DE60303236D1 - Vielteiliger fester Tintenstift - Google Patents

Vielteiliger fester Tintenstift

Info

Publication number
DE60303236D1
DE60303236D1 DE60303236T DE60303236T DE60303236D1 DE 60303236 D1 DE60303236 D1 DE 60303236D1 DE 60303236 T DE60303236 T DE 60303236T DE 60303236 T DE60303236 T DE 60303236T DE 60303236 D1 DE60303236 D1 DE 60303236D1
Authority
DE
Germany
Prior art keywords
multipart
solid ink
ink stick
stick
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60303236T
Other languages
English (en)
Other versions
DE60303236T2 (de
Inventor
Brent R Jones
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Application granted granted Critical
Publication of DE60303236D1 publication Critical patent/DE60303236D1/de
Publication of DE60303236T2 publication Critical patent/DE60303236T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17593—Supplying ink in a solid state
DE60303236T 2002-04-29 2003-04-29 Vielteiliger fester Tintenstift Expired - Lifetime DE60303236T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US135105 1993-10-12
US10/135,105 US6672716B2 (en) 2002-04-29 2002-04-29 Multiple portion solid ink stick

Publications (2)

Publication Number Publication Date
DE60303236D1 true DE60303236D1 (de) 2006-04-06
DE60303236T2 DE60303236T2 (de) 2006-07-20

Family

ID=29215643

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60303236T Expired - Lifetime DE60303236T2 (de) 2002-04-29 2003-04-29 Vielteiliger fester Tintenstift

Country Status (5)

Country Link
US (1) US6672716B2 (de)
EP (1) EP1359017B1 (de)
JP (1) JP2003312015A (de)
BR (1) BR0301301A (de)
DE (1) DE60303236T2 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6722764B2 (en) * 2002-04-29 2004-04-20 Xerox Corporation Feed guidance and identification for ink stick
US6705710B2 (en) 2002-05-30 2004-03-16 Xerox Corporation Load and feed apparatus for solid ink
US6565200B1 (en) * 2002-05-30 2003-05-20 Xerox Corporation Load and feed apparatus for solid ink
US7503648B2 (en) * 2005-06-09 2009-03-17 Xerox Corporation Ink consumption determination
US7874661B2 (en) * 2006-06-22 2011-01-25 Xerox Corporation Solid ink stick with coded markings and method and apparatus for reading markings
US7857439B2 (en) * 2006-06-23 2010-12-28 Xerox Corporation Solid ink stick with interface element
US7553008B2 (en) * 2006-06-23 2009-06-30 Xerox Corporation Ink loader for interfacing with solid ink sticks
US7753509B2 (en) * 2006-08-14 2010-07-13 Xerox Corporation Segmented ink stick
US7810918B2 (en) * 2006-11-07 2010-10-12 Xerox Corporation One way compatibility keying for solid ink sticks
US7854501B2 (en) * 2006-11-07 2010-12-21 Xerox Corporation Common side insertion keying for phase change ink sticks
US7780283B2 (en) * 2006-11-07 2010-08-24 Xerox Corporation Independent keying and guidance for solid ink sticks
US7798624B2 (en) 2006-11-21 2010-09-21 Xerox Corporation Transport system for solid ink in a printer
US7794072B2 (en) 2006-11-21 2010-09-14 Xerox Corporation Guide for printer solid ink transport and method
US7976144B2 (en) 2006-11-21 2011-07-12 Xerox Corporation System and method for delivering solid ink sticks to a melting device through a non-linear guide
US7883195B2 (en) * 2006-11-21 2011-02-08 Xerox Corporation Solid ink stick features for printer ink transport and method
US7819513B2 (en) * 2007-03-09 2010-10-26 Xerox Corporation Solid ink stick with multiple axis interlocking
US7802880B2 (en) * 2007-03-12 2010-09-28 Xerox Corporation Solid ink stick with canted surface
US8016403B2 (en) 2007-10-03 2011-09-13 Xerox Corporation Solid ink stick with visual orientation indicator
US7976118B2 (en) * 2007-10-22 2011-07-12 Xerox Corporation Transport system for providing a continuous supply of solid ink to a melting assembly in a printer
US7891792B2 (en) * 2007-11-06 2011-02-22 Xerox Corporation Solid ink stick with transition indicating region
US7942515B2 (en) 2007-12-21 2011-05-17 Xerox Corporation Solid ink stick having a feed drive coupler
US7887173B2 (en) 2008-01-18 2011-02-15 Xerox Corporation Transport system having multiple moving forces for solid ink delivery in a printer
US8240830B2 (en) 2010-03-10 2012-08-14 Xerox Corporation No spill, feed controlled removable container for delivering pelletized substances
US8366255B2 (en) * 2010-06-02 2013-02-05 Xerox Corporation Solid ink stick with retrieval feature
US8646892B2 (en) 2011-12-22 2014-02-11 Xerox Corporation Solid ink stick delivery apparatus using a lead screw drive
US8814336B2 (en) 2011-12-22 2014-08-26 Xerox Corporation Solid ink stick configuration
US8727478B2 (en) 2012-10-17 2014-05-20 Xerox Corporation Ink loader having optical sensors to identify solid ink sticks
US8777386B2 (en) 2012-10-17 2014-07-15 Xerox Corporation Solid ink stick having identical identifying features on a plurality of edges
CA3133635A1 (en) 2021-01-29 2022-07-29 Quanta Associates, L.P. Spring loaded ground clamp

Family Cites Families (105)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3205485A (en) * 1960-10-21 1965-09-07 Ti Group Services Ltd Screening vane electro-mechanical transducer
US3229198A (en) * 1962-09-28 1966-01-11 Hugo L Libby Eddy current nondestructive testing device for measuring multiple parameter variables of a metal sample
US4302721A (en) * 1978-05-08 1981-11-24 Tencor Instruments Non-contacting resistivity instrument with structurally related conductance and distance measuring transducers
FR2589566A1 (fr) * 1985-11-06 1987-05-07 Cegedur Procede de mesure au defile et sans contact de l'epaisseur et de la temperature de feuilles metalliques minces au moyen de courants de foucault
US4750141A (en) * 1985-11-26 1988-06-07 Ade Corporation Method and apparatus for separating fixture-induced error from measured object characteristics and for compensating the measured object characteristic with the error, and a bow/warp station implementing same
US4938600A (en) * 1989-02-09 1990-07-03 Interactive Video Systems, Inc. Method and apparatus for measuring registration between layers of a semiconductor wafer
US5485082A (en) * 1990-04-11 1996-01-16 Micro-Epsilon Messtechnik Gmbh & Co. Kg Method of calibrating a thickness measuring device and device for measuring or monitoring the thickness of layers, tapes, foils, and the like
US5455604A (en) 1991-04-29 1995-10-03 Tektronix, Inc. Ink jet printer architecture and method
US5223860A (en) * 1991-06-17 1993-06-29 Tektronix, Inc. Apparatus for supplying phase change ink to an ink jet printer
US5283141A (en) * 1992-03-05 1994-02-01 National Semiconductor Photolithography control system and method using latent image measurements
US5857258A (en) * 1992-03-13 1999-01-12 The United States Of America As Represented By The Secretary Of Commerce Electrical test structure and method for measuring the relative locations of conductive features on an insulating substrate
US5602492A (en) * 1992-03-13 1997-02-11 The United States Of America As Represented By The Secretary Of Commerce Electrical test structure and method for measuring the relative locations of conducting features on an insulating substrate
USD346821S (en) * 1992-07-27 1994-05-10 Dataproducts Corporation Stepped diameter recessed solid ink pellet
USD335683S (en) * 1992-07-27 1993-05-18 Dataproducts Corporation Smooth edge recessed solid ink pellet
US5823853A (en) * 1996-07-18 1998-10-20 Speedfam Corporation Apparatus for the in-process detection of workpieces with a monochromatic light source
US5805191A (en) 1992-11-25 1998-09-08 Tektronix, Inc. Intermediate transfer surface application system
US5642296A (en) * 1993-07-29 1997-06-24 Texas Instruments Incorporated Method of diagnosing malfunctions in semiconductor manufacturing equipment
JP3039210B2 (ja) * 1993-08-03 2000-05-08 日本電気株式会社 半導体装置の製造方法
US5700180A (en) * 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
US5546312A (en) * 1993-09-20 1996-08-13 Texas Instruments Incorporated Use of spatial models for simultaneous control of various non-uniformity metrics
DE69425100T2 (de) * 1993-09-30 2001-03-15 Koninkl Philips Electronics Nv Dynamisches neuronales Netzwerk
US5497381A (en) * 1993-10-15 1996-03-05 Analog Devices, Inc. Bitstream defect analysis method for integrated circuits
US5526293A (en) * 1993-12-17 1996-06-11 Texas Instruments Inc. System and method for controlling semiconductor wafer processing
JPH07201946A (ja) * 1993-12-28 1995-08-04 Hitachi Ltd 半導体装置等の製造方法及びその装置並びに検査方法及びその装置
US5511005A (en) * 1994-02-16 1996-04-23 Ade Corporation Wafer handling and processing system
US5666297A (en) * 1994-05-13 1997-09-09 Aspen Technology, Inc. Plant simulation and optimization software apparatus and method using dual execution models
JP3402412B2 (ja) * 1994-09-20 2003-05-06 株式会社リコー プロセスシミュレーション入力データ設定装置
US5510821B1 (en) * 1994-09-20 2000-05-02 Tektronix Inc Solid ink stick
US5519605A (en) * 1994-10-24 1996-05-21 Olin Corporation Model predictive control apparatus and method
DE4446966A1 (de) * 1994-12-28 1996-07-04 Itt Ind Gmbh Deutsche Informationssystem zur Produktionskontrolle
US5617023A (en) * 1995-02-02 1997-04-01 Otis Elevator Company Industrial contactless position sensor
US5646870A (en) * 1995-02-13 1997-07-08 Advanced Micro Devices, Inc. Method for setting and adjusting process parameters to maintain acceptable critical dimensions across each die of mass-produced semiconductor wafers
US5541510A (en) * 1995-04-06 1996-07-30 Kaman Instrumentation Corporation Multi-Parameter eddy current measuring system with parameter compensation technical field
US5559428A (en) * 1995-04-10 1996-09-24 International Business Machines Corporation In-situ monitoring of the change in thickness of films
USD373139S (en) * 1995-05-11 1996-08-27 Tektronix, Inc. Solid ink stick for a color printer
USD372270S (en) * 1995-05-11 1996-07-30 Tektronix, Inc. Solid ink stick for a color printer
US5649169A (en) * 1995-06-20 1997-07-15 Advanced Micro Devices, Inc. Method and system for declustering semiconductor defect data
US5665199A (en) * 1995-06-23 1997-09-09 Advanced Micro Devices, Inc. Methodology for developing product-specific interlayer dielectric polish processes
US5825913A (en) * 1995-07-18 1998-10-20 Cognex Corporation System for finding the orientation of a wafer
US6036349A (en) * 1995-07-27 2000-03-14 Health Designs, Inc. Method and apparatus for validation of model-based predictions
US5777901A (en) * 1995-09-29 1998-07-07 Advanced Micro Devices, Inc. Method and system for automated die yield prediction in semiconductor manufacturing
US5761064A (en) * 1995-10-06 1998-06-02 Advanced Micro Devices, Inc. Defect management system for productivity and yield improvement
US5654903A (en) * 1995-11-07 1997-08-05 Lucent Technologies Inc. Method and apparatus for real time monitoring of wafer attributes in a plasma etch process
US5719796A (en) * 1995-12-04 1998-02-17 Advanced Micro Devices, Inc. System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback
US5674787A (en) * 1996-01-16 1997-10-07 Sematech, Inc. Selective electroless copper deposited interconnect plugs for ULSI applications
US5734402A (en) 1996-03-07 1998-03-31 Tekronix, Inc. Solid ink stick feed system
US5861903A (en) 1996-03-07 1999-01-19 Tektronix, Inc. Ink feed system
US6017143A (en) * 1996-03-28 2000-01-25 Rosemount Inc. Device in a process system for detecting events
WO1997036164A1 (en) * 1996-03-28 1997-10-02 Bio-Analytics, Inc., Doing Business As Biomedware Method for measuring a degree of association for dimensionally referenced data
US5735055A (en) * 1996-04-23 1998-04-07 Aluminum Company Of America Method and apparatus for measuring the thickness of an article at a plurality of points
US5663797A (en) * 1996-05-16 1997-09-02 Micron Technology, Inc. Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
US5910846A (en) * 1996-05-16 1999-06-08 Micron Technology, Inc. Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
US5960185A (en) * 1996-06-24 1999-09-28 International Business Machines Corporation Method and apparatus for wafer disposition based on systematic error modeling
US6053608A (en) * 1996-07-24 2000-04-25 Brother Kogyo Kabushiki Kaisha Ink pellet with step configuration including slidable bearing surfaces
US6246972B1 (en) * 1996-08-23 2001-06-12 Aspen Technology, Inc. Analyzer for modeling and optimizing maintenance operations
US5667424A (en) * 1996-09-25 1997-09-16 Chartered Semiconductor Manufacturing Pte Ltd. New chemical mechanical planarization (CMP) end point detection apparatus
TW364956B (en) * 1996-10-21 1999-07-21 Nxp Bv Method and system for assessing a measurement procedure and measurement-induced uncertainties on a batchwise manufacturing process of discrete products
US6064759A (en) * 1996-11-08 2000-05-16 Buckley; B. Shawn Computer aided inspection machine
USD403699S (en) * 1997-03-10 1999-01-05 Tektronix, Inc. Solid ink stick for a color printer
US6108091A (en) * 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6097887A (en) * 1997-10-27 2000-08-01 Kla-Tencor Corporation Software system and method for graphically building customized recipe flowcharts
US5985497A (en) * 1998-02-03 1999-11-16 Advanced Micro Devices, Inc. Method for reducing defects in a semiconductor lithographic process
US6455937B1 (en) * 1998-03-20 2002-09-24 James A. Cunningham Arrangement and method for improved downward scaling of higher conductivity metal-based interconnects
US6017771A (en) * 1998-04-27 2000-01-25 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for yield loss analysis by yield management system
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US6127263A (en) * 1998-07-10 2000-10-03 Applied Materials, Inc. Misalignment tolerant techniques for dual damascene fabrication
US6141660A (en) * 1998-07-16 2000-10-31 International Business Machines Corporation Command line interface for creating business objects for accessing a hierarchical database
US6169931B1 (en) * 1998-07-29 2001-01-02 Southwest Research Institute Method and system for modeling, predicting and optimizing chemical mechanical polishing pad wear and extending pad life
US6210983B1 (en) * 1998-10-21 2001-04-03 Texas Instruments Incorporated Method for analyzing probe yield sensitivities to IC design
US6280289B1 (en) * 1998-11-02 2001-08-28 Applied Materials, Inc. Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
US6173240B1 (en) * 1998-11-02 2001-01-09 Ise Integrated Systems Engineering Ag Multidimensional uncertainty analysis
US6214734B1 (en) * 1998-11-20 2001-04-10 Vlsi Technology, Inc. Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection
US6172756B1 (en) * 1998-12-11 2001-01-09 Filmetrics, Inc. Rapid and accurate end point detection in a noisy environment
US6136163A (en) * 1999-03-05 2000-10-24 Applied Materials, Inc. Apparatus for electro-chemical deposition with thermal anneal chamber
US7020537B2 (en) * 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6334807B1 (en) * 1999-04-30 2002-01-01 International Business Machines Corporation Chemical mechanical polishing in-situ end point system
US6360133B1 (en) * 1999-06-17 2002-03-19 Advanced Micro Devices, Inc. Method and apparatus for automatic routing for reentrant process
US6204165B1 (en) * 1999-06-24 2001-03-20 International Business Machines Corporation Practical air dielectric interconnections by post-processing standard CMOS wafers
EP1065567A3 (de) * 1999-06-29 2001-05-16 Applied Materials, Inc. Integrierte Kontrolle einer kritischen Dimension
US20030213772A9 (en) * 1999-07-09 2003-11-20 Mok Yeuk-Fai Edwin Integrated semiconductor substrate bevel cleaning apparatus and method
US6405096B1 (en) * 1999-08-10 2002-06-11 Advanced Micro Devices, Inc. Method and apparatus for run-to-run controlling of overlay registration
US6368883B1 (en) * 1999-08-10 2002-04-09 Advanced Micro Devices, Inc. Method for identifying and controlling impact of ambient conditions on photolithography processes
US6287879B1 (en) * 1999-08-11 2001-09-11 Micron Technology, Inc. Endpoint stabilization for polishing process
US6217412B1 (en) * 1999-08-11 2001-04-17 Advanced Micro Devices, Inc. Method for characterizing polish pad lots to eliminate or reduce tool requalification after changing a polishing pad
US6276989B1 (en) * 1999-08-11 2001-08-21 Advanced Micro Devices, Inc. Method and apparatus for controlling within-wafer uniformity in chemical mechanical polishing
US6284622B1 (en) * 1999-10-25 2001-09-04 Advanced Micro Devices, Inc. Method for filling trenches
IL133326A0 (en) * 1999-12-06 2001-04-30 Nova Measuring Instr Ltd Method and system for endpoint detection
US6405144B1 (en) * 2000-01-18 2002-06-11 Advanced Micro Devices, Inc. Method and apparatus for programmed latency for improving wafer-to-wafer uniformity
US6584369B2 (en) * 2000-02-02 2003-06-24 Texas Instruments Incorporated Method and system for dispatching semiconductor lots to manufacturing equipment for fabrication
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
JP3979791B2 (ja) * 2000-03-08 2007-09-19 株式会社ルネサステクノロジ 半導体装置およびその製造方法
US6290572B1 (en) * 2000-03-23 2001-09-18 Micron Technology, Inc. Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6368884B1 (en) * 2000-04-13 2002-04-09 Advanced Micro Devices, Inc. Die-based in-fab process monitoring and analysis system for semiconductor processing
US6435952B1 (en) * 2000-06-30 2002-08-20 Lam Research Corporation Apparatus and method for qualifying a chemical mechanical planarization process
WO2002004887A1 (en) * 2000-07-08 2002-01-17 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US6379980B1 (en) * 2000-07-26 2002-04-30 Advanced Micro Devices, Inc. Method and apparatus for monitoring material removal tool performance using endpoint time removal rate determination
US6307628B1 (en) * 2000-08-18 2001-10-23 Taiwan Semiconductor Manufacturing Company, Ltd Method and apparatus for CMP end point detection using confocal optics
US6593737B2 (en) * 2000-08-24 2003-07-15 Shell Oil Company Method for measuring the wall thickness of an electrically conductive object
JP2002093761A (ja) * 2000-09-19 2002-03-29 Sony Corp 研磨方法、研磨装置、メッキ方法およびメッキ装置
KR100366630B1 (ko) * 2000-09-20 2003-01-09 삼성전자 주식회사 샘플 스킵 방식의 알고리즘을 이용한 웨이퍼의 연마 시간제어 방법 및 이를 이용한 웨이퍼의 연마 방법
JP2002124496A (ja) * 2000-10-18 2002-04-26 Hitachi Ltd 研磨加工の終点検出計測方法及びその装置、並びにそれを用いた半導体デバイスの製造方法及びその製造装置
US6304999B1 (en) * 2000-10-23 2001-10-16 Advanced Micro Devices, Inc. Method and apparatus for embedded process control framework in tool systems
US6517413B1 (en) * 2000-10-25 2003-02-11 Taiwan Semiconductor Manufacturing Company Method for a copper CMP endpoint detection system
US6336841B1 (en) * 2001-03-29 2002-01-08 Macronix International Co. Ltd. Method of CMP endpoint detection
US6549279B2 (en) * 2001-04-09 2003-04-15 Speedfam-Ipec Corporation Method and apparatus for optical endpoint calibration in CMP

Also Published As

Publication number Publication date
JP2003312015A (ja) 2003-11-06
EP1359017A1 (de) 2003-11-05
DE60303236T2 (de) 2006-07-20
US20030202070A1 (en) 2003-10-30
BR0301301A (pt) 2004-08-17
US6672716B2 (en) 2004-01-06
EP1359017B1 (de) 2006-01-18

Similar Documents

Publication Publication Date Title
DE60303236D1 (de) Vielteiliger fester Tintenstift
DE60317665D1 (de) Tintenstrahl-zusammensetzungen
DE602004010280D1 (de) Druckfarbe oder -tinte
DE602004030207D1 (de) Handdrucker
DE602004020877D1 (de) Fernauslösbarer stützstab
DE602004015711D1 (de) Tintenstrahldrucker
DE602004006448D1 (de) Tintenstrahldrucker
DE60300892D1 (de) Tintenstrahldrucker
DE60326918D1 (de) Tintenstrahldrucker
EP1612768A4 (de) Ultraleichtes schalldichtes material
DE602004002346D1 (de) Tintenstrahldrucker
DE602004026391D1 (de) Tintenstrahldrucker
DE602004013671D1 (de) Tintenstrahldruckverfahre
BR0301705B1 (pt) carregador de bastão de tinta sólida.
DE50308795D1 (de) Digitaldrucker
DE602004020408D1 (de) Tintenstrahldrucker
DE602004006034D1 (de) Tintenstrahldrucker
DE60305567D1 (de) Nicht-wässrige Tintezusammensetzung
DE602004001949D1 (de) Tintenstrahldrucker
DE60331995D1 (de) Tintenstrahldrucker
DE602004001696D1 (de) Tintensatz
DE502004007527D1 (de) Kautschukzusammensetzung
DE602004020037D1 (de) Tintenstrahldrucker
DE602004000414D1 (de) Tintenstrahldrucker
DE602004023980D1 (de) Tintenstrahldrucker

Legal Events

Date Code Title Description
8364 No opposition during term of opposition