US7449098B1
(en)
|
1999-10-05 |
2008-11-11 |
Novellus Systems, Inc. |
Method for planar electroplating
|
US7531079B1
(en)
|
1998-10-26 |
2009-05-12 |
Novellus Systems, Inc. |
Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation
|
US7686935B2
(en)
*
|
1998-10-26 |
2010-03-30 |
Novellus Systems, Inc. |
Pad-assisted electropolishing
|
US6719615B1
(en)
|
2000-10-10 |
2004-04-13 |
Beaver Creek Concepts Inc |
Versatile wafer refining
|
US7204917B2
(en)
|
1998-12-01 |
2007-04-17 |
Novellus Systems, Inc. |
Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
|
EP1052062A1
(de)
*
|
1999-05-03 |
2000-11-15 |
Applied Materials, Inc. |
Vorbehandlung eines fixierten Schleifmittels
|
JP2001188254A
(ja)
*
|
1999-10-21 |
2001-07-10 |
Matsushita Electric Ind Co Ltd |
基板内選択的電気化学処理装置と基板内選択的化学処理装置及びアクティブ基板の検査修正方法
|
US6341998B1
(en)
|
1999-11-04 |
2002-01-29 |
Vlsi Technology, Inc. |
Integrated circuit (IC) plating deposition system and method
|
US6299741B1
(en)
|
1999-11-29 |
2001-10-09 |
Applied Materials, Inc. |
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
|
US6379223B1
(en)
|
1999-11-29 |
2002-04-30 |
Applied Materials, Inc. |
Method and apparatus for electrochemical-mechanical planarization
|
US6612915B1
(en)
*
|
1999-12-27 |
2003-09-02 |
Nutool Inc. |
Work piece carrier head for plating and polishing
|
US6547937B1
(en)
*
|
2000-01-03 |
2003-04-15 |
Semitool, Inc. |
Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
|
US6630059B1
(en)
*
|
2000-01-14 |
2003-10-07 |
Nutool, Inc. |
Workpeice proximity plating apparatus
|
US6962524B2
(en)
|
2000-02-17 |
2005-11-08 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
US20080156657A1
(en)
*
|
2000-02-17 |
2008-07-03 |
Butterfield Paul D |
Conductive polishing article for electrochemical mechanical polishing
|
US7303462B2
(en)
*
|
2000-02-17 |
2007-12-04 |
Applied Materials, Inc. |
Edge bead removal by an electro polishing process
|
US6991526B2
(en)
|
2002-09-16 |
2006-01-31 |
Applied Materials, Inc. |
Control of removal profile in electrochemically assisted CMP
|
US6991528B2
(en)
*
|
2000-02-17 |
2006-01-31 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
US6848970B2
(en)
*
|
2002-09-16 |
2005-02-01 |
Applied Materials, Inc. |
Process control in electrochemically assisted planarization
|
US7125477B2
(en)
*
|
2000-02-17 |
2006-10-24 |
Applied Materials, Inc. |
Contacts for electrochemical processing
|
US6537144B1
(en)
|
2000-02-17 |
2003-03-25 |
Applied Materials, Inc. |
Method and apparatus for enhanced CMP using metals having reductive properties
|
US7303662B2
(en)
*
|
2000-02-17 |
2007-12-04 |
Applied Materials, Inc. |
Contacts for electrochemical processing
|
US7059948B2
(en)
*
|
2000-12-22 |
2006-06-13 |
Applied Materials |
Articles for polishing semiconductor substrates
|
US20040182721A1
(en)
*
|
2003-03-18 |
2004-09-23 |
Applied Materials, Inc. |
Process control in electro-chemical mechanical polishing
|
US7670468B2
(en)
|
2000-02-17 |
2010-03-02 |
Applied Materials, Inc. |
Contact assembly and method for electrochemical mechanical processing
|
US7374644B2
(en)
*
|
2000-02-17 |
2008-05-20 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
US7029365B2
(en)
*
|
2000-02-17 |
2006-04-18 |
Applied Materials Inc. |
Pad assembly for electrochemical mechanical processing
|
US20050092621A1
(en)
*
|
2000-02-17 |
2005-05-05 |
Yongqi Hu |
Composite pad assembly for electrochemical mechanical processing (ECMP)
|
US7678245B2
(en)
|
2000-02-17 |
2010-03-16 |
Applied Materials, Inc. |
Method and apparatus for electrochemical mechanical processing
|
US7066800B2
(en)
*
|
2000-02-17 |
2006-06-27 |
Applied Materials Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
US20040020789A1
(en)
*
|
2000-02-17 |
2004-02-05 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
US6653242B1
(en)
|
2000-06-30 |
2003-11-25 |
Applied Materials, Inc. |
Solution to metal re-deposition during substrate planarization
|
US7129160B2
(en)
|
2002-08-29 |
2006-10-31 |
Micron Technology, Inc. |
Method for simultaneously removing multiple conductive materials from microelectronic substrates
|
US7153195B2
(en)
|
2000-08-30 |
2006-12-26 |
Micron Technology, Inc. |
Methods and apparatus for selectively removing conductive material from a microelectronic substrate
|
US7220166B2
(en)
|
2000-08-30 |
2007-05-22 |
Micron Technology, Inc. |
Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
|
US7078308B2
(en)
|
2002-08-29 |
2006-07-18 |
Micron Technology, Inc. |
Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate
|
US6867448B1
(en)
|
2000-08-31 |
2005-03-15 |
Micron Technology, Inc. |
Electro-mechanically polished structure
|
US6464855B1
(en)
*
|
2000-10-04 |
2002-10-15 |
Speedfam-Ipec Corporation |
Method and apparatus for electrochemical planarization of a workpiece
|
US7377836B1
(en)
|
2000-10-10 |
2008-05-27 |
Beaver Creek Concepts Inc |
Versatile wafer refining
|
JP4644926B2
(ja)
*
|
2000-10-13 |
2011-03-09 |
ソニー株式会社 |
半導体製造装置および半導体装置の製造方法
|
WO2002041369A2
(en)
*
|
2000-11-20 |
2002-05-23 |
Rodel Holdings, Inc. |
Electropolishing and chemical mechanical planarization
|
US6896776B2
(en)
*
|
2000-12-18 |
2005-05-24 |
Applied Materials Inc. |
Method and apparatus for electro-chemical processing
|
US6613200B2
(en)
|
2001-01-26 |
2003-09-02 |
Applied Materials, Inc. |
Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform
|
US7201829B2
(en)
|
2001-03-01 |
2007-04-10 |
Novellus Systems, Inc. |
Mask plate design
|
US7189647B2
(en)
*
|
2001-04-05 |
2007-03-13 |
Novellus Systems, Inc. |
Sequential station tool for wet processing of semiconductor wafers
|
US6572755B2
(en)
*
|
2001-04-11 |
2003-06-03 |
Speedfam-Ipec Corporation |
Method and apparatus for electrochemically depositing a material onto a workpiece surface
|
US7137879B2
(en)
*
|
2001-04-24 |
2006-11-21 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
US7344432B2
(en)
*
|
2001-04-24 |
2008-03-18 |
Applied Materials, Inc. |
Conductive pad with ion exchange membrane for electrochemical mechanical polishing
|
TWI224531B
(en)
*
|
2001-09-11 |
2004-12-01 |
Ebara Corp |
Substrate processing apparatus and method
|
US6863794B2
(en)
*
|
2001-09-21 |
2005-03-08 |
Applied Materials, Inc. |
Method and apparatus for forming metal layers
|
US20030072639A1
(en)
*
|
2001-10-17 |
2003-04-17 |
Applied Materials, Inc. |
Substrate support
|
US6838149B2
(en)
*
|
2001-12-13 |
2005-01-04 |
3M Innovative Properties Company |
Abrasive article for the deposition and polishing of a conductive material
|
US6802955B2
(en)
|
2002-01-11 |
2004-10-12 |
Speedfam-Ipec Corporation |
Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
|
US6951599B2
(en)
|
2002-01-22 |
2005-10-04 |
Applied Materials, Inc. |
Electropolishing of metallic interconnects
|
US6837983B2
(en)
*
|
2002-01-22 |
2005-01-04 |
Applied Materials, Inc. |
Endpoint detection for electro chemical mechanical polishing and electropolishing processes
|
US6866559B2
(en)
|
2002-02-04 |
2005-03-15 |
Kla-Tencor Technologies |
Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad
|
US20030146102A1
(en)
*
|
2002-02-05 |
2003-08-07 |
Applied Materials, Inc. |
Method for forming copper interconnects
|
US20050194681A1
(en)
*
|
2002-05-07 |
2005-09-08 |
Yongqi Hu |
Conductive pad with high abrasion
|
US7152215B2
(en)
*
|
2002-06-07 |
2006-12-19 |
Praesagus, Inc. |
Dummy fill for integrated circuits
|
US7774726B2
(en)
*
|
2002-06-07 |
2010-08-10 |
Cadence Design Systems, Inc. |
Dummy fill for integrated circuits
|
US7363099B2
(en)
*
|
2002-06-07 |
2008-04-22 |
Cadence Design Systems, Inc. |
Integrated circuit metrology
|
US7393755B2
(en)
*
|
2002-06-07 |
2008-07-01 |
Cadence Design Systems, Inc. |
Dummy fill for integrated circuits
|
US7853904B2
(en)
*
|
2002-06-07 |
2010-12-14 |
Cadence Design Systems, Inc. |
Method and system for handling process related variations for integrated circuits based upon reflections
|
AU2003274370A1
(en)
|
2002-06-07 |
2003-12-22 |
Praesagus, Inc. |
Characterization adn reduction of variation for integrated circuits
|
US7124386B2
(en)
*
|
2002-06-07 |
2006-10-17 |
Praesagus, Inc. |
Dummy fill for integrated circuits
|
US20030229875A1
(en)
*
|
2002-06-07 |
2003-12-11 |
Smith Taber H. |
Use of models in integrated circuit fabrication
|
US7712056B2
(en)
*
|
2002-06-07 |
2010-05-04 |
Cadence Design Systems, Inc. |
Characterization and verification for integrated circuit designs
|
US6790336B2
(en)
*
|
2002-06-19 |
2004-09-14 |
Intel Corporation |
Method of fabricating damascene structures in mechanically weak interlayer dielectrics
|
US20040072445A1
(en)
*
|
2002-07-11 |
2004-04-15 |
Applied Materials, Inc. |
Effective method to improve surface finish in electrochemically assisted CMP
|
US7799200B1
(en)
|
2002-07-29 |
2010-09-21 |
Novellus Systems, Inc. |
Selective electrochemical accelerator removal
|
US7112270B2
(en)
|
2002-09-16 |
2006-09-26 |
Applied Materials, Inc. |
Algorithm for real-time process control of electro-polishing
|
US20050061674A1
(en)
*
|
2002-09-16 |
2005-03-24 |
Yan Wang |
Endpoint compensation in electroprocessing
|
US20040055873A1
(en)
*
|
2002-09-24 |
2004-03-25 |
Digital Matrix Corporation |
Apparatus and method for improved electroforming
|
US6855239B1
(en)
|
2002-09-27 |
2005-02-15 |
Rahul Jairath |
Plating method and apparatus using contactless electrode
|
US6796887B2
(en)
|
2002-11-13 |
2004-09-28 |
Speedfam-Ipec Corporation |
Wear ring assembly
|
US6776885B2
(en)
*
|
2002-11-14 |
2004-08-17 |
International Business Machines Corporation |
Integrated plating and planarization apparatus having a variable-diameter counterelectrode
|
US6773570B2
(en)
*
|
2002-11-14 |
2004-08-10 |
International Business Machines Corporation |
Integrated plating and planarization process and apparatus therefor
|
US6835657B2
(en)
|
2002-12-02 |
2004-12-28 |
Applied Materials, Inc. |
Method for recrystallizing metal in features of a semiconductor chip
|
US7138039B2
(en)
*
|
2003-01-21 |
2006-11-21 |
Applied Materials, Inc. |
Liquid isolation of contact rings
|
US7087144B2
(en)
*
|
2003-01-31 |
2006-08-08 |
Applied Materials, Inc. |
Contact ring with embedded flexible contacts
|
US7704367B2
(en)
*
|
2004-06-28 |
2010-04-27 |
Lam Research Corporation |
Method and apparatus for plating semiconductor wafers
|
US7025861B2
(en)
*
|
2003-02-06 |
2006-04-11 |
Applied Materials |
Contact plating apparatus
|
US7842169B2
(en)
|
2003-03-04 |
2010-11-30 |
Applied Materials, Inc. |
Method and apparatus for local polishing control
|
US7146994B2
(en)
*
|
2003-03-17 |
2006-12-12 |
Novellus Systems, Inc. |
Active rinse shield for electrofill chemical bath and method of use
|
WO2004083494A1
(ja)
*
|
2003-03-19 |
2004-09-30 |
Ebara Corporation |
複合加工装置及び方法
|
US7250103B2
(en)
*
|
2003-04-14 |
2007-07-31 |
Novellus Systems, Inc. |
Method and apparatus for eliminating defects and improving uniformity in electrochemically processed conductive layers
|
US7025860B2
(en)
*
|
2003-04-22 |
2006-04-11 |
Novellus Systems, Inc. |
Method and apparatus for the electrochemical deposition and removal of a material on a workpiece surface
|
US7390383B2
(en)
*
|
2003-07-01 |
2008-06-24 |
Semitool, Inc. |
Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces
|
US20050050767A1
(en)
*
|
2003-06-06 |
2005-03-10 |
Hanson Kyle M. |
Wet chemical processing chambers for processing microfeature workpieces
|
US7393439B2
(en)
*
|
2003-06-06 |
2008-07-01 |
Semitool, Inc. |
Integrated microfeature workpiece processing tools with registration systems for paddle reactors
|
US7313462B2
(en)
|
2003-06-06 |
2007-12-25 |
Semitool, Inc. |
Integrated tool with automated calibration system and interchangeable wet processing components for processing microfeature workpieces
|
US20070144912A1
(en)
*
|
2003-07-01 |
2007-06-28 |
Woodruff Daniel J |
Linearly translating agitators for processing microfeature workpieces, and associated methods
|
US20050016861A1
(en)
*
|
2003-07-24 |
2005-01-27 |
Thomas Laursen |
Method for planarizing a work piece
|
US8158532B2
(en)
*
|
2003-10-20 |
2012-04-17 |
Novellus Systems, Inc. |
Topography reduction and control by selective accelerator removal
|
US8530359B2
(en)
|
2003-10-20 |
2013-09-10 |
Novellus Systems, Inc. |
Modulated metal removal using localized wet etching
|
US20050121141A1
(en)
*
|
2003-11-13 |
2005-06-09 |
Manens Antoine P. |
Real time process control for a polishing process
|
US7186164B2
(en)
|
2003-12-03 |
2007-03-06 |
Applied Materials, Inc. |
Processing pad assembly with zone control
|
US20050178666A1
(en)
*
|
2004-01-13 |
2005-08-18 |
Applied Materials, Inc. |
Methods for fabrication of a polishing article
|
US7527723B2
(en)
|
2004-01-16 |
2009-05-05 |
Ebara Corporation |
Electrolytic processing apparatus and electrolytic processing method
|
US20060021974A1
(en)
*
|
2004-01-29 |
2006-02-02 |
Applied Materials, Inc. |
Method and composition for polishing a substrate
|
US7390744B2
(en)
*
|
2004-01-29 |
2008-06-24 |
Applied Materials, Inc. |
Method and composition for polishing a substrate
|
US7153777B2
(en)
|
2004-02-20 |
2006-12-26 |
Micron Technology, Inc. |
Methods and apparatuses for electrochemical-mechanical polishing
|
US7125324B2
(en)
|
2004-03-09 |
2006-10-24 |
3M Innovative Properties Company |
Insulated pad conditioner and method of using same
|
US20050218000A1
(en)
*
|
2004-04-06 |
2005-10-06 |
Applied Materials, Inc. |
Conditioning of contact leads for metal plating systems
|
US7285195B2
(en)
|
2004-06-24 |
2007-10-23 |
Applied Materials, Inc. |
Electric field reducing thrust plate
|
US20060030156A1
(en)
*
|
2004-08-05 |
2006-02-09 |
Applied Materials, Inc. |
Abrasive conductive polishing article for electrochemical mechanical polishing
|
US7566391B2
(en)
|
2004-09-01 |
2009-07-28 |
Micron Technology, Inc. |
Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
|
US7084064B2
(en)
*
|
2004-09-14 |
2006-08-01 |
Applied Materials, Inc. |
Full sequence metal and barrier layer electrochemical mechanical processing
|
WO2006039436A2
(en)
*
|
2004-10-01 |
2006-04-13 |
Applied Materials, Inc. |
Pad design for electrochemical mechanical polishing
|
US7520968B2
(en)
*
|
2004-10-05 |
2009-04-21 |
Applied Materials, Inc. |
Conductive pad design modification for better wafer-pad contact
|
US7655565B2
(en)
*
|
2005-01-26 |
2010-02-02 |
Applied Materials, Inc. |
Electroprocessing profile control
|
TW200727356A
(en)
*
|
2005-01-28 |
2007-07-16 |
Applied Materials Inc |
Tungsten electroprocessing
|
US20060169674A1
(en)
*
|
2005-01-28 |
2006-08-03 |
Daxin Mao |
Method and composition for polishing a substrate
|
US20060219663A1
(en)
*
|
2005-03-31 |
2006-10-05 |
Applied Materials, Inc. |
Metal CMP process on one or more polishing stations using slurries with oxidizers
|
US7427340B2
(en)
*
|
2005-04-08 |
2008-09-23 |
Applied Materials, Inc. |
Conductive pad
|
CN100575564C
(zh)
*
|
2005-10-12 |
2009-12-30 |
中国海洋大学 |
金属板的电解蚀刻装置
|
US20070153453A1
(en)
*
|
2006-01-05 |
2007-07-05 |
Applied Materials, Inc. |
Fully conductive pad for electrochemical mechanical processing
|
US20070235344A1
(en)
*
|
2006-04-06 |
2007-10-11 |
Applied Materials, Inc. |
Process for high copper removal rate with good planarization and surface finish
|
US20070251832A1
(en)
*
|
2006-04-27 |
2007-11-01 |
Applied Materials, Inc. |
Method and apparatus for electrochemical mechanical polishing of cu with higher liner velocity for better surface finish and higher removal rate during clearance
|
US7422982B2
(en)
|
2006-07-07 |
2008-09-09 |
Applied Materials, Inc. |
Method and apparatus for electroprocessing a substrate with edge profile control
|
KR100795969B1
(ko)
*
|
2006-07-11 |
2008-01-21 |
노바테크인더스트리 주식회사 |
패널의 박형화 장치 및 방법
|
US20080178460A1
(en)
*
|
2007-01-29 |
2008-07-31 |
Woodruff Daniel J |
Protected magnets and magnet shielding for processing microfeature workpieces, and associated systems and methods
|
US20080181758A1
(en)
*
|
2007-01-29 |
2008-07-31 |
Woodruff Daniel J |
Microfeature workpiece transfer devices with rotational orientation sensors, and associated systems and methods
|
US8012000B2
(en)
*
|
2007-04-02 |
2011-09-06 |
Applied Materials, Inc. |
Extended pad life for ECMP and barrier removal
|
US20080293343A1
(en)
*
|
2007-05-22 |
2008-11-27 |
Yuchun Wang |
Pad with shallow cells for electrochemical mechanical processing
|
US9117870B2
(en)
*
|
2008-03-27 |
2015-08-25 |
Lam Research Corporation |
High throughput cleaner chamber
|
KR101170765B1
(ko)
*
|
2009-02-11 |
2012-08-03 |
세메스 주식회사 |
기판 도금 장치 및 방법
|
DE102009048669A1
(de)
*
|
2009-09-30 |
2011-03-31 |
Siemens Aktiengesellschaft |
Verfahren zum elektrochemischen Beschichten eines Substrates durch Brush Plating und Vorrichtung zur Durchführung dieses Verfahrens
|
US8168540B1
(en)
|
2009-12-29 |
2012-05-01 |
Novellus Systems, Inc. |
Methods and apparatus for depositing copper on tungsten
|
US8562272B2
(en)
|
2010-02-16 |
2013-10-22 |
Lam Research Corporation |
Substrate load and unload mechanisms for high throughput
|
US8893642B2
(en)
|
2010-03-24 |
2014-11-25 |
Lam Research Corporation |
Airflow management for low particulate count in a process tool
|
US8282698B2
(en)
*
|
2010-03-24 |
2012-10-09 |
Lam Research Corporation |
Reduction of particle contamination produced by moving mechanisms in a process tool
|
JP2013077588A
(ja)
*
|
2011-09-29 |
2013-04-25 |
Toshiba Corp |
基板処理方法
|
US20140042030A1
(en)
*
|
2012-08-10 |
2014-02-13 |
General Electric Company |
Sealed laminated structure, system and method for electrolytic processing the same
|
CN104440513A
(zh)
*
|
2013-09-22 |
2015-03-25 |
盛美半导体设备(上海)有限公司 |
硅片加工装置及方法
|
CN103510149B
(zh)
*
|
2013-10-14 |
2015-11-18 |
陈功 |
一种带电解抛光液的湿式自动抛光方法及其设备
|
US9393759B2
(en)
|
2013-10-24 |
2016-07-19 |
General Electric Company |
Metal laminate structures with systems and methods for treating
|
WO2016130548A1
(en)
|
2015-02-10 |
2016-08-18 |
Arcanum Alloy Design, Inc. |
Methods and systems for slurry coating
|
CN106567130A
(zh)
*
|
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|
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(en)
|
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|
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(zh)
*
|
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|
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(en)
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|
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|