DE3685647D1 - Verbindungskontakte zwischen substraten und verfahren zur herstellung derselben. - Google Patents
Verbindungskontakte zwischen substraten und verfahren zur herstellung derselben.Info
- Publication number
- DE3685647D1 DE3685647D1 DE8686904381T DE3685647T DE3685647D1 DE 3685647 D1 DE3685647 D1 DE 3685647D1 DE 8686904381 T DE8686904381 T DE 8686904381T DE 3685647 T DE3685647 T DE 3685647T DE 3685647 D1 DE3685647 D1 DE 3685647D1
- Authority
- DE
- Germany
- Prior art keywords
- substrates
- producing
- same
- connecting contacts
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60156621A JPH0644583B2 (ja) | 1985-07-16 | 1985-07-16 | 基板間接続端子及びその製造法 |
JP61137961A JPH0656861B2 (ja) | 1986-06-13 | 1986-06-13 | 基板間接続子の製造法 |
PCT/JP1986/000364 WO1987000686A1 (en) | 1985-07-16 | 1986-07-16 | Connection terminals between substrates and method of producing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3685647D1 true DE3685647D1 (de) | 1992-07-16 |
DE3685647T2 DE3685647T2 (de) | 1993-01-07 |
Family
ID=26471120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686904381T Expired - Lifetime DE3685647T2 (de) | 1985-07-16 | 1986-07-16 | Verbindungskontakte zwischen substraten und verfahren zur herstellung derselben. |
Country Status (4)
Country | Link |
---|---|
US (2) | US4783722A (de) |
EP (1) | EP0229850B1 (de) |
DE (1) | DE3685647T2 (de) |
WO (1) | WO1987000686A1 (de) |
Families Citing this family (105)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0284820A3 (de) * | 1987-03-04 | 1989-03-08 | Canon Kabushiki Kaisha | Elektrisches Verbindungsteil und elektrisches Schaltungsteil und elektrische Schaltungsanordnung mit dem Verbindungsteil |
US4788767A (en) * | 1987-03-11 | 1988-12-06 | International Business Machines Corporation | Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
US5631447A (en) * | 1988-02-05 | 1997-05-20 | Raychem Limited | Uses of uniaxially electrically conductive articles |
JP2548602B2 (ja) * | 1988-04-12 | 1996-10-30 | 株式会社日立製作所 | 半導体実装モジュール |
US5238702A (en) * | 1988-10-27 | 1993-08-24 | Henning Giesecke | Electrically conductive patterns |
US4984358A (en) * | 1989-03-10 | 1991-01-15 | Microelectronics And Computer Technology Corporation | Method of assembling stacks of integrated circuit dies |
EP0399161B1 (de) * | 1989-04-17 | 1995-01-11 | International Business Machines Corporation | Mehrschichtleiterplattenstruktur |
FR2646558B1 (fr) * | 1989-04-26 | 1994-04-01 | Commissariat A Energie Atomique | Procede et machine d'interconnexion de composants electriques par elements de soudure |
US4914814A (en) * | 1989-05-04 | 1990-04-10 | International Business Machines Corporation | Process of fabricating a circuit package |
US4899439A (en) * | 1989-06-15 | 1990-02-13 | Microelectronics And Computer Technology Corporation | Method of fabricating a high density electrical interconnect |
US5018002A (en) * | 1989-07-03 | 1991-05-21 | General Electric Company | High current hermetic package including an internal foil and having a lead extending through the package lid and a packaged semiconductor chip |
US5504035A (en) * | 1989-08-28 | 1996-04-02 | Lsi Logic Corporation | Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate |
US5489804A (en) * | 1989-08-28 | 1996-02-06 | Lsi Logic Corporation | Flexible preformed planar structures for interposing between a chip and a substrate |
US5834799A (en) * | 1989-08-28 | 1998-11-10 | Lsi Logic | Optically transmissive preformed planar structures |
US5299730A (en) * | 1989-08-28 | 1994-04-05 | Lsi Logic Corporation | Method and apparatus for isolation of flux materials in flip-chip manufacturing |
US5164336A (en) * | 1989-09-11 | 1992-11-17 | Nippon Steel Corporation | Method of connecting tab tape to semiconductor chip, and bump sheet and bumped tape used in the method |
US5069628A (en) * | 1990-03-13 | 1991-12-03 | Hughes Aircraft Company | Flexible electrical cable connector with double sided dots |
US5081563A (en) * | 1990-04-27 | 1992-01-14 | International Business Machines Corporation | Multi-layer package incorporating a recessed cavity for a semiconductor chip |
US5130779A (en) * | 1990-06-19 | 1992-07-14 | International Business Machines Corporation | Solder mass having conductive encapsulating arrangement |
US5251806A (en) * | 1990-06-19 | 1993-10-12 | International Business Machines Corporation | Method of forming dual height solder interconnections |
US5229550A (en) * | 1990-10-30 | 1993-07-20 | International Business Machines Corporation | Encapsulated circuitized power core alignment and lamination |
FR2669500B1 (fr) * | 1990-11-16 | 1996-06-14 | Commissariat Energie Atomique | Circuit hybride forme de deux circuits dont les pistes sont reliees par des billes de connexion electrique |
US5306872A (en) * | 1991-03-06 | 1994-04-26 | International Business Machines Corporation | Structures for electrically conductive decals filled with organic insulator material |
US5338900A (en) * | 1991-03-06 | 1994-08-16 | International Business Machines Corporation | Structures for electrically conductive decals filled with inorganic insulator material |
US5162257A (en) * | 1991-09-13 | 1992-11-10 | Mcnc | Solder bump fabrication method |
US5372295A (en) * | 1991-10-04 | 1994-12-13 | Ryoden Semiconductor System Engineering Corporation | Solder material, junctioning method, junction material, and semiconductor device |
US5367764A (en) * | 1991-12-31 | 1994-11-29 | Tessera, Inc. | Method of making a multi-layer circuit assembly |
US5282312A (en) * | 1991-12-31 | 1994-02-01 | Tessera, Inc. | Multi-layer circuit construction methods with customization features |
EP0619935B1 (de) * | 1991-12-31 | 1998-05-13 | Tessera, Inc. | Verfahren zur konstruktion von mehrschichtigen schaltungen, strukturen mit personalisierungsmerkmalen und darin verwendete komponenten |
US5338208A (en) * | 1992-02-04 | 1994-08-16 | International Business Machines Corporation | High density electronic connector and method of assembly |
US5199163A (en) * | 1992-06-01 | 1993-04-06 | International Business Machines Corporation | Metal transfer layers for parallel processing |
US5334804A (en) * | 1992-11-17 | 1994-08-02 | Fujitsu Limited | Wire interconnect structures for connecting an integrated circuit to a substrate |
US5464652A (en) * | 1992-11-19 | 1995-11-07 | Hughes Aircraft Company | Green ceramic via metallization technique |
JP2518508B2 (ja) * | 1993-04-14 | 1996-07-24 | 日本電気株式会社 | 半導体装置 |
US5323947A (en) * | 1993-05-03 | 1994-06-28 | Motorola, Inc. | Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement |
US5474458A (en) * | 1993-07-13 | 1995-12-12 | Fujitsu Limited | Interconnect carriers having high-density vertical connectors and methods for making the same |
US5442852A (en) * | 1993-10-26 | 1995-08-22 | Pacific Microelectronics Corporation | Method of fabricating solder ball array |
US5456004A (en) * | 1994-01-04 | 1995-10-10 | Dell Usa, L.P. | Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards |
US6347037B2 (en) | 1994-04-28 | 2002-02-12 | Fujitsu Limited | Semiconductor device and method of forming the same |
JP3034180B2 (ja) * | 1994-04-28 | 2000-04-17 | 富士通株式会社 | 半導体装置及びその製造方法及び基板 |
US5665989A (en) * | 1995-01-03 | 1997-09-09 | Lsi Logic | Programmable microsystems in silicon |
JP3185588B2 (ja) * | 1995-02-23 | 2001-07-11 | 松下電器産業株式会社 | 電子部品の実装方法 |
JP3548628B2 (ja) * | 1995-06-02 | 2004-07-28 | シチズン時計株式会社 | 水深計測機能付き電子機器 |
EP0774888B1 (de) * | 1995-11-16 | 2003-03-19 | Matsushita Electric Industrial Co., Ltd | Gedruckte Leiterplatte und ihre Anordnung |
US5770889A (en) * | 1995-12-29 | 1998-06-23 | Lsi Logic Corporation | Systems having advanced pre-formed planar structures |
JP3145331B2 (ja) * | 1996-04-26 | 2001-03-12 | 日本特殊陶業株式会社 | 中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体および中継基板と取付基板の接続体の製造方法 |
AU2927897A (en) * | 1996-04-29 | 1997-11-19 | Carl Shine | Multilayer solder/barrier attach for semiconductor chip |
US6007348A (en) * | 1996-05-07 | 1999-12-28 | Advanced Intercommunications Corporation | Solder ball terminal |
TW406454B (en) * | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
US6635514B1 (en) * | 1996-12-12 | 2003-10-21 | Tessera, Inc. | Compliant package with conductive elastomeric posts |
US5957370A (en) * | 1997-01-10 | 1999-09-28 | Integrated Device Technology, Inc. | Plating process for fine pitch die in wafer form |
US5953816A (en) * | 1997-07-16 | 1999-09-21 | General Dynamics Information Systems, Inc. | Process of making interposers for land grip arrays |
US6435883B1 (en) * | 1997-09-24 | 2002-08-20 | Raytheon Company | High density multichip interconnect decal grid array with epoxy interconnects and transfer tape underfill |
IL123207A0 (en) * | 1998-02-06 | 1998-09-24 | Shellcase Ltd | Integrated circuit device |
US6159817A (en) * | 1998-05-07 | 2000-12-12 | Electro-Films Incorporated | Multi-tap thin film inductor |
KR100265563B1 (ko) | 1998-06-29 | 2000-09-15 | 김영환 | 볼 그리드 어레이 패키지 및 그의 제조 방법 |
JP3681542B2 (ja) | 1998-07-01 | 2005-08-10 | 富士通株式会社 | プリント回路基板および多段バンプ用中継基板 |
US6595408B1 (en) * | 1998-10-07 | 2003-07-22 | Micron Technology, Inc. | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement |
US6268275B1 (en) * | 1998-10-08 | 2001-07-31 | Micron Technology, Inc. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
KR100298829B1 (ko) * | 1999-07-21 | 2001-11-01 | 윤종용 | 칩 사이즈 패키지의 솔더 접합 구조 및 방법 |
JP3973340B2 (ja) * | 1999-10-05 | 2007-09-12 | Necエレクトロニクス株式会社 | 半導体装置、配線基板、及び、それらの製造方法 |
US6223973B1 (en) * | 1999-11-16 | 2001-05-01 | Visteon Global Technologies, Inc. | Apparatus and method for connecting printed circuit boards through soldered lap joints |
US6281041B1 (en) * | 1999-11-30 | 2001-08-28 | Aptos Corporation | Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball |
US6444921B1 (en) | 2000-02-03 | 2002-09-03 | Fujitsu Limited | Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like |
US6256202B1 (en) | 2000-02-18 | 2001-07-03 | Advanced Interconnections Corporation | Integrated circuit intercoupling component with heat sink |
JP2001326250A (ja) * | 2000-05-17 | 2001-11-22 | Nec Corp | フリップチップ型半導体装置及び製造方法 |
US6329609B1 (en) | 2000-06-29 | 2001-12-11 | International Business Machines Corporation | Method and structure to prevent distortion and expansion of organic spacer layer for thin film transfer-join technology |
JP3874062B2 (ja) * | 2000-09-05 | 2007-01-31 | セイコーエプソン株式会社 | 半導体装置 |
DE60108413T2 (de) | 2000-11-10 | 2005-06-02 | Unitive Electronics, Inc. | Verfahren zum positionieren von komponenten mit hilfe flüssiger antriebsmittel und strukturen hierfür |
US6863209B2 (en) | 2000-12-15 | 2005-03-08 | Unitivie International Limited | Low temperature methods of bonding components |
US6465084B1 (en) * | 2001-04-12 | 2002-10-15 | International Business Machines Corporation | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
US20030087477A1 (en) * | 2001-05-02 | 2003-05-08 | Tomohiro Kawashima | Repairable flip clip semiconductor device with excellent packaging reliability and method of manufacturing same |
FR2828983A1 (fr) * | 2001-08-23 | 2003-02-28 | Novatec | Interface d'interconnexion electrique et d'absorption de contraintes thermomecaniques et procede de realisation |
WO2003032370A2 (en) * | 2001-10-09 | 2003-04-17 | Tessera, Inc. | Stacked packages |
US6977440B2 (en) * | 2001-10-09 | 2005-12-20 | Tessera, Inc. | Stacked packages |
US7335995B2 (en) * | 2001-10-09 | 2008-02-26 | Tessera, Inc. | Microelectronic assembly having array including passive elements and interconnects |
US6657134B2 (en) * | 2001-11-30 | 2003-12-02 | Honeywell International Inc. | Stacked ball grid array |
WO2004001837A2 (en) | 2002-06-25 | 2003-12-31 | Unitive International Limited | Methods of forming electronic structures including conductive shunt layers and related structures |
US7531898B2 (en) | 2002-06-25 | 2009-05-12 | Unitive International Limited | Non-Circular via holes for bumping pads and related structures |
US7547623B2 (en) | 2002-06-25 | 2009-06-16 | Unitive International Limited | Methods of forming lead free solder bumps |
US6765288B2 (en) * | 2002-08-05 | 2004-07-20 | Tessera, Inc. | Microelectronic adaptors, assemblies and methods |
AU2003265417A1 (en) * | 2002-08-16 | 2004-03-03 | Tessera, Inc. | Microelectronic packages with self-aligning features |
US7294928B2 (en) * | 2002-09-06 | 2007-11-13 | Tessera, Inc. | Components, methods and assemblies for stacked packages |
US7071547B2 (en) * | 2002-09-11 | 2006-07-04 | Tessera, Inc. | Assemblies having stacked semiconductor chips and methods of making same |
EP1579477A2 (de) * | 2002-10-11 | 2005-09-28 | Tessera, Inc. | Komponenten, verfahren und baugruppen f r mehrchipkapselungen |
TWI225899B (en) | 2003-02-18 | 2005-01-01 | Unitive Semiconductor Taiwan C | Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer |
JP2005011838A (ja) * | 2003-06-16 | 2005-01-13 | Toshiba Corp | 半導体装置及びその組立方法 |
US6980015B2 (en) * | 2003-06-17 | 2005-12-27 | Agilent Technologies, Inc. | Back side probing method and assembly |
US7061121B2 (en) | 2003-11-12 | 2006-06-13 | Tessera, Inc. | Stacked microelectronic assemblies with central contacts |
US7427557B2 (en) * | 2004-03-10 | 2008-09-23 | Unitive International Limited | Methods of forming bumps using barrier layers as etch masks |
US7358174B2 (en) | 2004-04-13 | 2008-04-15 | Amkor Technology, Inc. | Methods of forming solder bumps on exposed metal pads |
US20060205170A1 (en) * | 2005-03-09 | 2006-09-14 | Rinne Glenn A | Methods of forming self-healing metal-insulator-metal (MIM) structures and related devices |
US7378734B2 (en) * | 2006-05-30 | 2008-05-27 | Touchdown Technologies, Inc. | Stacked contact bump |
WO2007040668A2 (en) * | 2005-09-14 | 2007-04-12 | Touchdown Technologies, Inc. | Stacked contact bump |
US7932615B2 (en) | 2006-02-08 | 2011-04-26 | Amkor Technology, Inc. | Electronic devices including solder bumps on compliant dielectric layers |
US7674701B2 (en) | 2006-02-08 | 2010-03-09 | Amkor Technology, Inc. | Methods of forming metal layers using multi-layer lift-off patterns |
US7545029B2 (en) | 2006-08-18 | 2009-06-09 | Tessera, Inc. | Stack microelectronic assemblies |
US8072084B2 (en) * | 2007-09-14 | 2011-12-06 | Qimonda Ag | Integrated circuit, circuit system, and method of manufacturing |
US20090279275A1 (en) * | 2008-05-09 | 2009-11-12 | Stephen Peter Ayotte | Method of attaching an integrated circuit chip to a module |
KR20100095268A (ko) * | 2009-02-20 | 2010-08-30 | 삼성전자주식회사 | 반도체 패키지 및 그 제조 방법 |
US20110186989A1 (en) * | 2010-02-04 | 2011-08-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor Device and Bump Formation Process |
CN202816916U (zh) * | 2012-10-10 | 2013-03-20 | 矽力杰半导体技术(杭州)有限公司 | 一种倒装封装装置 |
US9385098B2 (en) * | 2012-11-21 | 2016-07-05 | Nvidia Corporation | Variable-size solder bump structures for integrated circuit packaging |
US9679862B2 (en) * | 2014-11-28 | 2017-06-13 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device having conductive bumps of varying heights |
CN109478543B (zh) * | 2016-07-28 | 2022-07-05 | 三菱电机株式会社 | 半导体装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2497823A (en) * | 1946-06-10 | 1950-02-14 | Everett W Molloy | Radiation measuring device for air filters |
US3597834A (en) * | 1968-02-14 | 1971-08-10 | Texas Instruments Inc | Method in forming electrically continuous circuit through insulating layer |
DE2044494B2 (de) * | 1970-09-08 | 1972-01-13 | Siemens AG, 1000 Berlin u 8000 München | Anschlussflaechen zum anloeten von halbleiterbausteinen in flip chip technik |
DE2306236C2 (de) * | 1973-02-08 | 1982-11-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung von Schichtschaltungen mit leitenden Schichten auf beiden Seiten eines Keramiksubstrates |
US3921285A (en) * | 1974-07-15 | 1975-11-25 | Ibm | Method for joining microminiature components to a carrying structure |
GB1485569A (en) * | 1974-09-10 | 1977-09-14 | Siemens Ag | Multi-layer wired substrates for multi-chip circuits |
US4074342A (en) * | 1974-12-20 | 1978-02-14 | International Business Machines Corporation | Electrical package for lsi devices and assembly process therefor |
US4231154A (en) * | 1979-01-10 | 1980-11-04 | International Business Machines Corporation | Electronic package assembly method |
JPS5598840A (en) * | 1979-01-23 | 1980-07-28 | Nec Corp | Electroconductive structure for semiconductor device |
JPS584955A (ja) * | 1981-06-30 | 1983-01-12 | Shinko Electric Ind Co Ltd | 金めつきされた電子部品パツケ−ジ |
US4447857A (en) * | 1981-12-09 | 1984-05-08 | International Business Machines Corporation | Substrate with multiple type connections |
JPH0245357B2 (ja) * | 1982-06-25 | 1990-10-09 | Hitachi Ltd | Kibannosetsuzokukozo |
JPS5975695A (ja) * | 1982-10-23 | 1984-04-28 | 日本碍子株式会社 | セラミツク厚膜回路基板 |
GB2137421A (en) * | 1983-03-15 | 1984-10-03 | Standard Telephones Cables Ltd | Printed circuits |
US4617730A (en) * | 1984-08-13 | 1986-10-21 | International Business Machines Corporation | Method of fabricating a chip interposer |
JPS6164186A (ja) * | 1984-09-06 | 1986-04-02 | 三菱電機株式会社 | 電子部品リ−ドレスパツケ−ジの実装構造 |
US4685030A (en) * | 1985-04-29 | 1987-08-04 | Energy Conversion Devices, Inc. | Surface mounted circuits including hybrid circuits, having CVD interconnects, and method of preparing the circuits |
US4638400A (en) * | 1985-10-24 | 1987-01-20 | General Electric Company | Refractory metal capacitor structures, particularly for analog integrated circuit devices |
JPH06164186A (ja) * | 1992-11-19 | 1994-06-10 | Nippon Sheet Glass Co Ltd | 電磁波遮蔽体 |
-
1986
- 1986-07-16 WO PCT/JP1986/000364 patent/WO1987000686A1/ja active IP Right Grant
- 1986-07-16 DE DE8686904381T patent/DE3685647T2/de not_active Expired - Lifetime
- 1986-07-16 EP EP86904381A patent/EP0229850B1/de not_active Expired - Lifetime
- 1986-07-16 US US07/023,552 patent/US4783722A/en not_active Expired - Lifetime
-
1988
- 1988-03-25 US US07/173,745 patent/US4897918A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE3685647T2 (de) | 1993-01-07 |
EP0229850B1 (de) | 1992-06-10 |
US4897918A (en) | 1990-02-06 |
WO1987000686A1 (en) | 1987-01-29 |
EP0229850A4 (de) | 1987-10-08 |
EP0229850A1 (de) | 1987-07-29 |
US4783722A (en) | 1988-11-08 |
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