DE602004006270D1 - Dreidimensionale miniaturkapselung für mems-sensoren - Google Patents

Dreidimensionale miniaturkapselung für mems-sensoren

Info

Publication number
DE602004006270D1
DE602004006270D1 DE602004006270T DE602004006270T DE602004006270D1 DE 602004006270 D1 DE602004006270 D1 DE 602004006270D1 DE 602004006270 T DE602004006270 T DE 602004006270T DE 602004006270 T DE602004006270 T DE 602004006270T DE 602004006270 D1 DE602004006270 D1 DE 602004006270D1
Authority
DE
Germany
Prior art keywords
capsulation
structured
mems
mems sensors
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004006270T
Other languages
English (en)
Other versions
DE602004006270T2 (de
Inventor
Douglas C Macgugan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of DE602004006270D1 publication Critical patent/DE602004006270D1/de
Application granted granted Critical
Publication of DE602004006270T2 publication Critical patent/DE602004006270T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0074—3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
    • G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
    • G01C21/12—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning
    • G01C21/16—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
    • G01C21/166—Mechanical, construction or arrangement details of inertial navigation systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/88—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof adapted for simultaneous co-operation with two or more identical counterparts
DE602004006270T 2003-02-28 2004-02-27 Dreidimensionale miniaturkapselung für mems-sensoren Expired - Lifetime DE602004006270T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US377439 2003-02-28
US10/377,439 US6918297B2 (en) 2003-02-28 2003-02-28 Miniature 3-dimensional package for MEMS sensors
PCT/US2004/006207 WO2004079874A1 (en) 2003-02-28 2004-02-27 Miniature 3-dimensional package for mems sensors

Publications (2)

Publication Number Publication Date
DE602004006270D1 true DE602004006270D1 (de) 2007-06-14
DE602004006270T2 DE602004006270T2 (de) 2008-01-03

Family

ID=32908142

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004006270T Expired - Lifetime DE602004006270T2 (de) 2003-02-28 2004-02-27 Dreidimensionale miniaturkapselung für mems-sensoren

Country Status (5)

Country Link
US (1) US6918297B2 (de)
EP (1) EP1642365B1 (de)
AT (1) ATE361563T1 (de)
DE (1) DE602004006270T2 (de)
WO (1) WO2004079874A1 (de)

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CN102121829B (zh) * 2010-08-09 2013-06-12 汪滔 一种微型惯性测量系统
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US8567246B2 (en) 2010-10-12 2013-10-29 Invensense, Inc. Integrated MEMS device and method of use
US9664750B2 (en) 2011-01-11 2017-05-30 Invensense, Inc. In-plane sensing Lorentz force magnetometer
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Also Published As

Publication number Publication date
WO2004079874A1 (en) 2004-09-16
ATE361563T1 (de) 2007-05-15
EP1642365B1 (de) 2007-05-02
US20040169244A1 (en) 2004-09-02
EP1642365A1 (de) 2006-04-05
US6918297B2 (en) 2005-07-19
DE602004006270T2 (de) 2008-01-03

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