (en) * 2006-03-02 2008-11-11 Qualcomm Mems Technologies, Inc. Methods for producing MEMS with protective coatings using multi-component sacrificial layers
US7443082B2 (en) 2006-03-03 2008-10-28 Basf Corporation Piezoelectric polymer composite article and system
US7643203B2 (en) * 2006-04-10 2010-01-05 Qualcomm Mems Technologies, Inc. Interferometric optical display system with broadband characteristics
JP2009533237A (ja) * 2006-04-10 2009-09-17 エヌエックスピー ビー ヴィ 薄膜ｍｅｍｓ技術のための層間接合
US7711239B2 (en) 2006-04-19 2010-05-04 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing nanoparticles
US7369292B2 (en) * 2006-05-03 2008-05-06 Qualcomm Mems Technologies, Inc. Electrode and interconnect materials for MEMS devices
US20070268209A1 (en) * 2006-05-16 2007-11-22 Kenneth Wargon Imaging Panels Including Arrays Of Audio And Video Input And Output Elements
US20080075404A1 (en) * 2006-05-19 2008-03-27 New Jersey Institute Of Technology Aligned embossed diaphragm based fiber optic sensor
WO2008100266A2 (en) * 2006-05-19 2008-08-21 New Jersey Institute Of Technology Mems fiber optic microphone
US7561277B2 (en) * 2006-05-19 2009-07-14 New Jersey Institute Of Technology MEMS fiber optic microphone
US7649671B2 (en) 2006-06-01 2010-01-19 Qualcomm Mems Technologies, Inc. Analog interferometric modulator device with electrostatic actuation and release
US7527998B2 (en) 2006-06-30 2009-05-05 Qualcomm Mems Technologies, Inc. Method of manufacturing MEMS devices providing air gap control
KR100787217B1 (ko) * 2006-07-10 2007-12-21 삼성전자주식회사 Ｍｅｍｓ 구조물 및 그 제조방법
US7763546B2 (en) 2006-08-02 2010-07-27 Qualcomm Mems Technologies, Inc. Methods for reducing surface charges during the manufacture of microelectromechanical systems devices
US20080121947A1 (en) * 2006-09-14 2008-05-29 Robert Eugene Frahm Solar-powered MEMS acoustic sensor and system for providing physical security in a geographical area with use thereof
KR100776210B1 (ko) * 2006-10-10 2007-11-16 주식회사 비에스이 마이크로폰 조립체의 제조장치 및 그 제조방법
US7706042B2 (en) 2006-12-20 2010-04-27 Qualcomm Mems Technologies, Inc. MEMS device and interconnects for same
US8115987B2 (en) 2007-02-01 2012-02-14 Qualcomm Mems Technologies, Inc. Modulating the intensity of light from an interferometric reflector
CN101262712A (zh) * 2007-03-09 2008-09-10 付庆兴 一种声音定向传播音响系统
US7733552B2 (en) 2007-03-21 2010-06-08 Qualcomm Mems Technologies, Inc MEMS cavity-coating layers and methods
US7643202B2 (en) 2007-05-09 2010-01-05 Qualcomm Mems Technologies, Inc. Microelectromechanical system having a dielectric movable membrane and a mirror
US7719752B2 (en) 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US7630121B2 (en) 2007-07-02 2009-12-08 Qualcomm Mems Technologies, Inc. Electromechanical device with optical function separated from mechanical and electrical function
US20090027566A1 (en) * 2007-07-27 2009-01-29 Kenneth Wargon Flexible sheet audio-video device
EP2183623A1 (de) 2007-07-31 2010-05-12 Qualcomm Mems Technologies, Inc. Einrichtungen zur verstärkung der farbverschiebung interferometrischer modulatoren
US7570415B2 (en) * 2007-08-07 2009-08-04 Qualcomm Mems Technologies, Inc. MEMS device and interconnects for same
US20090062913A1 (en) * 2007-08-30 2009-03-05 Laxminarayana Saggere Light powered microactuator, microfluidic dispenser and retinal prosthesis
DE102007041918A1 (de) * 2007-09-04 2009-03-05 Siemens Ag Piezoelektrischer Energiewandler mit Doppelmembran
GB2452941B (en) * 2007-09-19 2012-04-11 Wolfson Microelectronics Plc Mems device and process
JP5209727B2 (ja) 2007-10-19 2013-06-12 クォルコム・メムズ・テクノロジーズ・インコーポレーテッド 一体型光起電力デバイスを有するディスプレイ
US8058549B2 (en) 2007-10-19 2011-11-15 Qualcomm Mems Technologies, Inc. Photovoltaic devices with integrated color interferometric film stacks
JP2011504243A (ja) 2007-10-23 2011-02-03 クォルコム・メムズ・テクノロジーズ・インコーポレーテッド 調節可能透過型ｍｅｍｓベースの装置
US8941631B2 (en) 2007-11-16 2015-01-27 Qualcomm Mems Technologies, Inc. Simultaneous light collection and illumination on an active display
WO2009079279A2 (en) 2007-12-17 2009-06-25 Qualcomm Mems Technologies, Inc. Photovoltaics with interferometric back side masks
US8164821B2 (en) 2008-02-22 2012-04-24 Qualcomm Mems Technologies, Inc. Microelectromechanical device with thermal expansion balancing layer or stiffening layer
KR100878454B1 (ko) * 2008-02-28 2009-01-13 (주)실리콘화일 신호처리블록을 구비하는 적층형 마이크로폰과 그 제조방법
US7829366B2 (en) * 2008-02-29 2010-11-09 Freescale Semiconductor, Inc. Microelectromechanical systems component and method of making same
US7944604B2 (en) 2008-03-07 2011-05-17 Qualcomm Mems Technologies, Inc. Interferometric modulator in transmission mode
US7612933B2 (en) 2008-03-27 2009-11-03 Qualcomm Mems Technologies, Inc. Microelectromechanical device with spacing layer
US7898723B2 (en) * 2008-04-02 2011-03-01 Qualcomm Mems Technologies, Inc. Microelectromechanical systems display element with photovoltaic structure
EP2114085A1 (de) 2008-04-28 2009-11-04 Nederlandse Centrale Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek TNO Zusammengesetztes Mikrofon, Mikrofonanordnung und Herstellungsverfahren dafür
WO2009154981A2 (en) * 2008-05-27 2009-12-23 Tufts University Mems microphone array on a chip
US8023167B2 (en) 2008-06-25 2011-09-20 Qualcomm Mems Technologies, Inc. Backlight displays
EP3796671A1 (de) 2008-06-30 2021-03-24 The Regents of the University of Michigan Piezoelektrisches mems-mikrofon
US10170685B2 (en) 2008-06-30 2019-01-01 The Regents Of The University Of Michigan Piezoelectric MEMS microphone
US8358266B2 (en) 2008-09-02 2013-01-22 Qualcomm Mems Technologies, Inc. Light turning device with prismatic light turning features
KR101520070B1 (ko) 2008-09-22 2015-05-14 삼성전자 주식회사 압전형 마이크로 스피커 및 그 제조 방법
US8363864B2 (en) 2008-09-25 2013-01-29 Samsung Electronics Co., Ltd. Piezoelectric micro-acoustic transducer and method of fabricating the same
KR101562339B1 (ko) 2008-09-25 2015-10-22 삼성전자 주식회사 압전형 마이크로 스피커 및 그 제조 방법
EP2349440B1 (de) 2008-10-07 2019-08-21 Mc10, Inc. Katheterballon mit dehnbarer integrierter schaltung und sensoranordnung
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8389862B2 (en) * 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
KR101545271B1 (ko) 2008-12-19 2015-08-19 삼성전자주식회사 압전형 음향 변환기 및 이의 제조방법
US8270056B2 (en) 2009-03-23 2012-09-18 Qualcomm Mems Technologies, Inc. Display device with openings between sub-pixels and method of making same
US7864403B2 (en) * 2009-03-27 2011-01-04 Qualcomm Mems Technologies, Inc. Post-release adjustment of interferometric modulator reflectivity
WO2010138763A1 (en) 2009-05-29 2010-12-02 Qualcomm Mems Technologies, Inc. Illumination devices and methods of fabrication thereof
US8270062B2 (en) 2009-09-17 2012-09-18 Qualcomm Mems Technologies, Inc. Display device with at least one movable stop element
US8488228B2 (en) 2009-09-28 2013-07-16 Qualcomm Mems Technologies, Inc. Interferometric display with interferometric reflector
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
US20110218756A1 (en) * 2009-10-01 2011-09-08 Mc10, Inc. Methods and apparatus for conformal sensing of force and/or acceleration at a person's head
US8384341B2 (en) * 2009-10-28 2013-02-26 Harris Corporation Battery cell for MEMS device and related methods
TWI452006B (zh) * 2009-11-13 2014-09-11 United Microelectronics Corp 微機電系統結構
US8421168B2 (en) * 2009-11-17 2013-04-16 Fairchild Semiconductor Corporation Microelectromechanical systems microphone packaging systems
EP2330649A1 (de) * 2009-12-04 2011-06-08 Bayer MaterialScience AG Elektromechanischer Wandler, umfassend ein Polyurethanpolymer mit Polytetramethylenglykolether-Einheiten
US8821009B2 (en) * 2009-12-23 2014-09-02 Intel Corporation Thermal sensors having flexible substrates and use thereof
JP2011142280A (ja) * 2010-01-09 2011-07-21 Seiko Epson Corp アクチュエーター装置、アクチュエーター装置の製造方法、液体噴射ヘッドの製造方法および液体噴射装置の製造方法
WO2011126953A1 (en) 2010-04-09 2011-10-13 Qualcomm Mems Technologies, Inc. Mechanical layer of an electromechanical device and methods of forming the same
US9222816B2 (en) * 2010-05-14 2015-12-29 Belkin International, Inc. Apparatus configured to detect gas usage, method of providing same, and method of detecting gas usage
WO2012024238A1 (en) 2010-08-17 2012-02-23 Qualcomm Mems Technologies, Inc. Actuation and calibration of a charge neutral electrode in an interferometric display device
US9057872B2 (en) 2010-08-31 2015-06-16 Qualcomm Mems Technologies, Inc. Dielectric enhanced mirror for IMOD display
US8963159B2 (en) 2011-04-04 2015-02-24 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US9134527B2 (en) 2011-04-04 2015-09-15 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
EP2521193A1 (de) * 2011-05-06 2012-11-07 Bayer Material Science AG Elektromechanische Wandlereinrichtung
EP2712491B1 (de) 2011-05-27 2019-12-04 Mc10, Inc. Flexible elektronische struktur
GB2491366A (en) 2011-05-31 2012-12-05 Nokia Corp A configurable microphone or loudspeaker apparatus
US8506826B2 (en) 2011-08-02 2013-08-13 Harris Corporation Method of manufacturing a switch system
US8692111B2 (en) * 2011-08-23 2014-04-08 Sunpower Corporation High throughput laser ablation processes and structures for forming contact holes in solar cells
US8824706B2 (en) 2011-08-30 2014-09-02 Qualcomm Mems Technologies, Inc. Piezoelectric microphone fabricated on glass
US8724832B2 (en) 2011-08-30 2014-05-13 Qualcomm Mems Technologies, Inc. Piezoelectric microphone fabricated on glass
WO2013047875A1 (ja) 2011-09-30 2013-04-04 富士フイルム株式会社 電気音響変換フィルム、フレキシブルディスプレイ、声帯マイクロフォンおよび楽器用センサー
US8736939B2 (en) 2011-11-04 2014-05-27 Qualcomm Mems Technologies, Inc. Matching layer thin-films for an electromechanical systems reflective display device
US9181086B1 (en) 2012-10-01 2015-11-10 The Research Foundation For The State University Of New York Hinged MEMS diaphragm and method of manufacture therof
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
KR101346583B1 (ko) * 2013-05-23 2014-01-03 (주)에스엠인스트루먼트 Ｍｅｍｓ 마이크로폰을 이용한 유연 기판 부착형 음향 측정 장치 및 그 제조 방법
US9510103B2 (en) 2013-09-09 2016-11-29 Audio Pixels Ltd. Microelectromechanical apparatus for generating a physical effect
CN105933837B (zh) * 2013-10-18 2019-02-15 张小友 一种mems传声器振动膜片
CN103645215B (zh) * 2013-12-12 2017-01-11 中国科学院微电子研究所 一种基于柔性衬底的传感器模块
TWI575963B (zh) * 2014-02-27 2017-03-21 先技股份有限公司 微機電麥克風裝置
EP3148924A1 (de) 2014-05-28 2017-04-05 3M Innovative Properties Company Mems-vorrichtungen auf einem flexiblen substrat
CN105635926B (zh) * 2014-10-29 2019-06-28 中芯国际集成电路制造(上海)有限公司 一种mems麦克风及其制备方法、电子装置
US9729193B2 (en) 2014-11-11 2017-08-08 Ut-Battelle, Llc Wireless sensor platform
US9439002B2 (en) * 2014-11-13 2016-09-06 Invensense, Inc. Integrated package forming wide sense gap micro electro-mechanical system microphone and methodologies for fabricating the same
US10567883B2 (en) 2015-07-22 2020-02-18 Audio Pixels Ltd. Piezo-electric actuators
WO2017013665A1 (en) 2015-07-22 2017-01-26 Audio Pixels Ltd. Dsr speaker elements and methods of manufacturing thereof
KR101703608B1 (ko) * 2015-08-28 2017-02-07 현대자동차 주식회사 탈착형 마이크로폰 및 그 제조 방법
WO2017040174A1 (en) 2015-09-04 2017-03-09 Ut-Battelle, Llc Direct write sensors
DE102015116707A1 (de) 2015-10-01 2017-04-06 USound GmbH Flexible MEMS-Leiterplatteneinheit sowie Schallwandleranordnung
CN105336818B (zh) * 2015-12-03 2017-11-14 中国电子科技集团公司第十八研究所 太阳电池的制备方法
DE102016216365A1 (de) * 2016-08-31 2018-03-01 Robert Bosch Gmbh Wandlereinrichtung
JP6293938B1 (ja) 2017-02-08 2018-03-14 日本航空電子工業株式会社 フィルム面受音型音センサモジュール
US10505162B2 (en) 2017-10-05 2019-12-10 Analog Devices, Inc. Battery housing
US10356523B2 (en) 2017-12-13 2019-07-16 Nvf Tech Ltd Distributed mode loudspeaker actuator including patterned electrodes
CN110149100B (zh) * 2018-02-12 2023-10-13 诺思(天津)微系统有限责任公司 柔性电子器件及其制备方法
US11764392B2 (en) 2018-03-01 2023-09-19 Analog Devices, Inc. Battery assembly and method of manufacturing the same
US10477321B2 (en) * 2018-03-05 2019-11-12 Google Llc Driving distributed mode loudspeaker actuator that includes patterned electrodes
CN110300361A (zh) * 2019-06-20 2019-10-01 钰太芯微电子科技（上海）有限公司 一种带无线充电线圈的mems麦克风
CN110337056B (zh) * 2019-08-06 2021-01-26 常州元晶电子科技有限公司 一种高密度指向性压电电声换能器阵列的制作方法
CN111486973A (zh) * 2020-03-30 2020-08-04 成都众芯科技有限公司 一种全柔性热释电红外探测器

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61239678A (ja) * 1985-04-16 1986-10-24 Mitsubishi Electric Corp 光電変換装置
JPH0563171A (ja) * 1991-08-30 1993-03-12 Kyocera Corp 光電変換素子の製造方法
EP0557780A1 (de) * 1992-02-25 1993-09-01 Siemens Aktiengesellschaft Ultraschallwandler mit piezoelektrischer Polymerfolie
US5633552A (en) * 1993-06-04 1997-05-27 The Regents Of The University Of California Cantilever pressure transducer
JPH07254568A (ja) * 1994-01-28 1995-10-03 Toray Ind Inc アモルファスシリコン−ゲルマニウム膜およびその製造方法
US5914507A (en) * 1994-05-11 1999-06-22 Regents Of The University Of Minnesota PZT microdevice
US5488954A (en) * 1994-09-09 1996-02-06 Georgia Tech Research Corp. Ultrasonic transducer and method for using same
US5713724A (en) * 1994-11-23 1998-02-03 Coltec Industries Inc. System and methods for controlling rotary screw compressors
WO1997022141A1 (fr) * 1995-12-14 1997-06-19 Seiko Epson Corporation Procede de fabrication d'un film semi-conducteur mince et dispositif obtenu par ce procede
AU6533598A (en) * 1997-01-24 1998-08-18 California Institute Of Technology Flexible skin incorporating mems technology
JP4294798B2 (ja) * 1998-07-16 2009-07-15 マサチューセッツ・インスティテュート・オブ・テクノロジー 超音波トランスデューサ
JP2001085075A (ja) * 1999-09-10 2001-03-30 Hitachi Maxell Ltd 光電変換素子及びその製造方法
JP2001250963A (ja) * 2000-03-03 2001-09-14 Tdk Corp 太陽電池
KR20020016117A (ko) * 2000-08-24 2002-03-04 신현준 Ｍｅｍｓ 공정을 이용한 마이크로폰 제작방법
CN1144272C (zh) * 2000-09-04 2004-03-31 中国科学院半导体研究所 采用teos源pecvd生长氧化硅厚膜的方法
US6764446B2 (en) * 2000-10-16 2004-07-20 Remon Medical Technologies Ltd Implantable pressure sensors and methods for making and using them
US6641540B2 (en) * 2000-12-01 2003-11-04 The Cleveland Clinic Foundation Miniature ultrasound transducer
US6515402B2 (en) * 2001-01-24 2003-02-04 Koninklijke Philips Electronics N.V. Array of ultrasound transducers

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US20040061543A1 (en) 2004-04-01
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DE60312087T2 (de) 2007-11-29
KR100512960B1 (ko) 2005-09-07

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