DE3852073T2 - Angepasste gedruckte Schaltung. - Google Patents

Angepasste gedruckte Schaltung.

Info

Publication number: DE3852073T2
Authority: DE; Germany
Prior art keywords: printed circuit; custom printed; custom; circuit; printed
Prior art date: 1987-08-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE3852073T

Other languages

English (en)

Other versions

DE3852073D1 (de

Inventor

Mitsuhiro Ogura

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

HP Inc

Original Assignee

Hewlett Packard Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-08-18

Filing date

1988-08-09

Publication date

1995-03-16

1988-08-09 Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co

1994-12-15 Publication of DE3852073D1 publication Critical patent/DE3852073D1/de

1995-03-16 Application granted granted Critical

1995-03-16 Publication of DE3852073T2 publication Critical patent/DE3852073T2/de

2008-08-10 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

DE3852073T 1987-08-18 1988-08-09 Angepasste gedruckte Schaltung. Expired - Fee Related DE3852073T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1987125439U JPH0429561Y2 (de)	1987-08-18	1987-08-18

Publications (2)

Publication Number	Publication Date
DE3852073D1 DE3852073D1 (de)	1994-12-15
DE3852073T2 true DE3852073T2 (de)	1995-03-16

Family

ID=14910114

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE3852073T Expired - Fee Related DE3852073T2 (de)	1987-08-18	1988-08-09	Angepasste gedruckte Schaltung.

Country Status (4)

Country	Link
US (1)	US4899106A (de)
EP (1)	EP0305076B1 (de)
JP (1)	JPH0429561Y2 (de)
DE (1)	DE3852073T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2677772B1 (fr) *	1991-06-11	1993-10-08	Sgs Thomson Microelectronics Sa	Carte a pointes pour testeur de puces de circuit integre.
US5806181A (en) *	1993-11-16	1998-09-15	Formfactor, Inc.	Contact carriers (tiles) for populating larger substrates with spring contacts
US7073254B2 (en) *	1993-11-16	2006-07-11	Formfactor, Inc.	Method for mounting a plurality of spring contact elements
US20020053734A1 (en)	1993-11-16	2002-05-09	Formfactor, Inc.	Probe card assembly and kit, and methods of making same
US6741085B1 (en) *	1993-11-16	2004-05-25	Formfactor, Inc.	Contact carriers (tiles) for populating larger substrates with spring contacts
US5600259A (en) *	1993-12-17	1997-02-04	International Business Machines Corporation	Method and apparatus for reducing interference in a pin array
JPH07245133A (ja) *	1994-03-06	1995-09-19	Yokogawa Hewlett Packard Ltd	電気接続構造
US5546012A (en) *	1994-04-15	1996-08-13	International Business Machines Corporation	Probe card assembly having a ceramic probe card
AU6635296A (en) *	1995-05-26	1996-12-18	Formfactor, Inc.	Contact carriers (tiles) for populating larger substrates wi th spring contacts
US5994152A (en)	1996-02-21	1999-11-30	Formfactor, Inc.	Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) *	1996-02-21	2011-10-11	Formfactor, Inc.	Microelectronic contact structure
US5808475A (en) *	1996-06-07	1998-09-15	Keithley Instruments, Inc.	Semiconductor probe card for low current measurements
US6690185B1 (en)	1997-01-15	2004-02-10	Formfactor, Inc.	Large contactor with multiple, aligned contactor units
US6034533A (en) *	1997-06-10	2000-03-07	Tervo; Paul A.	Low-current pogo probe card
US6047469A (en) *	1997-11-12	2000-04-11	Luna Family Trust	Method of connecting a unit under test in a wireless test fixture
US7215131B1 (en) *	1999-06-07	2007-05-08	Formfactor, Inc.	Segmented contactor
JP2003031666A (ja) *	2001-07-12	2003-01-31	Mitsubishi Electric Corp	半導体デバイスまたは半導体ウェハ一括のテスト装置及びテスト方法
KR100443999B1 (ko) *	2003-02-28	2004-08-21	주식회사 파이컴	인쇄회로기판용 상호 접속체, 이의 제조방법 및 이를구비한 상호 접속 조립체
US8476918B2 (en) *	2010-04-28	2013-07-02	Tsmc Solid State Lighting Ltd.	Apparatus and method for wafer level classification of light emitting device
US9772391B2 (en) *	2014-01-24	2017-09-26	Tektronix, Inc.	Method for probe equalization

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3911361A (en) *	1974-06-28	1975-10-07	Ibm	Coaxial array space transformer
US4038599A (en) *	1974-12-30	1977-07-26	International Business Machines Corporation	High density wafer contacting and test system
US3963986A (en) *	1975-02-10	1976-06-15	International Business Machines Corporation	Programmable interface contactor structure
US4574235A (en) *	1981-06-05	1986-03-04	Micro Component Technology, Inc.	Transmission line connector and contact set assembly for test site
US4488111A (en) *	1982-06-01	1984-12-11	At&T Technologies, Inc.	Coupling devices for operations such as testing
JPS58189530U (ja) *	1982-06-10	1983-12-16	横河・ヒユ−レツト・パツカ−ド株式会社	プリント配線基板

1987
- 1987-08-18 JP JP1987125439U patent/JPH0429561Y2/ja not_active Expired
1988
- 1988-07-28 US US07/225,492 patent/US4899106A/en not_active Expired - Lifetime
- 1988-08-09 EP EP88307340A patent/EP0305076B1/de not_active Expired - Lifetime
- 1988-08-09 DE DE3852073T patent/DE3852073T2/de not_active Expired - Fee Related

Also Published As

Publication number	Publication date
DE3852073D1 (de)	1994-12-15
JPH0429561Y2 (de)	1992-07-17
EP0305076A3 (en)	1989-03-15
US4899106A (en)	1990-02-06
JPS6447042U (de)	1989-03-23
EP0305076A2 (de)	1989-03-01
EP0305076B1 (de)	1994-11-09

Legal Events

Date	Code	Title	Description
1995-12-07	8364	No opposition during term of opposition
2001-08-09	8327	Change in the person/name/address of the patent owner	Owner name: HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE),
2001-09-06	8339	Ceased/non-payment of the annual fee

Publication	Publication Date	Title
DE3880385T2 (de)	1993-10-28	Gedruckte Leiterplatte.
DE3775625D1 (de)	1992-02-13	Gedruckte leiterplatte.
DE3578811D1 (de)	1990-08-30	Gedruckte schaltung.
DE3850629T2 (de)	1995-01-05	Adaptierbarer Schaltkreis.
IT1229936B (it)	1991-09-16	Emporio elettronico.
DE68908687T2 (de)	1994-04-07	Gedruckte Schaltungsplatte.
DE68922118D1 (de)	1995-05-18	Schaltungsplatte.
DE69019030D1 (de)	1995-06-08	Gedruckte Leiterplatte.
DE3583178D1 (de)	1991-07-18	Gedruckte leiterplatte.
DE3852073D1 (de)	1994-12-15	Angepasste gedruckte Schaltung.
DE3884501D1 (de)	1993-11-04	Vergleichsschaltung.
DE3771707D1 (de)	1991-08-29	Gedruckte leiterplatte.
FI872537A (fi)	1987-12-07	Kretskoppling foer att skydda abonnentanslutningsenheters elektroniska graenssnitt.
DE3851118D1 (de)	1994-09-22	Leiterplatte.
DE3854633D1 (de)	1995-12-07	Speiseschaltung.
DE3850626D1 (de)	1994-08-18	Leiterplatte.
DE68906160T2 (de)	1993-10-28	Gedruckte Schaltungsplatte.
DE3872865D1 (de)	1992-08-20	Gedruckte leiterkarte.
NO861792L (no)	1986-11-07	Styrekrets.
DE3784634T2 (de)	1993-07-15	Gedruckte schaltungsplatte.
DE69023234D1 (de)	1995-11-30	Gedruckte schaltungsplatten.
DE69008944T2 (de)	1994-11-24	Gedruckte Schaltungsplatte.
FI885753A (fi)	1988-12-12	Identitetstickpropp foer elektroniska moduler.
DE396954T1 (de)	1991-02-28	Gedruckte schaltungsplatte.
NO880689D0 (no)	1988-02-17	Korreksjonskrets.