DE60305295D1 - Methode zur herstellung von rfid etiketten - Google Patents

Methode zur herstellung von rfid etiketten

Info

Publication number
DE60305295D1
DE60305295D1 DE60305295T DE60305295T DE60305295D1 DE 60305295 D1 DE60305295 D1 DE 60305295D1 DE 60305295 T DE60305295 T DE 60305295T DE 60305295 T DE60305295 T DE 60305295T DE 60305295 D1 DE60305295 D1 DE 60305295D1
Authority
DE
Germany
Prior art keywords
sections
rfid
transport member
antenna
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60305295T
Other languages
English (en)
Other versions
DE60305295T2 (de
DE60305295T3 (de
Inventor
Alan Green
Rene Benoit
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avery Dennison Corp
Original Assignee
Avery Dennison Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26983984&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60305295(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Avery Dennison Corp filed Critical Avery Dennison Corp
Publication of DE60305295D1 publication Critical patent/DE60305295D1/de
Publication of DE60305295T2 publication Critical patent/DE60305295T2/de
Application granted granted Critical
Publication of DE60305295T3 publication Critical patent/DE60305295T3/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

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    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y10T156/1077—Applying plural cut laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1097—Lamina is running length web
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
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US35060602P 2002-01-18 2002-01-18
US350606P 2002-01-18
US10/323,490 US6951596B2 (en) 2002-01-18 2002-12-18 RFID label technique
PCT/US2003/001513 WO2003105063A2 (en) 2002-01-18 2003-01-17 Cross-reference
EP03748885.5A EP1470528B2 (de) 2002-01-18 2003-01-17 Methode zur herstellung von rfid etiketten

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WO2003105063A3 (en) 2004-07-29
DE20321502U1 (de) 2007-10-25
ES2270072T3 (es) 2007-04-01
KR100967856B1 (ko) 2010-07-05
EP1470528A2 (de) 2004-10-27
EP2306372A1 (de) 2011-04-06
WO2003105063A2 (en) 2003-12-18
EP1470528B1 (de) 2006-05-17
US6951596B2 (en) 2005-10-04
ES2270072T5 (es) 2017-04-25
US20050252605A1 (en) 2005-11-17
JP4860918B2 (ja) 2012-01-25
CA2816324A1 (en) 2003-12-18
JP2009048662A (ja) 2009-03-05
US20060213609A1 (en) 2006-09-28
ATE326734T2 (de) 2006-06-15
MXPA04006913A (es) 2004-10-15
BRPI0306992A2 (pt) 2016-07-12
CA2816158A1 (en) 2003-12-18
BRPI0306992B8 (pt) 2022-08-23
AU2003267938B2 (en) 2008-04-24
JP2005520266A (ja) 2005-07-07
ES2588207T3 (es) 2016-10-31
US7368032B2 (en) 2008-05-06
CA2473729A1 (en) 2003-12-18
CN1628321A (zh) 2005-06-15
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EP1693792A1 (de) 2006-08-23
CA2473729C (en) 2015-12-08
EP1693792B1 (de) 2015-08-12
BRPI0306992B1 (pt) 2017-08-29
US8246773B2 (en) 2012-08-21
US20080142154A1 (en) 2008-06-19
CN101159036A (zh) 2008-04-09
CA2816180A1 (en) 2003-12-18
CN101159036B (zh) 2010-11-10
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US9495632B2 (en) 2016-11-15
US20030136503A1 (en) 2003-07-24
ES2551274T3 (es) 2015-11-17
EP1470528B2 (de) 2016-10-05
DE03748885T1 (de) 2005-09-29
US20120297609A1 (en) 2012-11-29
DE60305295T2 (de) 2007-01-18
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KR20040075095A (ko) 2004-08-26
US7361251B2 (en) 2008-04-22

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