DE3878765D1 - Kupferhaltige leitfaehige ueberzugsmasse. - Google Patents

Kupferhaltige leitfaehige ueberzugsmasse.

Info

Publication number
DE3878765D1
DE3878765D1 DE8888111695T DE3878765T DE3878765D1 DE 3878765 D1 DE3878765 D1 DE 3878765D1 DE 8888111695 T DE8888111695 T DE 8888111695T DE 3878765 T DE3878765 T DE 3878765T DE 3878765 D1 DE3878765 D1 DE 3878765D1
Authority
DE
Germany
Prior art keywords
copper
conductive coating
containing conductive
coating
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8888111695T
Other languages
English (en)
Inventor
Shoji Mitsubisi Petr Yamaguchi
Kimiko Mitsubishi Petro Yamada
Katsuyoshi Mitsubishi Pet Yada
Mitsubishi Petrochem Sakaguchi
Hiromu Mitsubishi Petroc Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Petrochemical Co Ltd
Original Assignee
Mitsubishi Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Petrochemical Co Ltd filed Critical Mitsubishi Petrochemical Co Ltd
Application granted granted Critical
Publication of DE3878765D1 publication Critical patent/DE3878765D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE8888111695T 1987-07-24 1988-07-20 Kupferhaltige leitfaehige ueberzugsmasse. Expired - Lifetime DE3878765D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18528087 1987-07-24
JP23075187 1987-09-14

Publications (1)

Publication Number Publication Date
DE3878765D1 true DE3878765D1 (de) 1993-04-08

Family

ID=26503010

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888111695T Expired - Lifetime DE3878765D1 (de) 1987-07-24 1988-07-20 Kupferhaltige leitfaehige ueberzugsmasse.

Country Status (5)

Country Link
US (1) US4921623A (de)
EP (1) EP0300453B1 (de)
JP (1) JP2611347B2 (de)
CA (1) CA1328520C (de)
DE (1) DE3878765D1 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU631595B2 (en) * 1988-12-24 1992-12-03 Technology Applications Company Limited Improved method for making printed circuits
US5061566A (en) * 1989-12-28 1991-10-29 Chomerics, Inc. Corrosion inhibiting emi/rfi shielding coating and method of its use
DE69121449T2 (de) * 1990-04-12 1997-02-27 Matsushita Electric Ind Co Ltd Leitende Tintenzusammensetzung und Verfahren zum Herstellen eines dickschichtigen Musters
US5270364A (en) * 1991-09-24 1993-12-14 Chomerics, Inc. Corrosion resistant metallic fillers and compositions containing same
US5236362A (en) * 1991-10-11 1993-08-17 Essential Dental Systems, Inc. Root canal filling material and adhesive composition
JPH0768562B2 (ja) * 1992-11-25 1995-07-26 三井金属鉱業株式会社 半田付け可能な導電性塗料用銅粉の製造方法
US6338809B1 (en) * 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
TR200003197T2 (tr) * 1998-05-11 2001-02-21 Union Carbide Chemicals & Plastics Technology Corporation Elektrostatik atomizasyon uygulama yöntemleri için uygun yüksek katılı iletken kaplama bileşimleri
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
JP3656558B2 (ja) * 2001-02-19 2005-06-08 株式会社村田製作所 導電性ペースト及びそれを用いた電子部品
WO2002080637A1 (en) 2001-04-02 2002-10-10 Nashua Corporation Circuit elements having an embedded conductive trace and methods of manufacture
EP1383364A3 (de) * 2002-05-23 2006-01-04 Nashua Corporation Schaltungselemente mit tintenaufnehmender Beschichtung und einer Leiterbahn und Verfahren zu deren Herstellung
US7211205B2 (en) * 2003-01-29 2007-05-01 Parelec, Inc. High conductivity inks with improved adhesion
US20040178391A1 (en) * 2003-01-29 2004-09-16 Conaghan Brian F. High conductivity inks with low minimum curing temperatures
US7141185B2 (en) * 2003-01-29 2006-11-28 Parelec, Inc. High conductivity inks with low minimum curing temperatures
US20050248908A1 (en) * 2004-05-06 2005-11-10 Gunther Dreezen Termination coating
JP2008237940A (ja) * 2005-01-14 2008-10-09 Basf Coatings Japan Ltd 塗膜形成方法および塗装物
US7459007B2 (en) * 2005-03-15 2008-12-02 Clarkson University Method for producing ultra-fine metal flakes
JP4821396B2 (ja) * 2006-03-27 2011-11-24 住友金属鉱山株式会社 導電性組成物及び導電膜形成方法
MY149267A (en) * 2006-12-26 2013-08-15 Sumitomo Bakelite Co Conductive paste
JP2009021149A (ja) * 2007-07-13 2009-01-29 Sumitomo Bakelite Co Ltd 導電性ペースト
PL2191482T3 (pl) 2007-09-13 2017-08-31 Henkel Ag & Co. Kgaa Kompozycja przewodząca prąd elektryczny
CN101887762A (zh) * 2009-05-12 2010-11-17 鸿富锦精密工业（深圳）有限公司 电磁屏蔽材料及其制备方法
JP5416153B2 (ja) * 2010-03-18 2014-02-12 古河電気工業株式会社 導電性ペースト、及びその製造方法、並びに導電接続部材
JPWO2012077548A1 (ja) * 2010-12-10 2014-05-19 旭硝子株式会社 導電ペーストおよびこれを用いた導電膜付き基材、ならびに導電膜付き基材の製造方法
JP5677107B2 (ja) 2011-01-26 2015-02-25 日東電工株式会社 配線回路基板
KR20140038413A (ko) * 2011-05-23 2014-03-28 아사히 가라스 가부시키가이샤 도전 페이스트 및 이것을 사용한 도전막이 형성된 기재, 그리고 도전막이 형성된 기재의 제조 방법
JP5848552B2 (ja) * 2011-08-29 2016-01-27 日立金属株式会社 銅微粒子分散液の製造方法、銅微粒子の製造方法、銅微粒子分散液および銅微粒子
CN102407328B (zh) * 2011-11-14 2013-03-20 苏州钻石金属粉有限公司 铜金粉后处理方法
CN102924996A (zh) * 2012-10-16 2013-02-13 复旦大学 纳米铜油墨和铜导电薄膜的制备方法
JP6201150B2 (ja) * 2014-02-28 2017-09-27 住友金属鉱山株式会社 積層セラミックコンデンサ内部電極用導電性ペーストおよびその製造方法、ならびに、積層セラミックコンデンサ
EP3275572A4 (de) * 2015-03-26 2018-11-14 Mitsui Mining and Smelting Co., Ltd. Kupferpulver und leitfähige zusammensetzung damit
TWI698474B (zh) * 2015-08-20 2020-07-11 日商拓自達電線股份有限公司 導電性組成物
RU2720190C1 (ru) * 2019-09-26 2020-04-27 Денис Александрович Чурзин Электропроводящая композиция для нанесения токопроводящих линий для использования в детских играх

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3564636D1 (en) * 1984-07-31 1988-09-29 Mitsubishi Petrochemical Co Copper-type conductive coating composition

Also Published As

Publication number Publication date
JP2611347B2 (ja) 1997-05-21
EP0300453B1 (de) 1993-03-03
US4921623A (en) 1990-05-01
CA1328520C (en) 1994-04-12
JPH01158081A (ja) 1989-06-21
EP0300453A2 (de) 1989-01-25
EP0300453A3 (en) 1990-08-16

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Legal Events

Date Code Title Description
8332 No legal effect for de