DE3854865T2 - Selbsttätiges laminographie-system zur inspektion von elektronika - Google Patents
Selbsttätiges laminographie-system zur inspektion von elektronikaInfo
- Publication number
- DE3854865T2 DE3854865T2 DE3854865T DE3854865T DE3854865T2 DE 3854865 T2 DE3854865 T2 DE 3854865T2 DE 3854865 T DE3854865 T DE 3854865T DE 3854865 T DE3854865 T DE 3854865T DE 3854865 T2 DE3854865 T2 DE 3854865T2
- Authority
- DE
- Germany
- Prior art keywords
- computer system
- item
- synchronization
- electron beam
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
- G01N23/043—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using fluoroscopic examination, with visual observation or video transmission of fluoroscopic images
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
- G01N23/044—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using laminography or tomosynthesis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/304—Contactless testing of printed or hybrid circuits
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/115,171 US4926452A (en) | 1987-10-30 | 1987-10-30 | Automated laminography system for inspection of electronics |
PCT/US1988/003423 WO1989004477A1 (en) | 1987-10-30 | 1988-10-04 | Automated laminography system for inspection of electronics |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3854865D1 DE3854865D1 (de) | 1996-02-15 |
DE3854865T2 true DE3854865T2 (de) | 1996-06-13 |
Family
ID=22359695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3854865T Expired - Fee Related DE3854865T2 (de) | 1987-10-30 | 1988-10-04 | Selbsttätiges laminographie-system zur inspektion von elektronika |
Country Status (8)
Country | Link |
---|---|
US (1) | US4926452A (de) |
EP (1) | EP0355128B1 (de) |
JP (1) | JPH06100451B2 (de) |
AT (1) | ATE132627T1 (de) |
CA (1) | CA1323453C (de) |
DE (1) | DE3854865T2 (de) |
IL (1) | IL87934A0 (de) |
WO (1) | WO1989004477A1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10142159B4 (de) * | 2000-08-30 | 2006-03-30 | Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto | Z-Achsen-Eliminierung in einem Röntgen-Laminographi-System unter Verwendung von Bildvergrößerung zur Z-Ebenen-Einstellung |
US7729468B2 (en) | 2004-02-27 | 2010-06-01 | Kabushiki Kaisha Toshiba | X-ray tomograph and stereoradioscopic image construction equipment |
DE102010010723A1 (de) | 2010-03-09 | 2011-09-15 | Yxlon International Gmbh | Laminographieanlage |
Families Citing this family (121)
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US5561696A (en) * | 1987-10-30 | 1996-10-01 | Hewlett-Packard Company | Method and apparatus for inspecting electrical connections |
US5097492A (en) * | 1987-10-30 | 1992-03-17 | Four Pi Systems Corporation | Automated laminography system for inspection of electronics |
US5081656A (en) * | 1987-10-30 | 1992-01-14 | Four Pi Systems Corporation | Automated laminography system for inspection of electronics |
US5621811A (en) * | 1987-10-30 | 1997-04-15 | Hewlett-Packard Co. | Learning method and apparatus for detecting and controlling solder defects |
US4852131A (en) * | 1988-05-13 | 1989-07-25 | Advanced Research & Applications Corporation | Computed tomography inspection of electronic devices |
NL8802556A (nl) * | 1988-10-18 | 1990-05-16 | Philips Nv | Computertomografiescanner met tomosynthetisch scanogram. |
US5027418A (en) * | 1989-02-13 | 1991-06-25 | Matsushita Electric Industrial Co., Ltd. | Electro-optical inspection apparatus for printed-circuit boards with components mounted thereon |
US5113425A (en) * | 1989-06-02 | 1992-05-12 | Glenbrook Technologies, Inc. | X-ray inspection system for electronic components |
EP0407685B1 (de) * | 1989-07-14 | 1995-06-28 | Hitachi, Ltd. | Verfahren und Vorrichtung zur Untersuchung von Lötstellen mittels eines röntgenfluoroskopischen Bildes |
US6031892A (en) | 1989-12-05 | 2000-02-29 | University Of Massachusetts Medical Center | System for quantitative radiographic imaging |
US5150394A (en) | 1989-12-05 | 1992-09-22 | University Of Massachusetts Medical School | Dual-energy system for quantitative radiographic imaging |
US5164994A (en) * | 1989-12-21 | 1992-11-17 | Hughes Aircraft Company | Solder joint locator |
US5182775A (en) * | 1990-01-12 | 1993-01-26 | Kawasaki Jukogyo Kabushiki Kaisha | Method of processing radiographic image data for detecting a welding defect |
US5259012A (en) * | 1990-08-30 | 1993-11-02 | Four Pi Systems Corporation | Laminography system and method with electromagnetically directed multipath radiation source |
US5199054A (en) * | 1990-08-30 | 1993-03-30 | Four Pi Systems Corporation | Method and apparatus for high resolution inspection of electronic items |
JPH05223532A (ja) * | 1991-07-10 | 1993-08-31 | Raytheon Co | 自動視覚検査システム |
DE4244925C2 (de) * | 1991-11-27 | 2001-08-30 | Thermo Trex Corp | CCD-Bildaufnahmeanordnung zur Umwandlung von Röntgenstrahlung in ein elektronisches, digitales Bildausgangssignal |
US5289520A (en) * | 1991-11-27 | 1994-02-22 | Lorad Corporation | Stereotactic mammography imaging system with prone position examination table and CCD camera |
GB9214114D0 (en) * | 1992-07-03 | 1992-08-12 | Ibm | X-ray inspection apparatus for electronic circuits |
DE4235183C2 (de) * | 1992-10-19 | 1997-10-23 | Fraunhofer Ges Forschung | Verfahren zur Erzeugung von Schichtaufnahmen von einem Meßobjekt mittels Röntgenstrahlung |
JP3051279B2 (ja) * | 1993-05-13 | 2000-06-12 | シャープ株式会社 | バンプ外観検査方法およびバンプ外観検査装置 |
US5541856A (en) * | 1993-11-08 | 1996-07-30 | Imaging Systems International | X-ray inspection system |
CA2113752C (en) | 1994-01-19 | 1999-03-02 | Stephen Michael Rooks | Inspection system for cross-sectional imaging |
US5500886A (en) * | 1994-04-06 | 1996-03-19 | Thermospectra | X-ray position measuring and calibration device |
EP0683389A1 (de) | 1994-05-12 | 1995-11-22 | Kabushiki Kaisha Toshiba | Laminographie-Tomograph und damit aufgebautes Inspektions- und Reparaturgerät |
US5594770A (en) * | 1994-11-18 | 1997-01-14 | Thermospectra Corporation | Method and apparatus for imaging obscured areas of a test object |
US5583904A (en) * | 1995-04-11 | 1996-12-10 | Hewlett-Packard Co. | Continuous linear scan laminography system and method |
US5687209A (en) * | 1995-04-11 | 1997-11-11 | Hewlett-Packard Co. | Automatic warp compensation for laminographic circuit board inspection |
US5524132A (en) * | 1995-05-12 | 1996-06-04 | International Business Machines Corporation | Process for revealing defects in testpieces using attenuated high-energy x-rays to form images in reusable photographs |
FR2749396B1 (fr) * | 1996-05-29 | 1998-08-07 | Softlink | Outil d'aide pour appareil de test de composants electroniques |
US5659483A (en) * | 1996-07-12 | 1997-08-19 | National Center For Manufacturing Sciences | System and method for analyzing conductor formation processes |
US5751784A (en) * | 1996-09-27 | 1998-05-12 | Kevex X-Ray | X-ray tube |
US6002790A (en) * | 1996-12-09 | 1999-12-14 | Advent Engineering Services, Inc. | Method for detecting and measuring voids in conductor insulation systems |
US6076411A (en) * | 1996-12-09 | 2000-06-20 | Advent Engineering Services, Inc. | Method and apparatus for determining remaining life of conductor insulation systems through void size and density correlation |
JP2842426B2 (ja) * | 1997-01-28 | 1999-01-06 | 日本電気株式会社 | アクティブマトリクス型液晶表示装置およびその製造方法 |
US6084663A (en) * | 1997-04-07 | 2000-07-04 | Hewlett-Packard Company | Method and an apparatus for inspection of a printed circuit board assembly |
US6002739A (en) | 1998-04-28 | 1999-12-14 | Hewlett Packard Company | Computed tomography with iterative reconstruction of thin cross-sectional planes |
KR100344587B1 (ko) | 1998-09-30 | 2003-03-26 | 삼성전자 주식회사 | 단층검사장치 |
US6314201B1 (en) | 1998-10-16 | 2001-11-06 | Agilent Technologies, Inc. | Automatic X-ray determination of solder joint and view delta Z values from a laser mapped reference surface for circuit board inspection using X-ray laminography |
US6201850B1 (en) * | 1999-01-26 | 2001-03-13 | Agilent Technologies, Inc. | Enhanced thickness calibration and shading correction for automatic X-ray inspection |
TW418342B (en) | 1999-02-02 | 2001-01-11 | Samsung Electronics Co Ltd | Sectional image photography system and method thereof |
US6463121B1 (en) | 1999-10-13 | 2002-10-08 | General Electric Company | Interactive x-ray position and exposure control using image data as reference information |
KR100522560B1 (ko) * | 1999-11-08 | 2005-10-20 | 테라다인 인코퍼레이티드 | 수직 슬라이스 이미징을 이용한 검사 방법 |
US6826173B1 (en) * | 1999-12-30 | 2004-11-30 | At&T Corp. | Enhanced subscriber IP alerting |
JP3629397B2 (ja) * | 2000-03-28 | 2005-03-16 | 松下電器産業株式会社 | 接合検査装置及び方法、並びに接合検査方法を実行させるプログラムを記録した記録媒体 |
JP2002014057A (ja) * | 2000-06-30 | 2002-01-18 | Nidek Co Ltd | 欠陥検査装置 |
US6630675B2 (en) * | 2000-07-26 | 2003-10-07 | Siemens Medical Solutions Usa, Inc. | X-ray scintillator compositions for X-ray imaging applications |
US6825856B1 (en) | 2000-07-26 | 2004-11-30 | Agilent Technologies, Inc. | Method and apparatus for extracting measurement information and setting specifications using three dimensional visualization |
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US7082182B2 (en) * | 2000-10-06 | 2006-07-25 | The University Of North Carolina At Chapel Hill | Computed tomography system for imaging of human and small animal |
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US6748046B2 (en) * | 2000-12-06 | 2004-06-08 | Teradyne, Inc. | Off-center tomosynthesis |
US6324249B1 (en) | 2001-03-21 | 2001-11-27 | Agilent Technologies, Inc. | Electronic planar laminography system and method |
US6563905B1 (en) * | 2001-10-30 | 2003-05-13 | Qualcomm, Incorporated | Ball grid array X-ray orientation mark |
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-
1988
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- 1988-10-04 WO PCT/US1988/003423 patent/WO1989004477A1/en active IP Right Grant
- 1988-10-04 JP JP63509124A patent/JPH06100451B2/ja not_active Expired - Lifetime
- 1988-10-04 DE DE3854865T patent/DE3854865T2/de not_active Expired - Fee Related
- 1988-10-04 EP EP88909919A patent/EP0355128B1/de not_active Expired - Lifetime
- 1988-10-05 IL IL87934A patent/IL87934A0/xx unknown
- 1988-10-12 CA CA000579869A patent/CA1323453C/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10142159B4 (de) * | 2000-08-30 | 2006-03-30 | Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto | Z-Achsen-Eliminierung in einem Röntgen-Laminographi-System unter Verwendung von Bildvergrößerung zur Z-Ebenen-Einstellung |
US7729468B2 (en) | 2004-02-27 | 2010-06-01 | Kabushiki Kaisha Toshiba | X-ray tomograph and stereoradioscopic image construction equipment |
DE102010010723A1 (de) | 2010-03-09 | 2011-09-15 | Yxlon International Gmbh | Laminographieanlage |
US8437447B2 (en) | 2010-03-09 | 2013-05-07 | Yxlon International Gmbh | Laminography system |
Also Published As
Publication number | Publication date |
---|---|
CA1323453C (en) | 1993-10-19 |
WO1989004477A1 (en) | 1989-05-18 |
EP0355128B1 (de) | 1996-01-03 |
JPH06100451B2 (ja) | 1994-12-12 |
EP0355128A1 (de) | 1990-02-28 |
IL87934A0 (en) | 1989-03-31 |
EP0355128A4 (en) | 1991-07-17 |
ATE132627T1 (de) | 1996-01-15 |
JPH02501411A (ja) | 1990-05-17 |
DE3854865D1 (de) | 1996-02-15 |
US4926452A (en) | 1990-05-15 |
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