DE3685148D1 - Einrichtung zum dampftrocknen. - Google Patents

Einrichtung zum dampftrocknen.

Info

Publication number
DE3685148D1
DE3685148D1 DE8686101834T DE3685148T DE3685148D1 DE 3685148 D1 DE3685148 D1 DE 3685148D1 DE 8686101834 T DE8686101834 T DE 8686101834T DE 3685148 T DE3685148 T DE 3685148T DE 3685148 D1 DE3685148 D1 DE 3685148D1
Authority
DE
Germany
Prior art keywords
drying device
steam drying
steam
drying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686101834T
Other languages
English (en)
Inventor
Masaki Kusuhara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wacom Co Ltd
Original Assignee
Wacom Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7839785A external-priority patent/JPS61237429A/ja
Priority claimed from JP7839985A external-priority patent/JPS61237430A/ja
Priority claimed from JP11547585A external-priority patent/JPS61276224A/ja
Priority claimed from JP11547685A external-priority patent/JPS61276225A/ja
Priority claimed from JP15601285A external-priority patent/JPS6218036A/ja
Priority claimed from JP15601485A external-priority patent/JPS6218037A/ja
Priority claimed from JP15601585A external-priority patent/JPS6218038A/ja
Application filed by Wacom Co Ltd filed Critical Wacom Co Ltd
Application granted granted Critical
Publication of DE3685148D1 publication Critical patent/DE3685148D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D12/00—Displacing liquid, e.g. from wet solids or from dispersions of liquids or from solids in liquids, by means of another liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/04—Apparatus
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
    • F26B21/145—Condensing the vapour onto the surface of the materials to be dried
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE8686101834T 1985-04-15 1986-02-13 Einrichtung zum dampftrocknen. Expired - Lifetime DE3685148D1 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP7839785A JPS61237429A (ja) 1985-04-15 1985-04-15 蒸気乾燥洗浄装置
JP7839985A JPS61237430A (ja) 1985-04-15 1985-04-15 半導体蒸気乾燥洗浄用石英容器
JP11547585A JPS61276224A (ja) 1985-05-30 1985-05-30 物品洗浄装置
JP11547685A JPS61276225A (ja) 1985-05-30 1985-05-30 蒸気乾燥洗浄装置
JP15601285A JPS6218036A (ja) 1985-07-17 1985-07-17 蒸気乾燥洗浄装置
JP15601485A JPS6218037A (ja) 1985-07-17 1985-07-17 パススル−ル−ム
JP15601585A JPS6218038A (ja) 1985-07-17 1985-07-17 蒸気乾燥洗浄装置

Publications (1)

Publication Number Publication Date
DE3685148D1 true DE3685148D1 (de) 1992-06-11

Family

ID=27565287

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686101834T Expired - Lifetime DE3685148D1 (de) 1985-04-15 1986-02-13 Einrichtung zum dampftrocknen.

Country Status (3)

Country Link
US (2) US4736758A (de)
EP (1) EP0198169B1 (de)
DE (1) DE3685148D1 (de)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4924890A (en) * 1986-05-16 1990-05-15 Eastman Kodak Company Method and apparatus for cleaning semiconductor wafers
JPH073634Y2 (ja) * 1987-12-28 1995-01-30 株式会社トムコ ウェハ液洗乾燥装置
US5235995A (en) * 1989-03-27 1993-08-17 Semitool, Inc. Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization
DE3824138A1 (de) * 1988-07-15 1990-01-18 Siemens Ag Anordnung zum spuelen von in horden angeordneten halbleiterkristallscheiben
JPH0247046U (de) * 1988-09-28 1990-03-30
US5357991A (en) * 1989-03-27 1994-10-25 Semitool, Inc. Gas phase semiconductor processor with liquid phase mixing
US5115576A (en) * 1989-10-27 1992-05-26 Semifab Incorporated Vapor device and method for drying articles such as semiconductor wafers with substances such as isopropyl alcohol
US4977688A (en) * 1989-10-27 1990-12-18 Semifab Incorporated Vapor device and method for drying articles such as semiconductor wafers with substances such as isopropyl alcohol
US5054210A (en) * 1990-02-23 1991-10-08 S&K Products International, Inc. Isopropyl alcohol vapor dryer system
US5371950A (en) * 1990-02-23 1994-12-13 S & K Products International, Inc. Isopropyl alcohol vapor dryer system
JPH0411728A (ja) * 1990-04-30 1992-01-16 Seiichiro Sogo 半導体ウェハの洗浄装置
CA2040989A1 (en) * 1990-05-01 1991-11-02 Ichiro Yoshida Washing/drying method and apparatus
US6375741B2 (en) * 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
US5259407A (en) * 1990-06-15 1993-11-09 Matrix Inc. Surface treatment method and apparatus for a semiconductor wafer
US5052126A (en) * 1990-06-21 1991-10-01 Rolf Moe Vapor drier for semiconductor wafers and the like
US5593507A (en) * 1990-08-22 1997-01-14 Kabushiki Kaisha Toshiba Cleaning method and cleaning apparatus
JPH04151828A (ja) * 1990-10-16 1992-05-25 Nippon Steel Corp 薬液雰囲気分離装置
US5275184A (en) * 1990-10-19 1994-01-04 Dainippon Screen Mfg. Co., Ltd. Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system
DE69108169T2 (de) * 1990-10-23 1995-07-20 Tokyo Special Wire Netting Co Reinigungsapparat.
JP3165435B2 (ja) * 1990-11-17 2001-05-14 東京エレクトロン株式会社 洗浄装置
JPH0531472A (ja) * 1990-11-17 1993-02-09 Tokyo Electron Ltd 洗浄装置
JP3162704B2 (ja) * 1990-11-28 2001-05-08 東京エレクトロン株式会社 処理装置
JP2648638B2 (ja) * 1990-11-30 1997-09-03 三菱マテリアル株式会社 ウェーハの接着方法およびその装置
US5186192A (en) * 1990-12-14 1993-02-16 Shin-Etsu Handotai Co., Ltd. Apparatus for cleaning silicon wafer
ATE258084T1 (de) 1991-10-04 2004-02-15 Cfmt Inc Superreinigung von komplizierten mikroteilchen
JPH07103470B2 (ja) * 1992-03-10 1995-11-08 ミネベア株式会社 金属品洗浄方法、金属品洗浄装置及び金属品乾燥装置
JPH05259136A (ja) * 1992-03-12 1993-10-08 Tokyo Electron Ltd 洗浄処理装置
JP3110218B2 (ja) * 1992-09-25 2000-11-20 三菱電機株式会社 半導体洗浄装置及び方法、ウエハカセット、専用グローブ並びにウエハ受け治具
JP3003016B2 (ja) * 1992-12-25 2000-01-24 東京エレクトロン株式会社 処理装置及び処理方法
JP2928432B2 (ja) * 1993-02-16 1999-08-03 東京エレクトロン株式会社 半導体ウエハの蒸気乾燥装置及びその消火方法及び洗浄システム
JP3347814B2 (ja) * 1993-05-17 2002-11-20 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置
GB9322160D0 (en) * 1993-10-27 1993-12-15 Rolls Royce Plc Improvements in or relating to electron beam welding
JP2894535B2 (ja) * 1994-01-18 1999-05-24 信越半導体株式会社 ウェーハホルダー
JPH08189768A (ja) * 1994-11-07 1996-07-23 Ryoden Semiconductor Syst Eng Kk 蒸気乾燥装置、それを組込んだ洗浄装置および蒸気乾燥方法
US5653045A (en) * 1995-06-07 1997-08-05 Ferrell; Gary W. Method and apparatus for drying parts and microelectronic components using sonic created mist
US5752532A (en) * 1995-08-17 1998-05-19 Schwenkler; Robert S. Method for the precision cleaning and drying surfaces
US5715612A (en) * 1995-08-17 1998-02-10 Schwenkler; Robert S. Method for precision drying surfaces
US5954911A (en) * 1995-10-12 1999-09-21 Semitool, Inc. Semiconductor processing using vapor mixtures
US5673713A (en) * 1995-12-19 1997-10-07 Lg Semicon Co., Ltd. Apparatus for cleansing semiconductor wafer
JP4421686B2 (ja) * 1996-06-24 2010-02-24 インテルウニフェルシテール ミクロエレクトロニカ セントルム フェライニジンク ゾンダ ウィンストベヤーク 平坦な基材を湿式でクリーニングまたはエッチングするための装置および方法
US5762804A (en) * 1996-07-12 1998-06-09 Striefler; Martin J. Filter prewetting and decontamination method and apparatus
AT408287B (de) * 1996-10-01 2001-10-25 Sez Semiconduct Equip Zubehoer Verfahren und vorrichtung zum trocknen von scheibenförmigen substraten der halbleitertechnik
JP3171807B2 (ja) * 1997-01-24 2001-06-04 東京エレクトロン株式会社 洗浄装置及び洗浄方法
WO1998035765A1 (en) * 1997-02-18 1998-08-20 Scp Global Technologies Multiple stage wet processing chamber
US6068002A (en) 1997-04-02 2000-05-30 Tokyo Electron Limited Cleaning and drying apparatus, wafer processing system and wafer processing method
US6736148B2 (en) 1997-05-05 2004-05-18 Semitool, Inc. Automated semiconductor processing system
US6869487B1 (en) * 1997-05-09 2005-03-22 Semitool, Inc. Process and apparatus for treating a workpiece such as a semiconductor wafer
JP3230051B2 (ja) * 1997-05-16 2001-11-19 東京エレクトロン株式会社 乾燥処理方法及びその装置
JPH10321585A (ja) * 1997-05-22 1998-12-04 Mitsubishi Electric Corp 乾燥装置および乾燥方法
US6231684B1 (en) * 1998-09-11 2001-05-15 Forward Technology Industries, Inc. Apparatus and method for precision cleaning and drying systems
US6328809B1 (en) 1998-10-09 2001-12-11 Scp Global Technologies, Inc. Vapor drying system and method
US5989359A (en) * 1998-10-09 1999-11-23 Berbel; Jose A. Method for drying objects with fluids
WO2001002108A1 (en) 1999-07-06 2001-01-11 Semitool, Inc. Fluid heating system for processing semiconductor materials
US6536450B1 (en) 1999-07-07 2003-03-25 Semitool, Inc. Fluid heating system for processing semiconductor materials
US6630031B1 (en) * 1999-08-12 2003-10-07 Sipec Corporation Surface purification apparatus and surface purification method
US6192600B1 (en) 1999-09-09 2001-02-27 Semitool, Inc. Thermocapillary dryer
US6199298B1 (en) 1999-10-06 2001-03-13 Semitool, Inc. Vapor assisted rotary drying method and apparatus
US6395101B1 (en) 1999-10-08 2002-05-28 Semitool, Inc. Single semiconductor wafer processor
DK1237853T3 (da) * 1999-12-17 2007-06-18 Pfizer Science & Tech Ltd Fremgangsåde til fjernelse af sporoplösningsmidler fra et materiale
US6497055B2 (en) * 2000-01-04 2002-12-24 Texas Instruments Incorporated System and method for controlling a vapor dryer process
US7364625B2 (en) * 2000-05-30 2008-04-29 Fsi International, Inc. Rinsing processes and equipment
DE102004044176A1 (de) * 2004-09-13 2006-03-30 BSH Bosch und Siemens Hausgeräte GmbH Trocknungsverfahren für ein Haushaltsgerät und Haushaltsgerät zur Durchführung des Trocknungsverfahren
US7637029B2 (en) * 2005-07-08 2009-12-29 Tokyo Electron Limited Vapor drying method, apparatus and recording medium for use in the method
WO2007047163A2 (en) * 2005-10-04 2007-04-26 Applied Materials, Inc. Methods and apparatus for drying a substrate
JP4758846B2 (ja) * 2005-11-18 2011-08-31 東京エレクトロン株式会社 乾燥装置、乾燥方法、及び乾燥プログラム、並びに、これらを有する基板処理装置、基板処理方法、及び基板処理プログラム
CN201839457U (zh) * 2010-05-24 2011-05-18 小田(中山)实业有限公司 发热器以及即热式电热水机
CN205287021U (zh) * 2015-11-18 2016-06-08 马笑远 一种香薰炉
JP7055467B2 (ja) * 2017-09-08 2022-04-18 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 半導体ウェハの洗浄方法及び洗浄装置
US11037805B2 (en) * 2018-11-23 2021-06-15 Nanya Technology Corporation Wafer cleaning apparatus and method of cleaning wafer
CN111069152B (zh) * 2019-12-30 2022-04-19 深圳市泰利创斯科技有限公司 进料传送方法和装置、宽度调节装置、抑制碎屑的装置
CN112833658B (zh) * 2020-12-25 2022-09-16 北京北方华创微电子装备有限公司 清洗干燥装置

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US2352709A (en) * 1942-11-26 1944-07-04 Western Electric Co Apparatus for annealing articles
US2689198A (en) * 1948-11-10 1954-09-14 Lyon Inc Method for removing paint from painted articles
US2896640A (en) * 1957-08-07 1959-07-28 Ramco Equipment Corp Degreasing apparatus
US4077467A (en) * 1976-01-28 1978-03-07 Spigarelli Donald J Method and apparatus for soldering, fusing or brazing
JPS53128160A (en) * 1977-04-14 1978-11-08 Matsushita Electric Ind Co Ltd Vertical supersonic wave cleaner
BE800531A (fr) * 1978-11-27 1973-10-01 Tongaat Sugar Pty Ltd Broyeur a marteaux pour defibreur utilisable notamment dans l'industrie sucriere
US4558524A (en) * 1982-10-12 1985-12-17 Usm Corporation Single vapor system for soldering, fusing or brazing

Also Published As

Publication number Publication date
US4777970A (en) 1988-10-18
EP0198169A2 (de) 1986-10-22
EP0198169B1 (de) 1992-05-06
US4736758A (en) 1988-04-12
EP0198169A3 (en) 1988-09-21

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Legal Events

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8364 No opposition during term of opposition